CN107148209A - A kind of electromagnetic shielding film - Google Patents
A kind of electromagnetic shielding film Download PDFInfo
- Publication number
- CN107148209A CN107148209A CN201710524774.8A CN201710524774A CN107148209A CN 107148209 A CN107148209 A CN 107148209A CN 201710524774 A CN201710524774 A CN 201710524774A CN 107148209 A CN107148209 A CN 107148209A
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- China
- Prior art keywords
- electromagnetic shielding
- shielding film
- mould release
- layer
- thickness
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
- C08K5/18—Amines; Quaternary ammonium compounds with aromatically bound amino groups
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The present invention relates to a kind of electromagnetic shielding film, the electromagnetic shielding film includes carrier layer (1), insulating barrier (2), conductive adhesive layer (3), metal level (4) and the release film layer (5) being sequentially connected, wherein first conductive adhesive layer contains any one in the acetone of 2 hydroxyl, 2 methyl, 1 phenyl 1,4 dimethylaminobenzoic acid ethyl esters or 1 hydroxycyclohexyl phenyl ketone or at least two combination.The electromagnetic shielding film has excellent capability of electromagnetic shielding, simple in construction, it is easy to carry out industrialized production.
Description
Technical field
The invention belongs to screened film field, and in particular to a kind of electromagnetic shielding film.
Background technology
In recent years, generally using with radiotechnics, electromagnetic pollution is more and more universal, while circuit low-voltage itself
The use of low-power consumption so that the ability of the electromagnetism interference (EMI) of circuit in itself is remarkably decreased.In product casing plating anti-EMI filter
Film, can both protect this product not influenceed by extraneous EMI, and itself interference to external world, European Union 89/336/ can be reduced again
EEC (EMC) standard has explicitly pointed out electronic product must be in product casing inwall plating anti-EMI filter film.The screen used at present
Covering material mainly has conductivity type, filled-type, Intrinsical and inhales wave mode, and preparation method is mainly metal paper tinsel, sputtering plating, plating
Or the method such as chemical plating and coating electrically-conducting paint.
With more and more intensive, the requirement more and more higher to electromagnetic shielding film of FPC wiring route, shielding effect
The electromagnetic shielding film that 60db can be more than increasingly is favored by market.Shield effectiveness has direct relation with conducting, turns on
Numerical value is smaller, and shield effectiveness is higher.
CN 104853577A disclose a kind of ultra-thin electromagnetic screened film and preparation method, the ultra-thin electromagnetic that the invention is provided
It is in netted that screened film, which sets glue-line, and conducting metal is filled in the netted hole of glue-line, is placed in the netted hole of glue-line
The interior webbed electro-magnetic screen layer of conductive metal layer structure, realizes effectiveness.The ultra-thin electromagnetic provided according to the present invention
Screened film, is in netted, by for realizing that the conductive metal layer of effectiveness is filled in the net of glue-line by the way that glue-line is set
In shape hole so that the ultra-thin electromagnetic screened film that the present invention is provided thickness on the premise of effectiveness is not influenceed can reach
To less than 8 μm.But the invention electromagnetic shielding film glue-line is netted, edge during metal level in grid can not be with metal
Fully contact, causes the conducting coefficient of electromagnetic shielding film to raise, capability of electromagnetic shielding is affected.
The content of the invention
For technical problem present in prior art, the present invention provides a kind of electromagnetic shielding film, the electromagnetic shielding film
It is simple in construction with excellent capability of electromagnetic shielding, it is easy to carry out industrialized production.
To reach above-mentioned purpose, the present invention uses following technical scheme：
The present invention provides a kind of electromagnetic shielding film, it is characterised in that the electromagnetic shielding film includes the carrier being sequentially connected
Film layer, insulating barrier, conductive adhesive layer, metal level and release film layer, wherein the conductive adhesive layer contains 2- hydroxy-2-methyl -1- benzene
Any one in base -1- acetone, 4- dimethylamino-ethyl benzoate or 1- hydroxy-cyclohexyl-phenyl ketones or at least two
Combination.
