JPH02147166A - Heating element assembling body for electric soldering iron and electric soldering iron - Google Patents
Heating element assembling body for electric soldering iron and electric soldering ironInfo
- Publication number
- JPH02147166A JPH02147166A JP30140288A JP30140288A JPH02147166A JP H02147166 A JPH02147166 A JP H02147166A JP 30140288 A JP30140288 A JP 30140288A JP 30140288 A JP30140288 A JP 30140288A JP H02147166 A JPH02147166 A JP H02147166A
- Authority
- JP
- Japan
- Prior art keywords
- soldering iron
- heating element
- aluminum nitride
- electric
- electric soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 title claims abstract description 88
- 229910052742 iron Inorganic materials 0.000 title claims abstract description 44
- 238000005476 soldering Methods 0.000 title claims abstract description 41
- 238000010438 heat treatment Methods 0.000 title claims abstract description 38
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims abstract description 19
- 229910052751 metal Inorganic materials 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims abstract description 6
- 238000004544 sputter deposition Methods 0.000 claims abstract description 5
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 5
- 239000010937 tungsten Substances 0.000 claims abstract description 5
- 238000005530 etching Methods 0.000 claims abstract description 4
- 238000007639 printing Methods 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 13
- 239000010408 film Substances 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 239000010409 thin film Substances 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 238000007740 vapor deposition Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 6
- 229910052802 copper Inorganic materials 0.000 abstract description 6
- 239000010949 copper Substances 0.000 abstract description 6
- 229910000623 nickel–chromium alloy Inorganic materials 0.000 abstract description 4
- 238000004804 winding Methods 0.000 abstract description 3
- 230000002542 deteriorative effect Effects 0.000 abstract 2
- 238000009413 insulation Methods 0.000 abstract 2
- 239000000615 nonconductor Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 238000010292 electrical insulation Methods 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 235000000396 iron Nutrition 0.000 description 1
- -1 nickel-chromium-aluminum Chemical compound 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
イ0発明の目的
〔産業上の利用分野〕
本発明は、電子回路の回路組立て等に使用する電気半田
こてであって、窒化アルミニウムを電気半田こて用加熱
素子組立体に用い、又、該加熱素子組立体を用いた電気
半日こてに関する。DETAILED DESCRIPTION OF THE INVENTION A. Object of the Invention [Field of Industrial Application] The present invention is an electric soldering iron used for circuit assembly of electronic circuits, in which aluminum nitride is used as a heating element for the electric soldering iron. The present invention also relates to an electric half-day trowel using the heating element assembly.
従来の電気半田こては、第3図に示すように半田こて先
3には熱伝導の良好な銅で製作し、加熱素子組立体とし
ては、ヒータ線1を雲母等の電気絶縁物2を介在させ、
こて、こて先、ヒータ線、電気絶縁物を保持金具4によ
り保持し、又、一部の半田こてではヒータ線の代わりに
セラミックヒータが使用されている。In the conventional electric soldering iron, as shown in Fig. 3, the soldering iron tip 3 is made of copper, which has good heat conduction, and the heating element assembly is made of a heater wire 1 made of an electrical insulating material 2 such as mica. intervene,
The iron, iron tip, heater wire, and electrical insulator are held by a holding metal fitting 4, and some soldering irons use a ceramic heater instead of the heater wire.
前記、従来の加熱素子組立体に使用される雲母等の電気
絶縁物は脆く、熱伝導率も1.8X10−3cal/c
m、 sec、 ’Cと悪いため、電気絶縁物を薄くす
る必要があった。そのため、ヒータ線が電気絶縁不良を
起し易く、こて先から被半田付物へ漏電してIC等の電
子部品を破壊したりした。又、電気絶縁物による熱伝導
損失が大きいため、発熱体をこて先の必要温度より、よ
り高く発熱させる必要があり、消費電力が大きくなると
共に電気半田こでの把手までも熱くなるという問題があ
った。As mentioned above, the electrical insulating material such as mica used in the conventional heating element assembly is brittle and has a thermal conductivity of 1.8X10-3 cal/c.
m, sec, 'C, so it was necessary to make the electrical insulator thinner. As a result, the heater wires tend to suffer from poor electrical insulation, causing current leakage from the tip of the soldering iron to the object to be soldered, resulting in destruction of electronic components such as ICs. In addition, because the heat conduction loss due to electrical insulators is large, it is necessary to heat the heating element higher than the required temperature of the soldering iron tip, which increases power consumption and causes the handle of the electric soldering iron to become hot. was there.
