TWM631018U - An improved device miniaturizing volume of power module - Google Patents

Abstract

The present invention relates to an improved device miniaturizing the volume of the power module, comprising a heat dissipation device, an outer case, an insulating piece, a circuit board, an electronic component, and a heat dissipation adhesive. The interior of the heat dissipation device is covered with insulating tape and is installed with the insulating piece, the circuit board, and the electronic component in sequence from the bottom up therewithin. During the re-assembling process, a dissipation adhesive is applied and spread on the interior of the heat dissipation device, so that every component is linked to one another and is connected to the heat dissipation device to deliver heat dissipation. The outer case is located in the outer area of the heat dissipation device and completely covers the heat dissipation device. The advantages of the present invention are a volume reduction of the electronic component while maintaining the same efficacy or better efficacy and, simultaneously, a volume reduction of the circuit board, the insulating piece, the heat dissipation device, and the outer case respectively.

Description

An improved device that can actively miniaturize the power module body

This creation is related to the design of the related field of the power module, more specifically, it refers to an improved device that can actively miniaturize the power module body.

In the design process of conventional power modules, the active components are often attached to the heat sink and the passive components are covered with insulating sheets, and the plug-ins are connected to the circuit board on the same side to form the circuit, and then the insulating sheet is used to cover the entire circuit board. After the circuit board is prevented from conducting electricity, the radiator is used to cover the whole, and finally a layer of shell is applied to cover the radiator.

However, the known technology has the following deficiencies:

1. The volume is too large and the production cost is high: Inserting active components and passive components into the same side of the circuit board will require a lot of space for the assembly of electronic components. When the volume of the circuit board is larger, the required heat dissipation The installation space of the device and the housing also needs to be enlarged, so a large amount of raw materials are required for production, resulting in high production costs.

2. Passive components are bulky: passive components need to store a lot of energy and the conversion rate is not good, so they need a huge volume for application, which requires a lot of space for placement, which directly affects the subsequent radiator and shell processing. space, so far the production cost is also high.

3. It is not easy to conduct heat: In the conventional technology, an insulating sheet is used to cover the circuit board as a whole to prevent the possibility of conducting electricity, but it will also affect the circuit board's inability to dissipate heat, so internal heat will be generated.

In view of this, I have conducted in-depth discussions on the aforementioned deficiencies based on my years of experience in research and development in related fields, and actively sought solutions based on the aforementioned needs. After a long period of hard research and multiple tests, I finally completed this creation.

The main purpose of this creation is to modify the arrangement design of the electronic component plug-in on the circuit board, thereby reducing the volume after assembly, which can reduce the volume of the circuit board, heat sink and casing at the same time, so as to reduce the production cost.

The main purpose of this creation is to reduce the volume of passive components in the same performance or better performance, which can reduce the volume of the circuit board, heat sink and casing at the same time, thereby reducing the production cost.

Another purpose of this creation is to eliminate the possibility of conducting electricity, reduce the application of insulating sheets, and use heat-dissipating glue for bonding, so that this creation can improve heat dissipation and reduce the accumulated heat inside this creation.

In order to achieve the above-mentioned purpose, the present invention is an improved device that can actively miniaturize the power module body, including a radiator, a casing, an insulating sheet, a circuit board, an electronic component, and a heat-dissipating glue;

The radiator system includes a U-shaped frame and a u-shaped frame, the U-shaped frame and the u-shaped frame can be joined to form a square frame; the outside can be covered by a shell, and the interior is covered with insulation. Adhesive tape, and is provided with at least insulating sheets, circuit boards and electronic components from bottom to top;

The casing is arranged outside the radiator, and when the radiator is assembled, the casing is wrapped around the radiator;

The insulating sheet is arranged above the U-shaped frame to prevent the circuit board from conducting electricity to the U-shaped frame;

The circuit board is arranged inside the radiator and above the insulating sheet, which is used for connecting electronic components in the form of plug-ins and providing circuit connection of electronic components;

The electronic components are connected to the circuit board, and include active components and passive components. The above-mentioned active components are arranged under the circuit board in the form of plug-ins, and the above-mentioned passive components are in the same function or higher. The way is arranged above the circuit board;

The heat-dissipating glue is arranged inside the radiator and can be used to be applied above the electronic components, below the circuit board and on both sides of the radiator, so that the electronic components are bonded to the radiator, and the circuit board and the insulating sheet are bonded and fixed to the radiator. , thereby improving heat dissipation;

Accordingly, in the same function or better function, the power module is assembled with a minimal volume and has good heat dissipation performance, which is the original creation.

