CN217563895U - Improved device capable of minimizing power module volume - Google Patents
Improved device capable of minimizing power module volume Download PDFInfo
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- CN217563895U CN217563895U CN202220751701.9U CN202220751701U CN217563895U CN 217563895 U CN217563895 U CN 217563895U CN 202220751701 U CN202220751701 U CN 202220751701U CN 217563895 U CN217563895 U CN 217563895U
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- circuit board
- radiator
- shaped frame
- insulating sheet
- electronic element
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Abstract
The utility model discloses an improved device which can minimize the volume of a power module, comprising a radiator, a shell, an insulating sheet, a circuit board, an electronic element and radiating glue; an insulating tape is pasted in the radiator, an insulating sheet, a circuit board and an electronic element are sequentially arranged in the radiator from bottom to top, and when the radiator is assembled, the radiating adhesive can be used for smearing the inside of the radiator, so that all components in the radiator are mutually jointed and connected with the radiator for radiating; the shell is arranged outside the radiator and can completely cover the radiator. The utility model has the advantages that: the electronic components are reduced in size in the same effect or better effect, so that the sizes of the circuit board, the insulating sheet, the radiator and the shell are synchronously reduced.
Description
Technical Field
The utility model belongs to power module's relevant field design, concretely relates to can be with the improvement device of power module volume miniaturation.
Background
In the design process of the existing power module, after an active element is usually attached to a radiating fin and a passive element is coated on an insulating sheet, a plug-in unit is connected with a circuit on the same surface of a circuit board in a facing mode, the insulating sheet is used for coating the whole circuit board, the circuit board is prevented from conducting electricity, then a radiator is used for coating the whole circuit board, and finally a shell is coated on the radiator.
However, the prior art suffers from the following disadvantages:
1. too bulky, and the production cost is high: the active component and the passive component are inserted into the circuit board in the same direction, which results in a large amount of space required for assembling the electronic component, and when the volume of the circuit board is larger, the required space of the heat sink and the housing also needs to be enlarged, so that a large amount of raw materials need to be consumed for production, and the production cost is high.
2. The passive components are bulky: the passive components need to store a large amount of energy and have poor conversion rate, so that a large volume is needed for application, a large amount of space is needed for placement, the subsequent processing of the radiator and the shell needs corresponding space, and the production cost is high.
3. Heat is not easily conducted: in the prior art, the circuit board is integrally coated by the insulating sheet, so that the possibility of electric conduction of the circuit board is eliminated, but the circuit board cannot be radiated, and heat accumulation is generated inside the circuit board.
SUMMERY OF THE UTILITY MODEL
The utility model discloses main aim at revises electronic component plug-in components in the range design of circuit board, borrows this to reduce the volume after assembling, can reduce the volume of circuit board, radiator and shell simultaneously in the lump, reaches reduction in production cost.
The utility model discloses secondary aim at in with efficiency or better efficiency, reduce the volume of passive component, can reduce the volume of circuit board, radiator and shell simultaneously in the lump, borrow this to reach reduction in production cost.
The utility model discloses in still another aim at stopping electrically conductive possibility, reduce the application of insulating piece to application heat dissipation is glued and is joined, makes the utility model provides high heat dissipating, reduces the utility model discloses inside long-pending heat.
