CN109427437A - A kind of Copper-Aluminum compound low-inductance bus and its manufacturing method - Google Patents
A kind of Copper-Aluminum compound low-inductance bus and its manufacturing method Download PDFInfo
- Publication number
- CN109427437A CN109427437A CN201710768402.XA CN201710768402A CN109427437A CN 109427437 A CN109427437 A CN 109427437A CN 201710768402 A CN201710768402 A CN 201710768402A CN 109427437 A CN109427437 A CN 109427437A
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- China
- Prior art keywords
- copper
- conductor layer
- guide post
- aluminum compound
- insulating layer
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/0009—Details relating to the conductive cores
- H01B7/0018—Strip or foil conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/023—Alloys based on aluminium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/06—Insulating conductors or cables
- H01B13/18—Applying discontinuous insulation, e.g. discs, beads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/02—Disposition of insulation
- H01B7/0208—Cables with several layers of insulating material
- H01B7/0225—Three or more layers
Abstract
The invention discloses a kind of Copper-Aluminum compound low-inductance bus, comprising: several conductor layers, the conductor layer are made of copper-aluminum composite board；The upper surface and/or lower surface of the conductor layer is arranged in several insulating layers, the insulating layer adhesive layer in a manner of being bonded respectively, so that the conductor layer is each other and the conductor layer and exterior insulation；Wherein, the conductor layer and insulating layer offer through-hole in corresponding position respectively, and the through-hole is used to that the guide post through the conductor layer and insulating layer to be arranged, and by the guide post, the conductor layer can constitute conductive path with external circuit；The manufacturing method of the Copper-Aluminum compound low-inductance bus, comprising: copper-aluminum composite board processing, guide post fixes, electroplating surface, pressing and forming；Copper-Aluminum compound low-inductance bus corrosion resistance of the invention is good, it is light-weight, conduct electricity very well, solve the problems, such as that existing aluminium bus array conductive capability is bad and existing fine copper busbar is at high cost, weight is big.
Description
Technical field
The present invention relates to electron electric power technical field more particularly to a kind of Copper-Aluminum compound low-inductance bus and its manufacturing methods.
Background technique
Low-inductance bus is also known as composite bus bar, as the bus for integrating various devices in relatively high power power electronics circuit, because
Often to apply in high current, high voltage electrical connection, so common conductive and mechanical properties preferably copper plate is as conductor
Layer material.
Copper has been cited as rare metal in China, belongs to strategic resource and is only second to petroleum, with National Development and Reform Committee, the Department of Science and Technology
Preferential support of the equal ministries and commissions to copper aluminum composite material, copper aluminum composite material in recent years obviously accelerate by development speed, issues within 2012 years
National sector standard about " Copper-Aluminum compound conductive material general technical specifications ", publication " GB/T32468-2015 in 2015
Copper-Aluminum compound strip ".Copper-Aluminum compound strip is different from copper clad aluminum material in GB/T32468-2015, and Copper-Aluminum compound strip is to pass through
Half melt high temperature, high pressure, anaerobic metallurgy are combined, and have good conductive, thermally conductive and mechanical property.Existing composite bus bar
There are aluminium bus array, fine copper busbar, but existing aluminium bus array electric conductivity is bad, existing fine copper busbar is at high cost, weight is big.This
Outside, the conductor material in existing composite bus bar is mostly red copper, since the price of copper is high, density is big, main cost and weight
Conductor part is all concentrated on, also just makes the at high cost of composite bus bar product, weight big.
Therefore, it is badly in need of developing a kind of low-inductance bus using copper-aluminum composite board carrying material as conductor material.
Summary of the invention
The present invention is intended to provide one kind is able to solve, existing aluminium bus array conductive capability is bad and existing fine copper busbar cost
The Copper-Aluminum compound low-inductance bus of problem high, weight is big.
According to an aspect of the invention, there is provided a kind of Copper-Aluminum compound low-inductance bus, comprising:
Several conductor layers, the conductor layer are made of copper-aluminum composite board；
The upper table of the conductor layer is arranged in several insulating layers, the insulating layer adhesive layer in a manner of being bonded respectively
Face and/or lower surface, so that the conductor layer is each other and the conductor layer and exterior insulation；
Wherein, the conductor layer and insulating layer offer through-hole in corresponding position respectively, and the through-hole is passed through for being arranged
The guide post for wearing the conductor layer and insulating layer, by the guide post, the conductor layer can constitute conductive path with external circuit.
