JPS6310582U - - Google Patents

Info

Publication number
JPS6310582U
JPS6310582U JP10590086U JP10590086U JPS6310582U JP S6310582 U JPS6310582 U JP S6310582U JP 10590086 U JP10590086 U JP 10590086U JP 10590086 U JP10590086 U JP 10590086U JP S6310582 U JPS6310582 U JP S6310582U
Authority
JP
Japan
Prior art keywords
printed wiring
electronic components
wiring board
printed
soldered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10590086U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10590086U priority Critical patent/JPS6310582U/ja
Publication of JPS6310582U publication Critical patent/JPS6310582U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Waveguide Connection Structure (AREA)
  • Waveguides (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例の印刷配線板の平面
図、第２図は第１図の印刷配線板に電子部品をは
んだ付けした状態を示す平面図、第３図は第２図
の印刷配線板における電子部品の取付状態を示す
部分断面図である。 １……基板、２……ストリツプライン、３……
絶縁膜、４……電子部品、５……はんだ。 Fig. 1 is a plan view of a printed wiring board according to an embodiment of the present invention, Fig. 2 is a plan view showing electronic components soldered to the printed wiring board of Fig. 1, and Fig. 3 is a plan view of the printed wiring board of Fig. 2. FIG. 3 is a partial cross-sectional view showing how electronic components are attached to the printed wiring board. 1... Board, 2... Stripline, 3...
Insulating film, 4...Electronic component, 5...Solder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 印刷されたストリツプライン間に電子部品がは
んだ付けされる印刷配線板において、前記電子部
品の両端が位置すべき部分の近傍にはんだ流れ防
止用の細線状の絶縁物が塗布してあることを特徴
とする印刷配線板。 In printed wiring boards on which electronic components are soldered between printed strip lines, a thin wire-shaped insulating material is applied to prevent solder flow near the areas where both ends of the electronic components are to be located. Characteristic printed wiring board.
JP10590086U 1986-07-09 1986-07-09 Pending JPS6310582U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10590086U JPS6310582U (en) 1986-07-09 1986-07-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10590086U JPS6310582U (en) 1986-07-09 1986-07-09

Publications (1)

Publication Number Publication Date
JPS6310582U true JPS6310582U (en) 1988-01-23

Family

ID=30980763

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10590086U Pending JPS6310582U (en) 1986-07-09 1986-07-09

Country Status (1)

Country Link
JP (1) JPS6310582U (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009267149A (en) * 2008-04-25 2009-11-12 Dainippon Printing Co Ltd Part built-in wiring board, and method for manufacturing part built-in wiring board
JP2010040891A (en) * 2008-08-07 2010-02-18 Dainippon Printing Co Ltd Wiring board with built-in component
WO2011040480A1 (en) * 2009-09-30 2011-04-07 株式会社村田製作所 Circuit board
JP2013225711A (en) * 2013-08-07 2013-10-31 Dainippon Printing Co Ltd Wiring board with component incorporated therein
JP5360221B2 (en) * 2009-09-16 2013-12-04 株式会社村田製作所 Electronic component built-in module
EP2211598A3 (en) * 2009-01-27 2014-02-12 Robert Bosch GmbH Method for making a sensor module

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009267149A (en) * 2008-04-25 2009-11-12 Dainippon Printing Co Ltd Part built-in wiring board, and method for manufacturing part built-in wiring board
JP2010040891A (en) * 2008-08-07 2010-02-18 Dainippon Printing Co Ltd Wiring board with built-in component
EP2211598A3 (en) * 2009-01-27 2014-02-12 Robert Bosch GmbH Method for making a sensor module
JP5360221B2 (en) * 2009-09-16 2013-12-04 株式会社村田製作所 Electronic component built-in module
US8675367B2 (en) 2009-09-16 2014-03-18 Murata Manufacturing Co., Ltd. Module incorporating electronic component
WO2011040480A1 (en) * 2009-09-30 2011-04-07 株式会社村田製作所 Circuit board
JPWO2011040480A1 (en) * 2009-09-30 2013-02-28 株式会社村田製作所 Circuit board
JP2013225711A (en) * 2013-08-07 2013-10-31 Dainippon Printing Co Ltd Wiring board with component incorporated therein

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