The technical scheme is as follows: the improved device capable of minimizing the volume of the power module comprises a radiator, a shell, an insulating sheet, a circuit board, an electronic element and radiating glue;
the heat radiator comprises a U-shaped frame and a reverse-U-shaped frame, and the U-shaped frame and the reverse-U-shaped frame can be jointed to form a square frame; the outer part of the insulating tape can be coated by the shell, the insulating tape is attached to the inner part of the insulating tape, and at least an insulating sheet, a circuit board and an electronic element are arranged from bottom to top;
the shell is arranged outside the radiator, and when the radiator is assembled, the shell covers the radiator;
the insulation sheet is arranged above the U-shaped frame, and the circuit board is prevented from being electrically conducted to the U-shaped frame;
the circuit board is arranged in the radiator and above the insulating sheet, and is used for connecting the electronic elements in a plug-in mode and providing circuit connection of the electronic elements;
the electronic element is connected with the circuit board and comprises an active element and a passive element, wherein the active element is arranged below the circuit board in a plug-in mode, and the passive element is arranged above the circuit board in the same or higher efficacy in the plug-in mode;
the heat dissipation glue is arranged in the radiator and can be used for being coated above the electronic element, below the circuit board and on two sides of the radiator to enable the electronic element to be jointed to the radiator and enable the circuit board and the insulating sheet to be jointed and fixed on the radiator, so that the heat dissipation performance is improved;
furthermore, the radiator is made of metal.
Further, the radiator is made of plastic materials.
An improved device capable of minimizing the volume of a power module comprises a radiator, an insulating sheet, a circuit board, an electronic element and radiating glue;
the radiator comprises a U-shaped frame and a reverse-U-shaped frame which can be jointed to form a square frame;
the insulation sheet is arranged above the U-shaped frame and used for preventing the circuit board from conducting electricity to the U-shaped frame, an insulation adhesive tape is attached to the interior of the insulation sheet, and at least the insulation sheet, the circuit board and the electronic element are arranged from bottom to top;
the circuit board is arranged in the radiator and above the insulating sheet, and is used for connecting the electronic elements in a plug-in mode and providing circuit connection of the electronic elements;
the electronic element is connected with the circuit board and comprises an active element and a passive element, wherein the active element is arranged below the circuit board in a plug-in mode, and the passive element is arranged above the circuit board in the plug-in mode in the same effect or higher effect;
the heat dissipation glue is arranged in the radiator, can be used for being smeared above the electronic element, below the circuit board and on two sides of the radiator, is used for enabling the electronic element to be jointed to the radiator, and enables the insulating sheet, the circuit board and the electronic element to be jointed and fixed on the radiator.
Furthermore, the radiator is made of metal.
Further, the radiator is made of plastic.
An improved device capable of minimizing the volume of a power module comprises a radiator, an insulating sheet, a circuit board, an electronic element and radiating glue;
the radiator is a U-shaped frame, an insulating tape is pasted in the radiator, and at least an insulating sheet, a circuit board and an electronic element are arranged above the radiator from bottom to top;
the insulation sheet is arranged above the U-shaped frame and used for preventing the circuit board from being conducted to the U-shaped frame;
the circuit board is arranged above the U-shaped frame and the insulating sheet and used for connecting the electronic elements in a plug-in mode and providing circuit connection of the electronic elements;
the electronic element is connected with the circuit board and comprises an active element and a passive element, wherein the active element is arranged below the circuit board in a plug-in mode, and the passive element is arranged above the circuit board in the plug-in mode in the same effect or higher effect;
the heat dissipation glue is arranged in the radiator, smeared above the electronic element, below the circuit board and on two sides of the radiator, and used for enabling the electronic element to be jointed to the radiator and enabling the insulating sheet, the circuit board and the electronic element to be jointed and fixed on the radiator.
Furthermore, the radiator is made of metal.
Furthermore, the radiator is made of plastic.
In view of the above, in with function or better function, the utility model discloses accomplish the equipment with the volume of miniaturation and form power module to there is good radiating efficiency.
To sum up, the utility model discloses utilize the rearrangement of electronic component to and reduce the volume of passive component and accomplish the utility model discloses an equipment can reach the improvement structure of the miniaturation of reduction in production cost and power module volume borrow this.
Drawings
FIG. 1: the present invention is an exploded view of the first preferred embodiment.
FIG. 2: the front view of the first preferred embodiment of the present invention is schematically illustrated.
FIG. 3: the first preferred embodiment of the present invention is schematically illustrated in a top view.
