CN108723538A - A kind of low-temperature welding method and equipment - Google Patents

A kind of low-temperature welding method and equipment Download PDF

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Publication number
CN108723538A
CN108723538A CN201810799074.4A CN201810799074A CN108723538A CN 108723538 A CN108723538 A CN 108723538A CN 201810799074 A CN201810799074 A CN 201810799074A CN 108723538 A CN108723538 A CN 108723538A
Authority
CN
China
Prior art keywords
cable
welding
low
temperature
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810799074.4A
Other languages
Chinese (zh)
Inventor
陈耀平
黄绍明
杨必友
叶健森
梁子锋
刘�东
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Shenglu Telecommunication Tech Co Ltd
Original Assignee
Guangdong Shenglu Telecommunication Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangdong Shenglu Telecommunication Tech Co Ltd filed Critical Guangdong Shenglu Telecommunication Tech Co Ltd
Priority to CN201810799074.4A priority Critical patent/CN108723538A/en
Publication of CN108723538A publication Critical patent/CN108723538A/en
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/02—Soldering irons; Bits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor

Abstract

The invention discloses a kind of low-temperature welding methods, which is characterized in that it is to use tin cream welding manner, using low temperature tin cream, cable is first assembled into circuit board to correspond on pad, cable, welding disking area add tin cream, are then again welded together cable and board pads at 300 DEG C or less with soldering iron.The present invention is simple to operate, can solve 280 DEG C of moment resistance to temperature or less cable and be welded on circuit board problem.

Description

A kind of low-temperature welding method and equipment
Technical field
The present invention relates to the cable of electronic circuit board welding process technique fields, more particularly to electronic circuit board and cable The method and apparatus of welding.
Background technology
Existing circuit board and cable welding manner are to be welded using tin silk (fusing point of tin silk is at 280 DEG C or more) and soldering iron Equipment carries out soldering.When actual production, this technology application necessarily requires 330 DEG C of welding temperature or more, and cable is interior Insulating layer must use the insulating materials (400 DEG C of moment high temperature resistant) of polytetrafluoroethylene (PTFE) (PTFE/ Teflons) material, and two conditions are same Shi Chengli could meet welding requirements.But it is FEP materials cable (280 DEG C of moment resistance to temperature or less) for inner insulating layer Product is not applicable.The prior art can cause FEP material cables short circuit or insulating materials damaged, and such properties of product is caused to fail Or bad order.In order to solve the problems, such as this, new low-temperature bounding method is developed.
Invention content
The purpose of the present invention is exactly to optimize product in order to which the one kind for solving the deficiency of the prior art and providing is easy to operate Quality improves the low-temperature welding method and equipment of production efficiency.
The present invention is to realize above-mentioned purpose using following technical solution：A kind of low-temperature welding method, feature exist In it is that cable is first assembled into circuit board and is corresponded on pad using low temperature tin cream using tin cream welding manner, cable, pad Region adds tin cream, is then again welded together cable and board pads at 300 DEG C or less with soldering iron.
As a further illustration of the above scheme, the cable uses moment 280 DEG C of cables below of resistance to temperature.
A kind of low-temperature welding equipment, which is characterized in that including fixation clip, welder, if being provided on fixation clip Dry welding slot, is used for fixing circuit board and cable, and welder is arranged above fixation clip, and the soldering tip of welder prolongs Stretch to welding slot.
Further, it is provided with compression bar on the welding slot, cable presses between compression bar and circuit board.
The compression bar has angle with cable.
The present invention is using the attainable advantageous effect of above-mentioned technical solution institute：
The present invention uses low temperature tin cream, and cable is first assembled into circuit board and is corresponded on pad, cable, welding disking area add tin Then cable and board pads are welded together with soldering iron (300 DEG C or less), compared with prior art, can be solved by cream again 280 DEG C of moment resistance to temperature or less cable is welded on circuit board problem.
Description of the drawings
Fig. 1 is the structural diagram of the present invention.
Reference sign：1, cable 2, circuit board 3, fixation clip 4, welder 5, welding slot 6, compression bar.
Specific implementation mode
The technical program is explained in detail below in conjunction with specific embodiment.
As shown in Figure 1, the present invention is a kind of low-temperature welding method, it is to use tin cream welding manner, using low temperature tin cream, Cable 1 is first assembled into circuit board 2 to correspond on pad, cable, welding disking area add tin cream, then use soldering iron at 300 DEG C or less again Cable and board pads are welded together.Cable uses moment 280 DEG C of cables below of resistance to temperature.
It is low-temperature welding equipment corresponding with the low-temperature welding method, including fixation clip 3, welder 4 below, It is provided with several welding slots 5 on fixation clip, is used for fixing circuit board and cable, welder is arranged on fixation clip The soldering tip of side, welder extends to welding slot.It is provided with compression bar 6 on welding slot, compression bar has angle with cable, generally It is vertical, cable presses between compression bar and circuit board.
Compared with prior art, the present invention using low temperature tin cream, cable is first assembled into circuit board and is corresponded on pad, line Cable, welding disking area add tin cream, are then again welded together cable and board pads with soldering iron (300 DEG C or less), and existing Technology is compared, and can be solved 280 DEG C of moment resistance to temperature or less cable and is welded on circuit board problem.
What has been described above is only a preferred embodiment of the present invention, it is noted that for those of ordinary skill in the art For, without departing from the concept of the premise of the invention, various modifications and improvements can be made, these belong to the present invention Protection domain.

