CN107072130A - A kind of electromagnetic shielding film - Google Patents
A kind of electromagnetic shielding film Download PDFInfo
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- CN107072130A CN107072130A CN201710492858.8A CN201710492858A CN107072130A CN 107072130 A CN107072130 A CN 107072130A CN 201710492858 A CN201710492858 A CN 201710492858A CN 107072130 A CN107072130 A CN 107072130A
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- Prior art keywords
- electromagnetic shielding
- conductive adhesive
- shielding film
- adhesive layer
- layer
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention relates to a kind of electromagnetic shielding film, the electromagnetic shielding film includes carrier layer (1), insulating barrier (2), the first conductive adhesive layer (3), metal level (4), the second conductive adhesive layer (5) and the release film layer (6) being sequentially connected, wherein described first conductive adhesive layer contains aluminium powder and/or magnesium powder, and second conductive adhesive layer contains nickel powder and/or cobalt powder.The electromagnetic shielding film has excellent capability of electromagnetic shielding, simple in construction, it is easy to carry out industrialized production.
Description
Technical field
The invention belongs to screened film field, and in particular to a kind of electromagnetic shielding film.
Background technology
In recent years, generally using with radiotechnics, electromagnetic pollution is more and more universal, while circuit low-voltage itself
The use of low-power consumption so that the ability of the electromagnetism interference (EMI) of circuit in itself is remarkably decreased.In product casing plating anti-EMI filter
Film, can both protect this product not influenceed by extraneous EMI, and itself interference to external world, European Union 89/336/ can be reduced again
EEC (EMC) standard has explicitly pointed out electronic product must be in product casing inwall plating anti-EMI filter film.The screen used at present
Covering material mainly has conductivity type, filled-type, Intrinsical and inhales wave mode, and preparation method is mainly metal paper tinsel, sputtering plating, plating
Or the method such as chemical plating and coating electrically-conducting paint.
With more and more intensive, the requirement more and more higher to electromagnetic shielding film of FPC wiring route, shielding effect
The electromagnetic shielding film that 60db can be more than increasingly is favored by market.Shield effectiveness has direct relation with conducting, turns on
Numerical value is smaller, and shield effectiveness is higher.
CN 104853577A disclose a kind of ultra-thin electromagnetic screened film and preparation method, the ultra-thin electromagnetic that the invention is provided
It is in netted that screened film, which sets glue-line, and conducting metal is filled in the netted hole of glue-line, is placed in the netted hole of glue-line
The interior webbed electro-magnetic screen layer of conductive metal layer structure, realizes effectiveness.The ultra-thin electromagnetic provided according to the present invention
Screened film, is in netted, by for realizing that the conductive metal layer of effectiveness is filled in the net of glue-line by the way that glue-line is set
In shape hole so that the ultra-thin electromagnetic screened film that the present invention is provided thickness on the premise of effectiveness is not influenceed can reach
To less than 8 μm.But the invention electromagnetic shielding film glue-line is netted, edge during metal level in grid can not be with metal
Fully contact, causes the conducting coefficient of electromagnetic shielding film to raise, capability of electromagnetic shielding is affected.
Therefore, a kind of new electromagnetic shielding film is prepared particularly significant.
The content of the invention
For technical problem present in prior art, the present invention provides a kind of electromagnetic shielding film, the electromagnetic shielding film
It is simple in construction with excellent capability of electromagnetic shielding, it is easy to carry out industrialized production.
To reach above-mentioned purpose, the present invention uses following technical scheme：
The present invention provides a kind of electromagnetic shielding film, it is characterised in that the electromagnetic shielding film includes the carrier being sequentially connected
Film layer, insulating barrier, the first conductive adhesive layer, metal level, the second conductive adhesive layer and release film layer, wherein first conductive adhesive layer contains
There are aluminium powder and/or magnesium powder, second conductive adhesive layer contains nickel powder and/or cobalt powder.
The electromagnetic shielding film that the present invention is provided, using contained in bilayer conductive plastic structure, and double layer of metal conducting resinl
Metal is different, and the ionization energy of the metal in the first conductive adhesive layer is greater than metal in the second conductive adhesive layer, and such electronics just has
The trend of the first conductive adhesive layer is flowed to from the second conductive adhesive layer, so as to hinder electromagnetism quiet from the biographies of screened film outer layers towards inner layers
Pass, effective shielding is formd to electromagnetism.
