TWI814297B - An improved device miniaturizing volume of power module - Google Patents

Abstract

The present invention relates to an improved device miniaturizing the volume of the power module, comprising a heat dissipation device, an outer case, an insulating piece, a circuit board, an electronic component, and a heat dissipation adhesive. The interior of the heat dissipation device is covered with insulating tape and is installed with the insulating piece, the circuit board, and the electronic component in sequence from the bottom up therewithin. During the re-assembling process, a dissipation adhesive is applied and spread on the interior of the heat dissipation device, so that every component is linked to one another and is connected to the heat dissipation device to deliver heat dissipation. The outer case is located in the outer area of the heat dissipation device and completely covers the heat dissipation device. The advantages of the present invention are a volume reduction of the electronic component while maintaining the same efficacy or better efficacy and, simultaneously, a volume reduction of the circuit board, the insulating piece, the heat dissipation device, and the outer case respectively.

Description

An improved device that can actively reduce the size of the power supply module

The present invention relates to the design of power modules in related fields, and more specifically, to an improved device that can actively miniaturize the power module body.

In the design process of conventional power modules, the active components are often attached to the heat sink and the passive components are covered with insulating sheets. The plug-ins are placed on the same side of the circuit board to form circuit connections, and then the insulating sheets are used to cover the entire circuit board. After stopping the circuit board from conducting electricity, use a radiator to cover the whole thing, and finally apply a layer of shell to cover the radiator.

However, the conventional technology has the following deficiencies:

1. The volume is too large and the production cost is high: Inserting active components and passive components into the same side of the circuit board will require a large amount of space for the assembly of electronic components. When the volume of the circuit board becomes larger, the heat dissipation required will increase. The installation space of the device and the casing also needs to be expanded, so a large amount of raw materials are consumed for production, resulting in high production costs.

2. Passive components are bulky: Passive components need to store a large amount of energy and have low conversion rates, so they require a huge volume for application, which requires a lot of space for placement, which directly affects the subsequent processing of the radiator and housing. space, production costs have remained high.

3. Not easy to conduct heat: In conventional technology, an insulating sheet is used to completely cover the circuit board to eliminate the possibility of conduction. However, this also prevents the circuit board from dissipating heat, so heat accumulation occurs inside.

In view of this, I have conducted in-depth discussions on the above-mentioned deficiencies based on my many years of research and development experience in related fields, and actively sought solutions based on the above-mentioned needs. After a long period of hard research and multiple tests, I finally completed the present invention.

The main purpose of the present invention is to modify the arrangement design of electronic component plug-ins on the circuit board, thereby reducing the volume after assembly, thereby simultaneously reducing the volume of the circuit board, the radiator and the casing, thereby reducing production costs.

The secondary purpose of the present invention is to reduce the size of passive components with the same performance or better performance, which can simultaneously reduce the size of the circuit board, heat sink and housing, thereby reducing production costs.

Another object of the present invention is to eliminate the possibility of electrical conduction, reduce the use of insulating sheets, and use heat dissipation glue for joints, so that the present invention improves heat dissipation and reduces heat accumulation inside the present invention.

In order to achieve the above purpose, the present invention can actively minimize the power module body and improve the device, which includes a radiator, a casing, an insulating sheet, a circuit board, electronic components and a heat dissipation glue;

The radiator includes a U-shaped frame and a U-shaped frame. The U-shaped frame and the U-shaped frame can be joined to form a square frame; its exterior can be covered by a shell, and its interior can be insulated. Tape, and at least insulating sheets, circuit boards and electronic components are provided from bottom to top;

The casing is located outside the radiator. When the radiator is assembled, the casing covers the radiator;

The insulating sheet is placed above the U-shaped frame to prevent the circuit board from conducting electricity to the U-shaped frame;

The circuit board is located inside the radiator and above the insulating sheet, and is used to connect electronic components in the form of plug-ins and provide circuit connections for electronic components;

The electronic components are connected to the circuit board and include active components and passive components. The aforementioned active components are arranged under the circuit board in the form of plug-ins. The aforementioned passive components have the same efficiency or higher efficiency. arranged above the circuit board;

The heat dissipation glue is installed inside the radiator and can be applied above the electronic components, below the circuit board and on both sides of the radiator. It allows the electronic components to be joined to the radiator, and the circuit board and insulating sheet to be joined and fixed to the radiator. , thereby improving heat dissipation;

Accordingly, the present invention is to assemble and form a power module with the same function or better function in a minimized volume and with good heat dissipation performance.

In summary, the present invention utilizes the rearrangement of electronic components and reducing the size of passive components to complete the assembly of the present invention, thereby achieving an improved structure that reduces production costs and minimizes the size of the power module.

