CN201503719U - Polyimide insulation hot-melt adhesive film structure of FFC - Google Patents

Polyimide insulation hot-melt adhesive film structure of FFC Download PDF

Info

Publication number
CN201503719U
CN201503719U CN2009200618757U CN200920061875U CN201503719U CN 201503719 U CN201503719 U CN 201503719U CN 2009200618757 U CN2009200618757 U CN 2009200618757U CN 200920061875 U CN200920061875 U CN 200920061875U CN 201503719 U CN201503719 U CN 201503719U
Authority
CN
China
Prior art keywords
melt adhesive
adhesive film
ffc
polyimide
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN2009200618757U
Other languages
Chinese (zh)
Inventor
吴锦图
张强
吴锦彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Lyle new materials Polytron Technologies Inc
Original Assignee
LEARY ELECTRICAL EQUIPMENT CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LEARY ELECTRICAL EQUIPMENT CO Ltd filed Critical LEARY ELECTRICAL EQUIPMENT CO Ltd
Priority to CN2009200618757U priority Critical patent/CN201503719U/en
Application granted granted Critical
Publication of CN201503719U publication Critical patent/CN201503719U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Abstract

The utility model discloses a polyimide insulation hot-melt adhesive film structure of an FFC (flexible flat cable), which is characterized in that the structure comprises a layer of polyimide film; and the surface of the polyimide film is coated with a layer of fire-proof insulation hot-melt adhesive. The polyimide insulation hot-melt adhesive film structure adopts the polyimide film to replace a PET (positron emission tomography), and the polyimide film can endure the high temperature of more than 200 DEG C without deformation, therefore, the high-temperature resistance of the insulation adhesive film is greatly improved, and the demands for different cables are satisfied by adjusting the thickness of the polyimide film and the fire-proof insulation hot-melt adhesive.

Description

The polyimide insulative hot melt adhesive film structure of FFC line
Technical field
The utility model relates to the sticking structure on a kind of FFC line surface.
Background technology
The English full name of FFC is: Flexible Flat Cable, it is flexible flat cable, it is a kind of with PET insulating material and zinc-plated flat copper wire as thin as a wafer, by the new types of data cable that the pressing of high-tech automation equipment production line forms, have softness, random bending fold, thin thickness, advantages such as volume is little, connection is simple, convenient disassembly, high-temperature space use.Can select lead number and spacing arbitrarily, make on line more convenient, significantly reduce the volume of electronic product, reduce production cost, enhance productivity, be suitable between moving-member and the mainboard most, pcb board between the pcb board, make the usefulness of data transmission cable in the miniaturization electrical equipment equipment.
The structure of the insulation glued membrane use that existing FFC flexible flat uses is PET (polyester film) coating certain thickness fire-proof insulation glue, and using shortcoming is that PET can produce contraction under the state more than 105 ℃, influences the stability in use of FFC wire rod under the condition of high temperature
The utility model content
The purpose of this utility model is, overcomes the deficiencies in the prior art, proposes a kind of hot melt adhesive film structure of new FFC line, still keeps stable under the state of higher temperatures.
The technical solution adopted in the utility model is as follows:
The polyimide insulative hot melt adhesive film structure of FFC line comprises one deck PI (polyimides) film, and polyimide film surface coated has one deck fire-proof insulation PUR.The direct pressing of described hot melt adhesive film insulation glue-line pastes conductor moulding FFC flexible flat cable.
The beneficial effects of the utility model are: adopt the PI film to replace PET, because the PI film can tolerate the high temperature more than 200 ℃ and can not be out of shape, thereby improved the heat resistance of insulation glued membrane greatly, can satisfy the requirement of different wire rods.
Description of drawings
Fig. 1 is the structural representation of the utility model hot melt adhesive film.
Embodiment
The polyimide insulative hot melt adhesive film structure of FFC line comprises one deck PI (polyimides) film 1, and the PI film surface is coated with one deck fire-proof insulation PUR 2.The direct pressing of described hot melt adhesive film glue-line pastes conductor moulding FFC flexible flat cable.

