TWM631408U - Improved structure for maximizing heat dissipation of power module - Google Patents

Abstract

The present invention relates to an improved structure for maximizing heat dissipation of a power module, that is an innovative structure based on the space setting between the circuit board and the extruded frame, leading to a complete tightness in the space therebetween. In addition, a heat dissipation adhesive is filled in this enclosed space to increase the heat dissipation performance. Therefore, the present invention maximizes the heat dissipation performance, achieves a uniform heat dissipation, increases the operating temperature range of the product, and reduce the failure rate of the product.

Description

Improved structure applied to power modules to maximize heat dissipation

This creation is related to the design of the related field of the power module, more specifically, it refers to the improved structure applied to the power module to maximize the heat dissipation.

Based on years of experience in research and development in electrical related fields, the creator has been granted the Republic of China Patent No. I389629 "Framework of Power Supply Module"; in the prior art, the frame assembly of the power supply module is a structure used for external heat dissipation design.

However, with the advancement of technology, the demand for power supply of the power supply module is also increasing. Therefore, further heat dissipation is required to maintain good usability.

Therefore, in order to keep improving, the creator will develop a further innovative structure to maximize heat dissipation based on this patent.

In view of this, I have conducted in-depth discussions on the aforementioned deficiencies based on my years of R&D experience in related fields, and actively sought solutions based on the aforementioned needs.

, After a long time of hard research and many tests, I finally completed this creation.

The main purpose of this creation is the design of the partition structure, which can improve the heat dissipation of the circuit board and the extruded frame, and can evenly dissipate heat, so as to reduce the probability of failure.

The main purpose of this creation is to increase the heat dissipation of different sides of the circuit board, so that the overall heat dissipation can be improved accordingly, thereby improving the heat resistance.

Another purpose of this creation is to design the partition structure, so that this creation can meet the safety insulation distance of information/medical/home appliances, and improve the safety of product use.

In order to achieve the above-mentioned purpose, the first aspect of the improved structure applied in the present invention to maximize the heat dissipation of the power module includes a circuit board, an electronic component, an insulating sheet, an extruded frame and an L-shaped partition; The circuit board provides connection of different electronic components in the form of plug-ins, and provides circuit connection of each electronic component; the electronic components include active components and passive components, and the active components are provided in the form of plug-ins under the circuit board. , the passive components are arranged above the circuit board in the form of plug-ins, so that the electronic components can dissipate heat in different directions and improve the heat dissipation; the insulating sheet is arranged under the electronic components and the circuit board to prevent the conduction of the electronic components. The inner shape is cut according to the position where the active element is placed; the extruded frame is arranged under the insulating sheet, and after the circuit board, electronic components and the insulating sheet are joined, it is fixed on the top of the extruded frame; The thickness of the L-shaped separator is set according to the safety insulation distance and the distance between the extruded frame and the circuit board. When inserted into the circuit board and the extruded frame, it will be completely fitted so that the distance is completely Sealing, fill the heat-dissipating glue in this confined space to improve its heat dissipation.

Accordingly, the present invention maximizes the heat dissipation, and makes it evenly dissipated, thereby increasing the operating temperature of the product and reducing the probability of the product crashing.

In addition, the second aspect is provided with an insulating and heat-dissipating layer, which uses a different structural design and can achieve the same effect as the L-shaped separator of the first preferred embodiment.

In addition, the third aspect is a structural design that uses fewer components and is integrally formed, and has the same effect as the L-shaped separator of the first aspect and the insulating heat dissipation layer of the second aspect.

To sum up, this creation adopts the heat dissipation of different sides of electronic components, and uses L-shaped partitions or insulating heat dissipation layers to completely seal the circuit board and the extruded frame, and fill the heat dissipation glue in the sealing area. This method will maximize the heat dissipation and improve the performance of the product, and according to the structural design of the L-shaped partition, it has a safe insulation distance to improve the safety of the product.

1: An improved structure applied to the power module to maximize heat dissipation

11: circuit board

12: Electronic Components

120: Active Components

121: Passive Components

13: Insulation sheet

14: Insulation and heat dissipation layer

15: Extruded frame

150: bottom layer

151: Square frame

16L: type separator

Figure 1: Schematic diagram of the explosion of the first preferred embodiment of the present invention.

Figure 2: A-A' cross-sectional schematic diagram of the first preferred embodiment of the present invention.

Figure 3: A schematic diagram of the explosion of the second preferred embodiment of the present invention.

Figure 4: A schematic cross-sectional view of B-B' of the second preferred embodiment of the present invention.

Figure 5: A schematic diagram of the explosion of the third preferred embodiment of the present invention.

Figure 6: C-C' cross-sectional schematic diagram of the third preferred embodiment of the present invention.

In order to have a more detailed understanding of the purpose, function, features and structure of this creation, two preferred embodiments are given and described with the drawings as follows.

Please refer to Fig. 1, 2, Fig. 1 is the exploded schematic diagram of the first preferred embodiment of the creation, and Fig. 2 is the A-A' sectional schematic diagram of the creation of the first preferred embodiment. .

As shown in FIGS. 1 and 2 , the first preferred embodiment of the present invention is an improved structure 1 applied to a power module to maximize heat dissipation, which includes a circuit board 11 , an electronic component 12 , an insulating sheet 13 , an extruded frame 15 and an L type partition 16; the circuit board 11 provides the connection of different electronic components 12 in the form of plug-ins, and provides the circuit connection of each electronic component 12; the electronic components 12 include active components 120 and passive components 121. The components 120 are arranged under the circuit board 11 in the form of plug-ins, and the passive components 121 are arranged above the circuit board 11 in the form of plug-ins, so that the electronic components 12 can dissipate heat in different directions and improve heat dissipation; the insulating sheet 13 It is arranged below the electronic component 12 and the circuit board 11 to prevent the electrical conductivity of the electronic component 12, and its internal shape is cut according to the position where the active component 120 is placed; The extruded frame 15 is disposed under the insulating sheet 13, and is fixed above the extruded frame 15 after the circuit board 11, the electronic components 12 and the insulating sheet 13 are joined together; the aforementioned extruded frame 15 is made of metal material, wherein The aluminum material is preferred.

The thickness of the L-shaped partition 16 is set according to the safety insulation distance and the distance between the extruded frame 15 and the circuit board 11, and is inserted between the circuit board 11 and the extruded frame 15 so that the distance is completely Sealing, fill the heat-dissipating glue in this confined space to improve its heat dissipation.

Wherein, the L-shaped separator 16 can be made of plastic material, or can be made of other non-conductive and heat-dissipating materials for this structure design.

Accordingly, the present invention maximizes the heat dissipation, and makes it evenly dissipated, thereby increasing the operating temperature of the product and reducing the probability of the product crashing.

Please refer to FIGS. 3 and 4. FIG. 3 is a schematic exploded view of the second preferred embodiment of the creation, and FIG. 4 is a schematic cross-sectional view of the B-B' of the second preferred embodiment of the creation.

As shown in FIGS. 3 and 4 , an improved structure 1 for maximizing heat dissipation of a power module according to the second preferred embodiment of the present invention includes a circuit board 11 , an electronic component 12 , an insulating heat dissipation layer 14 and an extruded frame 15 ; The circuit board 11 provides connection of different electronic components 12 in the form of plug-ins, and provides circuit connection of each electronic component 12; the electronic components 12 include active components 120 and passive components 121. The active components 120 are plug-in The passive components 121 are arranged above the circuit board 11 in the form of plug-ins, so that the electronic components 12 can dissipate heat in different directions and improve heat dissipation; the insulating heat dissipation layer 14 is a square frame 151, its cross-section is L-shaped, and is arranged below the circuit board 11; the extruded frame 15 is to fix the circuit board 11, the electronic components 12 and the insulating heat dissipation layer 14 above it to form a protective layer of the shell; the aforementioned extrusion The frame 15 is made of metal, and aluminum is preferred.

