JPS60121651U - Heat sink for high power semiconductor devices - Google Patents
Heat sink for high power semiconductor devicesInfo
- Publication number
- JPS60121651U JPS60121651U JP981284U JP981284U JPS60121651U JP S60121651 U JPS60121651 U JP S60121651U JP 981284 U JP981284 U JP 981284U JP 981284 U JP981284 U JP 981284U JP S60121651 U JPS60121651 U JP S60121651U
- Authority
- JP
- Japan
- Prior art keywords
- power semiconductor
- heat sink
- high power
- semiconductor devices
- cylindrical body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は大電力用半導体素子およびこれに着脱自由の本
考案の放熱器の一実施例を示す斜視図、第２図は２つの
突出部がある半導体素子の斜視図である。
１・・・放熱器、２・・・大電力用半導体素子、２ａと
２ｂ・・・大電力用半導体素子の突出部。FIG. 1 is a perspective view showing an embodiment of a high-power semiconductor device and a heat sink of the present invention that can be freely attached to and detached from the semiconductor device, and FIG. 2 is a perspective view of the semiconductor device having two protrusions. DESCRIPTION OF SYMBOLS 1... Heat sink, 2... High power semiconductor element, 2a and 2b... Protrusion part of high power semiconductor element.
Claims (1)
金製の筒状体からなり、該筒状体を、大電力用半導体素
子の少なくとも１つめ突出部へ着脱自由かつ固定可能に
構成してなることを特徴とする大電力半導体素子の放熱
器。It consists of a cylindrical body made of copper or prepared alloy whose outer circumferential surface is finned or roughened, and the cylindrical body is configured to be freely attachable and detachable to at least one protrusion of a high-power semiconductor element. A heatsink for a high-power semiconductor device, which is characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP981284U JPS60121651U (en) | 1984-01-26 | 1984-01-26 | Heat sink for high power semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP981284U JPS60121651U (en) | 1984-01-26 | 1984-01-26 | Heat sink for high power semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60121651U true JPS60121651U (en) | 1985-08-16 |
Family
ID=30490385
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP981284U Pending JPS60121651U (en) | 1984-01-26 | 1984-01-26 | Heat sink for high power semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60121651U (en) |
-
1984
- 1984-01-26 JP JP981284U patent/JPS60121651U/en active Pending
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