CN211700253U - DFN device packaging structure for surface mounting - Google Patents
DFN device packaging structure for surface mounting Download PDFInfo
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- CN211700253U CN211700253U CN202020443859.0U CN202020443859U CN211700253U CN 211700253 U CN211700253 U CN 211700253U CN 202020443859 U CN202020443859 U CN 202020443859U CN 211700253 U CN211700253 U CN 211700253U
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Abstract
The utility model discloses a DFN device packaging structure for surface mounting, its left pin, the respective other end of right pin extend from the epoxy packaging body, the terminal surface all bonds through heat-conducting adhesive layer around the chip has metal fin, the terminal surface all bonds through heat-conducting adhesive layer has left metal fin and right metal fin about the chip, and left through-hole and the right through-hole that has a plurality of confession left pin, right pin embedding are opened respectively to this left metal fin and right metal fin, left side through-hole, right through-hole respectively with between left pin, the right pin through-hole through the epoxy packaging body insulation isolation, a plurality of air channel has evenly been seted up to the lower surface of the epoxy packaging body. The utility model discloses DFN device packaging structure for surface mounting has increased effective heat radiating area, improves the radiating effect, also is favorable to improving the circulation of air speed between semiconductor device and the PCB circuit board to more be favorable to thermal diffusion.
Description
Technical Field
The utility model relates to a semiconductor device technical field especially relates to a DFN device packaging structure for surface mounting.
Background
DFN is a recent electronic packaging technology that uses advanced double-sided flat lead-free packaging. DFN platforms are the latest surface mount packaging technology. The mounting pads, solder mask and stencil pattern design and assembly process of the printed circuit board all follow the corresponding principles. The DFN platform has versatility to allow one or more semiconductor devices to be connected within a lead-free package.
In the existing DFN packaging structure of the chip, heat on the chip is conducted out and dissipated through the heat dissipation region by setting the heat dissipation region. However, in the prior art, the heat dissipation area mainly dissipates heat through contact with the external environment, but the contact area between the heat dissipation area and the external environment is limited, so the heat dissipation performance is relatively general. How to overcome the above technical problems has been the direction of efforts of those skilled in the art.
Disclosure of Invention
The utility model aims at providing a DFN device packaging structure for surface mounting, which increases the effective heat dissipation area, improves the heat dissipation effect, accelerates the heat dissipation speed, also improves the strength and reliability of the device and prolongs the service life of the chip; and is also beneficial to improving the air circulation rate between the semiconductor device and the PCB, thereby being more beneficial to the diffusion of heat.
In order to achieve the above purpose, the utility model adopts the technical scheme that: the utility model provides a DFN device packaging structure for surface mounting, is connected and is located a plurality of left pin, the right pin of the chip left and right sides respectively including chip, the one end that is located the epoxy packaging body and chip electricity, left side pin, the respective other end of right pin extend from the epoxy packaging body, the terminal surface all bonds through heat-conducting adhesive layer around the chip has metal fin, the terminal surface all bonds through heat-conducting adhesive layer has left metal fin and right metal fin about the chip, and this left metal fin and right metal fin open respectively has left through-hole and the right through-hole that a plurality of supplied left pin, right pin embedding, left through-hole, right through-hole respectively with left pin, right pin between through epoxy packaging body insulation isolation, a plurality of air channel has evenly been seted up to the lower surface of epoxy packaging body.
The further improved scheme in the technical scheme is as follows:
1. in the above scheme, the metal radiating fins are aluminum radiating fins, copper radiating fins or aluminum alloy radiating fins.
2. In the above scheme, the left metal radiating fin and the right metal radiating fin are both aluminum radiating fins, copper radiating fins or aluminum alloy radiating fins.
3. In the above aspect, the vent groove is semicircular.
4. In the above scheme, the thickness of the epoxy encapsulation body above the chip is greater than the thickness of the epoxy encapsulation body below the chip.
Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:
the utility model discloses DFN device packaging structure for surface mounting, its chip front and back terminal surface all have metal fin through heat-conducting glue film bonding, the chip left and right terminal surface all has left metal fin and right metal fin through heat-conducting glue film bonding, and this left metal fin and right metal fin are opened respectively has left through-hole and right through-hole that a plurality of confession left pin, right pin imbed, left through-hole, right through-hole are insulated with left pin, right pin respectively through epoxy packaging body and are kept apart, have increased effective heat radiating area, improve the radiating effect, have accelerated the speed of heat dissipation, have also improved the intensity and the reliability of device and lengthened the life of chip; in addition, a plurality of vent grooves are uniformly formed in the lower surface of the epoxy packaging body, so that the heat dissipation area is increased, the air circulation rate between the semiconductor device and the PCB is improved, and the heat diffusion is facilitated.
Drawings
FIG. 1 is a schematic view of the structure of the DFN device package for surface mounting of the present invention;
fig. 2 is a schematic top sectional view of fig. 1.
In the above drawings: 1. an epoxy package; 2. a chip; 3. a left pin; 4. a right pin; 5. a heat-conducting adhesive layer; 6. a metal heat sink; 7. a left metal heat sink; 8. a right metal heat sink; 9. a left through hole; 10. a right through hole; 11. a vent groove.
