CN204206720U - A kind of nano level metal electromagnetic shielding film - Google Patents
A kind of nano level metal electromagnetic shielding film Download PDFInfo
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- CN204206720U CN204206720U CN201420666612.XU CN201420666612U CN204206720U CN 204206720 U CN204206720 U CN 204206720U CN 201420666612 U CN201420666612 U CN 201420666612U CN 204206720 U CN204206720 U CN 204206720U
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Abstract
The utility model discloses a kind of nano level metal electromagnetic shielding film, belong to electromagnetic membrane and manufacture field.It comprises carrier layer (1), the first screen (2) and insulating barrier (3) three-decker, and the first described screen is conductive ink layer or magnetron sputtering coating; Described carrier layer, the first screen and insulating barrier are folded successively from the bottom to top to be established, and described carrying layer surface covers the first screen, and described first screen surface covers insulating barrier.The utility model provides nano level metal electromagnetic shielding film, adopt printing processing or magnetron sputtering mode, structure is easy to process, existing most of electronic equipment can be met more and more lightening, electronic devices and components are piled up more and more, occur the increasing requirement of electromagnetic interference situation, and this product shield effectiveness are good in narrow space, with low cost, successful.
Description
Technical field:
The present invention relates to a kind of electromagnetic membrane, be specifically related to a kind of nano level metal electromagnetic shielding film.
Background technology:
Existing shielding material is copper aluminum foil and adhesive tape, and because it is cheap, draw materials easily, the preferred material of shield effectiveness good Shi Gejia always Electronics Factory, but only have single layer structure, there is difficult processing, not easily bend, use location can limit to some extent.And single layer structure cannot meet the demand of some personalizations of designer, for designing the shielding material of the requirement meeting user, manufacturing enterprise can add all the other auxiliary materials, and this will improve production cost virtually.And copper aluminium base is due to its metallicity, in small space, easily secondary interference is produced to other electronic devices and components, thus scheme cannot be carried out, aluminum bronze all has futures in addition, price is comparatively large by market clout, thus makes its finished product price unstable, and risk is larger.
Summary of the invention:
1. the technical problem that solves of utility model
Combination process difficulty, gauffer easy to foaming is there is for existing original electromagnetic shielding film, affect the problem that the high and prices of raw and semifnished materials of function use, cross cutting difficult processing, cost easily fluctuate etc., the invention provides a kind of nano level metal electromagnetic shielding film, adopt the mode of printing processing or magnetron sputtering, easy to process, existing most of electronic equipment can be met more and more lightening, electronic devices and components are piled up more and more, the increasing requirement of electromagnetic interference situation is there is in narrow space, and this product shield effectiveness is good, with low cost, successful.
2. technical scheme
A kind of nano level metal electromagnetic shielding film, comprise carrier layer, the first screen and insulating barrier three-decker, the first described screen is conductive ink layer or magnetron sputtering coating; Described carrier layer, the first screen and insulating barrier are folded successively from the bottom to top to be established, and described carrying layer surface covers the first screen, and described first screen surface covers insulating barrier.
Described insulating barrier is the epoxy resin layer of solidification.
Described carrier layer is PETG or polycarbonate film.
Described conductive ink layer, essence is made up of conductive powder surface-coated ink; Described conductive powder is the one in silver-colored copper-clad, nickel or silver metal powder.
Described magnetron sputtering coating, essence is electroplated by various metals target and is formed, and described metallic target is the one in silver-colored target, nickel target, copper target.
Further, nano level metal electromagnetic shielding film, also comprises secondary shielding layer, and described secondary shielding layer is covered in carrier layer lower surface.
Further, the diaphragm of described screen is milky white PETG release film, and thickness is 20-65 micron.
Further, the thickness of described carrier layer is 42-46 micron, thickness of insulating layer 8-12 micron, if screen is conductive ink layer, first screen and secondary shielding layer, thickness is respectively 20-26 micron, if screen is magnetron sputtering coating, first screen and secondary shielding layer, thickness is respectively 0.3-0.8 micron.
3. beneficial effect
The present invention adopts soft PETG or polycarbonate film to be carrier layer, it has good mechanical property, folding resistance is good, good, the resistance to diluted acid of processability, diluted alkaline, good insulation property, excellent high-and low-temperature resistance, after it carries out surface treatment, the mode of printing conductive inks or employing magnetron sputtering is electroplated, and makes it have one or both sides and has conductive shield effectiveness.Also the mode by processing rear attaching makes it have different layer structures, to meet the individual demand of client.
