JPH042069U - - Google Patents
Info
- Publication number
- JPH042069U JPH042069U JP4229790U JP4229790U JPH042069U JP H042069 U JPH042069 U JP H042069U JP 4229790 U JP4229790 U JP 4229790U JP 4229790 U JP4229790 U JP 4229790U JP H042069 U JPH042069 U JP H042069U
- Authority
- JP
- Japan
- Prior art keywords
- electronic components
- printed wiring
- paste
- insulating substrate
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002265 prevention Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
Description
図は本考案の実施例の平面図を示す。 １……絶縁基板、６……流れ防止部。 The figure shows a top view of an embodiment of the invention. 1...Insulating substrate, 6...Flow prevention part.
Claims (1)
樹脂で封止するプリント配線板において、電子部
品を接続する箇所の周囲にソルダーレジスト、文
字用インク、抵抗用ペースト、導体用ペースト及
びガラスペーストのうち少なくとも一種からなる
流れ防止部を設けることを特徴とするプリント配
線板。 In printed wiring boards where electronic components are connected to an insulating substrate and the electronic components are sealed with resin, solder resist, character ink, resistor paste, conductor paste, and glass paste are applied around the parts where the electronic components are connected. A printed wiring board characterized in that it is provided with a flow prevention part made of at least one of the following.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4229790U JPH042069U (en) | 1990-04-20 | 1990-04-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4229790U JPH042069U (en) | 1990-04-20 | 1990-04-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH042069U true JPH042069U (en) | 1992-01-09 |
Family
ID=31553720
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4229790U Pending JPH042069U (en) | 1990-04-20 | 1990-04-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH042069U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01107563A (en) * | 1987-10-20 | 1989-04-25 | Cmk Corp | Mounting method for chip component on printed wiring board |
| JPH01290292A (en) * | 1988-05-18 | 1989-11-22 | Abisare:Kk | Conductive circuit board having dam for blocking outflow of sealant |
-
1990
- 1990-04-20 JP JP4229790U patent/JPH042069U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01107563A (en) * | 1987-10-20 | 1989-04-25 | Cmk Corp | Mounting method for chip component on printed wiring board |
| JPH01290292A (en) * | 1988-05-18 | 1989-11-22 | Abisare:Kk | Conductive circuit board having dam for blocking outflow of sealant |