JPH0543442Y2 - - Google Patents
Info
- Publication number
- JPH0543442Y2 JPH0543442Y2 JP14431787U JP14431787U JPH0543442Y2 JP H0543442 Y2 JPH0543442 Y2 JP H0543442Y2 JP 14431787 U JP14431787 U JP 14431787U JP 14431787 U JP14431787 U JP 14431787U JP H0543442 Y2 JPH0543442 Y2 JP H0543442Y2
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- chip resistor
- substrate
- width
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 11
- 239000000919 ceramic Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Description
【考案の詳細な説明】
産業上の利用分野
本考案は、電子機器の軽薄短小化を目的に使用
される面実装用の角形チツプ固定抵抗器（以下チ
ツプ抵抗器という。）に関するものである。[Detailed Description of the Invention] Industrial Application Field The present invention relates to a square chip fixed resistor for surface mounting (hereinafter referred to as a chip resistor) used for the purpose of making electronic equipment lighter, thinner, shorter and smaller.
従来の技術
従来のチツプ抵抗器は第４図に示すような構成
であつた。１は抵抗体部で、一般にはメタルグレ
ーズが用いられ保護膜が形成されている。２は電
極部で、回路基板に取付ける場合はんだ付け固定
される部分である。３は抵抗体の支持体で、一般
にセラミツク基板が用いられる。Prior Art A conventional chip resistor has a configuration as shown in FIG. Reference numeral 1 denotes a resistor portion, which is generally made of metal glaze and has a protective film formed thereon. Reference numeral 2 denotes an electrode portion, which is a portion that is fixed by soldering when attached to a circuit board. 3 is a support for the resistor, and a ceramic substrate is generally used.
以上のように構成されたチツプ抵抗器について
以下その動作について説明する。 The operation of the chip resistor constructed as above will be explained below.
実用回路基板に取付けられたチツプ抵抗器には
電流電圧が印加され抵抗機能が働くが、抵抗体部
はその電流あるいは電圧に比例してジユール熱に
より発熱し、その熱は熱伝導により抵抗体部と反
対側のセラミツク基板の裏表面へ達し抵抗体部表
面とほぼ同じ温度上昇をまねくことになる。 Current and voltage are applied to a chip resistor installed on a practical circuit board, and the resistance function is activated.The resistor body generates heat due to Joule heat in proportion to the current or voltage, and the heat is transferred to the resistor body by heat conduction. The heat reaches the back surface of the ceramic substrate on the opposite side, causing a temperature rise that is almost the same as that on the surface of the resistor.
考案が解決しようとする問題点
このような従来の構成では、チツプ抵抗器に高
電力が印加されると表面温度が比例して上昇し、
実用回路基板においてはチツプ抵抗器の裏面部の
温度上昇をまねき、ついには実用回路基板を焼損
し基板の絶縁破壊につながつていくものである。
これを防止するには、単位面積当りの印加電力の
規制を行なわなくてはならず、つまり従来の方法
では高電力のチツプ抵抗器を設計するには形状を
大きくしなければならずチツプ抵抗器の利点であ
る軽薄短小化を犠牲にするものであつた。Problems that the invention aims to solve In such a conventional configuration, when high power is applied to the chip resistor, the surface temperature increases proportionally.
In a practical circuit board, this causes a temperature rise on the back side of the chip resistor, which eventually burns out the practical circuit board and leads to dielectric breakdown of the board.
To prevent this, it is necessary to regulate the applied power per unit area.In other words, in the conventional method, designing a high-power chip resistor requires increasing the size of the chip resistor. This was at the expense of the advantages of being lighter, thinner, and smaller.
本考案はこのような問題点を解決するもので、
形状を極力小さくし、高電力印加における抵抗器
の裏面部の温度上昇を防ぐチツプ抵抗器を提供す
ることを目的とするものである。 This invention solves these problems,
It is an object of the present invention to provide a chip resistor whose shape is made as small as possible and which prevents a rise in temperature on the back side of the resistor when high power is applied.
問題点を解決するための手段
この問題を解決するためには、本考案は基板
と、この基板上に形成した抵抗体と、この抵抗体
の主面と直角な前記基板の側面から前記抵抗体の
通電方向と直角方向に設けかつ前記電極間方向の
幅が前記抵抗体の通電方向の幅より広い貫通穴と
からなるものである。Means for Solving the Problem In order to solve this problem, the present invention provides a substrate, a resistor formed on the substrate, and a resistor from a side surface of the substrate perpendicular to the main surface of the resistor. The through hole is provided in a direction perpendicular to the direction of conduction of electricity, and has a width in the direction between the electrodes that is wider than a width of the resistor in the direction of conduction of electricity.
作 用
この構成により、抵抗体部の発熱は熱伝導によ
り裏面部に直接伝わらなくなり、両電極部よりの
放熱により裏面部の温度上昇は低い温度上昇にお
さえることが可能となる。すなわち同形状でも高
電力印加が可能となり、高電力形でもより小さな
形状が可能となる。Effect: With this configuration, the heat generated by the resistor portion is not directly transmitted to the back surface portion due to thermal conduction, and the temperature rise in the back surface portion can be suppressed to a low level due to heat dissipation from both electrode portions. That is, even with the same shape, high power can be applied, and even with a high power type, a smaller shape is possible.
