CN107743357A - Suction wave plate for electronic product - Google Patents

Suction wave plate for electronic product Download PDF

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Publication number
CN107743357A
CN107743357A CN201710724316.9A CN201710724316A CN107743357A CN 107743357 A CN107743357 A CN 107743357A CN 201710724316 A CN201710724316 A CN 201710724316A CN 107743357 A CN107743357 A CN 107743357A
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China
Prior art keywords
parts
layer
suction
wave
adhesive layer
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CN201710724316.9A
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CN107743357B (en
Inventor
金闯
梁豪
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Taicang Sidike New Material Science and Technology Co Ltd
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Taicang Sidike New Material Science and Technology Co Ltd
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Priority to CN201710724316.9A priority Critical patent/CN107743357B/en
Priority to CN201510260692.8A priority patent/CN104893605B/en
Publication of CN107743357A publication Critical patent/CN107743357A/en
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04Homopolymers or copolymers of esters
    • C08L33/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/062Copolymers with monomers not covered by C08L33/06
    • C08L33/066Copolymers with monomers not covered by C08L33/06 containing -OH groups
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/06Interconnection of layers permitting easy separation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B32B9/007Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/048Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material made of particles
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08Materials not undergoing a change of physical state when used
    • C09K5/14Solid materials, e.g. powdery or granular
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2293Oxides; Hydroxides of metals of nickel
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/011Nanostructured additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00Polymer mixtures characterised by other features
    • C08L2205/03Polymer mixtures characterised by other features containing three or more polymers in a blend
    • C08L2205/035Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/10Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/10Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00Presence of inorganic and organic materials
    • C09J2400/10Presence of inorganic materials
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00Presence of (meth)acrylic polymer
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00Presence of (meth)acrylic polymer
    • C09J2433/006Presence of (meth)acrylic polymer in the substrate

Abstract

The present invention discloses a kind of suction wave plate for electronic product, including graphite flake, suction ripple layer and separated type material layer as reflecting layer, and the first adhesive layer is provided between the graphite flake, suction ripple layer;The second adhesive layer is provided between the suction ripple layer, separated type material layer;The suction ripple layer is composed of the following components:Wave-absorbing powder, butyl acrylate, acrylic acid, Isooctyl acrylate monomer, methyl methacrylate, vinyl acetate, the hydroxyl ethyl ester of methacrylic acid 2, Sodium Polyacrylate, methyl ethyl ketone peroxide;The wave-absorbing powder is composed of the following components:BaFe12O19, nickel sesquioxide, Nano graphite powder, naphthoic acid cobalt, unsaturated polyester (UP), acrylic compounds levelling agent.Wave absorbing patch of the present invention reaches 88% in the attenuation rate of 2 ~ 10GHz electromagnetic waves, and it is gluing to not only improve polymer, it is improved its proof voltage breakdown effect while effective electromagnetic wave absorption.