Contain 2- hydroxy-2-methyl -1- phenyl -1- acetone, 4- in the conductive adhesive layer for the electromagnetic shielding film that the present invention is provided
Dimethylamino-ethyl benzoate or 1- hydroxy-cyclohexyl-phenyls ketone any one or at least two combination, above-mentioned substance
Under Electromagnetic Field, it may result from, by base, afterwards along Electromagnetic Wave Propagation direction accelerating, bombarding metal level and produce and electromagnetism
The opposite electron stream of ripple direction spread speed, electron stream is high due to energy, can be neutralized with the energy of electromagnetic wave, and then play shielding
The effect of electromagnetic wave.
As currently preferred technical scheme, it is thin that the carrier layer includes PET film, PEN films, PI films, PBT
Any one in film or PPS films or at least two combination, the combination is typical but non-limiting examples have：PET film and
The combinations of PEN films, the combination of PI films and PBT films, the combination of PET film and PPS films, PEN films and PBT films
Combination or the combination of PET film, PBT films and PPS films etc..
As currently preferred technical scheme, the thickness of the carrier layer is 10~100 μm, such as 10 μm, 20 μm, 30
μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm or 100 μm etc., it is not limited to cited numerical value, the number range
Other interior unrequited numerical value are equally applicable.
As currently preferred technical scheme, the insulating barrier is ink insulating barrier.
Preferably, the thickness of the insulating barrier is 15~20 μm, such as 15 μm, 16 μm, 17 μm, 18 μm, 19 μm or 20 μm,
It is not limited to other unrequited numerical value are equally applicable in cited numerical value, the number range.
As currently preferred technical scheme, the material of the conductive adhesive layer includes polyacrylic resin, epoxy resin
Or any one in polyurethane or at least two combination, the combination is typical but non-limiting examples have：Polyacrylic resin
Combination or polyacrylic acid with the combination of the combination of epoxy resin, epoxy resin and polyurethane, polyacrylic resin and polyurethane
Combination of resin, epoxy resin and polyurethane etc..
As currently preferred technical scheme, the thickness of the conductive adhesive layer is 5~12 μm, such as 5 μm, 6 μm, 7 μm, 8 μ
M, 9 μm, 10 μm, 11 μm or 12 μm etc., it is not limited to other unrequited numerical value in cited numerical value, the number range
It is equally applicable.
As currently preferred technical scheme, the material of the metal level includes zinc and/or iron.
As currently preferred technical scheme, the thickness of the metal level is 0.5~1 μm, such as 0.5 μm, 0.6 μm, 0.7
μm, 0.8 μm, 0.9 μm or 1 μm etc., it is not limited to other unrequited numerical value are same in cited numerical value, the number range
Sample is applicable.
As currently preferred technical scheme, it is release that the release film layer includes PE mould release membrances, PET mould release membrances, OPP
Film, PC mould release membrances, PS barrier films, PMMA mould release membrances, BOPP mould release membrances, TPX mould release membrances, PVC stripping films, PTFE mould release membrances, list
Any one in silicon mould release membrance or polyester mould release membrance or at least two combination, the combination is typical but non-limiting examples have：
The combination of PE mould release membrances and PET mould release membrances, the combination of OPP mould release membrances and PC mould release membrances, the group of PS barrier films and PMMA mould release membrances
The combination of conjunction, the combination of BOPP mould release membrances and TPX mould release membrances, the combining of PVC stripping films and PTFE mould release membrances, single silicon mould release membrance and
The combination of polyester-type mould release membrance or the combination of PE mould release membrances, PET mould release membrances and PC mould release membrances etc..
As currently preferred technical scheme, the thickness of the release film layer is 10~100 μm, such as 10 μm, 20 μm, 30
μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm or 100 μm etc., it is not limited to cited numerical value, the number range
Other interior unrequited numerical value are equally applicable.