実施例
第１図、第２図は本考案の一実施例によるチツ
プ抵抗器の構成図であり、図において、１１は高
電力を印加することにより発熱する抵抗体部であ
る。１２，１２′は電極部で、回路基板にはんだ
付け接続される部分である。１３はセラミツク基
板で、抵抗体部１１の支持体である。１４は角形
の貫通穴である。このような貫通穴１４は例え
ば、未焼成セラミツク材料を湿式押出し方式や乾
式成型方式で筒状に成形した後、所定の長さに切
断して形成する。ここで、貫通穴１４は抵抗体部
１１の主面と直角なセラミツク基板１３の側面か
ら電極１２，１２′間方向の幅が抵抗体部１１の
電極部１２，１２′間方向の幅より広くなるよう
に構成されている。Embodiment FIGS. 1 and 2 are block diagrams of a chip resistor according to an embodiment of the present invention. In the figures, reference numeral 11 represents a resistor portion that generates heat when high power is applied. Reference numerals 12 and 12' denote electrode portions which are soldered and connected to the circuit board. A ceramic substrate 13 serves as a support for the resistor section 11. 14 is a rectangular through hole. Such a through hole 14 is formed, for example, by forming an unfired ceramic material into a cylindrical shape using a wet extrusion method or a dry molding method, and then cutting the material into a predetermined length. Here, the width of the through hole 14 in the direction between the electrodes 12 and 12' from the side surface of the ceramic substrate 13 perpendicular to the main surface of the resistor part 11 is wider than the width in the direction between the electrode parts 12 and 12' of the resistor part 11. It is configured to be.
以上のように、本実施例によれば、抵抗体部１
１、すなわち発熱部より幅広い貫通穴１４を設け
ることにより、抵抗体部１１の発熱は熱伝導によ
り直接下部に達することなく電極部のはんだ付け
固定部すなわち金属放熱部を経由するため、チツ
プ抵抗器の裏面部の温度上昇は極めて低くおさえ
ることができる。 As described above, according to this embodiment, the resistor section 1
1. In other words, by providing the through hole 14 which is wider than the heat generating part, the heat generated by the resistor part 11 does not reach the lower part directly due to heat conduction, but passes through the soldered fixing part of the electrode part, that is, the metal heat radiation part, so that the chip resistor The temperature rise on the back side can be kept extremely low.
なお、本実施例において、貫通穴は角形とした
が、第３図のように丸穴、だ円形、多角形等とし
てもよい。 In this embodiment, the through hole is square, but it may be round, oval, polygonal, etc. as shown in FIG.
考案の効果
以上のように、本考案によれば、以下のような
効果が得られる。Effects of the invention As described above, according to the invention, the following effects can be obtained.
(1) 貫通穴により抵抗体の発熱が、直接チツプ抵
抗器の裏面部に達することなく、温度上昇を低
くおさえることができる。(1) The through-hole prevents the heat generated by the resistor from directly reaching the back of the chip resistor, keeping the temperature rise low.
(2) チツプ抵抗器の裏面部の温度上昇をおさえる
ことができるので、高電力印加でも、回路基板
に直付けが可能である。(2) Since the temperature rise on the back side of the chip resistor can be suppressed, it can be directly attached to the circuit board even when high power is applied.
(3) チツプ抵抗器の裏面部の温度上昇をおさえる
ことができるので、同じ電力部でも、より小さ
な形状にチツプ抵抗器を設計することが可能と
なる。(3) Since the temperature rise on the back side of the chip resistor can be suppressed, it is possible to design the chip resistor in a smaller shape even in the same power section.
(4) 従来と同じ形状のチツプ抵抗器でも、より大
きな電力を印加することが可能である。(4) Even with a chip resistor of the same shape as a conventional one, it is possible to apply greater power.
(5) チツプ抵抗器の裏面部の形状は、従来のもの
と変わらないので、回路基板等への実装時の接
着剤による固定等についても、従来と変わらず
使用が可能である。(5) Since the shape of the back surface of the chip resistor is the same as that of conventional ones, it can be used for fixing with adhesive when mounting on a circuit board, etc., as before.
第１図は本考案の一実施例の斜視図、第２図は
本考案の一実施例の側面図、第３図は他の実施例
の側面図、第４図は従来例の斜視図である。
１１……抵抗体部、１２，１２′……電極部、
１３……セラミツク基板、１４……貫通穴。
Figure 1 is a perspective view of an embodiment of the present invention, Figure 2 is a side view of an embodiment of the invention, Figure 3 is a side view of another embodiment, and Figure 4 is a perspective view of a conventional example. be. 11...Resistor part, 12, 12'...Electrode part,
13...Ceramic substrate, 14...Through hole.
Claims (1)
抵抗体の主面と直角な前記基板の側面から前記抵
抗体の通電方向と直角方向に設けかつ前記電極間
方向の幅が前記抵抗体の通電方向の幅より広い貫
通穴とからなる角形チツプ固定抵抗器。 a substrate, a resistor formed on this substrate, and a resistor provided from a side surface of the substrate perpendicular to the main surface of the resistor in a direction perpendicular to the current conduction direction of the resistor and whose width in the inter-electrode direction is the width of the resistor. A square chip fixed resistor consisting of a through hole that is wider than the width in the current direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14431787U JPH0543442Y2 (en) | 1987-09-21 | 1987-09-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14431787U JPH0543442Y2 (en) | 1987-09-21 | 1987-09-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6448001U JPS6448001U (en) | 1989-03-24 |
| JPH0543442Y2 true JPH0543442Y2 (en) | 1993-11-02 |
Family
ID=31411922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14431787U Expired - Lifetime JPH0543442Y2 (en) | 1987-09-21 | 1987-09-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0543442Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0754961Y2 (en) * | 1988-05-30 | 1995-12-18 | 株式会社村田製作所 | Resistor |
-
1987
- 1987-09-21 JP JP14431787U patent/JPH0543442Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6448001U (en) | 1989-03-24 |
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