JPS5930546Y2 - Printed board - Google Patents

Description

[Detailed explanation of the idea] The present invention relates to a printed circuit board with good heat dissipation performance.

Conventionally, if heat exceeding its heat dissipation capacity is applied to a printed circuit board, the board will discolor or burn, so to avoid this, heat generating components such as resistors are mounted above the board surface using support members such as tubes or insulators. That's what I was doing.

However, this kind of attachment requires a lot of effort to attach the parts and also requires an extra support member, which poses a problem in terms of cost.

This invention solves these conventional problems,
To provide a printed circuit board whose heat dissipation performance is improved by leaving a conductive foil, which is conventionally left as a conductive pattern by etching, also in a part directly under a heat generating component and using the dummy pattern for heat dissipation.

The present invention will be explained in detail below based on the illustrated embodiments.

FIG. 1A shows a conductive pattern 2 on a printed circuit board 1 incorporating a heat-generating component R such as a resistor, and the surrounding area B is
An example is shown in which a dummy pattern 3, which is diagonally shaded directly below the heat-generating component R in FIG.

For the conductive pattern 2 shown in FIG. 2A, as shown in FIG.
An example is shown in which that portion is used as a dummy pattern 3 for heat radiation.

Here, the dummy pattern 3 is formed in the step of forming the conductive pattern 2 of conductive foil on the printed circuit board 1 by etching, so that a portion for attaching the heat generating component R is also left.

When the heat-generating component R is attached to the printed circuit board 1 formed in this way, the heat emitted from the heat-generating component R is diffused and dissipated by the dummy pattern 3, thereby preventing the adverse effects of the heat on the surface of the board 1. I can do it.

In order to further improve the heat dissipation effect, the heat dissipation area may be expanded by connecting the dummy pattern 3 to another pattern that does not affect the electric circuit, such as the ground pattern 4, as shown in FIG.

As described above, in this invention, a dummy pattern of conductive foil is formed directly under the heat-generating component, so the dummy pattern of conductive foil, which has good thermal conductivity because it is made of metal such as aluminum or copper, is used for heat dissipation. The dummy pattern described above can be formed at the same time as the process of forming the conductive pattern by etching, so no new materials or procedures are required in the manufacturing process. It is easy to manufacture, inexpensive, and has good heat dissipation performance.

[Brief explanation of drawings]

Figures 1A and B are plan views of an embodiment of the present invention; Figures 2A and 2B are plan views of an embodiment of the present invention;
B is a plan view of another embodiment, and FIG. 3 is a plan view of still another embodiment. 1... Printed circuit board, 2... Conductive pattern, 3... Dummy pattern, R...
Exothermic parts.

Claims (1)

[Scope of utility model registration request] A dummy pattern of conductive foil is formed on the surface of a printed circuit board on which a heat generating component such as a resistor is attached, and directly below the heat generating component, and this dummy pattern is used for heat radiation. A printed circuit board characterized by: