CN209912639U - Planar power resistor with packaged surface mounting structure - Google Patents
Planar power resistor with packaged surface mounting structure Download PDFInfo
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- CN209912639U CN209912639U CN201920890056.7U CN201920890056U CN209912639U CN 209912639 U CN209912639 U CN 209912639U CN 201920890056 U CN201920890056 U CN 201920890056U CN 209912639 U CN209912639 U CN 209912639U
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Abstract
A plane power resistor with a packaged surface-mounted structure comprises a ceramic substrate, a ceramic upper sheet, a resistor layer, pins and a plastic package shell, wherein the resistor layer is arranged between the ceramic substrate and the ceramic upper sheet; the power resistor is characterized in that a plated layer for metallization treatment is arranged on the bottom surface of the ceramic substrate, and the power resistor is welded on an external radiator through the plated layer. The device has removed the setting of mounting hole on the plastic envelope shell, makes the ceramic substrate area maximize of its resistance, and the bottom surface of the device's ceramic substrate adopts metallization processing, makes it have surface mounting welding nature function, but the lug connection is on the radiator, and the radiating effect is better, and this device simple structure, and production and processing cost is low, and excellent in use effect has realized the rated power maximize on the product with the volume.
Description
Technical Field
The utility model relates to an electronic components field especially relates to a encapsulation surface mounting structure plane power resistor.
Background
The Resistor (Resistor) is a current limiting element, which is generally and directly called as a Resistor in daily life. The chip resistor has the advantages of small volume, light weight, high installation density, strong shock resistance, strong anti-interference capability, good high-frequency characteristic and the like, is widely applied to computers, mobile phones, electronic dictionaries, medical electronic products, video cameras and the like, and can be divided into three types, namely rectangular, cylindrical and special-shaped according to the shape of the chip element.
The TO-247 packaged power resistor in the prior art is composed of a ceramic substrate, a resistor layer, pins and a plastic package shell, wherein a heating part of the power resistor is the resistor layer, if heat cannot be dissipated from the resistor layer, the resistance value of the resistor changes or welding points melt, and finally the resistor fails, the generated heat is mainly conducted TO a radiator through the ceramic substrate, part of the heat is conducted TO the plastic package shell and dissipated through radiation and convection, the plastic package shell is low in heat conductivity coefficient and poor in heat dissipation effect, and how TO transfer a large amount of heat generated by the resistor layer must be considered.
Generally, a mounting hole for fixing is designed on a plastic package shell of a product, a power resistor is fixedly mounted through a screw, a ceramic substrate is tightly attached to a radiator designed by a user, and heat-conducting silicone grease is coated between the ceramic substrate and the radiator to effectively strip heat continuously generated by the resistor during operation, so that the radiating effect of the resistor is ensured. However, the design of the mounting hole reduces the heat dissipation area of the power resistor, and the higher rated power requirement of some users cannot be met on the product with the same volume.
Disclosure of Invention
To the weak point that exists among the above-mentioned technique, the utility model provides a encapsulation surface mounting structure plane power resistor has removed the setting of mounting hole on the device's the plastic envelope shell, makes the substrate area maximize of its resistance, and the substrate of resistance adopts the metallization to handle, makes it have surface mounting welding nature function, but the lug weld on the radiator, and the radiating effect is better, has realized the rated power maximize on the product with the volume.
To achieve the above object, the present invention is implemented as follows:
a plane power resistor with a packaged surface-mounted structure comprises a ceramic substrate, a ceramic upper sheet, a resistor layer, pins and a plastic package shell, wherein the resistor layer is arranged between the ceramic substrate and the ceramic upper sheet; the power resistor is characterized in that a plated layer for metallization treatment is arranged on the bottom surface of the ceramic substrate, and the power resistor is welded on an external radiator through the plated layer. This power resistor has removed the setting of the mounting hole on the plastic envelope shell for current resistance for the area of this power resistor's ceramic substrate has almost spread this power resistor's bottom surface, and ceramic substrate area has obtained the utilization of maximize, has increased heat radiating area, and with the bottom surface metallization of ceramic substrate, makes it have the weldability, can be directly with this power resistor welding, and the connected mode is simple and the radiating effect is better, and rated power can reach 150W on the product with the volume.
Further, the plating layer is silver or nickel or tin. The plating layer is silver or nickel or tin, has solderability and has strong heat conductivity.
Furthermore, a limiting groove is arranged on the top surface of the plastic package shell, and the limiting groove is transversely arranged in the middle of the plastic package shell.
