JPH0716740A - Soldering iron and soldering method using the same - Google Patents

Abstract

PURPOSE:To provide a soldering iron and soldering method by which soldering can be executed in a short time. CONSTITUTION:The soldering iron is composed of a grip 7 having an electric wiring 8, a hollow metallic heat radiating bar 6, a metallic part 2, a metallic bar 3 to which the metallic part is fixed with a fixing screw 5 and a metallic cylinder 4 in the tip of the metallic bar. By using this soldering iron, the metallic cylinder 4 is heated by energizing or with a heater to execute the soldering.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering iron and a soldering method.

[0002]

2. Description of the Related Art An example of a conventional soldering iron and a soldering method is shown in FIG. 3. In the conventional soldering iron, a metal portion 2 for fixing the tip of a soldering iron by a fixing screw 5 is used. A metal rod 3 is attached to the. The metal portion 2 is fixed to the hollow metal heat dissipation rod 6 through which the wiring passes and which has a heat dissipation hole. The hollow metal radiator plate 6 has a handle 7 through which the electric wiring 8 passes, and the electric wiring 8 passes through the handle 7 to the outside and is connected to a power source. By connecting the electric wiring 8 and the power source, the metal rod 3 of the soldering iron is heated, and the solder is melted and bonded by the solder.

On the other hand, the conventional method of soldering using a soldering iron is needless to say, but the metal rod 3 at the tip of the above-mentioned soldering iron is heated to solder the metal film 1 or the like. It is common to melt and solder.

[0004]

In the work of adhering solder with a soldering iron as a solvent, in order to fix the solder efficiently at an arbitrary position on the metal surface, Is the area to be fixed with a soldering iron,
It is necessary to apply enough heat to melt the solder. However,
When the surface area of the object to which the solder is fixed is large and the fixing region is small, soldering becomes difficult, and a large amount of heat is required to heat the fixing region to the required temperature for soldering. When the soldering work is performed with a member having a large heat capacity, the heat conduction to the portion other than the fixed region is naturally large.
For example, when the member that performs the soldering work has a large degree of heat conduction to the portion other than the solder fixing area, the solder may not be used.

In order to eliminate these drawbacks, the object of the present invention is to use a metal cylinder as the tip of the soldering iron that contacts the metal surface and heats it, so that the object to which the solder can be fixed more quickly is fixed to the required temperature. Solder while heating to surround the area. As a result, less heat is dissipated near the midpoint of the metal cylinder, and the heat becomes faster and higher.
The temperature reaches the point where the solder melts in a short time. By heating in a short time, the heat conduction to the surroundings can be made smaller than that of the conventional one, so that it is effective for a substance having a large heat conduction, which is apt to be oxidizable and dislikes high heat. If you supply solder here and melt it,
It is an object of the present invention to provide a soldering iron having a metal cylinder at the tip and a soldering method using the same, which can reduce heat conduction to a region other than the fixed region and reduce the influence of heat.

[0006]

According to the present invention, there is provided a soldering iron characterized in that the tip of the metal rod of the soldering iron is a metal cylinder.

According to the present invention, a soldering iron having a metal cylinder at the tip is used, and a portion of the metal cylinder is heated by a heater to a temperature equal to or higher than the melting point of the solder to surround an area to be soldered, thereby melting the solder. Then, the soldering method using the above-mentioned soldering iron, which is characterized in that the metal member is bonded, can be obtained.

[0008]

According to the present invention, the tip of the soldering iron that contacts and heats the metal surface is a metal cylinder, so that the metal surface heated from the metal cylinder forms a high heat region by heat conduction for a short time. The temperature reaches the point where the solder melts.
In the metal cylinder having a shape in which the high temperature region is efficiently generated, since the high temperature center point is located at an equal distance from the bottom surface of the cylinder in contact with the metal surface, heat can be well transferred and the predetermined temperature can be efficiently reached. Therefore, if the cylindrical portion in contact with the metal surface is heated, the solder is heated to a necessary temperature for melting the solder in the vicinity of the center in a short time, and the solder can be fixed. Also, during this time, heat release to areas other than the fixed area is small because it is surrounded by the heated cylindrical portion, and the temperature near the center point of the cylinder becomes faster due to the melting temperature of the solder, and the wall thickness and inner diameter radius of the cylinder are minimized. By making it small, it becomes a structure in which heat release to areas other than the fixed region is further suppressed and the influence of oxidation and the like due to high heat can be reduced. Further, since it has a cylindrical shape, it is possible to supply solder and work on wiring material while heating. The substantially cylindrical shape may be a C shape, and these effects can be obtained as long as it substantially surrounds the area to be soldered.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to the drawings.

As shown in FIG. 1 (a), the soldering iron of the present invention has a handle 7 through which an electric wire 8 passes, a hollow metal heat dissipation rod 6 having a heat dissipation hole, a metal portion 2 and a metal. A soldering iron having a metal rod 3 whose portion is fixed by a fixing screw 5 and a metal cylinder 4 at the tip of the metal rod.

