CN203085249U - Fire-proof hot melt adhesive membrane structure formed by compounding conducting substrate and foam - Google Patents
Fire-proof hot melt adhesive membrane structure formed by compounding conducting substrate and foam Download PDFInfo
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- CN203085249U CN203085249U CN 201320103155 CN201320103155U CN203085249U CN 203085249 U CN203085249 U CN 203085249U CN 201320103155 CN201320103155 CN 201320103155 CN 201320103155 U CN201320103155 U CN 201320103155U CN 203085249 U CN203085249 U CN 203085249U
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- hot melt
- melt adhesive
- foam
- fire
- conducting substrate
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Abstract
The utility model relates to a fire-proof hot melt adhesive membrane structure formed by compounding a conducting substrate and foam. The fire-proof hot melt adhesive membrane structure is arranged between the conducting substrate and the foam, and is a layered structure consisting of a first release PET (Polyethylene Terephthalate) layer, a fire-proof hot melt adhesive layer and a second release PET layer from top to bottom. According to the fire-proof hot melt adhesive membrane structure, the conducting substrate and the foam are compounded, so that the requirements of customers on appearance and a fire-proof function are met; moreover, the value of the shielding or characteristic impedance of a finished wire rod can be changed by adjusting the thicknesses of the conducting substrate, the fire-proof hot melt adhesive layer and foam so as to meet the requirement of the wire rod; and meanwhile, the phenomena of cracking and extruding glue flow are avoided, and normal use of an FFC (Flexible Flat Cable) is ensured.
Description
Technical field
The utility model relates to the flexible flat cable structure, is specifically related to the compound fire prevention hot melt adhesive film structure of a kind of conductive base and foam.
Background technology
FFC (Flexible Flat Cable flexible flat cable) is a kind of with PET insulating material and zinc-plated flat copper wire as thin as a wafer, by the new types of data cable that the pressing of high-tech automation equipment production line forms, have softness, arbitrarily bending fold, thin thickness, volume is little, connection is simple, convenient disassembly, easily solve electromagnetic shielding advantages such as (EMI).Can select lead number and spacing arbitrarily, make on line more convenient, significantly reduce the volume of electronic product, reduce production cost, enhance productivity, be suitable between moving-member and the mainboard most, pcb board between the pcb board, make the usefulness of data transmission cable in the miniaturization electrical equipment equipment.
Existing FFC insulation hot melt adhesive film can only simply satisfy general performance, do not have fire-proof function, its conductive base of while and foam compound tense, thereby occur the generation that cracking and extruding gummosis cause the anomalies such as communication error in this FFC line applied environment easily, can not satisfy the requirement of conducting foam.
The utility model content
At the deficiencies in the prior art, the utility model provides a kind of conductive base and the compound fire prevention hot melt adhesive film structure of foam, it meets conductive base and foam by fire prevention hot melt adhesive film structure, satisfy the demand of client to outward appearance and fire-proof function, cracking and extruding gummosis can not occur simultaneously, guarantee the normal use of FFC line.
For achieving the above object, the utility model adopts following technical scheme:
The fire prevention hot melt adhesive film structure that a kind of conductive base and foam are compound, described fire prevention hot melt adhesive film structure is arranged between conductive base and the foam, and this fire prevention hot melt adhesive film structure is for being followed successively by the layer structure of the first release pet layer, fire prevention hot melt adhesive layer, the second release pet layer from top to bottom.
Preferably, the thickness of the described first release pet layer and the second release pet layer is 23 microns, and the thickness of described fire prevention hot melt adhesive layer is the 30-80 micron.
The fire prevention hot melt adhesive film structure that a kind of conductive base that the utility model is set forth and foam are compound, compared with prior art, its beneficial effect is: the utility model meets conductive base and foam by fire prevention hot melt adhesive film structure, satisfy the demand of client to outward appearance and fire-proof function, and, the value that can change the shielding of wire rod of finished product or characteristic impedance by the thickness of adjusting conductive base, fire prevention hot melt adhesive layer and foam is to satisfy the wire rod requirement, cracking and extruding gummosis can not occur simultaneously, guarantee the normal use of FFC line.
