CN208285729U - Simple EMI film - Google Patents
Simple EMI film Download PDFInfo
- Publication number
- CN208285729U CN208285729U CN201721903705.XU CN201721903705U CN208285729U CN 208285729 U CN208285729 U CN 208285729U CN 201721903705 U CN201721903705 U CN 201721903705U CN 208285729 U CN208285729 U CN 208285729U
- Authority
- CN
- China
- Prior art keywords
- layer
- conductive adhesive
- adhesive layer
- microns
- black oil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a kind of simple EMI films comprising carrier layer, black oil lamella, conductive adhesive layer and release film layer, the carrier layer, black oil lamella, conductive adhesive layer and release film layer are successively bonded according to sequence from top to bottom；The conductive adhesive layer with a thickness of 20~35 microns；The utility model smart structural design, rationally conductive adhesive layer is thickeied, to greatly enhance shielding properties, anti-interference ability is good, simultaneously with the function of conventional conductive glue-line and metal layer, electroplating work procedure and expensive electroplating device are effectively saved, simplifies production technology and overall structure, substantially reduces cost；And it is laminating on conductive adhesive layer have a black oil lamella, effective promotion high temperature resistant, radiation hardness, resistant to chemical etching and electrical insulation capability, good combination property, in addition whole soft good, easy to process, job stability, practical, is conducive to wide popularization and application.
Description
Technical field
The utility model relates to shield technical field of membrane, in particular to a kind of to have a shield effectiveness and at low cost is simple
EMI film.
Background technique
In recent years, with the generally use of radio technology, electromagnetic pollution is more and more common, while circuit low-voltage itself
The use of low-power consumption, so that the ability of the electromagnetism interference (EMI) of circuit itself is remarkably decreased.In product casing plating anti-EMI filter
Film, not only can protect this product is not influenced by extraneous EMI, but also can reduce itself to extraneous interference, European Union 89/336/
EEC (EMC) standard oneself explicitly pointed out electronic product must be in the anti-EM work film of product casing inner wall plating.Screen used at present
Covering material mainly has conductivity type, filled-type, Intrinsical and inhales wave mode, and preparation method is mainly metal foil, sputtering plating, plating
Or the methods of chemical plating and coating conductive coating.
More and more intensive with flexible circuit board wiring route, the requirement to electromagnetic shielding film is higher and higher, shielding effect
Favor of the electromagnetic shielding film of 60db increasingly by market can be greater than.Shield effectiveness and conducting have direct relationship, are connected
Numerical value is smaller, and shield effectiveness is higher.
Chinese invention patent Publication No. CN104853577 discloses a kind of ultra-thin electromagnetic screened film and preparation method, should
It is in netted that the ultra-thin electromagnetic screened film provided, which is invented, by glue-line setting, and conductive metal is filled in the netted hole of glue-line,
It is placed in the netted intrapore webbed electro-magnetic screen layer of conductive metal layer structure of glue-line, realizes effectiveness.According to this
Invent provide ultra-thin electromagnetic screened film, by by glue-line setting in it is netted, will be for realizing the conductive gold of effectiveness
Belong to layer to be filled in the netted hole of glue-line, so that ultra-thin electromagnetic screened film provided by the invention is not influencing effectiveness
Under the premise of thickness can reach 81 microns or less.However the invention electromagnetic shielding film glue-line be it is netted, when metal layer
The edge of grid cannot come into full contact with metal, and the conducting coefficient of electromagnetic shielding film is caused to increase, electromagnetic shielding performance by
It influences.
Chinese invention patent number 201710492858.8 discloses a kind of electromagnetic shielding film, the electromagnetic shielding film include according to
Carrier layer, insulating layer, the first conductive adhesive layer, metal layer, the second conductive adhesive layer and the release film layer of secondary connection, wherein described
One conductive adhesive layer contains aluminium powder and/or magnesium powder, and second conductive adhesive layer contains nickel powder and/or cobalt powder.Although its be able to achieve compared with
Good effectiveness, but it is provided with metal layer, higher cost, and be that special electroplating device is needed to pass through electroplating work procedure
Realize the formation of metal layer, process is tedious, and the production cycle is long, and electroplating device is expensive, and still leads using bilayer
Electric structural adhesive layer causes its overall cost higher, is unfavorable for promoting and applying.
Utility model content
In view of the above deficiencies, the utility model aim is to provide a kind of smart structural design, rationally, and shield effectiveness is good,
And simple EMI film at low cost.
To achieve the above object, provided technical solution is the utility model:
A kind of simple EMI film comprising carrier layer, black oil lamella, conductive adhesive layer and release film layer, the carrier film
Layer, black oil lamella, conductive adhesive layer and release film layer are successively bonded according to sequence from top to bottom；The thickness of the conductive adhesive layer
It is 20~35 microns.
As a kind of improvement of the utility model, metal powder interlayer is equipped in the conductive adhesive layer.
As a kind of improvement of the utility model, the carrier layer with a thickness of 50~75 microns.
As a kind of improvement of the utility model, the black oil lamella with a thickness of 5~10 microns.
As a kind of improvement of the utility model, the worn-out glue-line of screen with a thickness of 5~10 microns.