FIG. 1 is a perspective view showing a state where the soldering iron of the present invention is brought into contact with a metal surface. Figure 1 (a)
In the soldering iron of the present invention, the metal cylinder 2 is attached to the metal portion 2 for inserting and fixing the tip, the metal cylinder 3 is attached to the tip of the metal rod 3 having good heat conduction, and the metal rod including the tip portion of the soldering iron is fixed. It is fixed by screws 5. The heated metal part 2 is a hollow metal heat dissipation rod 6 having a heat dissipation hole through which a wiring drawn for heating by electric resistance and electric resistance is passed.
Has been fixed. Further, the hollow metal heat radiating rod 6 radiating heat through the heat radiating hole has a handle 7 and is fixed to the handle 7 made of plastic or wood having a low thermal conductivity, so that the soldering work can be performed. There is. The electric wiring 8 for heating the metal portion 2 by the electric resistance is passed through the handle 7 to the outside and connected to the power source. In FIG. 1, the bottom surface of the metal cylinder 4 heated by a heater or electricity is the metal film 1
The element 9 which is destroyed by a temperature near the melting point of the solder is fixed near the metal cylinder 4 on the metal film 1. Normally, the element 9 is destroyed near the melting point of the solder, and therefore, in such a state, the soldering work requires careful attention.

FIG. 1 (b) is a perspective view in which the tip of the soldering iron is enlarged and the metal cylinder 4 is seen through. The bottom surface of the hollow portion 10 of the metal cylinder 4 indicated by hatching is the metal film 1 of the metal cylinder 4.
The bottom surface 11 of the metal cylinder that is in contact with is heated to a temperature at which the solder melts. here,
When the temperature at which the solder melts is reached in a short time and the distance from the outer circumference of the metal cylinder 4 to the element 9 is larger than the distance from the inner circumference to the outer circumference of the metal cylinder 4, the heat for melting the solder of the metal cylinder 4 is The heat is dissipated by the time it reaches the element 9, and the temperature becomes low, so that the element 9 is less likely to be broken.

FIGS. 2A to 2C are explanatory views sequentially showing a soldering method using the soldering iron of the present invention to melt the solder and fix the lead wire. In FIG. 2 (a), the metal cylinder 1 at the tip of the soldering iron is brought into contact with the metal film 1 and heated, and the bottom surface of the hollow portion 10 of the metal cylinder 4 on the metal film 1 reaches the temperature at which the solder melts. The state is shown, and the solder 12 is put into the hollow portion 10. FIG. 2B shows the solder 1 on the metal film 1.
2 shows a state in which the metal cylinder 4 at the tip of the soldering iron is lifted vertically upward with respect to the metal film 1 in a state where 2 is melted and attached. Next, FIG. 2C shows how the lead wire 13 is quickly fixed to the solder 12. By making the state shown in FIG. 2B, the solder 12 once melted is somewhat hardened, but the high temperature is maintained for a short time. While maintaining the high temperature, the tip portion 14 of the conventional soldering iron, which has a temperature capable of melting the solder, is quickly brought into contact with the solder 12 to be melted again, and the lead wire 13 is put into the solder 12. Figure 2
FIG. 2D is a state in which the tip portion of the conventional soldering iron is separated from the solder 12 and the solder 12 is cooled by heat radiation and cured, as shown in FIG. Since high-temperature heat conduction to areas other than the solder fixing area during a series of operations occurs only in a small range around the metal cylinder 4,
Even if there is a substance on the metal film 1 which is far from the metal cylinder 4 and dislikes the temperature close to the melting point of the solder, the influence is very small.

[0014]

By using the soldering iron of the present invention,
It is possible to reduce a defective phenomenon due to heat conduction in a region other than the fixing region, which has occurred when fixing with a conventional soldering iron. Further, since the solder can be fixed in a short time, the working time can be greatly shortened when soldering is performed on a metal having a large heat capacity.

[Brief description of drawings]

FIG. 1 is an external perspective view showing a state in which a tip of a soldering iron is brought into contact with the surface of a metal film, as viewed obliquely.
Shows a perspective view showing the entire soldering iron, and FIG. 1B shows an enlarged perspective view of the tip of the soldering iron.

FIG. 2 is an explanatory diagram showing a flow when solder is melted on the surface of a metal film to fix a lead wire, and FIG. 2 (a) shows a process of heating a soldering iron and putting the solder into a metal cylinder. 2B is a perspective view showing a process in which the soldering iron is lifted vertically upward with respect to the metal film after the solder is melted, and FIG. FIG. 2D is a perspective view showing a process of melting the solder by using a soldering iron and fixing the lead wire to the solder, and FIG. 2D shows a process of cooling the solder and fixing the solder, the lead wire, and the metal film to complete the work. Perspective view.

FIG. 3 is a perspective view showing a conventional soldering iron.

[Explanation of symbols]

 1 Metal Film 2 Metal Part 3 Metal Rod 4 Metal Cylinder 5 Fixing Screw 6 Hollow Metal Heat Dissipator 7 Handle 8 Electrical Wiring 9 Element 10 Hollow Part 11 Metal Cylinder Bottom 12 Solder 13 Lead Wire 14 Tip Part

Claims (2)

[Claims] 1. A soldering iron, wherein the tip of a metal rod of the soldering iron is formed into a substantially cylindrical shape. 2. A soldering iron whose tip is a metal cylinder is used, and the metal cylinder is heated to a temperature equal to or higher than the melting point of the solder to surround a region to be soldered, thereby melting the solder and adhering the metal portion. A soldering method using the soldering iron according to claim 1.