Description

Suction wave plate for electronic product
Technical field
The invention belongs to technical field of electronic materials, more particularly to a kind of suction wave plate for electronic product.
Background technology
With the development of electronics industry, increasing electric equipment products has come into the life of people, and these products The influence for the Electromagnetic Radiation on Environment brought also increasingly increases.The electromagnetic wave of electronic product release, other electronics of surrounding can be given Equipment belt carrys out electromagnetic interference, makes its operation irregularity;Health can also be damaged simultaneously.Therefore, research and development can weaken electricity The absorbing material of magnetic radiation, have become the heat subject of material science concern.
Absorbing material is a kind of material for referring to effectively absorb incident electromagnetic wave and make it decay, and it passes through different damages Incident electromagnetic wave is changed into heat energy or other form of energy to reach the purpose of suction ripple by consumption mechanism.In absorbing material, paster Type absorbing material thickness of thin, it is easy to use, for reducing electromagnetic radiation, preventing electromagnetic interference from having good effect, relatively it is adapted to Apply in electronic product.And the main trend of electronic product development is miniaturization, Highgrade integration, interiors of products space is relative It is narrow and small.Therefore, on the premise of absorbing property is ensured how by material manufacture enough to it is thin be the biggest problem that people face.
The content of the invention
The present invention provides a kind of suction wave plate for electronic product, and this is used for the suction wave plate of electronic product in 2 ~ 10GHz electricity The attenuation rate of magnetic wave reaches 88%, and it is gluing to not only improve polymer, also mixed powder is uniformly dispersed in the polymer, so as to It ensure that the reliability of electromagnetic performance.
To reach above-mentioned purpose, the technical solution adopted by the present invention is:A kind of suction wave plate for electronic product, including make For the graphite flake in reflecting layer, ripple layer and separated type material layer are inhaled, the first adhesive layer is provided between the graphite flake, suction ripple layer;Institute State to inhale and be provided with the second adhesive layer between ripple layer, separated type material layer;
The suction ripple layer is composed of the following components:
100 parts of wave-absorbing powder,
30 parts of butyl acrylate,
18 parts of acrylic acid,
32 parts of Isooctyl acrylate monomer,
12 parts of methyl methacrylate,
1.8 parts of vinyl acetate,
0.8 part of 2-hydroxyethyl methacry-late,
1.2 parts of Sodium Polyacrylate,
0.6 part of methyl ethyl ketone peroxide;
The wave-absorbing powder is composed of the following components:
BaFe12O19100 parts,
38 ~ 42 parts of nickel sesquioxide,
9 ~ 12 parts of Nano graphite powder,
18 ~ 22 parts of naphthoic acid cobalt,
50 ~ 60 parts of unsaturated polyester (UP),
40 ~ 50 parts of acrylic compounds levelling agent.
Further improved technical scheme is as follows in above-mentioned technical proposal:
1st, in such scheme, first adhesive layer, the second adhesive layer are esters of acrylic acid adhesive layer.
2nd, in such scheme, the unsaturated polyester (UP) synthesized by maleic anhydride, phthalic anhydride and propane diols and Into.
Because above-mentioned technical proposal is used, the present invention has following advantages compared with prior art:
1st, the present invention is used for the suction wave plate of electronic product, and it is inhaled ripple layer and uses composite wave-absorbing powder BaFe12O19100 parts, three oxidations 20 ~ 35 parts of two nickel, Nano graphite powder, naphthoic acid cobalt and butyl acrylate, 10 ~ 20 parts of acrylic acid, 20 ~ 35 parts of Isooctyl acrylate monomer, 0.1 ~ 1 part of methyl methacrylate 10 ~ 30, vinyl acetate 1 ~ 3,2-hydroxyethyl methacry-late synergy, have stronger Electromaganic wave absorbing property, reach 88% in the attenuation rate of 2 ~ 10GHz electromagnetic waves, further add 0.5 ~ 2 part of Sodium Polyacrylate, mistake 0.4 ~ 1 part of MEKP, it is gluing to not only improve polymer, also mixed powder is uniformly dispersed in the polymer, so as to protect The reliability of electromagnetic performance is demonstrate,proved;Secondly, further it is equipped with unsaturated polyester (UP) in formula, acrylic compounds levelling agent improves entirely The heat conductivility of ripple layer is inhaled, the stability and product for being advantageous to, by heat expanding caused by electromagnetic wave, improve performance use the longevity Life.
