CN204634158U - A kind of jointing of LED pcb board - Google Patents
A kind of jointing of LED pcb board Download PDFInfo
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- CN204634158U CN204634158U CN201520230262.7U CN201520230262U CN204634158U CN 204634158 U CN204634158 U CN 204634158U CN 201520230262 U CN201520230262 U CN 201520230262U CN 204634158 U CN204634158 U CN 204634158U
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- pcb board
- led
- salient point
- jointing
- soft
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Abstract
The utility model relate to a kind of LED pcb board jointing, comprises metal substrate, the soft pcb board of salient point.It is the metal substrate by being out of shape the soft pcb board back side of salient point, metal salient point on the soft pcb board of salient point can be crimped on electric conductor to be connected effectively, thus form good connection, obtain electric conductivity good, the assembling mode be connected fast with electric conductor to be connected, greatly improves the efficiency of assembled LED illuminating product and the reliability of product.
Description
Technical field
The jointing that the utility model relates to a kind of pcb board particularly relates to the jointing of a kind of LED PCB.
Background technology
Society is more and more stronger to the consciousness of environmental protection, and energy-conservation LED product still uses traditional PCB substrate in a large number, traditional LED with pcb board with external circuit conduct electricity be connected time, generally completed by tin welding, the inefficiency of connection, causes environmental pollution.The surface treatment handling process of tradition LED pcb board, it is complicated and pollution level is very large; Owing to there being the plating link that can not reduce or remit, not only cause Cu Ni Ag metallic pollution, and increase the consumption of water, consumption Ni a large amount of especially the precious metal such as Ag, thus improve traditional LED pcb board production cost.Situation compel, make PCB enterprise put forth effort developing low-cost, pollute few LED pcb board, develop to cleaner production.Cladded aluminum foil pcb board, because cost is low, exempt from the huge advantage of plating, becomes one of brand-new material in PCB industry.Cladded aluminum foil pcb board is environmental protection, energy-conservation, but its pad is when welding external interface, need special aluminium welding wire, and welding parameter is also welded with difference with common tin, and the inconvenience of increase LED illumination industry downstream components, affects the efficiency of downstream components like this.
Summary of the invention
The technical problems to be solved in the utility model is to provide the various LED pcb board of a kind of adaptation, and welding efficiency is high, the LED pcb board jointing that reliability is secure.
The jointing of LED pcb board: comprise a metal substrate, the soft pcb board of salient point;
The soft pcb board attachment of salient point on metallic substrates.By being out of shape the metal substrate at the soft pcb board back side of salient point, the metal salient point on the soft pcb board of salient point can being crimped on electric conductor to be connected effectively, forming good connection.
A jointing for LED pcb board, electric conductor to be connected can be terminal or
Person is the conductive plate of pcb board.
A jointing for LED pcb board, the conductive plate material of pcb board can be metal or
Metal composite layer.
A jointing for LED pcb board, the soft pcb board of salient point is the soft of pre-convex point pressing
Pcb board; Salient point position can be the set of the random geometry of the conduction protruded; Its conductive can be metal or the nonmetallic materials of conduction; Its insulating layer material can be the plastic films such as PI, PET, PVC, PC, TEFLON.
A jointing for LED pcb board, the non-gold of soft pcb board conductive layer of pre-convex point pressing
Belonging to material can be conducting resinl.
A jointing for LED pcb board, metal substrate be can bend metal.
A jointing for LED pcb board, the Metal Substrate at the distortion soft pcb board back side of salient point
Plate, is realized by extrusion connected mode.
A jointing for LED pcb board, the soft pcb board attachment of salient point on metallic substrates
By heat curing-type glue or adhesive bonding.
The utility model is the component side at LED pcb board, and the electric conductor to be connected salient point with soft pcb board, with the metal substrate of distortion salient point pcb board, when being connected with electric conductor to be connected, can be connected by punch forming fast.The method technique is simple, easy to operate, can realize mass production, meet the growing market demand.
[accompanying drawing explanation]
For convenience of explanation, the utility model is described in detail by following preferably case study on implementation and accompanying drawing.
Fig. 1 is the connection flow chart of the jointing of the utility model embodiment 1 LED pcb board.
Fig. 2 is the schematic diagram after the soft pcb board of the utility model embodiment 1 metal substrate attachment bumps.
