CN207869493U - electromagnetic shielding film - Google Patents
electromagnetic shielding film Download PDFInfo
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- CN207869493U CN207869493U CN201721900691.6U CN201721900691U CN207869493U CN 207869493 U CN207869493 U CN 207869493U CN 201721900691 U CN201721900691 U CN 201721900691U CN 207869493 U CN207869493 U CN 207869493U
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- conductive adhesive
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Abstract
The utility model discloses a kind of electromagnetic shielding films comprising black PI films, copper electroplating layer, conductive adhesive layer and the release film layer being bonded successively according to sequence from top to bottom；The utility model smart structural design, plating is rationally carried out on black PI films and forms the copper electroplating layer with good compactness, is different from conventional metals lamellar structure, in conjunction with more closely, laminating property is good, shielding properties, strong antijamming capability can be more promoted, and thickness is thin, whole flexibility is good, it is easy to process, while conductive adhesive layer also has certain screening ability, further promotes shielding properties；Traditional carrier layer and ink insulating layer are substituted using black PI films; effective protection copper electroplating layer is not damaged; with excellent mechanical performance, chemical stability and humidity resistance, radiation resistance, dielectricity and anti-scratch mill; overall structure is simple; on the basis of meeting shielding properties; effectively simplify tradition shielding membrane structure, good combination property is conducive to wide popularization and application.
Description
Technical field
The utility model is related to shield technical field of membrane, more particularly to a kind of electromagnetic shielding film.
Background technology
More and more intensive with flexible circuit board wiring route, the requirement to electromagnetic shielding film is higher and higher, shielding effect
Electromagnetic shielding film that can be more than 60db is increasingly favored by market.Shield effectiveness has direct relationship with conducting, is connected
Numerical value is smaller, and shield effectiveness is higher.
Chinese invention patent Publication No. CN104853577 discloses a kind of ultra-thin electromagnetic screened film and preparation method, should
It is in netted that the ultra-thin electromagnetic screened film provided, which is invented, by glue-line setting, and conductive metal is filled in the netted hole of glue-line,
It is placed in the netted intrapore webbed electro-magnetic screen layer of conductive metal layer structure of glue-line, realizes effectiveness.According to this
Invent provide ultra-thin electromagnetic screened film, by by glue-line setting in it is netted, will be for realizing the conductive gold of effectiveness
Belong to layer to be filled in the netted hole of glue-line so that ultra-thin electromagnetic screened film provided by the invention is not influencing effectiveness
Under the premise of thickness can reach 81 microns or less.However the invention electromagnetic shielding film glue-line is netted, when metal layer
The edge of grid cannot come into full contact with metal, and the conducting coefficient of electromagnetic shielding film is caused to increase, capability of electromagnetic shielding by
It influences.
Chinese invention patent number 201710492858.8 discloses a kind of electromagnetic shielding film, the electromagnetic shielding film include according to
Carrier layer, insulating layer, the first conductive adhesive layer, metal layer, the second conductive adhesive layer and the release film layer of secondary connection, wherein described
One conductive adhesive layer contains aluminium powder and/or magnesium powder, and second conductive adhesive layer contains nickel powder and/or cobalt powder.Although its can realize compared with
Good effectiveness, but its is complicated, thickness is thicker, and flexibility is not good enough, and its insulating layer insulate for ink
Layer, still has room for promotion in mechanical performance, chemical stability and humidity resistance, radiation resistance, dielectricity and anti-scratch mill property.
Utility model content
Against the above deficiency, the utility model aim is to provide a kind of smart structural design, rationally, and shield effectiveness is good,
And thickness is thin, the electromagnetic shielding film of flexibility.
To achieve the above object, the technical solution provided is the utility model：
A kind of electromagnetic shielding film comprising black PI films, copper electroplating layer, conductive adhesive layer and release film layer, the black PI
Film, copper electroplating layer, conductive adhesive layer and release film layer are bonded successively according to sequence from top to bottom.
As a kind of improvement of the utility model, the thickness of the black PI films is 5~12.5 microns.
As a kind of improvement of the utility model, the thickness of the copper electroplating layer is 0.1~0.3 micron.
As a kind of improvement of the utility model, the thickness of the conductive adhesive layer is 5~15 microns.
As a kind of improvement of the utility model, the thickness of the release film layer is 38~75 microns.
The beneficial effects of the utility model are：The utility model smart structural design rationally carries out electricity on black PI films
Plating forms the copper electroplating layer with good compactness, is different from conventional metals lamellar structure, and in conjunction with more closely, laminating property is good,
Shielding properties, strong antijamming capability can be more promoted, and thickness is thin, whole flexibility is good, easy to process, while conductive adhesive layer also has
There is certain screening ability, further promotes shielding properties；Traditional carrier layer is substituted using black PI films and ink is exhausted
Edge layer, effective protection copper electroplating layer are not damaged, and have excellent mechanical performance, chemical stability and humidity resistance, radiation hardness
Property, dielectricity and anti-scratch mill, overall structure it is simple, on the basis of meeting shielding properties, effectively simplify traditional screened film knot
Structure, good combination property are conducive to wide popularization and application.