Nano level metal electromagnetic membrane adopts printing, magnetron sputtering electroplates the mode conformed to, and according to customer requirement, make the final ideal product of client, processability is good, and client directly can use by stamp, time saving and energy saving.Folding resistance is good, and the scope of application is relatively extensive.Thus make it have different screening effectivenesss and Costco Wholesale, farthest can control cost under the application demand prerequisite meeting client, compare traditional shielding material copper aluminum foil and adhesive tape and there is greater flexibility.
Accompanying drawing illustrates:
Fig. 1 is nano level metal electromagnetic shielding film structural representation in embodiment 1;
Fig. 2 is nano level metal electromagnetic shielding film structural representation in embodiment 2.
Fig. 3 is nano level metal electromagnetic shielding film structural representation in embodiment 4.
Fig. 4 is nano level metal electromagnetic shielding film structural representation in embodiment 5.
Fig. 5 is nano level metal electromagnetic shielding film structural representation in embodiment 6.
In figure: 1-carrier layer; 2-first screen; 3-insulating barrier; 4-diaphragm; 5-secondary shielding layer; 6-first adhesive layer; 7-second adhesive layer.
Embodiment:
Embodiment 1
As shown in Figure 1, a kind of nano level metal electromagnetic shielding film, it comprises carrier layer 1, first screen 2 and insulating barrier 3 three-decker, and wherein, carrier layer 1 is polycarbonate film, and thickness is 42 microns; First screen 2 is conductive ink layer, and essence is made up of silver metal conductive powder surface-coated ink, thickness of insulating layer 8 microns; Insulating barrier 3 is the epoxy resin layer of solidification, and thickness is 20 microns; Carrier layer 1, first screen 2 and insulating barrier 3 are folded successively from the bottom to top to be established, and carrier layer 1 surface covers the first screen 2, first screen 2 surface and covers insulating barrier 3.
By the nano level metal electromagnetic shielding film in embodiment 1, test under certain testing situations, its test result is: resistance to chemical reagents qualified (test condition: 2mol/L HCl soaks 10min), electromagnetic wave shielding performance is decay intensity 20-40% (test condition: frequency range: 10-1000Hz), sheet resistance 0.2-0.5 ohm (test condition: air line distance 15mm tests), depot under room temperature 10-25 degree Celsius, be less than or equal to 60 days, depot under refrigeration 2-10 degree Celsius, be less than or equal to 180 days.
Embodiment 2
As shown in Figure 2, a kind of nano level metal electromagnetic shielding film, it comprises carrier layer 1, first screen 2, insulating barrier 3 and diaphragm 4 four-layer structure; Wherein, carrier layer 1 is PETG, and thickness is 46 microns; First screen 2 is conductive ink layer, and essence is made up of nickel metallic conduction powder surface-coated ink, insulating barrier 3 thickness 12 microns; Insulating barrier 3 is the epoxy resin layer of solidification, and thickness is 22 microns; Screen diaphragm 4 is milky white PETG release film, and thickness is 65 microns; The diaphragm 4 of carrier layer 1, first screen 2, insulating barrier 3 and screen is folded successively from the bottom to top to be established, and carrier layer 1 surface covers the first screen 2, first screen 2 surface and covers insulating barrier 3, insulating barrier 3 surface-coated diaphragm 4.
By the nano level metal electromagnetic shielding film in embodiment 2, its test result is: resistance to chemical reagents qualified (test condition: 2mol/L HCl soaks 10min), electromagnetic wave shielding performance is decay intensity 20-40% (test condition: frequency range: 10-1000Hz), sheet resistance 0.2-0.5 ohm (test condition: air line distance 15mm tests), depot under room temperature 10-25 degree Celsius, be less than or equal to 60 days, depot under refrigeration 2-10 degree Celsius, be less than or equal to 180 days.
Embodiment 3
As shown in Figure 2, structural material is with embodiment 2, and difference is that described conductive powder is silver metal powder; The thickness of described carrier layer is 44 microns, thickness of insulating layer 10 microns, and shielding thickness is 26 microns.Test result is with embodiment 2.
Embodiment 4
As shown in Figure 3, structural material is with embodiment 1, and difference is also to comprise secondary shielding layer 5, and described secondary shielding layer 5 is covered in carrier layer 1 lower surface; The thickness of described carrier layer is 44 microns, thickness of insulating layer 10 microns, and the first shielding thickness is identical with secondary shielding layer thickness, is 26 microns.Test result is with embodiment 2.