In order to provide a more detailed understanding of the purpose, effects, features and structure of the present invention, preferred embodiments are described below along with the drawings.

Please refer to Figures 1 and 2. Figure 1 is an explosion schematic diagram of the first preferred embodiment of the present invention, and Figure 2 is a front schematic diagram of the first preferred embodiment of the present invention.

As shown in Figures 1 and 2, the first preferred embodiment of the improved device 1 of the present invention that can actively miniaturize the power module body includes a heat sink 11, a casing 12, an insulating sheet 13, a circuit board 14, and an electronic circuit board. Component 15 and heat dissipation glue 16;

The radiator 11 includes a U-shaped frame 110 and a U-shaped frame 111, which can be joined to form a square frame, the outside of which can be covered by the shell 12, and the inside is adhered with an insulating tape 112, and from the bottom At least an insulating sheet 13, a circuit board 14 and an electronic component 15 are provided;

The casing 12 is provided outside the radiator 11. When the radiator 11 is assembled, the casing 12 completely covers the radiator 11;

The insulating sheet 13 is arranged above the U-shaped frame 110 to prevent the circuit board 14 from conducting electricity to the U-shaped frame;

The circuit board 14 is located inside the radiator 11 and above the insulating sheet 13, and is used to allow the electronic components 15 to be connected in a plug-in manner and to provide circuit connections for the electronic components 15;

The electronic component 15 is connected to the circuit board 14 and includes an active component 150 and a passive component 151. The active component 150 is arranged under the circuit board 14 in a plug-in manner, and the passive component 151 has the same efficiency or higher. Among the functions, they are arranged in a plug-in manner above the circuit board 14;

The heat dissipation glue 16 is located inside the radiator 11 and can be applied above the electronic components 15 , below the circuit board 14 and on both sides of the radiator 11 , so that the electronic components 15 can be joined to the radiator 11 and the insulation sheet 13 , the circuit board 14 and the electronic components 15 are joined and fixed to the heat sink 11, thereby improving the heat dissipation;

Accordingly, with the same function or better function, the power module can be assembled with a minimal volume and has good heat dissipation performance. This is the first preferred embodiment of the present invention that can actively integrate the power module body. Improved miniaturization device 1.

Please refer to Figures 2 and 3 compared with Figure 1. Figure 2 is a schematic front view of the first preferred embodiment of the present invention, and Figure 3 is a schematic top view of the first preferred embodiment of the present invention. Figures 2 and 3 are based on the first preferred embodiment of the present invention. A preferred embodiment is taken as an example and can also be applied to the second preferred embodiment and the third preferred embodiment.

As shown in Figures 2 and 3, there is a safe insulation distance A above and on the side of the present invention. The setting is in compliance with the safety regulations of information/medical/home appliances. Therefore, the safety insulation distance A can replace the top and side of the present invention. It is necessary to install more insulating sheets 13 to achieve the same insulation effect, so the present invention can only provide the insulating sheets 13 on the U-shaped frame 110, so as to meet the insulation effect of safety regulations and also reduce the installation of the insulating sheets 13;

Furthermore, under the condition that the insulating sheet 13 eliminates electrical conduction, the shape of the insulating sheet 13 can be improved according to the placement position of the active component 150 to cooperate with the connection between the active component 150 and the U-shaped frame 110, thereby Improve the thermal conductivity of the present invention.

Among them, the heat dissipation glue 16 can be applied above the electronic component 15 and on both sides of the inside of the heat sink 11. The thickness of the application can at least fill the safe insulation distance A, so that the U-shaped frame 110 and the U-shaped frame 111 can pass through. When the heat dissipation glue 16 is used for joining, the connection can be achieved through the heat dissipation glue 16 to achieve an almost complete sealing effect.

Please refer to Figure 4 and compare it with Figure 2. Figure 4 is an explosion schematic diagram of the second preferred embodiment of the present invention.

As shown in Figure 4, the second preferred embodiment of the improved device 1 of the present invention that can actively miniaturize the power module includes a heat sink 11, an insulating sheet 13, a circuit board 14, electronic components 15 and heat dissipation glue. 16;

The radiator 11 includes a U-shaped frame 110 and a U-shaped frame 111, which can be joined to form a square frame, with an insulating tape 112 attached inside, and at least an insulating sheet 13 and a circuit from bottom to top. Board 14 and electronic components 15;

The insulating sheet 13 is arranged above the U-shaped frame 110 to prevent the circuit board 14 from conducting electricity to the U-shaped frame 110;