FIG. 4: the explosion diagram of the second preferred embodiment of the present invention.
FIG. 5: the explosion diagram of the third preferred embodiment of the present invention.
FIG. 6: the utility model discloses a U style of calligraphy frame sketch map.
FIG. 7 is a schematic view of: the utility model discloses a U style of calligraphy frame schematic diagram.
Wherein:
1-improved device capable of minimizing the volume of power module
11-heat sink
110-U shaped frame
111-inverted-U shaped frame
112-insulating tape
12-outer cover
13-insulating sheet
14-Circuit Board
15-electronic component
150-active element
151-passive element
16-Heat-dissipating glue
A-safe insulation distance
The specific implementation mode is as follows:
in order to make the objects, functions, features and structures of the present invention more comprehensible, preferred embodiments accompanied with figures are described below.
First preferred embodiment
Referring to fig. 1 and 2, fig. 1 is an exploded view of a first preferred embodiment of the present invention, and fig. 2 is a front view of the first preferred embodiment of the present invention.
As shown in fig. 1 and 2, an improved apparatus 1 for minimizing the volume of a power module comprises a heat sink 11, a housing 12, an insulating sheet 13, a circuit board 14, an electronic component 15 and a heat dissipation adhesive 16;
the heat sink 11 includes a U-shaped frame 110 and a n-shaped frame 111, which can be joined to form a square frame, the outer portion of which can be covered by the housing 12, and the inner portion of which is adhered with an insulating tape 112, and at least an insulating sheet 13, a circuit board 14 and an electronic component 15 are arranged from bottom to top;
the shell 12 is arranged outside the radiator 11, and when the radiator 11 is assembled, the shell 12 completely covers the radiator 11;
the insulation sheet 13 is arranged above the U-shaped frame 110, so that the circuit board 14 is prevented from being conducted to the U-shaped frame;
the circuit board 14 is disposed inside the heat sink 11 and above the insulating sheet 13, and is used for connecting the electronic components 15 in a plug-in manner and providing circuit connection of the electronic components 15;
the electronic component 15 is connected to the circuit board 14, and includes an active component 150 and a passive component 151, the active component 150 is disposed under the circuit board 14 in a plug-in manner, and the passive component 151 is disposed above the circuit board 14 in a plug-in manner in the same or higher efficiency;
the heat dissipation glue 16 is arranged in the heat radiator 11, is coated above the electronic element 15, below the circuit board 14 and on two sides of the heat radiator 11, can enable the electronic element 15 to be jointed to the heat radiator 11, and enables the insulating sheet 13, the circuit board 14 and the electronic element 15 to be jointed and fixed on the heat radiator 11, thereby improving the heat dissipation performance;
in view of the above, in the same function or better function, accomplish the equipment with the volume of minimumization and form power module to there is good radiating efficiency, promptly the utility model discloses the improvement device 1 that can be with power module volume minimumization of first preferred embodiment.
Referring to fig. 2 and 3, fig. 1 is a comparison view, fig. 2 is a front view of a first preferred embodiment of the present invention, and fig. 3 is a top view of the first preferred embodiment of the present invention; fig. 2 and fig. 3 illustrate the first preferred embodiment, and may also be applied to the second preferred embodiment and the third preferred embodiment.
As shown in fig. 2 and 3, the safety insulation distance a is provided above and beside the utility model, and the setting thereof conforms to the safety regulations of information/medical treatment/household appliances, so that the insulation sheet 13 required to be provided above and beside the utility model can be replaced by the safety insulation distance a to achieve the equivalent insulation effect, so that the utility model can only arrange the insulation sheet 13 on the U-shaped frame 110, thereby conforming to the insulation effect of the safety regulations and reducing the arrangement of the insulation sheet 13 at the same time;
furthermore, the insulating sheet 13 can be further disposed in the shape of the insulating sheet 13 according to the position of the active element 150 under the condition of stopping the electrical conduction, so as to cooperate the active element 150 to be connected with the U-shaped frame 110, thereby improving the thermal conductivity of the present invention.