Embodiment 5
As shown in Figure 4, structural material is with embodiment 1, and difference is to comprise the first adhesive layer 6, and described first adhesive layer 6 is covered in carrier layer 1 lower surface; The thickness of described carrier layer 1 is 44 microns, insulating barrier 3 thickness 10 microns, and the first screen 2 thickness is 26 microns.Test result is with embodiment 2.
Embodiment 6
As shown in Figure 5, structural material is with embodiment 5, and difference is also to comprise the second adhesive layer 7, and described second adhesive layer 7 is attached to insulating barrier 3 upper surface; Described first adhesive layer 6 and the second adhesive layer 7 are transparent pressure-sensitive adhesive layer or conductive adhesive layer, and thickness is 5-50 micron; The thickness of described carrier layer 1 is 44 microns, insulating barrier 3 thickness 10 microns, and the first screen 2 thickness is 26 microns.Test result is with embodiment 2.
Embodiment 7
Structural material is with embodiment 5, and difference is that described conductive powder is silver-colored copper-clad metal dust.Test result is with embodiment 2.
Embodiment 8
Structure is with embodiment 1, and difference is, the first screen 2 is magnetron sputtering coating, and essence to be electroplated by the mode of magnetron sputtering by silver-colored target and formed, and the first screen 2 thickness is respectively 0.3 micron.
By the nano level metal electromagnetic shielding film in embodiment 8, test under certain testing situations, its test result is: resistance to chemical reagents qualified (test condition: 2mol/L HCl soaks 10min), electromagnetic wave shielding performance is decay intensity 20-40% (test condition: frequency range: 10-1000Hz), sheet resistance 0.2-0.5 ohm (test condition: air line distance 15mm tests), depot under room temperature 10-25 degree Celsius, be less than or equal to 60 days, depot under refrigeration 2-10 degree Celsius, be less than or equal to 180 days.
Embodiment 9
Structure is with embodiment 4, and difference is, the first screen 2 is magnetron sputtering coating, and the first screen 2 essence to be electroplated by the mode of magnetron sputtering by nickel target and formed, and the first screen 2 thickness is respectively 0.5 micron; Secondary shielding layer essence to be electroplated by the mode of magnetron sputtering by copper target and is formed, and secondary shielding layer thickness is respectively 0.8 micron.Test result is with embodiment 2.
Embodiment 10
Structure is with embodiment 9, and difference is, the first screen 2 thickness is respectively 0.8 micron; Secondary shielding layer essence to be electroplated by the mode of magnetron sputtering by copper target and is formed, and secondary shielding layer thickness is respectively 0.6 micron.Test result is with embodiment 2.
Embodiment 11
Structure is with embodiment 9, and difference is, secondary shielding layer thickness is respectively 0.3 micron.Test result is with embodiment 2.
Claims (10)
1. a nano level metal electromagnetic shielding film, is characterized in that: comprise carrier layer (1), the first screen (2) and insulating barrier (3) three-decker, and described the first screen (2) is conductive ink layer or magnetron sputtering coating; Described carrier layer (1), the first screen (2) and insulating barrier (3) are folded successively from the bottom to top to be established, and described carrier layer (1) surface covers the first screen (2), and described first screen (2) surface covers insulating barrier (3).
2. nano level metal electromagnetic shielding film according to claim 1, is characterized in that, described insulating barrier (3) is the epoxy resin layer of solidification.
3. nano level metal electromagnetic shielding film according to claim 1, it is characterized in that, described carrier layer (1) is PETG or polycarbonate film.
4. nano level metal electromagnetic shielding film according to claim 1, it is characterized in that, described conductive ink layer, essence is made up of conductive powder surface-coated ink; Described conductive powder is the one in silver-colored copper-clad, nickel or silver metal powder.
5. nano level metal electromagnetic shielding film according to claim 1, is characterized in that, described magnetron sputtering coating, and essence is electroplated by metallic target and formed; Described metallic target is the one in silver-colored target, nickel target or copper target.
6. nano level metal electromagnetic shielding film according to claim 1, it is characterized in that, also comprise secondary shielding layer (5), described secondary shielding layer (5) is covered in carrier layer (1) lower surface.
7. nano level metal electromagnetic shielding film according to claim 1, it is characterized in that, also comprise the first adhesive layer (6), described first adhesive layer (6) is covered in carrier layer (1) lower surface.