The circuit board 14 is located inside the radiator 11 and above the insulating sheet 13, and is used to allow the electronic components 15 to be connected in a plug-in manner and to provide circuit connections for the electronic components 15;

The electronic component 15 is connected to the circuit board 14 and includes an active component 150 and a passive component 151. The active component 150 is arranged under the circuit board 14 in a plug-in manner, and the passive component 151 has the same efficiency or higher. Among the functions, they are arranged in a plug-in manner above the circuit board 14;

The heat dissipation glue 16 is located inside the radiator 11 and can be applied above the electronic components 15 , below the circuit board 14 and on both sides of the radiator 11 , so that the electronic components 15 can be joined to the radiator 11 and the insulation sheet 13 , the circuit board 14 and the electronic components 15 are joined and fixed to the heat sink 11, thereby improving the heat dissipation;

Accordingly, with the same function or better function, the power module can be assembled with a minimal volume and has good heat dissipation performance. This is the second preferred embodiment of the present invention that can actively integrate the power module body. Improved miniaturization device 1.

Please refer to Figure 5 and compare it with Figure 2. Figure 5 is an explosion schematic diagram of the third preferred embodiment of the present invention.

As shown in Figure 5, the third preferred embodiment of the improved device 1 of the present invention that can actively miniaturize the power module body includes a heat sink 11, an insulating sheet 13, a circuit board 14, electronic components 15 and heat dissipation glue. 16;

The heat sink 11 is a U-shaped frame 110, with an insulating tape 112 attached to the top, and at least an insulating sheet 13, a circuit board 14 and an electronic component 15 are provided from bottom to top;

The insulating sheet 13 is arranged above the U-shaped frame 110 to prevent the circuit board 14 from conducting electricity to the U-shaped frame 110;

The circuit board 14 is located above the U-shaped frame 110 and the insulating sheet 13, and is used to connect the electronic components 15 in a plug-in manner and provide circuit connections for the electronic components 15;

The electronic component 15 is connected to the circuit board 14 and includes an active component 150 and a passive component 151. The active component 150 is arranged under the circuit board 14 in a plug-in manner, and the passive component 151 has the same efficiency or higher. Among the functions, they are arranged in a plug-in manner above the circuit board 14;

The heat dissipation glue 16 is located inside the radiator 11 and can be applied above the electronic components 15 , below the circuit board 14 and on both sides of the radiator 11 , so that the electronic components 15 can be joined to the radiator 11 and the insulation sheet 13 , the circuit board 14 and the electronic components 15 are joined and fixed to the heat sink 11, thereby improving the heat dissipation;

Accordingly, with the same function or better function, the power module can be assembled with a minimal volume and has good heat dissipation performance. This is the third preferred embodiment of the present invention that can actively integrate the power module body. Improved miniaturization device 1.

Please refer to Figures 6 and 7 compared with Figure 1. Figure 6 is a schematic diagram of the U-shaped frame of the present invention, and Figure 7 is a schematic diagram of the U-shaped frame of the present invention (wherein Figures 6 and 7 are based on the first preferred embodiment. For example, it can also be applied to the second preferred embodiment and the third preferred embodiment).

As shown in FIGS. 6 and 7 , the insulating tape 112 can be attached to each surface inside the U-shaped frame 111 and at the same time attached to the top of the U-shaped frame 110 .

Please refer to Figures 1, 4, and 5 again. Figure 1 is an explosion schematic diagram of the first preferred embodiment of the present invention. Figure 4 is an exploded schematic diagram of the second preferred embodiment of the present invention. Figure 5 is a third preferred embodiment of the present invention. An example of an explosion diagram.

Continuing from the above, in the first, second and third preferred embodiments of the present invention, the heat sink 11 is made of metal. The metal material can enhance the heat conduction of the power module and improve the efficiency of the present invention. Heat resistance during operation, reducing the possibility of user crashes during use;

Similarly, the radiator 11 can also be made of plastic. Using plastic with thermal conductivity can dissipate heat and eliminate the possibility of electrical conduction, thereby reducing the installation of the insulating sheet 13, reducing production costs and reducing the generation of heat accumulation. .

Among them, the aforementioned insulating sheet 13 can be cut into different shapes through the position where the active component 150 is placed, so that when the circuit board 14 is joined to the U-shaped frame 110, the active component 150 can be more closely aligned with the heat sink 11. The active component 150 The joint with the heat sink 11 can also be bonded by applying heat dissipation glue 16, thereby improving heat dissipation and reducing heat accumulation inside the heat sink 11.

The advantages of the improved device that can actively minimize the power module body of the present invention are:

1. Modify the placement of electronic components to reduce the size of the power module: placing active components on the lower layer of the circuit board and passive components on the upper layer of the circuit board can reduce the size of the circuit board and modify the radiator simultaneously. and the size of the shell to reduce production costs.