口0発明の構成
〔課題を解決するための手段〕
本発明は前記問題点を解決するために、電気半田こて用
加熱素子組立体に、高熱伝導セラミックスである窒化ア
ルミニウムからなり、端部に半田こて先を嵌挿する軸受
を有する柱状、又は管状の絶縁基体を用い、その外周上
に発熱体を配設した加熱素子、とにより形成したもので
ある。Structure of the Invention [Means for Solving the Problems] In order to solve the above-mentioned problems, the present invention provides a heating element assembly for an electric soldering iron made of aluminum nitride, which is a highly thermally conductive ceramic, It is formed by using a columnar or tubular insulating substrate having a bearing into which a soldering iron tip is inserted, and a heating element having a heating element disposed on the outer periphery of the insulating substrate.
窒化アルミニウムはその体積固有抵抗が10+3Ω−c
m’以上の電気絶縁物である一方、熱伝達能力に優れ、
アルミニウムと同等の熱伝導率を有する。Aluminum nitride has a volume resistivity of 10+3Ω-c
While it is an electrical insulator with a diameter of more than m', it has excellent heat transfer ability,
Has thermal conductivity equivalent to aluminum.
銅、アルミニウム、鉄の熱伝導率はそれぞれ0、934
.0.503.0.175 [cal/Cm、 see
、 ’C)であり、一方、窒化アルミニウムは0.45
ないし0.5 (cal/cm、 sec、 ’C)で
ある。又、耐久性、耐食性に優れたセラミックスである
。The thermal conductivities of copper, aluminum, and iron are 0 and 934, respectively.
.. 0.503.0.175 [cal/Cm, see
, 'C), while aluminum nitride is 0.45
to 0.5 (cal/cm, sec, 'C). Additionally, it is a ceramic with excellent durability and corrosion resistance.
即ち本考案は、
1、一端に半田こて先を挿入する軸受を形成した窒化ア
ルミニウムからなる柱状、又は管状の絶縁基体に、該絶
縁基体の外周上に絶縁基体表面に密着し巻回された加熱
素子とからなることを特徴とした電気半田こて用加熱素
子組立体。That is, the present invention has the following features: 1. A columnar or tubular insulating substrate made of aluminum nitride, which has a bearing formed at one end into which a soldering iron tip is inserted, is wound on the outer periphery of the insulating substrate in close contact with the surface of the insulating substrate. A heating element assembly for an electric soldering iron, characterized by comprising a heating element.
2、請求項1記載の窒化アルミニウムからなる絶縁基体
の外周上に巻回する加熱素子は、タングステンペースト
等の高融点金属を印刷・焼付けによる厚膜法、又はニッ
ケルクロム合金等の薄膜をスパッタ・蒸着・メッキし、
エツチングにより形成したことを特徴とする電気半田こ
て用加熱素子組立体。2. The heating element wound around the outer periphery of the insulating substrate made of aluminum nitride according to claim 1 is produced by a thick film method by printing and baking a high melting point metal such as tungsten paste, or by sputtering and sputtering a thin film such as a nickel chromium alloy. Evaporated and plated,
A heating element assembly for an electric soldering iron, characterized in that it is formed by etching.
3、請求項1、又は請求項2記載の半田こて用加熱素子
組立体の一端に設けた軸受に半田こて先を挿入し、半田
こて先と加熱素子組立体とを包み、半田こて先と加熱素
子組立体端部外周を中空状のスリーブで固定し、中空状
のスリーブを把手に固定されている保持金具にねじによ
り固定した構造としたことを特徴とする電気半田用こて
である。3. Insert the soldering iron tip into the bearing provided at one end of the heating element assembly for a soldering iron according to claim 1 or claim 2, wrap the soldering iron tip and the heating element assembly, and then An electric soldering iron characterized by having a structure in which the tip and the outer periphery of the end of the heating element assembly are fixed with a hollow sleeve, and the hollow sleeve is fixed with a screw to a holding fitting fixed to the handle. It is.
窒化アルミニウムからなる円柱状、角柱状の柱状、又は
管柱状の絶縁基体の外周上に高抵抗体からなるニッケル
・クローム合金にニッケル・クローム・アルミニウム合
金等の高抵抗金属からなるヒータ線や、タングステンペ
ースト等で厚膜法により直接形成された加熱素子、ポジ
スタ、サーミスタと呼ばれる半導体加熱素子から加えら
れる熱は、窒化アルミニウムからなる絶縁基体を介して
銅、又は銅合金からなる半田こて先に伝達される。On the outer periphery of a cylindrical, prismatic, or tubular insulating substrate made of aluminum nitride, a heater wire made of a high resistance metal such as a nickel-chromium alloy made of a high-resistance element, a nickel-chromium-aluminum alloy, or a tungsten Heat applied from a semiconductor heating element called a positor or thermistor, which is directly formed using a thick film method using paste, etc., is transmitted to a soldering iron tip made of copper or a copper alloy through an insulating base made of aluminum nitride. be done.