The heat dissipation glue 16 can be applied on the top of the electronic component 15 and on both sides of the inside of the heat sink 11, and the applied thickness at least fills up the safe insulation distance a, so that when the U-shaped frame 110 and the U-shaped frame 111 are joined by the heat dissipation glue 16, the almost complete sealing effect can be achieved by the connection of the heat dissipation glue 16.
Second preferred embodiment
Referring to fig. 4 and fig. 2, fig. 4 is an exploded view of a second preferred embodiment of the present invention.
As shown in fig. 4, the improved apparatus 1 of the present invention, which can minimize the volume of the power module, includes a heat sink 11, an insulating sheet 13, a circuit board 14, an electronic component 15 and a heat dissipation glue 16;
the heat sink 11 includes a U-shaped frame 110 and a n-shaped frame 111, which can be joined to form a square frame, and an insulating tape 112 is attached to the inside of the frame, and at least an insulating sheet 13, a circuit board 14 and an electronic component 15 are arranged from bottom to top;
the insulation sheet 13 is arranged above the U-shaped frame 110, so that the circuit board 14 is prevented from being electrically conducted to the U-shaped frame 110;
the circuit board 14 is arranged inside the heat sink 11 and above the insulating sheet 13, and is used for connecting the electronic components 15 in a plug-in manner and providing circuit connection of the electronic components 15;
the electronic component 15 is connected to the circuit board 14 and includes an active component 150 and a passive component 151, wherein the active component 150 is disposed under the circuit board 14 in a plug-in manner, and the passive component 151 is disposed above the circuit board 14 in a plug-in manner in the same or higher efficiency;
the heat dissipation glue 16 is arranged in the heat radiator 11, is coated above the electronic element 15, below the circuit board 14 and on two sides of the heat radiator 11, can enable the electronic element 15 to be jointed to the heat radiator 11, and enables the insulating sheet 13, the circuit board 14 and the electronic element 15 to be jointed and fixed on the heat radiator 11, thereby improving the heat dissipation performance;
in view of the above, in the same function or better function, accomplish the equipment with the volume of minimumization and form power module to there is good radiating efficiency, promptly the utility model discloses the improvement device 1 that can be with power module volume minimumization of second preferred embodiment.
Third preferred embodiment
Referring to fig. 5 and fig. 2, fig. 5 is an exploded view of a third preferred embodiment of the present invention.
As shown in fig. 5, the improved apparatus 1 of the present invention, which can minimize the volume of the power module, includes a heat sink 11, an insulating sheet 13, a circuit board 14, an electronic component 15 and a heat dissipation glue 16;
the radiator 11 is a U-shaped frame 110, an insulating tape 112 is attached to the upper part of the U-shaped frame, and at least an insulating sheet 13, a circuit board 14 and an electronic element 15 are arranged from bottom to top;
the insulation sheet 13 is arranged above the U-shaped frame 110, so that the circuit board 14 is prevented from being electrically conducted to the U-shaped frame 110;
the circuit board 14 is disposed above the U-shaped frame 110 and the insulating sheet 13, and is used for connecting the electronic components 15 in a plug-in manner and providing circuit connection of the electronic components 15;
the electronic component 15 is connected to the circuit board 14 and includes an active component 150 and a passive component 151, wherein the active component 150 is disposed under the circuit board 14 in a plug-in manner, and the passive component 151 is disposed above the circuit board 14 in a plug-in manner in the same or higher efficiency;
the heat dissipation glue 16 is arranged in the heat sink 11, and can be used for being coated above the electronic element 15, below the circuit board 14 and on two sides of the heat sink 11, so that the electronic element 15 can be jointed to the heat sink 11, and the insulating sheet 13, the circuit board 14 and the electronic element 15 are jointed and fixed on the heat sink 11, thereby improving the heat dissipation performance;
in view of the above, in the same function or better function, accomplish the equipment with the volume of minimization and form power module to there is good heat dissipation efficiency, promptly the utility model discloses the improvement device 1 that can minimize power module volume of third preferred embodiment.