To sum up, this creation uses the rearrangement of electronic components and the reduction of the volume of passive components to complete the assembly of this creation, thereby achieving an improved structure that reduces production costs and minimizes the size of the power module.

In order to have a more detailed understanding of the purpose, function, features and structure of this creation, preferred embodiments are given and described in conjunction with the drawings as follows.

Please refer to FIGS. 1 and 2. FIG. 1 is an exploded schematic diagram of the first preferred embodiment of the creation, and FIG. 2 is a schematic front view of the first preferred embodiment of the creation.

As shown in Figures 1 and 2, the first preferred embodiment of the improved device 1 that can actively miniaturize the power module body of the present invention includes a heat sink 11, a casing 12, an insulating sheet 13, a circuit board 14, an electronic component 15 and heat dissipation glue 16;

The radiator 11 includes a U-shaped frame 110 and a U-shaped frame 111, which can be joined to form a square frame, the outer part of which can be covered by the outer shell 12, and the inner part is covered with insulating tape 112, and can be formed from the bottom. At least an insulating sheet 13, a circuit board 14 and an electronic component 15 are provided on the top;

The casing 12 is disposed outside the radiator 11, and when the radiator 11 is assembled, the casing 12 completely covers the radiator 11;

The insulating sheet 13 is arranged above the U-shaped frame 110 to prevent the circuit board 14 from conducting electricity to the U-shaped frame;

The circuit board 14 is arranged inside the heat sink 11 and above the insulating sheet 13, which is used to connect the electronic components 15 in the form of plug-ins, and provide the circuit connection of the electronic components 15;

The electronic component 15 is connected to the circuit board 14, and includes an active component 150 and a passive component 151. The aforementioned active component 150 is arranged under the circuit board 14 in the form of a plug-in, and the aforementioned passive component 151 has the same efficacy or higher. In the effect of , it is arranged above the circuit board 14 in the form of a plug-in;

The heat-dissipating glue 16 is arranged inside the heat sink 11 and can be applied to the top of the electronic component 15 , below the circuit board 14 and both sides of the heat sink 11 , so that the electronic component 15 can be bonded to the heat sink 11 and the insulating sheet 13 can be applied. , the circuit board 14 and the electronic components 15 are joined and fixed to the radiator 11, thereby improving the heat dissipation;

Accordingly, in the same function or a better function, the power module is assembled with a minimal volume, and has good heat dissipation performance, that is, the first preferred embodiment of the present invention can make the power module body active. Miniaturized Improved Device 1.

Please refer to FIGS. 2 and 3 compared with FIG. 1. FIG. 2 is a schematic front view of the first preferred embodiment of the creation, and FIG. 3 is a schematic top view of the first preferred embodiment of the creation. A preferred embodiment is illustrated as an example, and is also applicable to the second preferred embodiment and the third preferred embodiment.

As shown in Figures 2 and 3, there is a safety insulation distance A above and beside this creation, and its setting is in line with the safety regulations of information/medical/home appliances, so the above and the side of this creation can be replaced by this safety insulation distance A. The insulating sheet 13 needs to be installed to achieve the same insulating effect, so this creation can only set the insulating sheet 13 on the U-shaped frame 110, so as to meet the insulating effect of safety regulations and also reduce the setting of the insulating sheet 13;

Furthermore, under the condition that the insulating sheet 13 prevents conduction, the shape of the insulating sheet 13 can be improved according to the placement position of the active element 150 to match the connection between the active element 150 and the U-shaped frame 110 , thereby Improve the thermal conductivity of this creation.