As currently preferred technical scheme, it is thin that the carrier layer includes PET film, PEN films, PI films, PBT
Any one in film or PPS films or at least two combination, the combination is typical but non-limiting examples have：PET film and
The combinations of PEN films, the combination of PI films and PBT films, the combination of PET film and PPS films, PEN films and PBT films
Combination or the combination of PET film, PBT films and PPS films etc..
As currently preferred technical scheme, the thickness of the carrier layer is 10~100 μm, such as 10 μm, 20 μm, 30
μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm or 100 μm etc., it is not limited to cited numerical value, the number range
Other interior unrequited numerical value are equally applicable.
As currently preferred technical scheme, the insulating barrier is ink insulating barrier.
Preferably, the thickness of the insulating barrier is 15~20 μm, such as 15 μm, 16 μm, 17 μm, 18 μm, 19 μm or 20 μm,
It is not limited to other unrequited numerical value are equally applicable in cited numerical value, the number range.
As currently preferred technical scheme, the material of first conductive adhesive layer includes polyacrylic resin, epoxy
Any one in resin or polyurethane or at least two combination, the combination is typical but non-limiting examples have：Polyacrylic acid
The combination of resin and epoxy resin, the combination of epoxy resin and polyurethane, polyacrylic resin and the combination of polyurethane or poly- third
Combination of olefin(e) acid resin, epoxy resin and polyurethane etc..
Preferably, the thickness of first conductive adhesive layer (3) be 8~15 μm, such as 8 μm, 9 μm, 10 μm, 11 μm, 12 μm, 13
μm, 14 μm or 15 μm etc., it is not limited to other unrequited numerical value are equally fitted in cited numerical value, the number range
With.
As currently preferred technical scheme, the material of the metal level includes zinc and/or iron.
As currently preferred technical scheme, the thickness of the metal level is 0.5~1 μm, such as 0.5 μm, 0.6 μm, 0.7
μm, 0.8 μm, 0.9 μm or 1 μm etc., it is not limited to other unrequited numerical value are same in cited numerical value, the number range
Sample is applicable.
As currently preferred technical scheme, the material of second conductive adhesive layer includes polyacrylic resin, epoxy
Any one in resin or polyurethane or at least two combination, the combination is typical but non-limiting examples have：Polyacrylic acid
The combination of resin and epoxy resin, the combination of epoxy resin and polyurethane, polyacrylic resin and the combination of polyurethane or poly- third
Combination of olefin(e) acid resin, epoxy resin and polyurethane etc..
Preferably, the thickness of second conductive adhesive layer be 8~15 μm, such as 8 μm, 9 μm, 10 μm, 11 μm, 12 μm, 13 μm,
14 μm or 15 μm etc., it is not limited to other unrequited numerical value are equally applicable in cited numerical value, the number range.
As currently preferred technical scheme, it is release that the release film layer includes PE mould release membrances, PET mould release membrances, OPP
Film, PC mould release membrances, PS barrier films, PMMA mould release membrances, BOPP mould release membrances, TPX mould release membrances, PVC stripping films, PTFE mould release membrances, list
Any one in silicon mould release membrance or polyester mould release membrance or at least two combination, the combination is typical but non-limiting examples have：
The combination of PE mould release membrances and PET mould release membrances, the combination of OPP mould release membrances and PC mould release membrances, the group of PS barrier films and PMMA mould release membrances
The combination of conjunction, the combination of BOPP mould release membrances and TPX mould release membrances, the combining of PVC stripping films and PTFE mould release membrances, single silicon mould release membrance and
The combination of polyester-type mould release membrance or the combination of PE mould release membrances, PET mould release membrances and PC mould release membrances etc..
As currently preferred technical scheme, the thickness of the release film layer is 10~100 μm, such as 10 μm, 20 μm, 30
μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm or 100 μm etc., it is not limited to cited numerical value, the number range
Other interior unrequited numerical value are equally applicable.