The insulating heat-dissipating layer 14 may be made of plastic material, or may be other non-conductive and heat-dissipating materials for this structure design.

Accordingly, the insulating and heat-dissipating layer 14 completely closes the distance between the circuit board 11 and the extruded frame 15, and the enclosed space is filled with heat-dissipating glue to improve its heat-dissipation. Maximize heat dissipation.

Please refer to Fig. 2,4, Fig. 2 is the A-A ' cross-sectional schematic diagram of the creation of the first preferred embodiment, and Fig. 4 is the B-B ' cross-sectional schematic diagram of the creation of the second preferred embodiment.

As shown in FIGS. 2 and 4 , it can be seen from the figures that the structural design of the L-shaped separator 16 and the insulating heat dissipation layer 14 of the two preferred embodiments of the present invention is to make the distance between the circuit board 11 and the extruded frame 15 to be A closed space; the closed space can be filled with heat-dissipating glue, so that the active element 120 can improve heat dissipation and uniformly dissipate heat.

In addition, the structural design of the above-mentioned L-shaped separator 16 and the insulating heat dissipation layer 14 conforms to the safety regulations of information/medical/home appliances, so the safety in use can be improved.

Please refer to Figures 5 and 6, Figure 5 is a schematic diagram of an explosion of the third preferred embodiment of the creation, and Figure 6 is a schematic cross-sectional view of C-C' of the third preferred embodiment of the creation.

As shown in FIG. 5 , the present invention is applied to an improved structure 1 for maximizing heat dissipation of a power module, which includes a circuit board 11 , electronic components 12 and an extruded frame 15 ; the circuit board 11 provides different electronic components 12 for plugging in The electronic components 12 include active components 120 and passive components 121, and the active components 120 are connected by plug-ins. The passive components 121 are arranged above the circuit board 11 in the form of plug-ins, so that the electronic components 12 can dissipate heat in different directions and improve heat dissipation; the extrusion frame 15 is formed by the bottom layer 150. The bottom layer 150 and the square frame 151 are integrally formed, so after the circuit board 11 and the electronic components 12 are joined, they are fixed on the top of the extrusion frame 15, and the circuit board 11 and the extrusion The spacing of the frame 15 is set according to the safety insulation distance, and the interior of the frame 15 is completely sealed, and the heat dissipation glue is filled in the closed space to improve the heat dissipation.

The bottom layer 150 of the extruded frame 15 is made of metal material, which can be used for heat dissipation of the electronic components 12, and the square frame 151 of the extruded frame 15 is made of plastic material, which can be used for insulation and heat dissipation, and the two are integrally formed. , so its tightness is very high.

Accordingly, the present invention maximizes the heat dissipation, and makes it evenly dissipated, thereby increasing the operating temperature of the product and reducing the probability of the product crashing.

The advantages of this creation applied to the improved structure of the power module to maximize heat dissipation are:

1. Diverse heat dissipation directions: The electronic components are rearranged and designed to dissipate heat from the top, and the heat dissipation can be optimized so that both the top and the bottom can be dissipated to improve heat dissipation.

2. Improve heat dissipation and uniform heat dissipation: The innovative structures of the three embodiments are used to enable uniform heat dissipation under the circuit board and improve heat dissipation, thereby expanding the operating temperature range.

3. The designed creative structure complies with the safety regulations of the Bureau of Standards and Inspection of the Ministry of Economic Affairs: the innovative structure of the three embodiments, the L-shaped partition, the insulating heat dissipation layer and the integrally formed extruded frame can make the structure of this creation conform to the information/ Safety regulations for medical/home appliances, so the safety in use can be improved.

Therefore, this creation has excellent progress and practicability among similar products. At the same time, after searching domestic and foreign technical documents about such structures, it is true that no identical or similar structures exist before the application in this case. Therefore, this case The patent requirements for "creativeness", "suitability for industrial utilization" and "progressiveness" should be met, and the application should be filed in accordance with the law.