窒化アルミニウムは、高熱伝導、高耐久性を有する絶縁
基体であるので、従って電気絶縁不良による被半田物の
破壊を防止出来ると共に、熱伝達損失が少なく、熱応答
性が速くなる等の長所を有する電気半田こて用加熱素子
組立体、及び電気半田こてを構成出来る。Aluminum nitride is an insulating substrate with high thermal conductivity and high durability, so it can prevent damage to soldered objects due to poor electrical insulation, and has advantages such as less heat transfer loss and faster thermal response. A heating element assembly for an electric soldering iron and an electric soldering iron can be constructed.
次に、本発明の実施例について図面を参照し説明する。 Next, embodiments of the present invention will be described with reference to the drawings.
第1図に示す実施例は、本発明による加熱素子組立体の
構成図である。円柱状、角柱状、又は管状に形成された
窒化アルミニウム絶縁基体5の一端には銅、又は銅合金
からなる半田こて先3の軸を嵌挿する中空の軸受7が形
成されている。加熱素子6は窒化アルミニウム絶縁基体
5の外周上に直接ヒータ線を巻き付けて形成するか、サ
ーミスタポジスタ等の半導体発熱体、又は、タングステ
ンペースト等の高融点金属や、ニッケル・クローム合金
等のスパッタ膜を絶縁基体外周に沿ってスパイラル状に
印刷・焼付け、又はエツチングによって形成したもので
ある。The embodiment shown in FIG. 1 is a block diagram of a heating element assembly according to the present invention. A hollow bearing 7 into which the shaft of a soldering iron tip 3 made of copper or copper alloy is inserted is formed at one end of the aluminum nitride insulating base 5 formed in a columnar, prismatic, or tubular shape. The heating element 6 may be formed by winding a heater wire directly on the outer periphery of the aluminum nitride insulating substrate 5, or may be formed by a semiconductor heating element such as a thermistor positor, or a sputtered film of a high melting point metal such as tungsten paste, or a nickel-chromium alloy. is formed by printing, baking, or etching in a spiral shape along the outer periphery of the insulating base.
第2図は第1図に示す加熱素子組立体を用いた電気半田
こての構成図を示すものである。窒化アルミニウム絶縁
基体5の半田こて先3の軸受7を有する端部は、鋼製、
又はセラミックス製のスリーブ9で嵌合固定される。半
田こて先3の軸はスリーブ9の中空を通して絶縁基体の
軸受に嵌挿され、スリーブ9に設けたねじ穴を通してね
じ10で半田こて先3を固定する。スリーブ9は又、こ
ての把手に固定された保持金具11とねじ10によって
固定されており、半日こてを形成する。FIG. 2 shows a block diagram of an electric soldering iron using the heating element assembly shown in FIG. The end portion of the aluminum nitride insulating base 5 having the bearing 7 of the soldering iron tip 3 is made of steel;
Alternatively, it is fitted and fixed with a ceramic sleeve 9. The shaft of the soldering iron tip 3 is inserted into the bearing of the insulating base through the hollow of the sleeve 9, and the soldering iron tip 3 is fixed with a screw 10 through a screw hole provided in the sleeve 9. The sleeve 9 is also fixed by a screw 10 to a retaining fitting 11 fixed to the handle of the trowel, forming a half-day trowel.
ハ0発明の効果
本発明は、以上に説明したように構成されているので、
以下に記載されるような効果を奏する。Effects of the Invention Since the present invention is configured as explained above,
This produces the effects described below.
高熱伝導性、耐久性、電気絶縁性に優れる窒化アルミニ
ウムを加熱素子組立ての絶縁基体とすることにより、電
気絶縁不良による漏電により被半田付物である電子部品
の破壊を防止出来る。又、発熱体素子と半田こて先の熱
伝達損失が小さくなることで局部的な加熱によりこて把
手部分が熱くなったり、半田こて光温度が適切になるま
で時間がかかる等の問題を解決するだけでなく、省エネ
ルギー効果が期待出来る。By using aluminum nitride, which has excellent thermal conductivity, durability, and electrical insulation, as the insulating base for the heating element assembly, it is possible to prevent electronic components to be soldered from being destroyed due to current leakage due to poor electrical insulation. In addition, because the heat transfer loss between the heating element and the soldering iron tip is reduced, problems such as the iron handle becoming hot due to local heating and the time required for the soldering iron light temperature to become appropriate can be avoided. Not only will it solve the problem, but it can also be expected to save energy.