Compared with prior art, the present invention at least has the advantages that：
(1) the invention provides a kind of electromagnetic shielding film, the shield effectiveness of the screened film is more than 95DB, reaches as high as
102DB；
(2) the invention provides a kind of electromagnetic shielding film, the screened film is simple in construction, it is easy to carry out industrialized production.
Brief description of the drawings
Fig. 1 is a kind of structural representation for electromagnetic shielding film that the present invention is provided；
In figure：1- carrier layers, 2- insulating barriers, 3- conductive adhesive layers, 4- metal levels, 5- release film layers.
Embodiment
Further illustrate technical scheme below in conjunction with the accompanying drawings and by embodiment.
For the present invention is better described, technical scheme is readily appreciated, of the invention is typical but non-limiting
Embodiment is as follows：
Embodiment 1
A kind of structure electromagnetic shielding film as shown in Figure 1, it is characterised in that the electromagnetic shielding film includes what is be sequentially connected
Carrier layer 1, insulating barrier 2, conductive adhesive layer 3, metal level 4 and release film layer 5, wherein the conductive adhesive layer contains 2- hydroxyls -2-
Methyl isophthalic acid-phenyl -1- acetone.
Wherein, the carrier layer 1 is PET film, and thickness is 10 μm；The insulating barrier 2 is ink insulating barrier, and thickness is 15
μm；The material of the conductive adhesive layer 3 is polyacrylic resin, and thickness is 5 μm；The material of the metal level 4 is zinc, and thickness is
0.5μm；The release film layer 5 is PE mould release membrances, and thickness is 10 μm.
Embodiment 2
A kind of structure electromagnetic shielding film as shown in Figure 1, it is characterised in that the electromagnetic shielding film includes what is be sequentially connected
Carrier layer 1, insulating barrier 2, conductive adhesive layer 3, metal level 4 and release film layer 5, wherein the conductive adhesive layer contains 4- dimethylamine
Base-ethyl benzoate.
Wherein, the carrier layer 1 is pen film, and thickness is 100 μm；The insulating barrier 2 is ink insulating barrier, and thickness is
20μm；The material of the conductive adhesive layer 3 is epoxy resin, and thickness is 12 μm；The material of the metal level 4 is iron, and thickness is 1 μ
m；The release film layer 5 is PET mould release membrances, and thickness is 100 μm.
Embodiment 3
A kind of structure electromagnetic shielding film as shown in Figure 1, it is characterised in that the electromagnetic shielding film includes what is be sequentially connected
Carrier layer 1, insulating barrier 2, conductive adhesive layer 3, metal level 4 and release film layer 5, wherein the conductive adhesive layer contains 1- hydroxyls-ring
Hexyl-phenyl ketone.
Wherein, the carrier layer 1 is PBT films, and thickness is 20 μm；The insulating barrier 2 is ink insulating barrier, and thickness is 16
μm；The material of the conductive adhesive layer 3 is polyacrylic resin, and thickness is 8 μm；The material of the metal level 4 is zinc, and thickness is
0.6μm；The release film layer 5 is PET mould release membrances, and thickness is 20 μm.
Embodiment 4
A kind of structure electromagnetic shielding film as shown in Figure 1, it is characterised in that the electromagnetic shielding film includes what is be sequentially connected
Carrier layer 1, insulating barrier 2, conductive adhesive layer 3, metal level 4 and release film layer 5, wherein the conductive adhesive layer contains 2- hydroxyls -2-
Methyl isophthalic acid-phenyl -1- acetone and 1- hydroxy-cyclohexyl-phenyls ketone (mol ratio 1:1).
Wherein, the carrier layer 1 is PET film, and thickness is 80 μm；The insulating barrier 2 is ink insulating barrier, and thickness is 18
μm；The material of the conductive adhesive layer 3 is polyurethane, and thickness is 11 μm；The material of the metal level 4 is iron, and thickness is 0.5 μm；
The release film layer 5 is PE mould release membrances, and thickness is 80 μm.