However, the above are only the preferred embodiments of this creation, and any other equivalent structural changes made by applying the description of this creation and the scope of the patent application should be included in the scope of the patent application of this creation.

1: An improved structure applied to the power module to maximize heat dissipation

11: circuit board

12: Electronic Components

121: Passive Components

13: Insulation sheet

15: Extruded frame

16: L-shaped partition

Claims (9)

An improved structure applied to a power module to maximize heat dissipation, comprising a circuit board, an electronic component, an insulating sheet, an extruded frame and an L-shaped partition; The circuit connection of various electronic components; the electronic components include active components and passive components, the active components are arranged under the circuit board in the form of plug-ins, and the passive components are arranged above the circuit board in the form of plug-ins, so that the electronic components are It can dissipate heat in different directions and improve heat dissipation; the insulating sheet is arranged under the electronic components and the circuit board to prevent the electrical conductivity of the electronic components, and its internal shape can be cut according to the position where the active components are placed; The extruded frame is arranged under the insulating sheet, and is fixed on the top of the extruded frame after bonding the circuit board, electronic components and the insulating sheet; the thickness of the L-shaped partition is based on the safety insulation distance and the extruded frame. The distance between the circuit board and the circuit board is set. When it is inserted into the circuit board and the extruded frame, it will be completely fitted to make the distance close, and the heat dissipation glue will be filled in this closed space to improve its heat dissipation. An improved structure applied to a power module to maximize heat dissipation, comprising a circuit board, an electronic component, an insulating heat dissipation layer and an extruded frame; The circuit board provides connection of different electronic components in the form of plug-ins, and provides circuit connection of each electronic component; the electronic components include active components and passive components, and the active components are provided in the form of plug-ins under the circuit board. , the passive components are arranged above the circuit board in the form of plug-ins, so that the electronic components can dissipate heat in different directions and improve the heat dissipation; the insulating heat dissipation layer is a square frame with an L-shaped cross section, and is arranged on the Below the circuit board; the extruded frame fixes the circuit board, the electronic components and the insulating and heat-dissipating layer above it to form a casing protection layer; accordingly, the insulating and heat-dissipating layer completely closes the distance between the circuit board and the extruded frame Combined, this confined space is filled with heat-dissipating glue to improve its heat-dissipation, and its uniform heat-dissipation enables this creation to maximize heat-dissipation. An improved structure applied to a power module for maximizing heat dissipation, comprising a circuit board, electronic components and an extruded frame; the circuit board provides connection of different electronic components in the form of plug-ins, and provides circuit connections for each electronic component; The electronic components include active components and passive components, the active components are arranged under the circuit board in the form of plug-ins, and the passive components are arranged above the circuit board in the form of plug-ins, so that the electronic components can dissipate heat in different directions, Improve heat dissipation; The extruded frame is formed by connecting the square frame above the bottom layer. The bottom layer and the square frame are integrally formed, so after the circuit board and the electronic components are joined, they are fixed on the top of the extrusion frame, and the circuit board and the extruded frame are formed. The spacing of the frame is set according to the safety insulation distance, and its interior is completely tight, and heat dissipation glue is filled in this closed space to improve its heat dissipation. The improved structure applied to the power module to maximize heat dissipation as described in claim 1, wherein the L-shaped partition can be made of plastic material. As claimed in claim 2, the improved structure applied to a power module to maximize heat dissipation, wherein the insulating heat dissipation layer can be made of plastic material. The improved structure for maximizing heat dissipation of a power module according to claim 3, wherein the bottom layer of the extruded frame is made of metal. The improved structure applied to the power module to maximize heat dissipation according to claim 3, wherein the square frame of the extruded frame is made of plastic material. According to the improved structure for maximizing heat dissipation of a power supply module according to claim 1 or 2, the extruded frame can be made of metal material. According to the improved structure for maximizing heat dissipation of a power module as described in claim 8, it is preferable that the extruded frame is made of aluminum material.

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