Claims (5)

1. a kind of low-temperature welding method, which is characterized in that it is to use tin cream welding manner, using low temperature tin cream, first by cable It is assembled into circuit board to correspond on pad, cable, welding disking area add tin cream, then use soldering iron at 300 DEG C or less by cable and electricity again Road plate pad solder is together.
2. a kind of low-temperature welding method according to claim 1, which is characterized in that the cable uses moment resistance to temperature 280 DEG C of cables below.
3. a kind of low-temperature welding equipment corresponding with low-temperature welding method as claimed in claim 1 or 2, which is characterized in that including Fixation clip, welder are provided with several welding slots on fixation clip, are used for fixing circuit board and cable, welding dress It installs above fixation clip, the soldering tip of welder extends to welding slot.
4. low-temperature welding equipment according to claim 3, which is characterized in that be provided with compression bar, line on the welding slot Cable presses between compression bar and circuit board.
5. low-temperature welding equipment according to claim 3, which is characterized in that compression bar has angle with cable.
CN201810799074.4A 2018-07-19 2018-07-19 A kind of low-temperature welding method and equipment Pending CN108723538A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810799074.4A CN108723538A (en) 2018-07-19 2018-07-19 A kind of low-temperature welding method and equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810799074.4A CN108723538A (en) 2018-07-19 2018-07-19 A kind of low-temperature welding method and equipment

Publications (1)

Publication Number Publication Date
CN108723538A true CN108723538A (en) 2018-11-02

Family

ID=63926772

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810799074.4A Pending CN108723538A (en) 2018-07-19 2018-07-19 A kind of low-temperature welding method and equipment

Country Status (1)

Country Link
CN (1) CN108723538A (en)

Citations (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1989006581A1 (en) * 1985-12-09 1989-07-27 Henry Kim Means and method for soldering and desoldering electronic components
US5332144A (en) * 1993-03-17 1994-07-26 Pace, Incorporated Concave soldering iron tip and method of soldering using same
JPH0716740A (en) * 1993-06-30 1995-01-20 Tokin Corp Soldering iron and soldering method using the same
JPH11239866A (en) * 1997-12-19 1999-09-07 Nihon Almit Co Ltd Low-temperature soldering method
US6371805B1 (en) * 2000-12-28 2002-04-16 Hon Hai Precision Ind. Co., Ltd. Cable assembly and method for making the same
JP2003008229A (en) * 2001-06-25 2003-01-10 Matsushita Electric Ind Co Ltd Printed circuit board and method of manufacturing the same
JP2007221138A (en) * 2007-02-14 2007-08-30 Sanyo Electric Co Ltd Soldering method of tab lead
CN101198220A (en) * 2007-12-28 2008-06-11 天津三星电机有限公司 Method of welding varnished wire and plated circuit soft plate in electronic component
CN202498277U (en) * 2012-02-29 2012-10-24 博罗县精汇电子科技有限公司 Rotary type manual soldering device
CN203368927U (en) * 2013-06-26 2013-12-25 深圳市晶福源电子技术有限公司 PCB pad
CN103495784A (en) * 2013-10-12 2014-01-08 四川钟顺太阳能开发有限公司 Welding jig for grating solar battery pieces and welding process thereof
CN103917056A (en) * 2012-12-31 2014-07-09 联想(北京)有限公司 Welding process and circuit board
CN203875447U (en) * 2014-05-27 2014-10-15 张曹 Ultrasonic wave low-temperature brazing device
CN104682016A (en) * 2013-11-26 2015-06-03 广东盛路通信科技股份有限公司 Multi-frequency miniaturized handset antenna
CN204686241U (en) * 2015-05-07 2015-10-07 天地融科技股份有限公司 Press welding device
CN105472879A (en) * 2016-01-12 2016-04-06 深圳市立洋光电子股份有限公司 Auxiliary welding structure of ALC PCB and preparation technology of auxiliary welding structure
US20160285221A1 (en) * 2013-07-22 2016-09-29 Frisimos, Ltd. Method and system of an automatic-robotic-cable-connector-assembly system
CN206361663U (en) * 2017-01-04 2017-07-28 浙江阳光美加照明有限公司 A kind of bonding wire structure of high heat conduction light source board
CN207606379U (en) * 2017-12-12 2018-07-13 深圳市优特利电源有限公司 A kind of welding structure and welding fixture
CN207625857U (en) * 2017-10-20 2018-07-17 广州广电运通金融电子股份有限公司 A kind of circuit board
CN208743872U (en) * 2018-07-19 2019-04-16 广东盛路通信科技股份有限公司 A kind of low-temperature welding equipment