第1図は、本発明による電気半日こての加熱素子組立体
の構成を示す断面図。
第2図は、本発明による電気半田こてのこて先部分の構
成を示す断面図。
第3図は、従来の電気半田こて加熱部の構成を示す断面
図。
l・・・ヒータ線、2.8・・・電気絶縁物、3・・・
半田こで先。
4.11・・・保持金具、5・・・窒化アルミニウム絶
縁基体、6・・・加熱素子、7・・・軸受、9・・・ス
リーブ、 10・・・ねじ。FIG. 1 is a sectional view showing the configuration of a heating element assembly for an electric half-day trowel according to the present invention. FIG. 2 is a sectional view showing the configuration of the tip portion of the electric soldering iron according to the present invention. FIG. 3 is a sectional view showing the configuration of a conventional electric soldering iron heating section. l... Heater wire, 2.8... Electrical insulator, 3...
Handa first. 4.11... Holding fitting, 5... Aluminum nitride insulating base, 6... Heating element, 7... Bearing, 9... Sleeve, 10... Screw.
Claims (1)
ルミニウムからなる柱状、又は管状の絶縁基体に、該絶
縁基体の外周上に絶縁基体表面に密着し巻回された加熱
素子とからなることを特徴とした電気半田こて用加熱素
子組立体。 2、請求項1記載の窒化アルミニウムからなる絶縁基体
の外周上に巻回する加熱素子は、タングステンペースト
等の高融点金属を印刷・焼付けによる厚膜法、又はニッ
ケルクローム合金等の薄膜をスパッタ・蒸着・メッキし
、エッチングにより形成したことを特徴とする電気半田
こて用加熱素子組立体。 3、請求項1、又は請求項2記載の半田こて用加熱素子
組立体の一端に設けた軸受に半田こて先を挿入し、半田
こて先と加熱素子組立体とを包み、半田こて先と加熱素
子組立体端部外周を中空状のスリーブで固定し、中空状
のスリーブを把手に固定されている保持金具にねじによ
り固定した構造としたことを特徴とする電気半田用こて
。[Scope of Claims] 1. A columnar or tubular insulating substrate made of aluminum nitride having a bearing formed at one end into which a soldering iron tip is fitted, is wound on the outer periphery of the insulating substrate in close contact with the surface of the insulating substrate. 1. A heating element assembly for an electric soldering iron, characterized by comprising a heating element. 2. The heating element wound around the outer periphery of the insulating substrate made of aluminum nitride according to claim 1 is produced by a thick film method by printing and baking a high melting point metal such as tungsten paste, or by sputtering and sputtering a thin film such as a nickel chrome alloy. A heating element assembly for an electric soldering iron, characterized in that it is formed by vapor deposition, plating, and etching. 3. Insert the soldering iron tip into the bearing provided at one end of the heating element assembly for a soldering iron according to claim 1 or claim 2, wrap the soldering iron tip and the heating element assembly, and then An electric soldering iron characterized by having a structure in which the tip and the outer periphery of the end of the heating element assembly are fixed with a hollow sleeve, and the hollow sleeve is fixed with a screw to a holding fitting fixed to the handle. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30140288A JPH0677828B2 (en) | 1988-11-28 | 1988-11-28 | Heating element assembly for electric soldering iron and electric soldering iron |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP30140288A JPH0677828B2 (en) | 1988-11-28 | 1988-11-28 | Heating element assembly for electric soldering iron and electric soldering iron |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02147166A true JPH02147166A (en) | 1990-06-06 |
JPH0677828B2 JPH0677828B2 (en) | 1994-10-05 |
Family
ID=17896439
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP30140288A Expired - Lifetime JPH0677828B2 (en) | 1988-11-28 | 1988-11-28 | Heating element assembly for electric soldering iron and electric soldering iron |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0677828B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0471779A (en) * | 1990-07-12 | 1992-03-06 | Masahiro Ashizuka | Soldering gun |
US5221819A (en) * | 1990-07-13 | 1993-06-22 | Siemens Aktiengesellschaft | Ceramic soldering element |
WO2000062967A1 (en) * | 1999-04-20 | 2000-10-26 | Atsunobu Sakamoto | Hot iron such as soldering iron and method of controlling the iron |
-
1988
- 1988-11-28 JP JP30140288A patent/JPH0677828B2/en not_active Expired - Lifetime
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0471779A (en) * | 1990-07-12 | 1992-03-06 | Masahiro Ashizuka | Soldering gun |
US5221819A (en) * | 1990-07-13 | 1993-06-22 | Siemens Aktiengesellschaft | Ceramic soldering element |
WO2000062967A1 (en) * | 1999-04-20 | 2000-10-26 | Atsunobu Sakamoto | Hot iron such as soldering iron and method of controlling the iron |
US6455813B1 (en) | 1999-04-20 | 2002-09-24 | Atsunobu Sakamoto | Hot iron such as soldering iron and method of controlling the iron |
JP4958131B2 (en) * | 1999-04-20 | 2012-06-20 | 坂本 篤信 | Hot iron such as solder iron and its control method |
Also Published As
Publication number | Publication date |
---|---|
JPH0677828B2 (en) | 1994-10-05 |
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