The heat-dissipating glue 16 can be applied on the top of the electronic components 15 and on both sides of the inside of the heat sink 11 , and the applied thickness is at least more than the safety insulation distance A, so that the U-shaped frame 110 and the U-shaped frame 111 can pass through. When the heat-dissipating adhesive 16 is joined, the heat-dissipating adhesive 16 can be connected to achieve an almost complete sealing effect.

Please refer to FIG. 4 and FIG. 2 . FIG. 4 is an exploded schematic diagram of the second preferred embodiment of the creation.

As shown in FIG. 4 , the second preferred embodiment of the improved device 1 that can actively miniaturize the power module body of the present invention includes a heat sink 11 , an insulating sheet 13 , a circuit board 14 , an electronic component 15 and a heat-dissipating glue 16;

The heat sink 11 includes a U-shaped frame 110 and a U-shaped frame 111, which can be joined to form a square frame, an insulating tape 112 is attached to the inside of the frame, and at least an insulating sheet 13 and a circuit are provided from bottom to top. board 14 and electronic components 15;

The insulating sheet 13 is disposed above the U-shaped frame 110 to prevent the circuit board 14 from conducting electricity to the U-shaped frame 110;

The circuit board 14 is arranged inside the heat sink 11 and above the insulating sheet 13, which is used to connect the electronic components 15 in the form of plug-ins, and provide the circuit connection of the electronic components 15;

The electronic component 15 is connected to the circuit board 14, and includes an active component 150 and a passive component 151. The aforementioned active component 150 is arranged under the circuit board 14 in the form of a plug-in, and the aforementioned passive component 151 has the same efficacy or higher. In the effect of , it is arranged above the circuit board 14 in the form of a plug-in;

The heat-dissipating glue 16 is arranged inside the heat sink 11 and can be applied to the top of the electronic component 15 , below the circuit board 14 and both sides of the heat sink 11 , so that the electronic component 15 can be bonded to the heat sink 11 and the insulating sheet 13 can be applied. , the circuit board 14 and the electronic components 15 are joined and fixed to the radiator 11, thereby improving the heat dissipation;

Accordingly, in the same function or a better function, the power module is assembled with a minimal volume, and has good heat dissipation performance, which is the second preferred embodiment of the present invention. The power module body can be positively Miniaturized Improved Device 1.

Please refer to FIG. 5 and FIG. 2 . FIG. 5 is an exploded schematic diagram of the third preferred embodiment of the creation.

As shown in FIG. 5 , the third preferred embodiment of the improved device 1 capable of actively miniaturizing the power module body of the present invention includes a heat sink 11 , an insulating sheet 13 , a circuit board 14 , an electronic component 15 and a heat-dissipating glue 16;

The radiator 11 is a U-shaped frame 110 with an insulating tape 112 attached thereon, and at least an insulating sheet 13, a circuit board 14 and an electronic component 15 are provided from bottom to top;

The insulating sheet 13 is disposed above the U-shaped frame 110 to prevent the circuit board 14 from conducting electricity to the U-shaped frame 110;

The circuit board 14 is arranged above the U-shaped frame 110 and the insulating sheet 13, which is used to connect the electronic components 15 in a plug-in manner, and to provide circuit connection of the electronic components 15;

The electronic component 15 is connected to the circuit board 14, and includes an active component 150 and a passive component 151. The aforementioned active component 150 is arranged under the circuit board 14 in the form of a plug-in, and the aforementioned passive component 151 has the same efficacy or higher. In the effect of , it is arranged above the circuit board 14 in the form of a plug-in;

The heat-dissipating glue 16 is arranged inside the heat sink 11 and can be applied to the top of the electronic component 15 , below the circuit board 14 and both sides of the heat sink 11 , so that the electronic component 15 can be bonded to the heat sink 11 and the insulating sheet 13 can be applied. , the circuit board 14 and the electronic components 15 are joined and fixed to the radiator 11, thereby improving heat dissipation;

Accordingly, in the same function or a better function, the power module is assembled with a minimal volume, and has good heat dissipation performance, which is the third preferred embodiment of the present invention. The power module body can be positively Miniaturized Improved Device 1.