Compared with prior art, the present invention at least has the advantages that：
(1) the invention provides a kind of electromagnetic shielding film, the shield effectiveness of the screened film is more than 90DB, reaches as high as
98DB；
(2) the invention provides a kind of electromagnetic shielding film, the screened film is simple in construction, it is easy to carry out industrialized production.
Brief description of the drawings
Fig. 1 is a kind of structural representation for electromagnetic shielding film that the present invention is provided；
In figure：1- carrier layers, 2- insulating barriers, the conductive adhesive layers of 3- first, 4- metal levels, the conductive adhesive layers of 5- second, 6- from
Type film layer.
Embodiment
Further illustrate technical scheme below in conjunction with the accompanying drawings and by embodiment.
For the present invention is better described, technical scheme is readily appreciated, of the invention is typical but non-limiting
Embodiment is as follows：
Embodiment 1
A kind of structure electromagnetic shielding film as shown in Figure 1, it is characterised in that the electromagnetic shielding film includes what is be sequentially connected
Carrier layer 1, insulating barrier 2, the first conductive adhesive layer 3, metal level 4, the second conductive adhesive layer 5 and release film layer 6, wherein described first
Conductive adhesive layer contains aluminium powder, and second conductive adhesive layer contains nickel powder.
Wherein, the carrier layer 1 is PET film, and thickness is 10 μm；The insulating barrier 2 is ink insulating barrier, and thickness is 15
μm；The material of first conductive adhesive layer 3 is polyacrylic resin, and thickness is 8 μm；The material of the metal level 4 is zinc, thickness
For 0.5 μm；The material of second conductive adhesive layer 5 is epoxy resin, and thickness is 8 μm；The release film layer 6 is PE mould release membrances,
Thickness is 10 μm.
Embodiment 2
A kind of electromagnetic shielding film, it is characterised in that the electromagnetic shielding film includes carrier layer 1, the insulation being sequentially connected
The 2, first conductive adhesive layer 3 of layer, metal level 4, the second conductive adhesive layer 5 and release film layer 6, wherein first conductive adhesive layer contains magnesium
Powder, second conductive adhesive layer contains cobalt powder.
Wherein, the carrier layer 1 is pen film, and thickness is 100 μm；The insulating barrier 2 is ink insulating barrier, and thickness is
20μm；The material of first conductive adhesive layer 3 is epoxy resin, and thickness is 15 μm；The material of the metal level 4 is iron, thickness
For 1 μm；The material of second conductive adhesive layer 5 is polyacrylic resin, and thickness is 15 μm；The release film layer 6 is that PET is release
Film, thickness is 100 μm.
Embodiment 3
A kind of electromagnetic shielding film, it is characterised in that the electromagnetic shielding film includes carrier layer 1, the insulation being sequentially connected
The 2, first conductive adhesive layer 3 of layer, metal level 4, the second conductive adhesive layer 5 and release film layer 6, wherein first conductive adhesive layer contains aluminium
Powder, second conductive adhesive layer contains cobalt powder.
Wherein, the carrier layer 1 is PBT films, and thickness is 20 μm；The insulating barrier 2 is ink insulating barrier, and thickness is 16
μm；The material of first conductive adhesive layer 3 is polyacrylic resin, and thickness is 10 μm；The material of the metal level 4 is zinc, thick
Spend for 0.6 μm；The material of second conductive adhesive layer 5 is polyacrylic resin, and thickness is 10 μm；The release film layer 6 is PET
Mould release membrance, thickness is 20 μm.
Embodiment 4
A kind of electromagnetic shielding film, it is characterised in that the electromagnetic shielding film includes carrier layer 1, the insulation being sequentially connected
The 2, first conductive adhesive layer 3 of layer, metal level 4, the second conductive adhesive layer 5 and release film layer 6, wherein first conductive adhesive layer contains aluminium
Powder and magnesium powder (mass ratio 1:1), second conductive adhesive layer contains nickel powder and cobalt powder (mass ratio 1:1).