Preferably, the contact surface of the side exterior surface of the guide post and the insulating layer is provided with dead ring.
Preferably, the Copper-Aluminum compound volume ratio of the copper-aluminum composite board is 2:8.
Preferably, the conductor layer is made of the copper-aluminum composite board that Copper-Aluminum compound volume ratio is 2:8.
Preferably, the guide post is copper guide post or aluminium guide post.
Preferably, the guide post is fixed in the through-hole in a manner of being brazed or riveting.
Preferably, the insulating layer and the adhesive layer are made of the flexible insulating material of energy bending.
According to another aspect of the present invention, a kind of manufacturing method of Copper-Aluminum compound low-inductance bus is provided, including as follows
Step:
The through-hole for fixing guide post is processed at the relative position in conductor layer and insulating layer；Wherein, the conductor
Layer is made of copper-aluminum composite board, and the insulating layer is identical as the shape of the conductor layer, size；
Insulating layer is fitted in the upper surface and/or lower surface of the conductor layer by adhesive layer, so that conductor layer is each other
Between mutually insulated and conductor layer and exterior insulation；Wherein, when being bonded insulating layer and conductor layer, by the through-hole on insulating layer
It is aligned with the through-hole of relative position in conductor layer；
The conductor layer of alignment overlapping and insulating layer are formed into complex structure body by way of hot pressing；
Setting runs through the guide post of the complex structure body in through-holes, so that the conductor layer in the complex structure body can
Conductive path is constituted with external circuit.
Preferably, when setting runs through the guide post of the complex structure body in through-holes, also outside the side of the guide post
Dead ring is arranged in the contact surface of surface and the insulating layer.
Preferably, when setting runs through the guide post of the complex structure body in through-holes, by the way of soldering or riveting
Guide post is fixed in through-holes.
Compared with prior art, one or more embodiments in above scheme can have following advantage or beneficial to effect
Fruit:
1, relative to aluminium bus array, Copper-Aluminum compound low-inductance bus provided by the invention has more preferably conductive capability.
2, relative to fine copper busbar, under same conductive capability, Copper-Aluminum compound low-inductance bus provided by the invention has
Lighter weight can reduce integral product weight by using Copper-Aluminum compound low-inductance bus provided by the invention, realize light weight
Change design.
3, relative to aluminium alloy busbar, Copper-Aluminum compound low-inductance bus environment resistant corrosivity provided by the invention is more preferable, salt tolerant
Mist ability is stronger.
Other features and advantages of the present invention will be illustrated in the following description, and partly becomes from specification
It is clear that understand through the implementation of the invention.The objectives and other advantages of the invention can be by wanting in specification, right
Specifically noted structure is sought in book and attached drawing to be achieved and obtained.
Detailed description of the invention
Attached drawing is used to provide further understanding of the present invention, and constitutes part of specification, with reality of the invention
It applies example and is used together to explain the present invention, be not construed as limiting the invention.In the accompanying drawings:
Fig. 1 shows the overall structure figure of the Copper-Aluminum compound low-inductance bus of the embodiment of the present invention one；
Fig. 2 shows the top views of the Copper-Aluminum compound low-inductance bus of the embodiment of the present invention one；
Fig. 3 shows the side view of the Copper-Aluminum compound low-inductance bus of the embodiment of the present invention one；
Fig. 4 shows the Copper-Aluminum compound low-inductance bus hierarchical view of the embodiment of the present invention two.
Appended drawing reference: the first insulating layer of 1-, the first conductor layer of 2-, 3- second insulating layer, the second conductor layer of 4-, 5- third are exhausted
Edge layer, 6- dead ring, the first circular through hole of 7-, the second circular through hole of 8-, the first copper-aluminum composite board of 2-1-, the first guide post of 2-2-,
The second copper-aluminum composite board of 4-1-, the second guide post of 4-2-.
Specific embodiment
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings and examples, how to apply to the present invention whereby
Technological means solves technical problem, and the realization process for reaching technical effect can fully understand and implement.It needs to illustrate
As long as not constituting conflict, each feature in each embodiment and each embodiment in the present invention can be combined with each other,
It is within the scope of the present invention to be formed by technical solution.
Embodiment one:
The embodiment of the present invention one provides a kind of Copper-Aluminum compound low-inductance bus as shown in Figures 1 to 4.Fig. 1 is the present invention
The overall structure figure of the Copper-Aluminum compound low-inductance bus of embodiment one.Fig. 2 is the Copper-Aluminum compound low-inductance bus of the embodiment of the present invention one
Top view.Fig. 3 is the side view of the Copper-Aluminum compound low-inductance bus of the embodiment of the present invention one.Fig. 4 is the embodiment of the present invention one
Copper-Aluminum compound low-inductance bus hierarchical view.
Referring to figs. 1 to 4, the Copper-Aluminum compound low-inductance bus that the embodiment of the present invention one provides, including the first conductor layer
2, the second conductor layer 4, the first insulating layer 1, second insulating layer 3 and third insulating layer 5.Above-mentioned first insulating layer 1 and third are exhausted
Edge layer 5 is respectively arranged at the lower surface of the first conductor layer 2 and the upper surface of the second conductor layer 4.Above-mentioned second insulating layer 3 is set to
Between first conductor layer 2 and the second conductor layer 4.Above-mentioned each conductor layer and insulating layer are by having the bonding of sticky insulating materials
Layer is fitted and connected.
Above-mentioned first conductor layer 2 is made of the first copper-aluminum composite board 2-1 and the first guide post 2-2.Above-mentioned second conductor layer 4
It is made of the second copper-aluminum composite board 4-1 and the second guide post 4-2.
Above-mentioned first conductor layer 2, the second conductor layer 4, the first insulating layer 1, second insulating layer 3 and third insulating layer 5 are equal
Offer the circular through hole for guide post to be arranged.The circular through hole of above-mentioned each conductor layer and insulating layer is in each conductor layer and insulating layer
The first circular through hole 7 and the second circular through hole 8 are overlapped to form after being fitted and connected.Above-mentioned first guide post 2-2 and the second guide post 4-2 points
Above-mentioned first circular through hole 7 and the second circular through hole 8 are not extended vertically through.
In the side exterior surface and the first insulating layer and third insulating layer of above-mentioned first guide post 2-2 and the second guide post 4-2
Contact surface is respectively arranged with dead ring 6.
In the embodiment of the present invention one, above-mentioned insulating layer and above-mentioned adhesive layer are by can be carried out the flexible insulating material structure of bending
At.Such setting is convenient to the Copper-Aluminum compound low-inductance bus bending and molding after heating as three-dimensional structure at any angle.
Above-mentioned first guide post 2-2, the second guide post 4-2 respectively with above-mentioned first circular through hole 7, above-mentioned second circular through hole 8
Using copper and aluminium welding tin silk as solder, it is fixedly connected by way of soldering.(in addition, the fixation of above-mentioned guide post and circular through hole
Connection type can also be used the other modes such as riveting and fix, in the present invention with no restrictions.)
The Copper-Aluminum compound volume ratio of above-mentioned first copper-aluminum composite board 2-1 and the second copper-aluminum composite board 4-1 are 2:8.So set
Setting can make the weight ratio pure copper material of conductor material reduce 1/3 or more.
In addition, in the embodiment of the present invention one, the table of above-mentioned first copper-aluminum composite board 2-1 and the second copper-aluminum composite board 4-1
Face carries out tin plating processing by way of plating.Copper-aluminum composite board after tin plating process has more preferably corrosion resistance
And salt spray resistance ability.
In the embodiment of the present invention one, above-mentioned first guide post 2-2, the second guide post 4-2 are set as copper guide post.It (may also set up
For aluminium guide post)
The first conductor layer 2 and the second conductor layer 4 of Copper-Aluminum compound low-inductance bus in the embodiment of the present invention one are according to copper aluminium
The conductivity and size of current of composite plate design its plate thickness.
Embodiment two:
Second embodiment of the present invention provides a kind of manufacturing methods of Copper-Aluminum compound low-inductance bus as shown in Figure 4.Fig. 4 is this
The Copper-Aluminum compound low-inductance bus hierarchical view of inventive embodiments two.
Referring to shown in Fig. 4, second embodiment of the present invention provides a kind of manufacturing methods of Copper-Aluminum compound low-inductance bus, including such as
Lower step:
Step S1: it is processed respectively on the first copper-aluminum composite board 2-1 and the second copper-aluminum composite board 4-1 for fixing guide post
First circular through hole 7 and the second circular through hole 8.
Step S2: by the first copper-aluminum composite board 2-1, the second copper-aluminum composite board 4-1, the first guide post 2-2 and the second guide post
4-2 is tin plating in the way of plating.
Step S3: will be processed into the first copper-aluminum composite board 2-1, the second copper-aluminum composite board 4-1 it is onesize, shape
One insulating layer 1, third insulating layer 5 are fitted in lower surface and the second copper-aluminum composite board 4-1 of the first copper-aluminum composite board 2-1 respectively
The second insulating layer 3 is set between the first copper-aluminum composite board 2-1 and the second copper-aluminum composite board 4-1 by upper surface, and formation is led
The multilayered structure of body layer and insulating layer overlapping.
Step S4: the first guide post 2-2 and the second guide post 4-2 are respectively perpendicular across above-mentioned first circular through hole 7 and second
Circular through hole 8 and the side exterior surface of above-mentioned first guide post 2-2 and the first insulating layer 1, third insulating layer 5 contact surface on point
It She Zhi not dead ring 6；Similarly, in the side exterior surface of above-mentioned second guide post 4-2 and the first insulating layer 1, third insulating layer 5
Dead ring 6 is respectively set on contact surface.
Step S5: above-mentioned first guide post 2-2 and the second guide post 4-2 are separately fixed at above-mentioned first circular through hole 7 and
On one circular through hole 8.
Step S6: by after overlapping conductor layer and insulating layer composite construction is formed by the way of hot pressing.
Step S7: preferably, the composite construction is subjected to bending and molding processing, forms Copper-Aluminum compound low-inductance bus.
Wherein, in above-mentioned steps S2, by copper-aluminum composite board carry out it is tin plating before further include: once heavy zinc step, move back zinc step,
Secondary heavy zinc step, nickel plating step and copper coating step.Increase secondary heavy zinc step in the embodiment of the present invention two for increasing gold
Metal surface activity, keeps subsequent electroplating processes more convenient.Increased nickel plating step is for improving copper in the embodiment of the present invention two
The environment resistant corrosive nature of the compound low-inductance bus of aluminium.
It wherein, include soldering or riveting by the fixed form that guide post is fixed on circular through hole.
As it can be seen that using the embodiment of the present invention one and Copper-Aluminum compound low-inductance bus provided by Embodiment 2 of the present invention and its system
Method is made, has more preferably conductive capability relative to aluminium bus array.Relative to fine copper busbar, under same conductive capability, this hair
It is bright to have lighter weight, integral product weight can be reduced by using Copper-Aluminum compound low-inductance bus provided by the invention, it is real
Existing light-weight design.In addition, Copper-Aluminum compound low-inductance bus environment resistant corrosivity provided by the invention is more relative to aluminium alloy busbar
Good, salt spray resistance ability is stronger.
While it is disclosed that embodiment content as above but described only to facilitate understanding the present invention and adopting
Embodiment is not intended to limit the invention.Any those skilled in the art to which this invention pertains are not departing from this
Under the premise of the disclosed spirit and scope of invention, any modification and change can be made in the implementing form and in details,
But protection scope of the present invention still should be subject to the scope of the claims as defined in the appended claims.
Claims (10)
1. a kind of Copper-Aluminum compound low-inductance bus characterized by comprising
Several conductor layers, the conductor layer are made of copper-aluminum composite board；
The upper surface of the conductor layer is arranged in several insulating layers, the insulating layer adhesive layer in a manner of being bonded respectively
And/or lower surface, so that the conductor layer is each other and the conductor layer and exterior insulation；
Wherein, the conductor layer and insulating layer offer through-hole in corresponding position respectively, and the through-hole runs through institute for being arranged
The guide post for stating conductor layer and insulating layer, by the guide post, the conductor layer can constitute conductive path with external circuit.
2. Copper-Aluminum compound low-inductance bus according to claim 1, it is characterised in that:
The contact surface of the side exterior surface of the guide post and the insulating layer is provided with dead ring.
3. Copper-Aluminum compound low-inductance bus according to claim 1 or 2, which is characterized in that the conductor layer is by Copper-Aluminum compound
The copper-aluminum composite board that volume ratio is 2:8 is constituted.
4. Copper-Aluminum compound low-inductance bus according to claim 3, which is characterized in that the electroplating surfaces with tin of the copper-aluminum composite board
Or nickel plating.
5. Copper-Aluminum compound low-inductance bus according to claim 4, which is characterized in that the guide post is that copper guide post or aluminium are led
Column.
6. Copper-Aluminum compound low-inductance bus according to claim 5, which is characterized in that side of the guide post to be brazed or rivet
Formula is fixed in the through-hole.
7. Copper-Aluminum compound low-inductance bus according to claim 6, which is characterized in that the insulating layer and the adhesive layer by
The flexible insulating material of energy bending is constituted.
8. a kind of manufacturing method of Copper-Aluminum compound low-inductance bus, which comprises the steps of:
The through-hole for fixing guide post is processed at the relative position in conductor layer and insulating layer；Wherein, the conductor layer by
Copper-aluminum composite board is constituted, and the insulating layer is identical as the shape of the conductor layer, size；
Insulating layer is fitted in the upper surface and/or lower surface of the conductor layer by adhesive layer, so that between conductor layer
Mutually insulated and conductor layer and exterior insulation；Wherein, be bonded insulating layer and when conductor layer, by insulating layer through-hole with lead
The through-hole alignment of relative position on body layer；
The conductor layer of alignment overlapping and insulating layer are formed into complex structure body by way of hot pressing；
Setting runs through the guide post of the complex structure body in through-holes so that conductor layer in the complex structure body can with it is outer
Portion's circuit constitutes conductive path.
9. the manufacturing method of Copper-Aluminum compound low-inductance bus according to claim 8, which is characterized in that setting is passed through in through-holes
When wearing the guide post of the complex structure body, also it is arranged in the contact surface of the side exterior surface of the guide post and the insulating layer and insulate
Ring.
10. the manufacturing method of Copper-Aluminum compound low-inductance bus according to claim 8, which is characterized in that using soldering or riveting
The mode connect is fixed in through-holes by guide post.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710768402.XA CN109427437A (en) | 2017-08-31 | 2017-08-31 | A kind of Copper-Aluminum compound low-inductance bus and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710768402.XA CN109427437A (en) | 2017-08-31 | 2017-08-31 | A kind of Copper-Aluminum compound low-inductance bus and its manufacturing method |
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| Publication Number | Publication Date |
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| CN109427437A true CN109427437A (en) | 2019-03-05 |
Family
ID=65504608
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710768402.XA Pending CN109427437A (en) | 2017-08-31 | 2017-08-31 | A kind of Copper-Aluminum compound low-inductance bus and its manufacturing method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110838656A (en) * | 2019-11-29 | 2020-02-25 | 广东美的暖通设备有限公司 | Busbar, frequency converter and centrifugal machine |
| CN114628186A (en) * | 2020-12-14 | 2022-06-14 | 平高集团有限公司 | Flow guide row connecting structure of grounding switch |
| CN116053090A (en) * | 2023-02-13 | 2023-05-02 | 温州宏丰电工合金股份有限公司 | Circuit breaker conductor assembly and preparation method thereof |
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| CN2935571Y (en) * | 2006-08-18 | 2007-08-15 | 无锡市华辉电力设备有限公司 | Copper-aluminum composite solid bus-slot |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110838656A (en) * | 2019-11-29 | 2020-02-25 | 广东美的暖通设备有限公司 | Busbar, frequency converter and centrifugal machine |
| CN110838656B (en) * | 2019-11-29 | 2022-02-11 | 上海美控智慧建筑有限公司 | Busbar, frequency converter and centrifugal machine |
| CN114628186A (en) * | 2020-12-14 | 2022-06-14 | 平高集团有限公司 | Flow guide row connecting structure of grounding switch |
| CN116053090A (en) * | 2023-02-13 | 2023-05-02 | 温州宏丰电工合金股份有限公司 | Circuit breaker conductor assembly and preparation method thereof |
| CN116053090B (en) * | 2023-02-13 | 2023-09-15 | 温州宏丰电工合金股份有限公司 | Circuit breaker conductor assembly and preparation method thereof |
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Application publication date: 20190305 |