Description of drawings
Accompanying drawing 1 is the cutaway view of the compound fire prevention hot melt adhesive film structure of a kind of conductive base of the utility model and foam.
Embodiment
Below, in conjunction with the accompanying drawings and embodiment, the fire prevention hot melt adhesive film structure compound to conductive base of the present utility model and foam is described further, so that clearerly understand the utility model technological thought required for protection.
As shown in Figure 1, the fire prevention hot melt adhesive film structure that a kind of conductive base and foam are compound, this fire prevention hot melt adhesive film structure is arranged between conductive base and the foam, and this fire prevention hot melt adhesive film structure is for being followed successively by the layer structure of the first release pet layer 1, fire prevention hot melt adhesive layer 2, the second release pet layer 3 from top to bottom.Wherein the thickness of the first release pet layer 1 and the second release pet layer 3 is 23 microns, and the two is the diaphragm structure; The thickness of fire prevention hot melt adhesive layer 2 is the 30-80 micron, and it is bonding fireprotection layer.This fire prevention hot melt adhesive film structure and conductive base and foam compound tense, need the tear first release pet layer 1 and the second release pet layer 3, add man-hour at 115-160 degree centigrade of EMI material, fire prevention hot melt adhesive layer 2 can merge mutually with conductive base (aluminium foil or conductive fabric) and foamed cotton layer (PU foam or PE foam), satisfy the needs of client to outward appearance and fire-proof function (94V-0 fire resistance rating), and cracking and processing do not occur unusually, satisfy the requirement of conducting foam.
For a person skilled in the art, can make other various corresponding changes and distortion, and these all changes and distortion should belong within the protection range of the utility model claim all according to technical scheme described above and design.
Claims (2)
1. conductive base and the compound fire prevention hot melt adhesive film structure of foam, it is characterized in that, described fire prevention hot melt adhesive film structure is arranged between conductive base and the foam, and this fire prevention hot melt adhesive film structure is for being followed successively by the layer structure of the first release pet layer, fire prevention hot melt adhesive layer, the second release pet layer from top to bottom.
2. the fire prevention hot melt adhesive film structure that conductive base according to claim 1 and foam are compound is characterized in that the thickness of the described first release pet layer and the second release pet layer is 23 microns, and the thickness of described fire prevention hot melt adhesive layer is the 30-80 micron.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320103155 CN203085249U (en) | 2013-03-06 | 2013-03-06 | Fire-proof hot melt adhesive membrane structure formed by compounding conducting substrate and foam |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320103155 CN203085249U (en) | 2013-03-06 | 2013-03-06 | Fire-proof hot melt adhesive membrane structure formed by compounding conducting substrate and foam |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203085249U true CN203085249U (en) | 2013-07-24 |
Family
ID=48831066
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320103155 Expired - Lifetime CN203085249U (en) | 2013-03-06 | 2013-03-06 | Fire-proof hot melt adhesive membrane structure formed by compounding conducting substrate and foam |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203085249U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111452376A (en) * | 2020-04-27 | 2020-07-28 | 深圳市信维通信股份有限公司 | Manufacturing process of conductive foam |
-
2013
- 2013-03-06 CN CN 201320103155 patent/CN203085249U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111452376A (en) * | 2020-04-27 | 2020-07-28 | 深圳市信维通信股份有限公司 | Manufacturing process of conductive foam |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 528300 Guangdong province Foshan city Shunde District Xingtan town Bai'an northbound water Industrial Zone Patentee after: GUANGDONG LEARY NEW MATERIALS TECHNOLOGY Co.,Ltd. Address before: 528300 Guangdong province Foshan city Shunde District Xingtan town Bai'an northbound water Industrial Zone Patentee before: LEARY ELECTRONIC MATERIALS CO.,LTD. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130724 |