JPS61104580U - - Google Patents
Info
- Publication number
- JPS61104580U JPS61104580U JP18897184U JP18897184U JPS61104580U JP S61104580 U JPS61104580 U JP S61104580U JP 18897184 U JP18897184 U JP 18897184U JP 18897184 U JP18897184 U JP 18897184U JP S61104580 U JPS61104580 U JP S61104580U
- Authority
- JP
- Japan
- Prior art keywords
- electrical components
- reflective layer
- wiring board
- printed wiring
- heat reflective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案に係る印刷配線板の一実施例を
示す断面図、第２図はその斜視図、第３図は本考
案による熱反射効果を説明する説明図、第４図は
本考案による熱反射層を形成した基板の温度変化
を示す実験例の説明図である。
１…印刷基板、２…電気部品、３…リード線、
４…銅箔ランド、７…熱反射層。
Fig. 1 is a sectional view showing an embodiment of the printed wiring board according to the present invention, Fig. 2 is a perspective view thereof, Fig. 3 is an explanatory diagram illustrating the heat reflection effect according to the present invention, and Fig. 4 is a cross-sectional view showing an embodiment of the printed wiring board according to the present invention. FIG. 2 is an explanatory diagram of an experimental example showing the temperature change of a substrate on which a heat reflective layer is formed. 1... Printed circuit board, 2... Electrical parts, 3... Lead wire,
4...Copper foil land, 7...Heat reflective layer.
Claims (1)
くとも前記電気部品に対面して熱反射層を形成し
たことを特徴とする印刷配線板。 1. A printed wiring board, characterized in that a heat reflective layer is formed on the surface of a printed circuit board on which electrical components are mounted, at least facing the electrical components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18897184U JPS61104580U (en) | 1984-12-14 | 1984-12-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18897184U JPS61104580U (en) | 1984-12-14 | 1984-12-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61104580U true JPS61104580U (en) | 1986-07-03 |
Family
ID=30746435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18897184U Pending JPS61104580U (en) | 1984-12-14 | 1984-12-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61104580U (en) |
-
1984
- 1984-12-14 JP JP18897184U patent/JPS61104580U/ja active Pending
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