Wherein, the carrier layer 1 is PET film, and thickness is 80 μm；The insulating barrier 2 is ink insulating barrier, and thickness is 18
μm；The material of first conductive adhesive layer 3 is polyurethane, and thickness is 13 μm；The material of the metal level 4 is iron, and thickness is 0.5
μm；The material of second conductive adhesive layer 5 is polyurethane, and thickness is 13 μm；The release film layer 6 is PE mould release membrances, and thickness is
80μm。
Embodiment 5
A kind of electromagnetic shielding film, it is characterised in that the electromagnetic shielding film includes carrier layer 1, the insulation being sequentially connected
The 2, first conductive adhesive layer 3 of layer, metal level 4, the second conductive adhesive layer 5 and release film layer 6, wherein first conductive adhesive layer contains aluminium
Powder, second conductive adhesive layer contains nickel powder.
Wherein, the carrier layer 1 is PBT films, and thickness is 50 μm；The insulating barrier 2 is ink insulating barrier, and thickness is 17
μm；The material of first conductive adhesive layer 3 is polyacrylic resin, and thickness is 12 μm；The material of the metal level 4 is zinc, thick
Spend for 0.6 μm；The material of second conductive adhesive layer 5 is polyacrylic resin, and thickness is 12 μm；The release film layer 6 is PET
Mould release membrance, thickness is 50 μm.
Comparative example 1
A kind of electromagnetic shielding film, in addition to removing the first conductive adhesive layer 3, other conditions are same as Example 5.
Comparative example 2
A kind of electromagnetic shielding film, is iron powder except what is contained in the first conductive adhesive layer 3 and the second conductive adhesive layer 5, and golden
Belong to the material of layer 4 for outside iron, other conditions are same as Example 5.
Embodiment 1-5 and comparative example 1 and 2 capability of electromagnetic shielding are tested, as a result as shown in table 1.
Table 1
| Project | Shield effectiveness/DB |
| Embodiment 1 | 91 |
| Embodiment 2 | 98 |
| Embodiment 3 | 96 |
| Embodiment 4 | 96 |
| Embodiment 5 | 97 |
| Comparative example 1 | 62 |
| Comparative example 2 | 71 |
Embodiment 1-5 shield effectiveness is in more than 90DB as can be seen from Table 1, reaches as high as 98DB, and comparative example 1 with
Embodiment is only the first conductive adhesive layer and the second conduction in 62DB, comparative example 2 compared to one layer of conductive adhesive layer, shield effectiveness has been lacked
The metal powder and the material of metal level that glue-line contains are iron, and shield effectiveness is only 71DB.
Applicant states that the present invention illustrates the detailed construction feature of the present invention by above-described embodiment, but the present invention is simultaneously
Above-mentioned detailed construction feature is not limited to, that is, does not mean that the present invention has to rely on above-mentioned detailed construction feature and could implemented.Institute
Belong to those skilled in the art it will be clearly understood that any improvement in the present invention, to the equivalence replacement of part selected by the present invention
And increase, the selection of concrete mode of accessory etc., within the scope of all falling within protection scope of the present invention and being open.
The preferred embodiment of the present invention described in detail above, still, the present invention are not limited in above-mentioned embodiment
Detail, in the range of the technology design of the present invention, a variety of simple variants can be carried out to technical scheme, this
A little simple variants belong to protection scope of the present invention.
It is further to note that each particular technique feature described in above-mentioned embodiment, in not lance
In the case of shield, can be combined by any suitable means, in order to avoid unnecessary repetition, the present invention to it is various can
The combination of energy no longer separately illustrates.
In addition, various embodiments of the present invention can be combined randomly, as long as it is without prejudice to originally
The thought of invention, it should equally be considered as content disclosed in this invention.
Claims (10)
1. a kind of electromagnetic shielding film, it is characterised in that the electromagnetic shielding film includes carrier layer (1), the insulation being sequentially connected
Layer (2), the first conductive adhesive layer (3), metal level (4), the second conductive adhesive layer (5) and release film layer (6), wherein described first is conductive
Glue-line contains aluminium powder and/or magnesium powder, and second conductive adhesive layer contains nickel powder and/or cobalt powder.
2. electromagnetic shielding film according to claim 1, it is characterised in that the carrier layer (1) includes PET film, PEN
Any one in film, PI films, PBT films or PPS films or at least two combination.