Patent Citations (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1989006581A1 (en) * 1985-12-09 1989-07-27 Henry Kim Means and method for soldering and desoldering electronic components
US5332144A (en) * 1993-03-17 1994-07-26 Pace, Incorporated Concave soldering iron tip and method of soldering using same
JPH0716740A (en) * 1993-06-30 1995-01-20 Tokin Corp Soldering iron and soldering method using the same
JPH11239866A (en) * 1997-12-19 1999-09-07 Nihon Almit Co Ltd Low-temperature soldering method
US6371805B1 (en) * 2000-12-28 2002-04-16 Hon Hai Precision Ind. Co., Ltd. Cable assembly and method for making the same
JP2003008229A (en) * 2001-06-25 2003-01-10 Matsushita Electric Ind Co Ltd Printed circuit board and method of manufacturing the same
JP2007221138A (en) * 2007-02-14 2007-08-30 Sanyo Electric Co Ltd Soldering method of tab lead
CN101198220A (en) * 2007-12-28 2008-06-11 天津三星电机有限公司 Method of welding varnished wire and plated circuit soft plate in electronic component
CN202498277U (en) * 2012-02-29 2012-10-24 博罗县精汇电子科技有限公司 Rotary type manual soldering device
CN103917056A (en) * 2012-12-31 2014-07-09 联想(北京)有限公司 Welding process and circuit board
CN203368927U (en) * 2013-06-26 2013-12-25 深圳市晶福源电子技术有限公司 PCB pad
US20160285221A1 (en) * 2013-07-22 2016-09-29 Frisimos, Ltd. Method and system of an automatic-robotic-cable-connector-assembly system
CN103495784A (en) * 2013-10-12 2014-01-08 四川钟顺太阳能开发有限公司 Welding jig for grating solar battery pieces and welding process thereof
CN104682016A (en) * 2013-11-26 2015-06-03 广东盛路通信科技股份有限公司 Multi-frequency miniaturized handset antenna
CN203875447U (en) * 2014-05-27 2014-10-15 张曹 Ultrasonic wave low-temperature brazing device
CN204686241U (en) * 2015-05-07 2015-10-07 天地融科技股份有限公司 Press welding device
CN105472879A (en) * 2016-01-12 2016-04-06 深圳市立洋光电子股份有限公司 Auxiliary welding structure of ALC PCB and preparation technology of auxiliary welding structure
CN206361663U (en) * 2017-01-04 2017-07-28 浙江阳光美加照明有限公司 A kind of bonding wire structure of high heat conduction light source board
CN207625857U (en) * 2017-10-20 2018-07-17 广州广电运通金融电子股份有限公司 A kind of circuit board
CN207606379U (en) * 2017-12-12 2018-07-13 深圳市优特利电源有限公司 A kind of welding structure and welding fixture
CN208743872U (en) * 2018-07-19 2019-04-16 广东盛路通信科技股份有限公司 A kind of low-temperature welding equipment

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
梅开乡等: "电子电路设计与制作 电子技术课程设计教学指导", vol. 2, 北京理工大学出版社, pages: 175 - 176 *

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