2nd, the present invention is used for the suction wave plate of electronic product, and it includes the graphite flake as reflecting layer, inhales ripple layer and release material The bed of material, the first adhesive layer is provided between the graphite flake, suction ripple layer;The is provided between the suction ripple layer, separated type material layer Two adhesive layers;Material thickness is very thin, and general thickness is less than 0.8mm;The setting in reflecting layer can form multiple absorption, significantly improve The absorbing property of material;The setting of insulating barrier improves the outward appearance of wave absorbing patch, and makes it in the same of effective electromagnetic wave absorption Shi Tigao its proof voltage breakdown effects.
Embodiment
With reference to embodiment, the invention will be further described:
Embodiment:A kind of suction wave plate for electronic product, including graphite flake, suction ripple layer and separated type material as reflecting layer Layer, the first adhesive layer is provided between the graphite flake, suction ripple layer;Second is provided between the suction ripple layer, separated type material layer Adhesive layer;
The component for inhaling ripple layer and content are as shown in table 1:
Table 1
The wave-absorbing powder as shown in Table 2 content groups packet into:
Table 2
The thickness of above-mentioned first adhesive layer is less than the thickness of the second adhesive layer, and the thickness of second adhesive layer is gluing less than the 3rd Layer.
The thickness ratio of above-mentioned PET insulating barriers and layer of polypropylene foil is 10:4~6.
Above-mentioned unsaturated polyester (UP) is synthesized by maleic anhydride, phthalic anhydride and propane diols and formed.
Embodiment is as shown in table 3 in the maximum reflection coefficient and effective bandwidth of 2 ~ 18GHz frequency ranges:
Table 3
Inhale ripple layer and the electromagnetic wave that electronic product discharges is converted into heat energy or the energy of other forms in a manner of electrical loss, magnetic loss etc. Amount reduces the effect of electromagnetic radiation to reach, and has preferable absorption in the range of 2 ~ 18GHz, can be by the reflection of electromagnetic wave of incidence Resorption ripple layer forms multiple absorption.
Above-mentioned PET thickness of insulating layer is 6 microns;The thickness ratio of the PET insulating barriers and layer of polypropylene foil is 10:5.
Above-described embodiment has the preparation technology that ripple layer is inhaled in the Protection glue band for inhaling wave energy, comprises the following steps:
The first step:By BaFe12O19, nickel sesquioxide, Nano graphite powder, naphthoic acid cobalt, unsaturated polyester (UP), acrylic compounds levelling agent It is well mixed, and stir to form mixed powder in 84 ~ 86 DEG C of conditions;
Second step:By butyl acrylate, acrylic acid, Isooctyl acrylate monomer, methyl methacrylate, vinyl acetate, metering system Acid -2- hydroxyl ethyl esters, Sodium Polyacrylate mix with the mixed powder of the first step, and disperse 1 ~ 2 hour through high speed agitator, so as to mixed Conjunction is formed uniformly mixture;
3rd step:It is incubated after the mixture of second step is heated into 80 ~ 85 DEG C in a kettle, divides 1 ~ 3 time in insulating process Add methyl ethyl ketone peroxide and obtain and inhale ripple mixed liquor, the soaking time is 4 ~ 10 hours;
4th step:The suction ripple mixed liquor that 3rd step obtains is coated on substrate;
5th step:Baking is carried out to the suction ripple mixed liquor in the 4th step and forms suction ripple layer.
During using above-mentioned suction wave plate for electronic product, there is stronger electromaganic wave absorbing property, in 2 ~ 10GHz electromagnetism The attenuation rate of ripple reaches 88%, further adds 0.5 ~ 2 part of Sodium Polyacrylate, 0.4 ~ 1 part of methyl ethyl ketone peroxide, not only improves poly- Compound is gluing, also mixed powder is uniformly dispersed in the polymer, so as to ensure that the reliability of electromagnetic performance;Secondly, match somebody with somebody Further be equipped with unsaturated polyester (UP) in side, acrylic compounds levelling agent improves the whole heat conductivility for inhaling ripple layer, be advantageous to electricity Heat expanding caused by magnetic wave, improve the stability and product service life of performance.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art Scholar can understand present disclosure and implement according to this, and it is not intended to limit the scope of the present invention.It is all according to the present invention The equivalent change or modification that Spirit Essence is made, it should all be included within the scope of the present invention.