3. electromagnetic shielding film according to claim 1 or 2, it is characterised in that the thickness of the carrier layer (1) is 10~
100μm。
4. the electromagnetic shielding film according to claim any one of 1-3, it is characterised in that the insulating barrier (2) is that ink is exhausted
Edge layer；
Preferably, the thickness of the insulating barrier (2) is 15~20 μm.
5. the electromagnetic shielding film described in an acute claim any one of 1-4, it is characterised in that first conductive adhesive layer (3)
Material includes any one in polyacrylic resin, epoxy resin or polyurethane or at least two combination；
Preferably, the thickness of first conductive adhesive layer (3) is 8~15 μm.
6. the electromagnetic shielding film according to claim any one of 1-5, it is characterised in that the material bag of the metal level (4)
Include zinc and/or iron.
7. the electromagnetic shielding film according to claim any one of 1-6, it is characterised in that the thickness of the metal level (4) is
0.5~1 μm.
8. the electromagnetic shielding film according to claim any one of 1-7, it is characterised in that second conductive adhesive layer (5)
Material includes any one in polyacrylic resin, epoxy resin or polyurethane or at least two combination；
Preferably, the thickness of second conductive adhesive layer (5) is 8~15 μm.
9. the electromagnetic shielding film according to claim any one of 1-8, it is characterised in that the release film layer (6) includes PE
Mould release membrance, PET mould release membrances, OPP mould release membrances, PC mould release membrances, PS barrier films, PMMA mould release membrances, BOPP mould release membrances, TPX mould release membrances,
Any one in PVC stripping films, PTFE mould release membrances, single silicon mould release membrance or polyester mould release membrance or at least two combination.
10. the electromagnetic shielding film according to claim any one of 1-9, it is characterised in that the thickness of the release film layer (6)
For 10~100 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710492858.8A CN107072130A (en) | 2017-06-26 | 2017-06-26 | A kind of electromagnetic shielding film |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710492858.8A CN107072130A (en) | 2017-06-26 | 2017-06-26 | A kind of electromagnetic shielding film |
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| CN107072130A true CN107072130A (en) | 2017-08-18 |
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| CN201710492858.8A Pending CN107072130A (en) | 2017-06-26 | 2017-06-26 | A kind of electromagnetic shielding film |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107513351A (en) * | 2017-10-11 | 2017-12-26 | 广东正业科技股份有限公司 | A kind of electromagnetic shielding film and preparation method thereof |
| CN107592783A (en) * | 2017-09-15 | 2018-01-16 | 中山国安火炬科技发展有限公司 | A kind of electromagnetic shielding film and preparation method thereof |
| CN108274837A (en) * | 2018-01-31 | 2018-07-13 | 苏州维洛克电子科技有限公司 | Novel composite membrane |
| CN108282990A (en) * | 2018-03-14 | 2018-07-13 | 苏州城邦达力材料科技有限公司 | A kind of electromagnetic shielding film of base material reinforcement and preparation method thereof, application |
| CN108495544A (en) * | 2018-07-02 | 2018-09-04 | 蔡志浩 | A kind of electromagnetic shielding film |
| CN115746740A (en) * | 2022-11-04 | 2023-03-07 | 四川普利司德高分子新材料有限公司 | Electromagnetic shielding protection film |
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| CN2512777Y (en) * | 2001-12-06 | 2002-09-25 | 惠达 | Conductive aluminium foil rubber tape |
| CN106061103A (en) * | 2016-07-21 | 2016-10-26 | 东莞市航晨纳米材料有限公司 | High flexible electromagnetic shielding film and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107592783A (en) * | 2017-09-15 | 2018-01-16 | 中山国安火炬科技发展有限公司 | A kind of electromagnetic shielding film and preparation method thereof |
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| CN108282990A (en) * | 2018-03-14 | 2018-07-13 | 苏州城邦达力材料科技有限公司 | A kind of electromagnetic shielding film of base material reinforcement and preparation method thereof, application |
| CN108495544A (en) * | 2018-07-02 | 2018-09-04 | 蔡志浩 | A kind of electromagnetic shielding film |
| CN115746740A (en) * | 2022-11-04 | 2023-03-07 | 四川普利司德高分子新材料有限公司 | Electromagnetic shielding protection film |
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