Please refer to FIGS. 6 and 7 in comparison with FIG. 1 , FIG. 6 is a schematic diagram of a U-shaped frame created by the creation, and FIG. 7 is a schematic diagram of a U-shaped frame created by the creation (wherein, FIG. 6 and FIG. For example, it can also be applied to the second preferred embodiment and the third preferred embodiment).

As shown in FIGS. 6 and 7 , the insulating tape 112 can be attached to each side inside the U-shaped frame 111 , and at the same time attached to the top of the U-shaped frame 110 .

Please refer to FIGS. 1 , 4 and 5 again. FIG. 1 is a schematic diagram of the explosion of the first preferred embodiment of the creation, FIG. 4 is a schematic diagram of the explosion of the second preferred embodiment of the creation, and FIG. 5 is the third preferred embodiment of the creation. Example of an explosion diagram.

Continuing from the above, in the first preferred embodiment, the second preferred embodiment and the third preferred embodiment of the present invention, the heat sink 11 is made of metal material, and the heat conduction of the power module can be enhanced through the metal material, thereby improving the performance of the present invention. Heat resistance when operable, reducing the possibility of users crashing during use;

Similarly, the heat sink 11 can also be made of plastic material, and the plastic with thermal conductivity can be used to dissipate heat and prevent the possibility of conducting electricity, thereby reducing the installation of insulating sheets 13, reducing the production cost and reducing the generation of accumulated heat .

Wherein, the aforementioned insulating sheet 13 can be cut in different shapes according to the position where the active element 150 is placed, so that when the circuit board 14 is joined to the U-shaped frame 110 , the active element 150 can be more closely attached to the heat sink 11 , and the active element 150 The joint with the heat sink 11 can also be attached by applying heat dissipation glue 16 , thereby improving the heat dissipation and reducing the accumulated heat inside the heat sink 11 .

The advantages of this improved device that can actively minimize the power module body are:

1. Modify the placement of electronic components to reduce the volume of the power module: the active components are placed on the lower layer of the circuit board, and the passive components are placed on the upper layer of the circuit board, which can reduce the size of the circuit board and modify the heat sink synchronously And the size of the shell to reduce production costs.

2. Modify the volume of passive components: by increasing the conversion rate of passive components, you can reduce the volume of passive components in the same or better performance, thereby affecting the volume reduction of circuit boards, heat sinks, and enclosures at the same time. Body is reduced.

3. Improve heat dissipation in compliance with the safety regulations of the Bureau of Standards and Inspection of the Ministry of Economic Affairs: This creation is in line with the safety regulations of the Bureau of Standards and Inspection of the Ministry of Economic Affairs. The volume of the structure is improved to reduce production costs and improve heat dissipation. This optimizes performance.

Therefore, this creation has excellent progress and practicability among similar products. At the same time, after searching domestic and foreign technical documents about such structures, it is true that no identical or similar structures exist before the application in this case. Therefore, this case The patent requirements of "novelty", "suitability for industrial utilization" and "progressiveness" should be met, and the application should be filed in accordance with the law.

However, the above are only the preferred embodiments of this creation, and any other equivalent structural changes made by applying the description of this creation and the scope of the patent application should be included in the scope of the patent application of this creation.

1: An improved device that can actively miniaturize the power module body 11: Radiator 110: U-shaped frame 111: ㄇ font frame 112: Insulation tape 12: Shell 13: Insulation sheet 14: circuit board 15: Electronic Components 150: Active Components 151: Passive Components 16: Thermal glue A: Safe insulation distance

Figure 1: Schematic diagram of the explosion of the first preferred embodiment of the present invention. Figure 2: A schematic front view of the first preferred embodiment of the present invention. Figure 3: A schematic top view of the first preferred embodiment of the present invention. Figure 4: A schematic diagram of the explosion of the second preferred embodiment of the present invention. Figure 5: A schematic diagram of the explosion of the third preferred embodiment of the present invention. Figure 6: Schematic diagram of the ㄇ-shaped frame of this creation. Figure 7: Schematic diagram of the U-shaped frame of this creation.