Embodiment 5
A kind of structure electromagnetic shielding film as shown in Figure 1, it is characterised in that the electromagnetic shielding film includes what is be sequentially connected
Carrier layer 1, insulating barrier 2, conductive adhesive layer 3, metal level 4 and release film layer 5, wherein the conductive adhesive layer contains 2- hydroxyls -2-
Methyl isophthalic acid-phenyl -1- acetone and 4- dimethylamino-ethyl benzoate (mol ratio 2:1).
Wherein, the carrier layer 1 is PBT films, and thickness is 50 μm；The insulating barrier 2 is ink insulating barrier, and thickness is 17
μm；The material of the conductive adhesive layer 3 is polyacrylic resin, and thickness is 9 μm；The material of the metal level 4 is zinc, and thickness is
0.6μm；The release film layer 5 is PET mould release membrances, and thickness is 50 μm.
Embodiment 6
A kind of electromagnetic shielding film, except the conductive adhesive layer 3 thickness be 3 μm in addition to, other conditions with the phase of embodiment 3
Together.
Embodiment 7
A kind of electromagnetic shielding film, except the conductive adhesive layer 3 thickness be 20 μm in addition to, other conditions with the phase of embodiment 3
Together.
Comparative example 1
A kind of electromagnetic shielding film, in addition to 1- hydroxy-cyclohexyl-phenyl ketones are not contained in conductive adhesive layer 3, other conditions
It is same as Example 3.
Embodiment 1-5 and comparative example 1 and 2 capability of electromagnetic shielding are tested, as a result as shown in table 1.
Table 1
| Project | Shield effectiveness/DB |
| Embodiment 1 | 96 |
| Embodiment 2 | 102 |
| Embodiment 3 | 101 |
| Embodiment 4 | 99 |
| Embodiment 5 | 97 |
| Embodiment 6 | 83 |
| Embodiment 7 | 80 |
| Comparative example 1 | 23 |
Embodiment 1-5 shield effectiveness is in more than 95DB as can be seen from Table 1, reaches as high as 102DB, and embodiment 6
Be only compared with Example 33 μm because conductive adhesive layer is excessively thin, shield effectiveness is only 83DB, embodiment 7 compared with Example 3 by
Blocked up in conductive adhesive layer is 20 μm, and shield effectiveness is only 80DB, and does not contain 1- hydroxy-cyclohexans in comparative example 1 in conductive adhesive layer 3
Base-phenyl ketone, therefore shield effectiveness is only 23DB.
Applicant states that the present invention illustrates the detailed construction feature of the present invention by above-described embodiment, but the present invention is simultaneously
Above-mentioned detailed construction feature is not limited to, that is, does not mean that the present invention has to rely on above-mentioned detailed construction feature and could implemented.Institute
Belong to those skilled in the art it will be clearly understood that any improvement in the present invention, to the equivalence replacement of part selected by the present invention
And increase, the selection of concrete mode of accessory etc., within the scope of all falling within protection scope of the present invention and being open.
The preferred embodiment of the present invention described in detail above, still, the present invention are not limited in above-mentioned embodiment
Detail, in the range of the technology design of the present invention, a variety of simple variants can be carried out to technical scheme, this
A little simple variants belong to protection scope of the present invention.
It is further to note that each particular technique feature described in above-mentioned embodiment, in not lance
In the case of shield, can be combined by any suitable means, in order to avoid unnecessary repetition, the present invention to it is various can
The combination of energy no longer separately illustrates.
In addition, various embodiments of the present invention can be combined randomly, as long as it is without prejudice to originally
The thought of invention, it should equally be considered as content disclosed in this invention.
Claims (10)
1. a kind of electromagnetic shielding film, it is characterised in that the electromagnetic shielding film includes carrier layer (1), the insulation being sequentially connected
Layer (2), conductive adhesive layer (3), metal level (4) and release film layer (5), wherein first conductive adhesive layer contains 2- hydroxyl -2- first
Any one in base -1- phenyl -1- acetone, 4- dimethylamino-ethyl benzoate or 1- hydroxy-cyclohexyl-phenyl ketones or extremely
Few two kinds combination.
