CN105472879A - Auxiliary welding structure of ALC PCB and preparation technology of auxiliary welding structure - Google Patents
Auxiliary welding structure of ALC PCB and preparation technology of auxiliary welding structure Download PDFInfo
- Publication number
- CN105472879A CN105472879A CN201610016905.7A CN201610016905A CN105472879A CN 105472879 A CN105472879 A CN 105472879A CN 201610016905 A CN201610016905 A CN 201610016905A CN 105472879 A CN105472879 A CN 105472879A
- Authority
- CN
- China
- Prior art keywords
- weld tabs
- welding
- connect
- welding structure
- alcpcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
Abstract
The invention discloses an auxiliary welding structure of an ALC PCB and a preparation technology of the auxiliary welding structure. The auxiliary welding structure comprises an ALC substrate and a metal sheet, wherein multiple groups of bonding pads are arranged on the ALC substrate; the metal sheet comprises an upper welding sheet and lower welding sheets; the lower welding sheets are located at two sides of the upper welding sheet; the lower welding sheets are correspondingly connected with each group of bonding pads respectively; the width of each lower welding sheet is smaller than that of the upper welding sheet; the upper welding sheet arches upwards relative to the lower welding sheets; and the preparation technology comprises the following steps: carrying out cleaning treatment on the surface of the ALC substrate; printing a tin paste on the bonding pads on the ALC substrate; placing the metal sheet to the corresponding bonding pad, and carrying out high-temperature reflow soldering; and welding a lead on the metal sheet by electric soldering iron which is smaller than 75W. Compared with the method of directly utilizing the electric soldering iron for welding in the prior art, the auxiliary welding structure is safer, more reliable, more stable in connection, not easy to fall off, low in cost, simple to operate and high in production practicability.
Description
[technical field]
The present invention relates to PCB technical field, specifically, relate to a kind of assistant welding structure and preparation technology thereof of ALCPCB plate.
[background technology]
ALC substrate is a kind of novel heat superconducting aluminium base. its conductive coefficient is very superior, reaches 122W/ (mK), and because insulating barrier is very thin, heat conduction is too fast, welding difficulty.At normal temperatures, weld with the very difficult solder of below 75W electric soldering iron, cannot not there will be stickyly tin phenomenon.One method solves the problem of ALC substrate welding by (80 degree) welding on heating platform, but the method efficiency is low, production poor practicability; Can also weld with the electric soldering iron more than 120W in addition, welding temperature is more than 600 degree, but now operating process is abnormally dangerous, poor stability, is unfavorable for producing.
Above-mentioned defect, is worth improving.
[summary of the invention]
In order to overcome the deficiency of existing technology, the invention provides a kind of assistant welding structure and preparation technology thereof of ALCPCB plate.
Technical solution of the present invention is as described below:
A kind of assistant welding structure of ALCPCB plate, it is characterized in that, comprise ALC substrate and sheet metal, described ALC substrate is provided with some assembly welding dishes, the described pad often organized comprises two solder joints, described sheet metal comprise connect weld tabs and be positioned at described on connect weld tabs both sides under connect weld tabs, connect under described that weld tabs is corresponding with two the described phase of solder joints often organized in described pad respectively to be connected, the width connecing weld tabs under described be less than described on connect the width of weld tabs, connect on described weld tabs more described under connect weld tabs and upwards arch upward and make the side of described sheet metal in " door " character form structure.
Further, connect on described weld tabs with described under to connect the thickness of weld tabs identical.
Further, connect weld tabs on described and described under connect weld tabs thickness be 0.26-0.34mm.
Further, connect under described between weld tabs and described solder joint and be provided with high temperature tin cream, and be fixed connection by high temperature reflux weldering.
Further, described sheet metal is copper sheet.
Further, described copper sheet is red metal or brass.
Further, described copper sheet surface is coated with layer gold through turmeric technique, and described layer gold thickness is 0.5mm.
A preparation technology for the assistant welding structure of ALCPCB plate, is characterized in that, comprises the following steps:
(1) clean is carried out to ALC substrate surface;
(2) at normal temperatures, to print solder paste on the pad of ALC substrate;
(3) sheet metal is mounted on the pad of correspondence, and cross high temperature Reflow Soldering;
(4) with electric iron welding lead on sheet metal of below 75W, its welding temperature 400 DEG C and more than.
Further, in described step (3), artificial tweezers or special mounting device is used to mount sheet metal.
According to the present invention of said structure, its beneficial effect is, the invention solves the defect that ALC substrate cannot simply weld, avoid the situation of the not sticky tin of welding process, safer, reliable compared with the mode directly using electric iron to carry out welding in prior art, connect more solid, difficult drop-off, and the copper sheet made with turmeric technique can not variable color at high temperature reflux postwelding, attractive in appearance, generous.Cost of the present invention is low, simple to operate, and production practicality is high.