Fig. 2-1 is A position cutaway view after the soft pcb board of the utility model embodiment 1 metal substrate attachment bumps.
Fig. 3 be the utility model embodiment 1 metal substrate punching shaping after schematic diagram.
Fig. 3-1 be the utility model embodiment 1 metal substrate punching shaping after F position enlarged drawing.
Fig. 3-2 be the utility model embodiment 1 metal substrate punching shaping after B position cutaway view.
Fig. 4 is schematic diagram after the bending of the utility model embodiment 1 metal substrate.
Fig. 4-1 is G position enlarged drawing after the bending of the utility model embodiment 1 metal substrate.
Fig. 4-2 is C position cutaway view after the bending of the utility model embodiment 1 metal substrate.
Fig. 5 the utility model embodiment 1 metal substrate is installed schematic diagram after LED pcb board.
Fig. 5-1 is for the utility model embodiment 1 metal substrate being installed D position cutaway view after LED pcb board.
Fig. 6 is schematic diagram after the utility model embodiment 1 metal substrate crimps with LED pcb board.
Fig. 6-1 is E position cutaway view after the utility model embodiment 1 metal substrate crimps with LED pcb board.
Fig. 7 is schematic diagram after the utility model embodiment 2 LED Down lamp sheet metal forming.
Fig. 7-1 is H position enlarged drawing after the utility model embodiment 2 LED Down lamp sheet metal forming.
Fig. 7-2 is L position cutaway view after the embodiment of the present invention 2 LED Down lamp sheet metal forming.
Fig. 8 is schematic diagram after the bending of the utility model embodiment 2 LED Down lamp plate link position.
Fig. 8-1 is I position enlarged drawing after the bending of the utility model embodiment 2 LED Down lamp plate link position.
Fig. 8-2 is M position cutaway view after the bending of the utility model embodiment 2 LED Down lamp plate link position.
Fig. 9 is the schematic diagram after the utility model embodiment 2 LED Down lamp plate connects external conductive line.
Fig. 9-1 is J position enlarged drawing after the utility model embodiment 2 LED Down lamp plate connection external conductive line.
Fig. 9-2 is N position cutaway view after the utility model embodiment 2 LED Down lamp plate connection external conductive line.
Figure 10 is that the utility model embodiment 2 LED Down lamp plate and external conductive line pressure connect rear schematic diagram.
Figure 10-1 connects rear K position enlarged drawing for the utility model embodiment 2 LED Down lamp plate and external conductive line pressure.
Figure 10-2 connects rear O position cutaway view for the utility model embodiment 2 LED Down lamp plate and external conductive line pressure.
Figure 11 is the connection flow chart of the method for attachment of the utility model embodiment 2 LED pcb board.
Label declaration in accompanying drawing
The connection electric conductor 11 soft pcb board insulating barrier 12 soft pcb board conductive layer 13 metal salient point 14 adhesive 31 pcb board conductive layer 32 pcb board insulating barrier 33 pcb board substrate layer 41 Down lamp plate insulating layer 42 Down lamp plate conductive layer 43 Down lamp plate substrate layer 51 external conductive line 52 external conductive line insulating layer of 101 metal substrate 102 salient point soft pcb board 201 metal substrate crooked place 301 LED pcb board 302 pcb board electric conductor to be connected 401 LED down plate 402 LED down plates
[embodiment]
Case study on implementation one
Fig. 1 gives the connection flow chart of a kind of LED pcb board of the utility model jointing, and Fig. 2-6 gives the structure by the utility model LED pcb board jointing, is illustrated the connection of the LED daylight lamp plate of 1.2 meters below in conjunction with accompanying drawing 1-6:
The connection idiographic flow of LED daylight lamp plate is as follows: 1) prepare LED pcb board 301; 2) the soft pcb board 102 of salient point is made; 3) the soft pcb board 102 of salient point adheres to metal substrate 101; 4) metal substrate 101 is rushed; 5) crimp; 6) test.Concrete steps are described below:
Step 1: prepare LED pcb board 301.Get two LED pcb boards to be assembled.
Step 2: make the soft pcb board 102 of salient point.Get a thick 25um of copper thick 0.5OZ, PI
Flexible copper-clad plate, be formed with the Flexible Printed Circuit of copper electric conductor by image transfer, then be formed with the soft pcb board 102 of salient point of copper metal with particular manufacturing craft; Then by chemical nickel plating gold, make salient point copper surface have the nickel dam of thick layer 4um and thick 1U " layer gold, to increase mechanical performance and the electric conductivity of soft pcb board salient point.
Step 3: the soft pcb board 102 of salient point adheres to metal substrate 101.Prepare a 0.6mm thick, the aluminium sheet of long 1200mm, by soft for salient point pcb board 102 by 3M467 glue (peelable glue 14) and metal substrate 101(namely: aluminium sheet) bonding.
Step 4: rush metal substrate 101.To post the aluminium sheet of the soft pcb board 102 of salient point with particular manufacturing craft, punch forming becomes " recessed " font.
Step 5: crimping.Bending metal substrate bending position 201, are extruded in the two ends of the metal substrate 101 of " recessed " font with wherein two pieces of LED pcb boards 301, the metal salient point 13 on the soft pcb board of salient point 102 is made can be effectively crimped on the pcb board conductive layer 31 of pcb board electric conductor 301 to be connected, and the insulating barrier of soft pcb board on the soft pcb board of salient point 102 and pcb board insulating barrier 32, metal substrate 101 and pcb board substrate layer 33 are insulated, thus forms the good mode of communicating of insulating properties.
Step 6: test.Test connects insulation, the break-make performance of rear LED pcb board 301.
By above method, other LED pcb board 301 is coupled together, the fluorescent lamp panel of combination growth 1200mm.
Through every reliability testing, the LED fluorescent lamp of the jointing manufacture of a kind of LED pcb board of application the utility model, link position performance is secure, without phenomenons such as broken string, not prison weldings.The utility model improves lamp assembled efficiency, for LED lamp industry provides a kind of production program of high performance-price ratio.
Case study on implementation two
Figure 11 gives another flow chart of the jointing of a kind of LED pcb board of the utility model, Fig. 7-10 gives the another kind of structure of the LED pcb board joint manufactured by the utility model, is illustrated the joint of LED down plate below in conjunction with accompanying drawing 7-11:
The connection idiographic flow of LED down plate is as follows: 1) prepare LED down plate 401; 2) punch forming goes out the connection electric conductor 402 of LED down plate; 3) crimp; 4) test.Illustrated below in conjunction with Fig. 7-11:
Step 1: prepare LED Down lamp plate 401.Prepare a LED down plate to be assembled.
Step 2: punch forming goes out the connection electric conductor 402 of LED down plate.By LED down
The connection electric conductor 402 of the LED down plate on plate 401, utilizes particular manufacturing craft to strike out " recessed " font.
Step 3: crimping.Punching there is the connection electric conductor 402 of the LED down plate of " recessed " font
Extrude with external conductive line 51, both made external conductive line 51 effectively can be crimped on LED
On LED down plate conductive layer 42 on the connection electric conductor 402 of Down lamp plate, form good connection, external conductive line insulating layer 52 can coordinate with Down lamp plate insulating layer 41 again, makes Down lamp plate substrate layer 43 and external conductive line 51 form good insulation.
Step 4: test.Break-make, insulation property after test LED down plate 402 is connected with external conductive line 51.
Through every reliability testing, the LED Down lamp of the jointing manufacture of a kind of LED pcb board of application the utility model, link position performance is secure, without phenomenons such as broken string, not prison weldings.The utility model improves lamp assembled efficiency, for LED lamp industry provides a kind of production program of high performance-price ratio.
Case study on implementation three
Fig. 1 gives the connection flow chart of the jointing of a kind of LED pcb board of the utility model, and Fig. 2-6 gives the another kind of structure of the LED pcb board joint manufactured by the utility model, is illustrated the connection of LED panel lamp below in conjunction with accompanying drawing 1-6:
Connection idiographic flow and the case study on implementation one of LED panel lamp are similar, and just the arrangement mode of metal substrate material and LED pcb board is different, from step 3:
Step 3: the soft pcb board 102 of salient point adheres to metal substrate 101.Prepare a 0.4mm thick, the stainless iron plate of long 600mm, wide 600mm, will the soft pcb board 102 of salient point be had bonding with stainless iron plate by 3M467 glue (peelable glue 14).
Step 4: rush metal substrate 101.To post the stainless iron plate of the soft pcb board of salient point 102 with particular manufacturing craft, punch forming becomes " recessed " font.
Step 5: crimping.Bending metal substrate bending position 201, are extruded in the two ends of the metal substrate 101 of " recessed " font with wherein two pieces of LED pcb boards 301, the metal salient point 13 on the soft pcb board of salient point 102 is made can be effectively crimped on the pcb board conductive layer 31 of pcb board electric conductor 301 to be connected, and the insulating barrier of soft pcb board on the soft pcb board of salient point 102 and pcb board insulating barrier 32, metal substrate 101 and pcb board substrate layer 33 are insulated, thus forms the good mode of communicating of insulating properties.
Step 6: test.Insulation after test LED pcb board connects and break-make performance.
By above method, other LED pcb board is coupled together, be combined into the LED panel lamp that size is 600*600mm.
Through every reliability testing, the LED Panel light of the jointing manufacture of a kind of LED pcb board of application the utility model, link position performance is secure, without phenomenons such as broken string, not prison weldings.
The utility model improves lamp assembled efficiency, for LED lamp industry provides a kind of production program of high performance-price ratio.
Above specific embodiment of the utility model is described.It is to be appreciated that the utility model is not limited to above-mentioned particular implementation, the equipment wherein do not described in detail to the greatest extent and structure are construed as to be implemented with the common mode in this area; Those skilled in the art can make various distortion or amendment within the scope of the claims, and this does not affect flesh and blood of the present utility model.
Claims (8)
1. the jointing of LED pcb board: comprise a metal substrate, the soft pcb board of salient point; The soft pcb board attachment of salient point on metallic substrates, by being out of shape the metal substrate at the soft pcb board back side of salient point, making the metal salient point on the soft pcb board of salient point to be effectively crimped on electric conductor to be connected, forming good connection.
2. the jointing of LED pcb board according to claim 1, is characterized in that: described electric conductor to be connected can be the conductive plate of terminal or pcb board.
3. the jointing of LED pcb board according to claim 2, is characterized in that: the conductive plate material of pcb board can be metal or metal composite layer.
4. the jointing of LED pcb board according to claim 1, is characterized in that: the soft pcb board of described salient point is the soft pcb board of pre-convex point pressing; Salient point position can be the set of the random geometry of the conduction protruded; Its conductive can be metal or the nonmetallic materials of conduction; Its insulating layer material can be the plastic films such as PI, PET, PVC, PC, TEFLON.
5. the jointing of LED pcb board according to claim 4, is characterized in that: the soft pcb board conductive layer nonmetallic materials of described pre-convex point pressing can be conducting resinls.
6. the jointing of LED pcb board according to claim 1, is characterized in that: described metal substrate is the metal that can bend.
7. the jointing of LED pcb board according to claim 1, is characterized in that: the metal substrate at the soft pcb board back side of described distortion salient point, is realized by extrusion connected mode.
8. the jointing of LED pcb board according to claim 1, is characterized in that: described salient point soft pcb board attachment on metallic substrates by heat curing-type glue or adhesive bonding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520230262.7U CN204634158U (en) | 2015-04-17 | 2015-04-17 | A kind of jointing of LED pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520230262.7U CN204634158U (en) | 2015-04-17 | 2015-04-17 | A kind of jointing of LED pcb board |
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| Publication Number | Publication Date |
|---|---|
| CN204634158U true CN204634158U (en) | 2015-09-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201520230262.7U Active CN204634158U (en) | 2015-04-17 | 2015-04-17 | A kind of jointing of LED pcb board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017120808A1 (en) * | 2016-01-12 | 2017-07-20 | 袁志贤 | Auxiliary welding structure for alc pcb board and process of fabrication thereof |
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2015
- 2015-04-17 CN CN201520230262.7U patent/CN204634158U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017120808A1 (en) * | 2016-01-12 | 2017-07-20 | 袁志贤 | Auxiliary welding structure for alc pcb board and process of fabrication thereof |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 518125 No.9, Xinfa 2nd Road, Xinqiao community, Xinqiao street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Dinghua Xintai Technology Co.,Ltd. Address before: 518125 building 7, row 3, Xinqiao Xinfa Industrial Zone, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: ACCELERATED PRINTED CIRCUIT BOARD Co.,Ltd. |