1: An improved device that can actively miniaturize the power module body

11: Radiator

110: U-shaped frame

111: ㄇ font frame

112: Insulation tape

12: Shell

13: Insulation sheet

14: circuit board

15: Electronic Components

151: Passive Components

16: Thermal glue

Claims (5)

An improved device capable of actively miniaturizing a power module body, comprising a radiator, a casing, an insulating sheet, a circuit board, an electronic component and a heat-dissipating glue; The radiator system includes a U-shaped frame and a u-shaped frame, the U-shaped frame and the u-shaped frame can be joined to form a square frame; the outside can be covered by a shell, and the interior is covered with insulation. Adhesive tape, and is provided with at least insulating sheets, circuit boards and electronic components from bottom to top; The casing is arranged outside the radiator, and the radiator is covered by the casing; The insulating sheet is arranged above the U-shaped frame to prevent the circuit board from conducting electricity to the U-shaped frame; The circuit board is arranged inside the radiator and above the insulating sheet, which is used for connecting electronic components in the form of plug-ins and providing circuit connection of electronic components; The electronic components are connected to the circuit board, and include active components and passive components. The above-mentioned active components are arranged under the circuit board in the form of plug-ins, and the above-mentioned passive components are in the same function or higher. The way is arranged above the circuit board; The heat-dissipating glue is arranged inside the radiator and can be used to be applied above the electronic components, below the circuit board and on both sides of the radiator, so as to bond the electronic components to the radiator, and to bond and fix the insulating sheet, the circuit board and the electronic components. on the radiator to improve heat dissipation. An improved device capable of actively miniaturizing a power module body, comprising a radiator, an insulating sheet, a circuit board, electronic components, and heat-dissipating glue; The radiator system includes a U-shaped frame and a U-shaped frame, which can be joined to form a square frame. The insulating sheet is arranged above the U-shaped frame to prevent the circuit board from conducting electricity to the U-shaped frame, an insulating tape is attached to the interior, and at least insulating sheets, circuit boards and electronic components are provided from bottom to top; The circuit board is arranged inside the radiator and above the insulating sheet, which is used for connecting electronic components in the form of plug-ins and providing circuit connection of electronic components; The electronic components are connected to the circuit board, and include active components and passive components. The above-mentioned active components are arranged under the circuit board in the form of plug-ins, and the above-mentioned passive components are in the same function or higher. The way is arranged above the circuit board; The heat-dissipating glue is arranged inside the radiator and can be used to be applied above the electronic components, below the circuit board and on both sides of the radiator, to bond the electronic components to the radiator, and to bond the insulating sheet, the circuit board and the electronic components It is fixed to the heat sink to improve heat dissipation. An improved device capable of actively miniaturizing a power module body, comprising a radiator, an insulating sheet, a circuit board, electronic components, and heat-dissipating glue; The radiator is a U-shaped frame, the interior of which can be affixed with insulating tape, and at least insulating sheets, circuit boards and electronic components are arranged above the radiator from bottom to top; The insulating sheet is arranged above the U-shaped frame to prevent the circuit board from conducting electricity to the U-shaped frame; The circuit board is arranged above the U-shaped frame and the insulating sheet, which is used for connecting electronic components in a plug-in manner and providing circuit connection of electronic components; The electronic components are connected to the circuit board, and include active components and passive components. The above-mentioned active components are arranged under the circuit board in the form of plug-ins, and the above-mentioned passive components are in the same function or higher. The way is arranged above the circuit board; The heat-dissipating glue is arranged inside the radiator and can be used to be applied above the electronic components, below the circuit board and on both sides of the radiator, so as to bond the electronic components to the radiator, and to bond and fix the insulating sheet, the circuit board and the electronic components. on the radiator to improve heat dissipation. As claimed in claim 1, 2 or 3, the improved device for actively miniaturizing the power module body, wherein the heat sink can be made of a metal material. As claimed in claim 1, 2 or 3, the improved device for actively miniaturizing the power module body, wherein the heat sink can be made of plastic material.

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