Claims (2)

1.FFC the polyimide insulative hot melt adhesive film structure of line is characterized in that: comprise one deck polyimide film, polyimide film surface coated has one deck fire-proof insulation PUR.
2. hot melt adhesive film structure as claimed in claim 1, the direct pressing of described hot melt adhesive film paste conductor moulding FFC flexible flat cable.
CN2009200618757U 2009-08-05 2009-08-05 Polyimide insulation hot-melt adhesive film structure of FFC Expired - Lifetime CN201503719U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2009200618757U CN201503719U (en) 2009-08-05 2009-08-05 Polyimide insulation hot-melt adhesive film structure of FFC

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2009200618757U CN201503719U (en) 2009-08-05 2009-08-05 Polyimide insulation hot-melt adhesive film structure of FFC

Publications (1)

Publication Number Publication Date
CN201503719U true CN201503719U (en) 2010-06-09

Family

ID=42454648

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009200618757U Expired - Lifetime CN201503719U (en) 2009-08-05 2009-08-05 Polyimide insulation hot-melt adhesive film structure of FFC

Country Status (1)

Country Link
CN (1) CN201503719U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107057624A (en) * 2017-04-25 2017-08-18 江苏金坤科技有限公司 A kind of PUR, a kind of PI hot melt adhesive films and a kind of preparation method of PI hot melt adhesive films
CN111526614A (en) * 2020-05-12 2020-08-11 北京宏宇航天技术有限公司 Radiation-resistant film electric heater for spacecraft and manufacturing process thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107057624A (en) * 2017-04-25 2017-08-18 江苏金坤科技有限公司 A kind of PUR, a kind of PI hot melt adhesive films and a kind of preparation method of PI hot melt adhesive films
CN111526614A (en) * 2020-05-12 2020-08-11 北京宏宇航天技术有限公司 Radiation-resistant film electric heater for spacecraft and manufacturing process thereof

Similar Documents

Publication Publication Date Title
CN202986235U (en) Double-faced flexible copper-clad plate
CN201465619U (en) Insulating hot melt adhesive polyimide Nylar structure of FFC wire
CN201910272U (en) FFC (flexible flat cable) high-frequency transmission wire shielding membrane and FFC high-frequency transmission wire
CN201503719U (en) Polyimide insulation hot-melt adhesive film structure of FFC
KR101796452B1 (en) Flexible printed circuit board and method for manufacturing thereof
CN201465622U (en) Hot melt aluminium foil Nylar structure of FFC wire
CN203708621U (en) Ultrathin single-sided flexible printed circuit board
CN102209437B (en) Circuit board with polyimide and aluminum substrate composite structure and manufacturing method thereof
CN201465621U (en) Aramid insulating hot melt adhesive membrane structure of FFC wire
CN202435714U (en) Glue-free single-sided copper foil coated substrate with bonding function
CN104869754A (en) Flexible substrate embedded with conducting wire and manufacturing method thereof
CN105813380B (en) A kind of LED pcb boards connection method
CN201440345U (en) Novel FFC line structure
CN203085247U (en) Reinforcing plate structure used for FFC (flexible flat cable) taking PU (polyurethane) as base material
CN205179499U (en) Polyimide is high, and heat dissipation covers membrane
CN103200771A (en) Non-glue single face copper clad laminate with bonding function and manufacturing method thereof
CN201465620U (en) Halogen-free fire-retardant insulating hot melt adhesive membrane material structure of FFC wire
CN204634158U (en) A kind of jointing of LED pcb board
CN103260333A (en) PCB capable of being bent by 360 degrees and preparation method thereof
CN203884076U (en) Flexible circuit board of novel connecting structure
CN204795841U (en) Location type flexible line way board
CN203126052U (en) Composite double-sided copper foil substrate
CN202488884U (en) Plate line split mounting type signal output device
CN203085249U (en) Fire-proof hot melt adhesive membrane structure formed by compounding conducting substrate and foam
CN211378346U (en) Novel flexible printed copper paste circuit board

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CP03 Change of name, title or address
CP03 Change of name, title or address

Address after: 528300 Guangdong province Foshan city Shunde District Xingtan town Bai'an northbound water Industrial Zone

Patentee after: Guangdong Lyle new materials Polytron Technologies Inc

Address before: 528325 laer electronic material company, north water industrial area, Shunde, Guangdong, Foshan

Patentee before: Leary Electrical Equipment Co., Ltd.

CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20100609