The utility model has the advantages of, the setting of mounting hole has been removed on the device's the plastic envelope shell, makes the ceramic substrate area maximize of its resistance, and the bottom surface of the device's ceramic substrate adopts the metallization to handle, makes it have surface mounting weldability function, but the lug welding is on the radiator, and heat conduction radiating effect is better, and this device simple structure, and the production and processing cost is low, excellent in use effect has realized the rated power maximize on the product with the volume.
Drawings
Fig. 1 is a schematic structural diagram of a planar power resistor with a package surface mount structure according to the present invention.
Fig. 2 is a bottom view of the planar power resistor with the package surface mount structure according to the present invention.
Fig. 3 is a left side view of the planar power resistor with the package surface mount structure of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Reference is made to figures 1-3 of the drawings.
A plane power resistor 1 with a packaged surface-mounted structure comprises a ceramic substrate 2, a ceramic upper sheet (not shown), a resistor layer (not shown), pins 3 and a plastic package shell 4, wherein the resistor layer is arranged between the ceramic substrate 2 and the ceramic upper sheet, the ceramic substrate 2, the ceramic upper sheet and the resistor layer are wrapped in the plastic package shell 4, the bottom surface of the ceramic substrate 2 is exposed, and the pins 3 are connected with the resistor layer and extend out of one side surface of the plastic package shell 4; the power resistor is characterized in that a plated layer which is subjected to metallization treatment is arranged on the bottom surface of the ceramic substrate 2, and the power resistor 1 is welded on an external radiator through the plated layer. This power resistor 1 is for current resistance, the setting of the mounting hole on the plastic envelope shell 4 has been removed, make this power resistor 1's the bottom surface that this power resistor 1 was almost paved with to ceramic substrate 2's area, ceramic substrate 2 area has obtained the utilization of maximize, heat radiating area has been increased, and with ceramic substrate 2's bottom surface metallization, it has the weldability to make it, can be directly with this power resistor 1 welding, the simple and radiating effect of connected mode is better, realize rated power maximize on the product with the volume.
In this embodiment, the plating layer is silver or nickel or tin. The plating layer is silver or nickel or tin, has solderability and has strong heat conductivity.
In this embodiment, a limiting groove 41 is disposed on the top surface of the plastic package housing 4, and the limiting groove 5 is transversely disposed in the middle of the plastic package housing 4.
The utility model has the advantages of, the setting of mounting hole has been removed on the device's the plastic envelope shell, makes the ceramic substrate area maximize of its resistance, and the bottom surface of the device's ceramic substrate adopts the metallization to handle, makes it have surface mounting weldability function, but the lug welding is on the radiator, and the radiating effect is better, and this device simple structure, and the production and processing cost is low, excellent in use effect has realized the rated power maximize on the product with the volume.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (3)
1. A plane power resistor with a packaged surface-mounted structure comprises a ceramic substrate, a ceramic upper sheet, a resistor layer, pins and a plastic package shell, wherein the resistor layer is arranged between the ceramic substrate and the ceramic upper sheet; the power resistor is characterized in that a plated layer for metallization treatment is arranged on the bottom surface of the ceramic substrate, and the power resistor is welded on an external radiator through the plated layer.
2. The packaged surface mount structure planar power resistor of claim 1, wherein the plating is silver or nickel or tin.
3. The packaged surface mount structure planar power resistor of claim 1, wherein the top surface of the plastic package casing is provided with a limiting groove, and the limiting groove is transversely disposed in the middle of the plastic package casing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920890056.7U CN209912639U (en) | 2019-06-13 | 2019-06-13 | Planar power resistor with packaged surface mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920890056.7U CN209912639U (en) | 2019-06-13 | 2019-06-13 | Planar power resistor with packaged surface mounting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209912639U true CN209912639U (en) | 2020-01-07 |
Family
ID=69050026
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920890056.7U Active CN209912639U (en) | 2019-06-13 | 2019-06-13 | Planar power resistor with packaged surface mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209912639U (en) |
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2019
- 2019-06-13 CN CN201920890056.7U patent/CN209912639U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20211026 Address after: 523648 Room 101, building 17, Lihe Bauhinia intelligent manufacturing center, No. 105, Qingbin East Road, Qingxi Town, Dongguan City, Guangdong Province Patentee after: GUANGDONG YIJIE TECHNOLOGY Co.,Ltd. Address before: 518000 Guangdong Shenzhen Nanshan District science and Technology Park 1 Nanshan District science and Technology Park standard workshop 23 north 5, 6 level Patentee before: EBG-SHENZHEN Co.,Ltd. |
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| TR01 | Transfer of patent right |