Claims (3)

  1. A kind of 1. suction wave plate for electronic product, it is characterised in that:Including the graphite flake as reflecting layer, inhale ripple layer and release Material layer, the first adhesive layer is provided between the graphite flake, suction ripple layer;It is provided between the suction ripple layer, separated type material layer Second adhesive layer;
    The suction ripple layer is composed of the following components:
    100 parts of wave-absorbing powder,
    30 parts of butyl acrylate,
    18 parts of acrylic acid,
    32 parts of Isooctyl acrylate monomer,
    12 parts of methyl methacrylate,
    1.8 parts of vinyl acetate,
    0.8 part of 2-hydroxyethyl methacry-late,
    1.2 parts of Sodium Polyacrylate,
    0.6 part of methyl ethyl ketone peroxide;
    The wave-absorbing powder is composed of the following components:
    BaFe12O19100 parts,
    38 ~ 42 parts of nickel sesquioxide,
    9 ~ 12 parts of Nano graphite powder,
    18 ~ 22 parts of naphthoic acid cobalt,
    50 ~ 60 parts of unsaturated polyester (UP),
    40 ~ 50 parts of acrylic compounds levelling agent.
  2. 2. the suction wave plate according to claim 1 for electronic product, it is characterised in that:The unsaturated polyester (UP) is by along fourth Enedioic acid acid anhydride, phthalic anhydride and propane diols synthesis form.
  3. 3. the suction wave plate according to claim 1 for electronic product, it is characterised in that:First adhesive layer, second Adhesive layer is esters of acrylic acid adhesive layer.
CN201710724316.9A 2015-05-21 2015-05-21 Wave absorbing plate for electronic product Active CN107743357B (en)

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Application Number Priority Date Filing Date Title
CN201710724316.9A CN107743357B (en) 2015-05-21 2015-05-21 Wave absorbing plate for electronic product
CN201510260692.8A CN104893605B (en) 2015-05-21 2015-05-21 Electromagnetic shielding suction wave plate

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Application Number Priority Date Filing Date Title
CN201710724316.9A CN107743357B (en) 2015-05-21 2015-05-21 Wave absorbing plate for electronic product

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CN107743357B CN107743357B (en) 2020-03-10

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Application Number Title Priority Date Filing Date
CN201510260692.8A Active CN104893605B (en) 2015-05-21 2015-05-21 Electromagnetic shielding suction wave plate
CN201710724245.2A Active CN108084908B (en) 2015-05-21 2015-05-21 Wave absorbing plate
CN201710724241.4A Active CN108084906B (en) 2015-05-21 2015-05-21 Electromagnetic wave-absorbing plate for electric appliance product
CN201710724243.3A Active CN108084907B (en) 2015-05-21 2015-05-21 Wave-absorbing patch for attenuating electromagnetic radiation
CN201710724811.XA Active CN107858115B (en) 2015-05-21 2015-05-21 Patch type wave absorbing material
CN201710724858.6A Active CN108093612B (en) 2015-05-21 2015-05-21 Wave-absorbing material for electromagnetic shielding
CN201710724316.9A Active CN107743357B (en) 2015-05-21 2015-05-21 Wave absorbing plate for electronic product
CN201710724856.7A Active CN107739581B (en) 2015-05-21 2015-05-21 Heat-conducting wave-absorbing patch
CN201710724199.6A Active CN108617153B (en) 2015-05-21 2015-05-21 Wave-absorbing patch for weakening electromagnetic radiation

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CN201510260692.8A Active CN104893605B (en) 2015-05-21 2015-05-21 Electromagnetic shielding suction wave plate
CN201710724245.2A Active CN108084908B (en) 2015-05-21 2015-05-21 Wave absorbing plate
CN201710724241.4A Active CN108084906B (en) 2015-05-21 2015-05-21 Electromagnetic wave-absorbing plate for electric appliance product
CN201710724243.3A Active CN108084907B (en) 2015-05-21 2015-05-21 Wave-absorbing patch for attenuating electromagnetic radiation
CN201710724811.XA Active CN107858115B (en) 2015-05-21 2015-05-21 Patch type wave absorbing material
CN201710724858.6A Active CN108093612B (en) 2015-05-21 2015-05-21 Wave-absorbing material for electromagnetic shielding

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CN201710724856.7A Active CN107739581B (en) 2015-05-21 2015-05-21 Heat-conducting wave-absorbing patch
CN201710724199.6A Active CN108617153B (en) 2015-05-21 2015-05-21 Wave-absorbing patch for weakening electromagnetic radiation

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CN (9) CN104893605B (en)
WO (1) WO2016184115A1 (en)

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CN104893605B (en) * 2015-05-21 2017-10-27 江苏斯迪克新材料科技股份有限公司 Electromagnetic shielding suction wave plate
CN108834391B (en) * 2018-07-25 2019-05-14 深圳市弘海电子材料技术有限公司 A kind of novel FPC composite electromagnetic shielding film and preparation method thereof
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