As a kind of improvement of the utility model, the release film layer with a thickness of 38~75 microns
The utility model has the following beneficial effects: the utility model smart structural design, rationally thickeies conductive adhesive layer, thus
Shielding properties is greatly enhanced, anti-interference ability is good, simultaneously with the function of conventional conductive glue-line and metal layer, effectively saves electricity
Process and expensive electroplating device are plated, simplifies production technology and overall structure, substantially reduces cost；And in conductive adhesive layer
It is upper it is laminating have a black oil lamella, effectively promotion high temperature resistant, radiation hardness, resistant to chemical etching and electrical insulation capability, good combination property, separately
Outer whole soft good, easy to process, job stability, it is practical, it is conducive to wide popularization and application.
Detailed description of the invention
Fig. 1 is the cross section structure schematic diagram of the utility model.
Specific embodiment
Embodiment: referring to Fig. 1, the utility model embodiment provides a kind of simple EMI film comprising carrier layer 1, black
Oil lamella 2, conductive adhesive layer 3 and release film layer 4, the carrier layer 1, black oil lamella 2, conductive adhesive layer 3 and release film layer 4 are pressed
It is successively bonded according to sequence from top to bottom.
The conductive adhesive layer 3 is that a certain proportion of metal charge is uniformly mixed in sizing material.But the ratio of metal charge is not
Can be too high, not so do not have viscosity.Although shielding properties can be increase accordingly by increasing thickness, but one it cannot hide all unlimited increase
Thickness.The conductive adhesive layer 3 with a thickness of 20~35 microns.Preferably 20 microns, 25 microns, 30 microns or 35 microns.Certainly,
In the case where the thickness of conductive adhesive layer 3 is fixed, to further increase shielding properties, gold can also be equipped in conductive adhesive layer 3
Belong to powder interlayer, can more promote shielding properties.This just greatly increases metal powder amount, and then promotes shield effectiveness.Preferably, also in institute
It states and is fitted with aluminium foil layer between conductive adhesive layer 3 and release film layer 4, further to promote shielding properties, avoid interfering.The copper foil layer
With a thickness of 15~30 microns, preferably 15 microns, 18 microns, 20 microns or 28 microns, to have shielded effect.
Specifically, the carrier layer 1 with a thickness of 50~75 microns.Preferably 50 microns, 55 microns, 60 microns or 75
Micron.The black oil lamella 2 with a thickness of 5~10 microns.Preferably 5 microns, 7 microns, 8 microns or 10 microns.The screen
Worn-out glue-line with a thickness of 5~10 microns.Preferably 5 microns, 8 microns, 9 microns or 10 microns.The release film layer 4 with a thickness of
38~75 microns.Preferably 38 microns, 42 microns, 63 microns or 75 microns.
In use, since the utility model rationally thickeies conductive adhesive layer 3 to 20~35 microns, to greatly enhance shielding
Performance, anti-interference ability is good, simultaneously with the function of conventional conductive glue-line 3 and metal layer, effectively saves electroplating work procedure and valence
The electroplating device of lattice valuableness simplifies production technology and overall structure, substantially reduces cost；And laminating on conductive adhesive layer 3 have
Black oil lamella 2, effectively promotion high temperature resistant, radiation hardness, resistant to chemical etching and electrical insulation capability, good combination property, the scope of application
Extensively.
According to the disclosure and teachings of the above specification, the utility model those skilled in the art can also be to above-mentioned reality
The mode of applying is changed and is modified.Therefore, the utility model is not limited to specific embodiment disclosed and described above, right
Some modifications and changes of the utility model should also be as falling into the protection scope of the claims of the present utility model.In addition, to the greatest extent
It is used some specific terms in pipe this specification, these terms are merely for convenience of description, not to the utility model
Any restrictions are constituted, using same or similar other membrane bodies, in scope of protection of the utility model.
Claims (5)
1. a kind of simple EMI film, which is characterized in that it includes carrier layer, black oil lamella, conductive adhesive layer and release film layer,
The carrier layer, black oil lamella, conductive adhesive layer and release film layer are successively bonded according to sequence from top to bottom；The conduction
Glue-line with a thickness of 20~35 microns.
2. simple EMI film according to claim 1, which is characterized in that be equipped with metal powder interlayer in the conductive adhesive layer.
3. simple EMI film according to claim 1, which is characterized in that the carrier layer with a thickness of 50~75 microns.
4. simple EMI film according to claim 1, which is characterized in that the black oil lamella it is micro- with a thickness of 5~10
Rice.
5. simple EMI film according to claim 1, which is characterized in that the release film layer with a thickness of 38~75 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721903705.XU CN208285729U (en) | 2017-12-29 | 2017-12-29 | Simple EMI film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721903705.XU CN208285729U (en) | 2017-12-29 | 2017-12-29 | Simple EMI film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208285729U true CN208285729U (en) | 2018-12-25 |
Family
ID=64747767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721903705.XU Expired - Fee Related CN208285729U (en) | 2017-12-29 | 2017-12-29 | Simple EMI film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208285729U (en) |
-
2017
- 2017-12-29 CN CN201721903705.XU patent/CN208285729U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181225 Termination date: 20201229 |