Please refer to fig. 6 and 7 in conjunction with fig. 1, fig. 6 is a schematic view of a U-shaped frame of the present invention, and fig. 7 is a schematic view of a U-shaped frame of the present invention (wherein fig. 6 and 7 are illustrated by way of example of the first preferred embodiment, and can also be applied to the second preferred embodiment and the third preferred embodiment).
As shown in fig. 6 and 7, the insulating tape 112 can be attached to each surface of the inside of the U-shaped frame 111 and also attached to the top of the U-shaped frame 110.
Referring to fig. 1, 4 and 5 again, fig. 1 is an explosion diagram of a first preferred embodiment of the present invention, fig. 4 is an explosion diagram of a second preferred embodiment of the present invention, and fig. 5 is an explosion diagram of a third preferred embodiment of the present invention.
Continuing from the foregoing, in the first preferred embodiment, the second preferred embodiment and the third preferred embodiment of the present invention, the heat sink 11 is made of metal material, which can enhance the heat conduction of the power module, thereby improving the heat resistance of the present invention during operation and reducing the possibility of the user crashing down during use;
similarly, the heat sink 11 may be made of plastic, and the plastic with thermal conductivity may dissipate heat and prevent the possibility of electrical conduction, thereby reducing the number of the insulating sheets 13, reducing the production cost, and reducing the generation of heat accumulation.
The insulating sheet 13 may be cut into different shapes according to the position of the active element 150, so that when the circuit board 14 is joined to the U-shaped frame 110, the active element 150 may be further attached to the heat sink 11, and the joint between the active element 150 and the heat sink 11 may be further attached by applying the heat dissipation adhesive 16, thereby improving the heat dissipation performance and reducing the heat accumulation inside the heat sink 11.
The utility model discloses a can lie in with power module volume miniaturation's improvement device's advantage:
1. the placing mode of the electronic element is modified, so that the volume of the power supply module is reduced: the active element is arranged on the lower layer of the circuit board, the passive element is arranged on the upper layer of the circuit board, the volume of the circuit board can be reduced, the sizes of the radiator and the shell can be synchronously modified, and the production cost is reduced.
2. Modifying the volume of the passive element: the conversion rate of the passive element is improved, so that the volume of the passive element can be reduced in the same effect or better effect, and the volume reduction of the circuit board, the radiator and the shell is influenced simultaneously, so that the volume minimization is achieved.
3. The heat dissipation performance is improved: the utility model discloses carry out the volume improvement of structure, outside reduction in production cost, more improve the thermal diffusivity, borrow this to optimize efficiency.
However, the above technical solutions are only preferred embodiments of the present invention, and all the modifications of the equivalent structures to which the present invention is applied in the specification and the claims of the present invention should be construed as being included in the claims of the present invention.
Claims (9)
1. An improved device capable of minimizing the volume of a power module is characterized by comprising a radiator, a shell, an insulating sheet, a circuit board, an electronic element and radiating glue;
the heat radiator comprises a U-shaped frame and a reversed U-shaped frame, and the U-shaped frame and the reversed U-shaped frame are jointed to form a square frame; the square frame is coated by the shell, the square frame is internally attached with an insulating tape, and at least an insulating sheet, a circuit board and an electronic element are arranged from bottom to top;
the shell is arranged outside the radiator and covers the radiator by applying the shell;
the insulation sheet is arranged above the U-shaped frame and used for preventing the circuit board from conducting electricity to the U-shaped frame;
the circuit board is arranged in the radiator and above the insulating sheet, and is used for connecting the electronic elements in a plug-in mode and providing circuit connection of the electronic elements;
the electronic element is connected with the circuit board and comprises an active element and a passive element, wherein the active element is arranged below the circuit board in a plug-in mode, and the passive element is arranged above the circuit board in the plug-in mode in the same effect or higher effect;
the heat dissipation glue is arranged in the radiator, smeared above the electronic element, below the circuit board and on two sides of the radiator, and used for enabling the electronic element to be jointed to the radiator and enabling the insulating sheet, the circuit board and the electronic element to be jointed and fixed on the radiator.