Detailed Description
Example 1: a DFN device packaging structure for surface mounting comprises a chip 2 in an epoxy packaging body 1, a plurality of left pins 3 and right pins 4 with one ends electrically connected with the chip 2 and respectively positioned at the left and right sides of the chip 2, the other ends of the left pin 3 and the right pin 4 extend out of the epoxy packaging body 1, the front end face and the rear end face of the chip 2 are both bonded with metal radiating fins 6 through heat conducting adhesive layers 5, the left and right end faces of the chip 2 are respectively bonded with a left metal radiating fin 7 and a right metal radiating fin 8 through a heat conducting glue layer 5, the left metal radiating fin 7 and the right metal radiating fin 8 are respectively provided with a plurality of left through holes 9 and right through holes 10 for embedding the left pins 3 and the right pins 4, the left through hole 9 and the right through hole 10 are insulated and isolated from the left pin 3 and the right pin 4 through the epoxy packaging body 1, and a plurality of vent grooves 11 are uniformly formed in the lower surface of the epoxy packaging body 1.
The metal heat sink 6 is an aluminum heat sink, and the left metal heat sink 7 and the right metal heat sink 8 are both aluminum heat sinks.
The thickness of the epoxy package 1 above the chip 2 is greater than the thickness of the epoxy package below the chip 2.
Example 2: a DFN device packaging structure for surface mounting comprises a chip 2 in an epoxy packaging body 1, a plurality of left pins 3 and right pins 4 with one ends electrically connected with the chip 2 and respectively positioned at the left and right sides of the chip 2, the other ends of the left pin 3 and the right pin 4 extend out of the epoxy packaging body 1, the front end face and the rear end face of the chip 2 are both bonded with metal radiating fins 6 through heat conducting adhesive layers 5, the left and right end faces of the chip 2 are respectively bonded with a left metal radiating fin 7 and a right metal radiating fin 8 through a heat conducting glue layer 5, the left metal radiating fin 7 and the right metal radiating fin 8 are respectively provided with a plurality of left through holes 9 and right through holes 10 for embedding the left pins 3 and the right pins 4, the left through hole 9 and the right through hole 10 are insulated and isolated from the left pin 3 and the right pin 4 through the epoxy packaging body 1, and a plurality of vent grooves 11 are uniformly formed in the lower surface of the epoxy packaging body 1.
The metal heat sink 6 is a copper heat sink,
the left metal heat sink 7 and the right metal heat sink 8 are both copper heat sinks.
The vent groove 11 is semicircular in shape.
The thickness of the epoxy package 1 above the chip 2 is greater than the thickness of the epoxy package below the chip 2.
When the DFN device packaging structure for surface mounting is adopted, the effective heat dissipation area is effectively increased, the heat dissipation effect is improved, the heat dissipation speed is accelerated, the strength and the reliability of the device are improved, and the service life of a chip is prolonged; in addition, a plurality of vent grooves are uniformly formed in the lower surface of the epoxy packaging body, so that the heat dissipation area is increased, the air circulation rate between the semiconductor device and the PCB is improved, and the heat diffusion is facilitated.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable people skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.
Claims (5)
1. The utility model provides a DFN device packaging structure for surface mounting which characterized in that: including chip (2), one end that are located epoxy packaging body (1) and be connected with chip (2) electricity and be located a plurality of left pin (3), right pin (4) of chip (2) left and right sides respectively, left side pin (3), right pin (4) respective other end extend from epoxy packaging body (1), the terminal surface all bonds through heat-conducting adhesive layer (5) around chip (2) has metal fin (6), the terminal surface all bonds through heat-conducting adhesive layer (5) has left metal fin (7) and right metal fin (8) about chip (2), and left through-hole (9) and right through-hole (10) that this left metal fin (7) and right metal fin (8) were opened respectively that a plurality of supplied left pin (3), right pin (4) to imbed, left through-hole (9), right through-hole (10) respectively with left pin (3), The right pin (4) is insulated and isolated through the epoxy packaging body (1), and a plurality of vent grooves (11) are uniformly formed in the lower surface of the epoxy packaging body (1).
2. The DFN device package structure for surface mounting according to claim 1, wherein: the vent groove (11) is semicircular in shape.
3. The DFN device package structure for surface mounting according to claim 1 or 2, wherein: the metal radiating fins (6) are aluminum radiating fins, copper radiating fins or aluminum alloy radiating fins.
4. The DFN device package structure for surface mounting according to claim 1 or 2, wherein: the left metal radiating fin (7) and the right metal radiating fin (8) are both aluminum radiating fins, copper radiating fins or aluminum alloy radiating fins.
5. The DFN device package structure for surface mounting according to claim 1 or 2, wherein: the thickness of the epoxy packaging body (1) above the chip (2) is larger than that of the epoxy packaging body below the chip (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020443859.0U CN211700253U (en) | 2020-03-31 | 2020-03-31 | DFN device packaging structure for surface mounting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020443859.0U CN211700253U (en) | 2020-03-31 | 2020-03-31 | DFN device packaging structure for surface mounting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211700253U true CN211700253U (en) | 2020-10-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202020443859.0U Active CN211700253U (en) | 2020-03-31 | 2020-03-31 | DFN device packaging structure for surface mounting |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112635419A (en) * | 2020-12-22 | 2021-04-09 | 国网智慧能源交通技术创新中心(苏州)有限公司 | Packaging structure of inverter IGBT module |
-
2020
- 2020-03-31 CN CN202020443859.0U patent/CN211700253U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112635419A (en) * | 2020-12-22 | 2021-04-09 | 国网智慧能源交通技术创新中心(苏州)有限公司 | Packaging structure of inverter IGBT module |
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