[accompanying drawing explanation]
Fig. 1 is structural representation of the present invention;
Fig. 2 is side structure exploded view of the present invention;
Fig. 3 is the structural representation of ALC substrate in the present invention;
Fig. 4 is the structural representation of sheet metal in the present invention;
Fig. 5 be in Fig. 4 A-A to cutaway view.
In the drawings, 1, ALC substrate; 2, copper sheet; 21, weld tabs is connect on; 22, weld tabs is connect under; 3, pad.
[embodiment]
Below in conjunction with accompanying drawing and execution mode, the present invention is conducted further description:
As shown in Figure 1-2, a kind of assistant welding structure of ALCPCB plate, comprises ALC substrate 1 and sheet metal, and in the present embodiment, sheet metal is copper sheet 2.Preferably, copper sheet 2 is for red metal or brass and be coated with layer gold on copper sheet 2 surface through turmeric technique, and its cost is lower, and preferably, the thickness of layer gold is 0.05mm.
As shown in Figure 3, ALC substrate 1 is provided with some assembly welding dishes 3, and every assembly welding dish 3 comprises two solder joints.
As illustrated in figures 4-5, copper sheet 2 comprise connect weld tabs 21 and be positioned at connect weld tabs 21 both sides under connect weld tabs 22, under connect that weld tabs 22 is corresponding with two phase of solder joints in every assembly welding dish 3 respectively to be connected, above connect weld tabs 21 and connect comparatively down weld tabs 22 and upwards arch upward and make the side of copper sheet 2 in " door " character form structure.
Preferably, connect under every side on weld tabs 22 and be respectively equipped with through hole 23 penetrating up and down, connect weld tabs 22 and the contact area of solder joint under can increasing, increase adhesion between the two.
In order to reduce the contact area of copper sheet 2 and ALC substrate 1, and ensure the conductance of product and certain intensity, copper sheet 2 adopts middle wide, structure that both sides are narrow, and on connect weld tabs 21 with under to connect the thickness of weld tabs 22 identical, both thickness is 0.26-0.34mm.Preferably, above connect weld tabs 21 and under connect weld tabs 22 thickness be 0.30mm.
Under connect between weld tabs 22 and solder joint and be provided with high temperature tin cream (fusing point is 217 degree), and be fixed connection by high temperature reflux weldering.After completing, available below 75W electric soldering iron carries out welding lead on copper sheet 2, can easily weld when welding temperature is more than 400 degree.
A preparation technology for the assistant welding structure of ALCPCB plate, comprises the following steps:
(1) clean is carried out to ALC substrate surface;
(2) at normal temperatures, to print solder paste on the pad of ALC substrate;
(3) use artificial tweezers or special mounting device to mount on the pad of correspondence sheet metal, and cross high temperature Reflow Soldering;
(4) with electric iron welding lead on sheet metal of below 75W.
In step (4), its welding temperature 400 DEG C and more than.
Should be understood that, for those of ordinary skills, can be improved according to the above description or convert, and all these improve and convert the protection range that all should belong to claims of the present invention.
By reference to the accompanying drawings exemplary description is carried out to patent of the present invention above; the realization of obvious patent of the present invention is not subject to the restrictions described above; as long as have employed the various improvement that method is conceived and technical scheme is carried out of patent of the present invention; or the design of patent of the present invention and technical scheme directly applied to other occasion, all in protection scope of the present invention without to improve.
Claims (8)
1. the assistant welding structure of an ALCPCB plate, it is characterized in that, comprise ALC substrate and sheet metal, described ALC substrate is provided with some assembly welding dishes, the described pad often organized comprises two solder joints, described sheet metal comprise connect weld tabs and be positioned at described on connect weld tabs both sides under connect weld tabs, connect under described that weld tabs is corresponding with two the described phase of solder joints often organized in described pad respectively to be connected, the width connecing weld tabs under described be less than described on connect the width of weld tabs, connect on described weld tabs more described under connect weld tabs and upwards arch upward and make the side of described sheet metal in " door " character form structure.
2. the assistant welding structure of ALCPCB plate according to claim 1, is characterized in that, connect on described weld tabs with described under to connect the thickness of weld tabs identical.
3. the assistant welding structure of ALCPCB plate according to claim 3, is characterized in that, connect weld tabs on described and described under connect weld tabs thickness be 0.26-0.34mm.
4. the assistant welding structure of ALCPCB plate according to claim 1, is characterized in that, connects between weld tabs and described solder joint and be provided with high temperature tin cream under described, and is fixed connection by high temperature reflux weldering.
5. the assistant welding structure of ALCPCB plate according to claim 1, is characterized in that, described sheet metal is copper sheet.
6. the assistant welding structure of ALCPCB plate according to claim 5, is characterized in that, described copper sheet is red metal or brass.
7. a preparation technology for the assistant welding structure of the ALCPCB plate as described in claim 1-6 any one, is characterized in that, comprise the following steps:
(1) clean is carried out to ALC substrate surface;
(2) at normal temperatures, to print solder paste on the pad of ALC substrate;
(3) sheet metal is mounted on the pad of correspondence, and cross high temperature Reflow Soldering;
(4) with electric iron welding lead on sheet metal of below 75W, its welding temperature 400 DEG C and more than.