2. The improved apparatus for minimizing the size of a power module as defined in claim 1, wherein said heat sink is made of metal.
3. The improved apparatus of claim 1, wherein the heat sink is made of plastic.
4. An improved device capable of minimizing the volume of a power module is characterized by comprising a radiator, an insulating sheet, a circuit board, an electronic element and radiating glue;
the radiator comprises a U-shaped frame and a reverse-U-shaped frame which can be jointed to form a square frame;
the insulating sheet is arranged above the U-shaped frame and used for preventing the circuit board from conducting electricity to the U-shaped frame, an insulating tape is attached to the inside of the insulating sheet, and at least one insulating sheet, one circuit board and at least one electronic element are arranged from bottom to top;
the circuit board is arranged in the radiator and above the insulating sheet, and is used for connecting the electronic elements in a plug-in mode and providing circuit connection of the electronic elements;
the electronic element is connected with the circuit board and comprises an active element and a passive element, wherein the active element is arranged below the circuit board in a plug-in mode, and the passive element is arranged above the circuit board in the same or higher efficacy in the plug-in mode;
the heat dissipation glue is arranged in the radiator, can be used for being smeared above the electronic element, below the circuit board and on two sides of the radiator, is used for enabling the electronic element to be jointed to the radiator, and enables the insulating sheet, the circuit board and the electronic element to be jointed and fixed on the radiator.
5. The improved apparatus for minimizing the size of a power module as defined in claim 4, wherein said heat sink is made of metal.
6. The improved apparatus of claim 4, wherein the heat sink is made of plastic.
7. An improved device capable of minimizing the volume of a power module is characterized by comprising a radiator, an insulating sheet, a circuit board, an electronic element and radiating glue;
the radiator is a U-shaped frame, an insulating tape is pasted in the radiator, and at least an insulating sheet, a circuit board and an electronic element are arranged above the radiator from bottom to top;
the insulation sheet is arranged above the U-shaped frame and used for preventing the circuit board from conducting electricity to the U-shaped frame;
the circuit board is arranged above the U-shaped frame and the insulating sheet and used for connecting the electronic elements in a plug-in mode and providing circuit connection of the electronic elements;
the electronic element is connected with the circuit board and comprises an active element and a passive element, wherein the active element is arranged below the circuit board in a plug-in mode, and the passive element is arranged above the circuit board in the same or higher efficacy in the plug-in mode;
the heat dissipation glue is arranged in the radiator, smeared above the electronic element, below the circuit board and on two sides of the radiator and used for enabling the electronic element to be jointed to the radiator and enabling the insulation sheet, the circuit board and the electronic element to be jointed and fixed on the radiator.
8. The improved apparatus for minimizing the size of a power module as recited in claim 7, wherein the heat sink is made of metal.
9. The improved apparatus for minimizing the size of a power module as recited in claim 7, wherein the heat sink is made of plastic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220751701.9U CN217563895U (en) | 2022-04-02 | 2022-04-02 | Improved device capable of minimizing power module volume |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220751701.9U CN217563895U (en) | 2022-04-02 | 2022-04-02 | Improved device capable of minimizing power module volume |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217563895U true CN217563895U (en) | 2022-10-11 |
Family
ID=83469781
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220751701.9U Active CN217563895U (en) | 2022-04-02 | 2022-04-02 | Improved device capable of minimizing power module volume |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217563895U (en) |
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2022
- 2022-04-02 CN CN202220751701.9U patent/CN217563895U/en active Active
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