8. nano level metal electromagnetic shielding film according to claim 7, it is characterized in that, also comprise the second adhesive layer (7), described second adhesive layer (7) is attached to insulating barrier (3) upper surface; Described first adhesive layer (6) and the second adhesive layer (7) are transparent pressure-sensitive adhesive layer or conductive adhesive layer, and thickness is 5-50 micron.
9. nano level metal electromagnetic shielding film according to claim 1, is characterized in that, also comprise diaphragm (4), and described diaphragm (4) is attached to insulating barrier (3) surface.
10. nano level metal electromagnetic shielding film according to claim 9, it is characterized in that, described diaphragm (4) is milky white PETG release film, thickness is 20-65 micron, the thickness of described carrier layer (1) is 42-46 micron, insulating barrier (3) thickness 8-12 micron, screen is conductive ink layer, and the first screen (2) and secondary shielding layer (5) thickness are respectively 20-26 micron; Or screen is magnetron sputtering coating, the first screen (2) and secondary shielding layer (5) thickness are respectively 0.3-0.8 micron.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420666612.XU CN204206720U (en) | 2014-11-10 | 2014-11-10 | A kind of nano level metal electromagnetic shielding film |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201420666612.XU CN204206720U (en) | 2014-11-10 | 2014-11-10 | A kind of nano level metal electromagnetic shielding film |
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| CN204206720U true CN204206720U (en) | 2015-03-11 |
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| CN201420666612.XU Expired - Fee Related CN204206720U (en) | 2014-11-10 | 2014-11-10 | A kind of nano level metal electromagnetic shielding film |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106872819A (en) * | 2016-12-30 | 2017-06-20 | 深圳天珑无线科技有限公司 | A kind of screened film test suite and test module |
| CN106916544A (en) * | 2017-02-28 | 2017-07-04 | 合肥钱锋特殊胶粘制品有限公司 | A kind of LCD diaphragms |
| CN107353777A (en) * | 2017-08-16 | 2017-11-17 | 苏州城邦达力材料科技有限公司 | It is electromagnetically shielded the preparation method of membrane coat and electromagnetic shielding film |
| CN108848662A (en) * | 2018-08-06 | 2018-11-20 | 梧州市兴能农业科技有限公司 | A kind of fiber electromagnetic shielding film |
| CN109041561A (en) * | 2018-08-28 | 2018-12-18 | 中国人民解放军海军航空大学青岛校区 | A kind of electromagnetic shielding method of technique for aircraft composite covering |
| CN112469260A (en) * | 2020-11-23 | 2021-03-09 | 南昌联能科技有限公司 | Shielding film, preparation method of shielding film and cable |
| CN112930100A (en) * | 2021-01-20 | 2021-06-08 | 中国电子科技集团公司第三十三研究所 | Metal transparentized electromagnetic shielding material and preparation method thereof |
-
2014
- 2014-11-10 CN CN201420666612.XU patent/CN204206720U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106872819A (en) * | 2016-12-30 | 2017-06-20 | 深圳天珑无线科技有限公司 | A kind of screened film test suite and test module |
| CN106916544A (en) * | 2017-02-28 | 2017-07-04 | 合肥钱锋特殊胶粘制品有限公司 | A kind of LCD diaphragms |
| CN107353777A (en) * | 2017-08-16 | 2017-11-17 | 苏州城邦达力材料科技有限公司 | It is electromagnetically shielded the preparation method of membrane coat and electromagnetic shielding film |
| CN108848662A (en) * | 2018-08-06 | 2018-11-20 | 梧州市兴能农业科技有限公司 | A kind of fiber electromagnetic shielding film |
| CN109041561A (en) * | 2018-08-28 | 2018-12-18 | 中国人民解放军海军航空大学青岛校区 | A kind of electromagnetic shielding method of technique for aircraft composite covering |
| CN109041561B (en) * | 2018-08-28 | 2020-04-28 | 中国人民解放军海军航空大学青岛校区 | Electromagnetic shielding method for aircraft composite material skin |
| CN112469260A (en) * | 2020-11-23 | 2021-03-09 | 南昌联能科技有限公司 | Shielding film, preparation method of shielding film and cable |
| CN112930100A (en) * | 2021-01-20 | 2021-06-08 | 中国电子科技集团公司第三十三研究所 | Metal transparentized electromagnetic shielding material and preparation method thereof |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150311 Termination date: 20151110 |
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| EXPY | Termination of patent right or utility model |