8. the preparation technology of the assistant welding structure of ALCPCB plate according to claim 7, is characterized in that, in described step (3), uses artificial tweezers or special mounting device to mount sheet metal.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610016905.7A CN105472879A (en) | 2016-01-12 | 2016-01-12 | Auxiliary welding structure of ALC PCB and preparation technology of auxiliary welding structure |
| PCT/CN2016/070841 WO2017120808A1 (en) | 2016-01-12 | 2016-01-14 | Auxiliary welding structure for alc pcb board and process of fabrication thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610016905.7A CN105472879A (en) | 2016-01-12 | 2016-01-12 | Auxiliary welding structure of ALC PCB and preparation technology of auxiliary welding structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105472879A true CN105472879A (en) | 2016-04-06 |
Family
ID=55610001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610016905.7A Pending CN105472879A (en) | 2016-01-12 | 2016-01-12 | Auxiliary welding structure of ALC PCB and preparation technology of auxiliary welding structure |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN105472879A (en) |
| WO (1) | WO2017120808A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108232494A (en) * | 2016-12-09 | 2018-06-29 | 富士康(昆山)电脑接插件有限公司 | Circuit board assemblies and its manufacturing method |
| CN108723538A (en) * | 2018-07-19 | 2018-11-02 | 广东盛路通信科技股份有限公司 | A kind of low-temperature welding method and equipment |
| CN110972394A (en) * | 2019-12-31 | 2020-04-07 | 中科可控信息产业有限公司 | Circuit board structure and electronic equipment |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114682870A (en) * | 2022-03-29 | 2022-07-01 | 联宝(合肥)电子科技有限公司 | POP hybrid welding process and system |
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| CN1816249A (en) * | 2005-01-31 | 2006-08-09 | 株式会社东芝 | Circuit board |
| CN1883241A (en) * | 2003-11-21 | 2006-12-20 | 罗姆股份有限公司 | Circuit board |
| KR20090040273A (en) * | 2009-03-20 | 2009-04-23 | 나병영 | A radiation device of heat for fet of rectifier output |
| JP2009117123A (en) * | 2007-11-05 | 2009-05-28 | Yazaki Corp | Connection structure between electric wire and printed-circuit board |
| CN202535643U (en) * | 2012-02-24 | 2012-11-14 | 昆山华晨电子有限公司 | Aluminium printed circuit board |
| CN205491425U (en) * | 2016-01-12 | 2016-08-17 | 深圳市立洋光电子股份有限公司 | Supplementary welded structure of ALCPCB board |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN201063971Y (en) * | 2007-05-18 | 2008-05-21 | 黄虎钧 | Highly effective heat radiating circuit board |
| CN102869189B (en) * | 2012-09-18 | 2016-03-30 | 上海华勤通讯技术有限公司 | Pad reinforces pcb board |
| CN204634158U (en) * | 2015-04-17 | 2015-09-09 | 深圳市环基实业有限公司 | A kind of jointing of LED pcb board |
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2016
- 2016-01-12 CN CN201610016905.7A patent/CN105472879A/en active Pending
- 2016-01-14 WO PCT/CN2016/070841 patent/WO2017120808A1/en active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1883241A (en) * | 2003-11-21 | 2006-12-20 | 罗姆股份有限公司 | Circuit board |
| CN1816249A (en) * | 2005-01-31 | 2006-08-09 | 株式会社东芝 | Circuit board |
| JP2009117123A (en) * | 2007-11-05 | 2009-05-28 | Yazaki Corp | Connection structure between electric wire and printed-circuit board |
| KR20090040273A (en) * | 2009-03-20 | 2009-04-23 | 나병영 | A radiation device of heat for fet of rectifier output |
| CN202535643U (en) * | 2012-02-24 | 2012-11-14 | 昆山华晨电子有限公司 | Aluminium printed circuit board |
| CN205491425U (en) * | 2016-01-12 | 2016-08-17 | 深圳市立洋光电子股份有限公司 | Supplementary welded structure of ALCPCB board |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108232494A (en) * | 2016-12-09 | 2018-06-29 | 富士康(昆山)电脑接插件有限公司 | Circuit board assemblies and its manufacturing method |
| CN108723538A (en) * | 2018-07-19 | 2018-11-02 | 广东盛路通信科技股份有限公司 | A kind of low-temperature welding method and equipment |
| CN110972394A (en) * | 2019-12-31 | 2020-04-07 | 中科可控信息产业有限公司 | Circuit board structure and electronic equipment |
| CN110972394B (en) * | 2019-12-31 | 2021-03-23 | 中科可控信息产业有限公司 | Circuit board structure and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017120808A1 (en) | 2017-07-20 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160406 |
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| RJ01 | Rejection of invention patent application after publication |