JPS6048246U - Heat dissipation cap for circuit components - Google Patents
Heat dissipation cap for circuit componentsInfo
- Publication number
- JPS6048246U JPS6048246U JP13932783U JP13932783U JPS6048246U JP S6048246 U JPS6048246 U JP S6048246U JP 13932783 U JP13932783 U JP 13932783U JP 13932783 U JP13932783 U JP 13932783U JP S6048246 U JPS6048246 U JP S6048246U
- Authority
- JP
- Japan
- Prior art keywords
- circuit components
- heat dissipation
- cap
- circuit board
- dissipation cap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図はプリント基板上の回路部品の熱を回路部品とプ
リント基板とが接触する面のみによって放熱させる従来
技術の構造を示す断面図、第２図はプリント基板上の回
路部品の熱を周囲に存在する冷媒へ放熱させる従来技術
の構造を示す断面図、第３図は第２図に示す構造に加え
て回路部品に放熱フィンを設けて放熱しやすくした従来
技術の構造を示す断面図、第４図は第１図に示す構造に
加えて、プリント基板上の回路部品の頭部に放熱板を接
触させて放熱しやすくした、従来技術の構造を示す断面
図、第５図は改善実施のための放熱キャップ単体を示す
図、第６図は放熱キャップを回路部品とプリント基板に
取り付けて使用している改善実施後を示す図である。第
７図は第６図のＡ−Ａ線断面図であり、図において１は
回路部品、２はプリント基板、３は回路部品からの熱流
、４は冷媒、５は放熱フィン、６は放熱板、７は放熱キ
ャップ、８は放熱キャップ７の放射状部分の先端に設け
られた切り込み、９は接着剤或はハンダである。なお、
図中同一あるいは相当部分には同一符号を付して示しで
ある。
第３図
第４図Figure 1 is a sectional view showing a conventional structure in which heat from circuit components on a printed circuit board is dissipated only through the contact surface between the circuit components and the printed circuit board, and Figure 2 is a cross-sectional view showing the structure of a conventional technology in which heat from circuit components on a printed circuit board is dissipated only through the contact surface between the circuit components and the printed circuit board. 3 is a sectional view showing a structure of a conventional technology that dissipates heat to a refrigerant existing in the circuit; FIG. 3 is a sectional view showing a structure of a conventional technology in which, in addition to the structure shown in FIG. Figure 4 is a cross-sectional view of a conventional technology structure in which, in addition to the structure shown in Figure 1, a heat sink is brought into contact with the head of the circuit component on the printed circuit board to facilitate heat radiation. Figure 5 is a cross-sectional view showing an improved structure. FIG. 6 is a diagram showing the heat dissipation cap as a single unit for the purpose of the present invention, and FIG. 6 is a diagram showing the heat dissipation cap after the improvement has been implemented, in which the heat dissipation cap is attached to circuit components and a printed circuit board. Figure 7 is a cross-sectional view taken along the line A-A in Figure 6, where 1 is a circuit component, 2 is a printed circuit board, 3 is heat flow from the circuit component, 4 is a refrigerant, 5 is a heat sink, and 6 is a heat sink. , 7 is a heat dissipation cap, 8 is a notch provided at the tip of the radial portion of the heat dissipation cap 7, and 9 is an adhesive or solder. In addition,
Identical or corresponding parts in the figures are indicated by the same reference numerals. Figure 3 Figure 4
Claims (1)
られているプリント基板との間を熱伝導性材料を介して
連結すると共に、上記回路部品にかぶせて、回路部品で
発生した熱をプリント基板へ放熱させることを目的とし
た放熱キャップにおいて、このキャップを構成する金属
体を帽状に形成すると共にその端部を放射状に広げて、
またその放射状の部分には周方向に複数箇所の切り込み
を設けた事を特徴とする放熱キャップ。The circuit components on the printed circuit board and the printed circuit board to which the circuit components are attached are connected via a thermally conductive material, and the heat generated by the circuit components is transferred to the printed circuit board by covering the circuit components. In a heat dissipation cap for the purpose of dissipating heat, the metal body constituting the cap is formed into a cap shape, and its ends are expanded radially.
The heat dissipation cap is also characterized by having multiple notches in the circumferential direction on its radial portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13932783U JPS6048246U (en) | 1983-09-08 | 1983-09-08 | Heat dissipation cap for circuit components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13932783U JPS6048246U (en) | 1983-09-08 | 1983-09-08 | Heat dissipation cap for circuit components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6048246U true JPS6048246U (en) | 1985-04-04 |
Family
ID=30312321
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13932783U Pending JPS6048246U (en) | 1983-09-08 | 1983-09-08 | Heat dissipation cap for circuit components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6048246U (en) |
-
1983
- 1983-09-08 JP JP13932783U patent/JPS6048246U/en active Pending
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