Description of the drawings
Fig. 1 is the cross section structure schematic diagram of the utility model.
Specific implementation mode
Embodiment：Referring to Fig. 1, the utility model embodiment provides a kind of electromagnetic shielding film comprising black PI films 1, electricity
Copper plate 2, conductive adhesive layer 3 and release film layer 4, the black PI films 1, copper electroplating layer 2, conductive adhesive layer 3 and release film layer 4 according to
Sequence from top to bottom is bonded successively.Preferably, it also is fitted with aluminium foil layer between the conductive adhesive layer 3 and release film layer 4, with
Shielding properties is further promoted, avoids interfering.The thickness of the copper foil layer be 15~30 microns, preferably 15 microns, 18 microns, 20
Micron or 28 microns, to have shielded effect.Alternatively, it is also possible to be equipped with metal powder interlayer in conductive adhesive layer 3, can more be promoted
Shielding properties.This just greatly increases metal powder amount, and then promotes shield effectiveness.
Specifically, the thickness of the black PI films 1 is 5~12.5 microns.Preferably 5 microns, 8 microns, 10 microns or
12.5 microns.The thickness of the copper electroplating layer 2 is 0.1~0.3 micron.Preferably 0.1 micron, 0.2 micron or 0.3 micron.Institute
The thickness for stating conductive adhesive layer 3 is 5~15 microns.Preferably 5 microns, 8 microns, 10 microns or 15 microns.The release film layer 4
Thickness is 38~75 microns.Preferably 38 microns, 50 microns, 60 microns or 75 microns.
In use, forming the electricity with good compactness since the utility model rationally carries out plating on black PI films 1
Copper plate 2 is different from conventional metals lamellar structure, and in conjunction with more closely, laminating property is good, can more promote shielding properties, anti-interference
Ability is strong, and thickness is thin, and whole flexibility is good, easy to process, while conductive adhesive layer 3 also has certain screening ability, into one
Step promotes shielding properties；Traditional carrier layer and ink insulating layer, effective protection copper electroplating layer are substituted using black PI films 1
2 are not damaged, and have excellent mechanical performance, chemical stability and humidity resistance, radiation resistance, dielectricity and anti-scratch mill,
Overall structure is simple, on the basis of meeting shielding properties, effectively simplifies tradition shielding membrane structure, good combination property.
According to the disclosure and teachings of the above specification, the utility model those skilled in the art can also be to above-mentioned reality
The mode of applying is changed and is changed.Therefore, the utility model is not limited to specific implementation mode disclosed and described above, right
Some modifications and changes of the utility model should also be as falling into the protection scope of the claims of the present utility model.In addition, to the greatest extent
Some specific terms are used in pipe this specification, these terms are merely for convenience of description, not to the utility model
Any restrictions are constituted, using same or similar other membrane bodies, in scope of protection of the utility model.
Claims (5)
1. a kind of electromagnetic shielding film, which is characterized in that it includes black PI films, copper electroplating layer, conductive adhesive layer and release film layer, institute
Black PI films, copper electroplating layer, conductive adhesive layer and release film layer is stated to be bonded successively according to sequence from top to bottom.
2. electromagnetic shielding film according to claim 1, which is characterized in that the thickness of the black PI films is 5~12.5 micro-
Rice.
3. electromagnetic shielding film according to claim 1, which is characterized in that the thickness of the copper electroplating layer is 0.1~0.3 micro-
Rice.
4. electromagnetic shielding film according to claim 1, which is characterized in that the thickness of the conductive adhesive layer is 5~15 microns.
5. electromagnetic shielding film according to claim 1, which is characterized in that the thickness of the release film layer is 38~75 micro-
Rice.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721900691.6U CN207869493U (en) | 2017-12-29 | 2017-12-29 | electromagnetic shielding film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721900691.6U CN207869493U (en) | 2017-12-29 | 2017-12-29 | electromagnetic shielding film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207869493U true CN207869493U (en) | 2018-09-14 |
Family
ID=63463664
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721900691.6U Expired - Fee Related CN207869493U (en) | 2017-12-29 | 2017-12-29 | electromagnetic shielding film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207869493U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111669957A (en) * | 2020-06-15 | 2020-09-15 | 江苏百旭电子新材料科技有限公司 | FPC hot-pressing shielding film and production method thereof |
-
2017
- 2017-12-29 CN CN201721900691.6U patent/CN207869493U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111669957A (en) * | 2020-06-15 | 2020-09-15 | 江苏百旭电子新材料科技有限公司 | FPC hot-pressing shielding film and production method thereof |
| CN111669957B (en) * | 2020-06-15 | 2022-08-02 | 江苏百旭电子新材料科技有限公司 | FPC hot-pressing shielding film and production method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180914 Termination date: 20201229 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |