JP2012222124A - Capacitor with insulating coating and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a capacitor with an insulating coating in which short circuit between terminal electrodes is prevented even if a chip type multilayer ceramic capacitor is mounted on a metal pedestal, and connection by wire bonding is possible.SOLUTION: The capacitor with an insulating coating is manufactured by a step for manufacturing a chip type laminate, a step for applying an underlying electrode to the chip type laminate, a step for plating on a terminal electrode, and a step for applying an insulating coating on one surface simultaneously having a plurality of terminal electrodes not connected electrically. The part where the insulating coating is applied is a part, on one surface simultaneously having the plurality of terminal electrodes not connected electrically, including at least the terminal electrode on one surface.

Description

The present invention relates to a chip-type multilayer ceramic capacitor partially coated with an insulating coating and a method for manufacturing the same.

When a capacitor mounted on a conductive base such as in a pyroelectric infrared sensor package is mounted on the conductive base as it is, the terminal electrodes at both ends thereof are electrically short-circuited. It is mounted on a complicatedly wired internal wiring board as shown in Japanese Patent Application Publication No. 2004-279118, and the terminal electrode is prevented from being short-circuited, and at the same time, it is electrically connected. There is a problem of cost because it is necessary to install a wiring board.

Further, in order to solve the above problem, in Japanese Patent Application Laid-Open No. 2010-169520, the internal wiring board is abolished, and a capacitor is directly fixed on the header with an adhesive such as an epoxy resin, so that electrical connection between each component is achieved. Is done by wire bonding.

JP 2004-279118 A JP 2010-169520 A

However, in Patent Document 2, since the capacitor is directly mounted on the metal pedestal using an adhesive, a short circuit may occur between the terminal electrodes when the capacitor is pressed against the metal pedestal in the bonding process. There was a problem.

In order to solve this problem, a method of forming an insulating film on the metal pedestal where the capacitor is mounted may be considered, but the insulating film is formed only in a very narrow space such as a gap between protrusions such as metal terminals. It is very difficult.

Therefore, in view of the above circumstances, the present invention has an insulating coating that does not short-circuit between terminal electrodes even when a chip-type multilayer ceramic capacitor is mounted directly on a metal pedestal and can be connected by wire bonding It is an object of the present invention to provide a capacitor and a manufacturing method thereof.

In order to solve the above-described problem, the present invention provides a chip-type multilayer ceramic capacitor having two or more terminal electrodes, at least on one surface having a plurality of terminal electrodes that are not electrically connected at the same time. A capacitor with an insulating coating in which an insulating coating is applied to a portion including the terminal electrode is employed.

In such a method of manufacturing a capacitor with an insulating film, a first step of manufacturing a chip-type laminate by a conventionally known method, a second step of applying a base electrode to the chip-type laminate, and the base Manufacture of a capacitor with an insulating coating comprising a third step of plating on an electrode and a fourth step of applying an insulating coating on one surface having a plurality of base electrodes that are not electrically connected simultaneously Method.

A first step of manufacturing a chip-type laminate by a conventionally known method, a second step of applying a base electrode to the chip-type laminate, and a plurality of base electrodes that are not electrically connected are simultaneously provided. The manufacturing method of the said capacitor | condenser with an insulating film which consists of a 3rd process of applying an insulating film on one surface, and a 4th process of plating on the said base electrode.

If the capacitor | condenser with an insulating film by this invention is used, it can mount on a metal surface, without terminal electrodes electrically connecting.

Perspective view of a general chip type multilayer ceramic capacitor The perspective view of the capacitor | condenser with an insulation film by this invention AA cross-sectional view of the capacitor with an insulating film in FIG. External perspective view of a capacitor with an insulating film mounted on a metal base Sectional view when a capacitor with an insulation coating is mounted on a metal base Sectional view of the second form of capacitor with insulation coating

In order to clarify the present invention, embodiments of the present invention will be described in detail with reference to the drawings.

First, FIG. 1 shows a chip-type multilayer ceramic capacitor 2 having terminal electrodes 1 on two opposing surfaces, which is well known. FIG. 2 shows the external appearance of the capacitor 3 with an insulating coating according to the present invention, and FIG. As described above, the insulating coating 4 is applied to at least a portion including the terminal electrode on the surface of the chip-type multilayer ceramic capacitor 2 on the surface having the two terminal electrodes 1 at the same time. That is, when the chip-type multilayer ceramic capacitor 2 is placed on a plane, the insulating coating 4 is applied to at least the terminal electrode portion in contact with the plane. In addition, as shown in FIG.2 and FIG.3, the insulating coating 4 covers not only the said terminal electrode part but the surface which has the two terminal electrodes 1 simultaneously, Furthermore, it wraps around and coat | covers to an outer peripheral surface, The insulation between the terminal electrodes is more reliable.

As shown in FIG. 3, the terminal electrode 1 of the chip type multilayer ceramic capacitor 2 includes a base electrode 5 made of Cu, Ag, Ni or the like as a first layer, a Ni plating 6 as a second layer, It is comprised from Au plating 7 which is the third layer. The insulating coating 4 is made of an insulating material such as epoxy, phenol, or acrylic.

As shown in FIGS. 4 and 5, the capacitor 3 with an insulating film according to the present invention is formed on a metal base 8 of a general pyroelectric infrared sensor package by an insulating adhesive 9 such as an epoxy system. Fixed. And in order to form a circuit, it connects to the upper end part of the metal terminal electrode 11 using the wire 10 by wire bonding. The metal terminal electrode 11 is insulated from the metal pedestal 8 by the insulating support portion 12.

(Example 1) As a method of manufacturing a capacitor 3 with an insulating film according to the present invention, a first step of manufacturing a conventionally known chip type laminate, and two surfaces on which internal electrodes of the chip type laminate are exposed A second step of applying the base electrode 5 to the substrate, a third step of applying the Ni plating 6 and the Au plating 7 to the base electrode 5 to complete the chip type multilayer ceramic capacitor 2, and the opposing of the chip type multilayer ceramic capacitor 2 There is a method of manufacturing a capacitor 3 with an insulating coating comprising a fourth step of applying an insulating coating on one surface having the two terminal electrodes 1 simultaneously.

The first process to the third process are conventionally known manufacturing methods. As a method of applying the insulating coating 4 to the one surface of the chip-type multilayer ceramic capacitor 2 as the fourth step, that is, the mounting surface 13 on the metal pedestal, there are inkjet, screen printing, transfer and the like.

Since the capacitor 3 with the insulating film is fixed to the metal base 8 using the adhesive 9, it is necessary to press the capacitor 3 with the insulating film against the metal base 8 in this bonding process. The base 8 may come into contact. At this time, when a capacitor not provided with the insulating coating 4 is used, a defect that the terminal electrode is short-circuited occurs. However, as shown in FIG. 5, since the mounting surface 13 is provided with the insulating film 4, the capacitor electrode 3 with the insulating film is short-circuited between the two terminal electrodes facing each other even when contacting the mounting surface. There is no.

And since the insulating film 4 is not given to the surface on the opposite side to the mounting surface 13 of the capacitor | condenser 3 with an insulating film, it can connect with the metal terminal electrode 11 easily by wire bonding. Therefore, an electric circuit can be formed without installing a complicated internal wiring board.

(Embodiment 2) As another method of manufacturing the capacitor 3 with an insulating coating according to the present invention, a first step of manufacturing a conventionally known chip type laminate, and a base electrode on two opposing surfaces of the chip type laminate 5, a third step of applying the insulating coating 4 on one surface having the two opposing base electrodes 5 simultaneously, and Ni plating 6 and Au plating 7 on the base electrode 5. There is a method of manufacturing a capacitor 3 with an insulating film comprising a fourth step to be applied.

Thus, even if the insulating film 4 is applied after the base electrode 5 is applied and then the Ni plating 6 and the Au plating 7 are applied, the plating is not applied on the insulating film 4 as shown in FIG. Further, it is applied only on the conductive base electrode 5. Therefore, the mounting surface 13 is not plated, and the same effect as the capacitor 3 with an insulating film shown in the first embodiment can be obtained.

Further, the capacitor 3 with the insulating coating film according to the manufacturing method of Example 2 has a smaller area for Ni plating and Au plating than the capacitor 3 with the insulating coating film according to the manufacturing method of Example 1, so that the manufacturing cost is viewed. It will be advantageous.

The procedure of coating the insulating coating 4 after applying the Ni plating 6 and then applying the Au plating 7 is not a practical method in consideration of production efficiency, but has the same effect as in the first and second embodiments. Obtainable.

As described above, the details of the present invention have been described with reference to specific examples. However, the present invention is shown as an embodiment of the present invention, and the effects of the invention are considered based on the technical idea. It should be understood that a part of the embodiment can be modified and implemented as long as it is not significantly impaired.

The capacitor with an insulating film according to the present invention does not conduct the terminal electrode even when mounted on a conductive substrate, and can be easily connected by wire bonding.

1; Terminal electrode 2; Chip-type multilayer ceramic capacitor 3; Capacitor with insulating coating 4; Insulating coating 5; Base electrode 6; Ni plating 7; Au plating 8; Metal base 9; 10; Wire 11; Metal terminal electrode 12; Insulation support 13; Mounting surface

Claims (3)

In a chip-type multilayer ceramic capacitor having two or more terminal electrodes, an insulating coating is provided with an insulating coating applied to at least a portion including the terminal electrodes on one surface having a plurality of terminal electrodes that are not electrically connected simultaneously. Capacitor. A first step for producing a chip-type laminate,
A second step of applying a base electrode to the chip-type laminate;
A third step of plating on the base electrode;
A fourth step of applying an insulating film on one surface having the plurality of base electrodes that are not electrically connected simultaneously;
The manufacturing method of the capacitor | condenser with an insulating film which consists of. A first step for producing a chip-type laminate,
A second step of applying a base electrode to the chip-type laminate;
A third step of applying an insulating film on one surface having the plurality of base electrodes that are not electrically connected simultaneously;
A fourth step of plating on the base electrode;
The manufacturing method of the capacitor | condenser with an insulating film which consists of.

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