2. electromagnetic shielding film according to claim 1, it is characterised in that the carrier layer (1) includes PET film, PEN
Any one in film, PI films, PBT films or PPS films or at least two combination.
3. electromagnetic shielding film according to claim 1 or 2, it is characterised in that the thickness of the carrier layer (1) is 10~
100μm。
4. the electromagnetic shielding film according to claim any one of 1-3, it is characterised in that the insulating barrier (2) is that ink is exhausted
Edge layer；
Preferably, the thickness of the insulating barrier (2) is 15~20 μm.
5. the electromagnetic shielding film described in an acute claim any one of 1-4, it is characterised in that first conductive adhesive layer (3)
Material includes any one in polyacrylic resin, epoxy resin or polyurethane or at least two combination.
6. the electromagnetic shielding film according to claim any one of 1-5, it is characterised in that the thickness of the conductive adhesive layer (3)
For 5~12 μm.
7. the electromagnetic shielding film according to claim any one of 1-6, it is characterised in that the material bag of the metal level (4)
Include any one in zinc, iron, cobalt or nickel or at least two combination.
8. the electromagnetic shielding film according to claim any one of 1-5, it is characterised in that the thickness of the metal level (4) is
0.5~1 μm.
9. the electromagnetic shielding film according to claim any one of 1-8, it is characterised in that the release film layer (5) includes PE
Mould release membrance, PET mould release membrances, OPP mould release membrances, PC mould release membrances, PS barrier films, PMMA mould release membrances, BOPP mould release membrances, TPX are release
Any one in film, PVC stripping films, PTFE mould release membrances, single silicon mould release membrance or polyester mould release membrance or at least two combination.
10. the electromagnetic shielding film according to claim any one of 1-9, it is characterised in that the thickness of the release film layer (5)
For 10~100 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710524774.8A CN107148209A (en) | 2017-06-30 | 2017-06-30 | A kind of electromagnetic shielding film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710524774.8A CN107148209A (en) | 2017-06-30 | 2017-06-30 | A kind of electromagnetic shielding film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107148209A true CN107148209A (en) | 2017-09-08 |
Family
ID=59784652
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710524774.8A Pending CN107148209A (en) | 2017-06-30 | 2017-06-30 | A kind of electromagnetic shielding film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107148209A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107592783A (en) * | 2017-09-15 | 2018-01-16 | 中山国安火炬科技发展有限公司 | A kind of electromagnetic shielding film and preparation method thereof |
| CN108495544A (en) * | 2018-07-02 | 2018-09-04 | 蔡志浩 | A kind of electromagnetic shielding film |
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| CN104877616A (en) * | 2015-05-15 | 2015-09-02 | 成都纳硕科技有限公司 | Ultraviolet curable conductive adhesive used for PCB (printed circuit board) |
| CN105246313A (en) * | 2015-09-29 | 2016-01-13 | 朱春芳 | Electromagnetic wave shielding film, printed circuit board including shielding film and preparation method of circuit board |
| US20160165767A1 (en) * | 2014-12-05 | 2016-06-09 | Chung Yuan Christian University | Taper Composite Metal-Matrix Composites and Fabricating Methods for the Same |
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|---|---|---|---|---|
| US20030085383A1 (en) * | 1998-10-13 | 2003-05-08 | Peter Burnell-Jones | Photocurable thermosetting luminescent resins |
| CN101896058A (en) * | 2009-05-22 | 2010-11-24 | 索尼爱立信移动通信日本株式会社 | Electromagnetic shielding method and electromagnetic shielding film |
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| US20160165767A1 (en) * | 2014-12-05 | 2016-06-09 | Chung Yuan Christian University | Taper Composite Metal-Matrix Composites and Fabricating Methods for the Same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107592783A (en) * | 2017-09-15 | 2018-01-16 | 中山国安火炬科技发展有限公司 | A kind of electromagnetic shielding film and preparation method thereof |
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