2. Modify the volume of passive components: By increasing the conversion rate of passive components, the volume of passive components can be reduced with the same or better performance, thereby simultaneously affecting the volume reduction of circuit boards, radiators, and casings, achieving Body size is being minimized.

3. Improve heat dissipation while complying with the safety regulations of the Bureau of Standards and Inspection of the Ministry of Economic Affairs: This invention improves the volume of the structure, reduces production costs, and improves heat dissipation while complying with the safety regulations of the Bureau of Standards and Inspection of the Ministry of Economic Affairs. This optimizes performance.

Therefore, the present invention has excellent progress and practicability among similar products. At the same time, after searching domestic and foreign technical documents on this type of structure, it is true that no identical or similar structure existed before the application of this case. Therefore, this case It should meet the patent requirements of "inventiveness," "industrial applicability," and "progressivity," and the application must be filed in accordance with the law.

However, the above are only preferred embodiments of the present invention. Any other equivalent structural changes made by applying this creative specification and the patent application scope should be included in the patent application scope of the present invention.

1: An improved device that can actively minimize the power module body 11: Radiator 110:U-shaped frame 111: U-shaped frame 112:Insulating tape 12: Shell 13: Insulation sheet 14:Circuit board 15: Electronic components 150:Active components 151: Passive components 16:Heat dissipation glue A:Safe insulation distance

Figure 1: Explosion diagram of the first preferred embodiment of the present invention. Figure 2: A schematic front view of the first preferred embodiment of the present invention. Figure 3: A schematic top view of the first preferred embodiment of the present invention. Figure 4: Explosion diagram of the second preferred embodiment of the present invention. Figure 5: Explosion diagram of the third preferred embodiment of the present invention. Figure 6: Schematic diagram of the U-shaped frame of the present invention. Figure 7: Schematic diagram of the U-shaped frame of the present invention.

without.

1: An improved device that can actively minimize the power module body

11: Radiator

110:U-shaped frame

111: U-shaped frame

112:Insulating tape

12: Shell

13: Insulation sheet

14:Circuit board

15: Electronic components

151: Passive components

16:Heat dissipation glue

Claims (5)

An improved device that can actively minimize the power module body, including a radiator, a casing, an insulating sheet, a circuit board, electronic components and heat dissipation glue; The radiator includes a U-shaped frame and a U-shaped frame. The U-shaped frame and the U-shaped frame can be joined to form a square frame; its exterior can be covered by a shell, and its interior can be insulated. Tape, and at least insulating sheets, circuit boards and electronic components are provided from bottom to top; The casing is installed outside the radiator, and the radiator is covered with the casing; The insulating sheet is placed above the U-shaped frame to prevent the circuit board from conducting electricity to the U-shaped frame; The circuit board is located inside the radiator and above the insulating sheet, and is used to connect electronic components in the form of plug-ins and provide circuit connections for electronic components; The electronic components are connected to the circuit board and include active components and passive components. The aforementioned active components are arranged under the circuit board in the form of plug-ins. The aforementioned passive components have the same efficiency or higher efficiency. arranged above the circuit board; The heat dissipation glue is installed inside the radiator and can be applied above the electronic components, below the circuit board and on both sides of the radiator. It allows the electronic components to be joined to the radiator, and the insulating sheet, circuit board and electronic components are joined and fixed. on the radiator to improve heat dissipation. An improved device that can actively minimize the power module body, including a radiator, insulating sheet, circuit board, electronic components and heat dissipation glue; The radiator includes a U-shaped frame and a U-shaped frame, which can be joined to form a square frame. The insulating sheet is placed above the U-shaped frame to prevent the circuit board from conducting electricity to the U-shaped frame. Insulating tape is attached to the inside of the insulating sheet, and at least the insulating sheet, circuit board and electronic components are provided from bottom to top; The circuit board is located inside the radiator and above the insulating sheet, and is used to connect electronic components in the form of plug-ins and provide circuit connections for electronic components; The electronic components are connected to the circuit board and include active components and passive components. The aforementioned active components are arranged under the circuit board in the form of plug-ins. The aforementioned passive components have the same efficiency or higher efficiency. arranged above the circuit board; The heat dissipation glue is located inside the radiator and can be applied above the electronic components, below the circuit board and on both sides of the radiator. It allows the electronic components to be bonded to the radiator, and to bond the insulating sheet, circuit board and electronic components. Fixed on the radiator to improve heat dissipation. An improved device that can actively minimize the power module body, including a radiator, insulating sheet, circuit board, electronic components and heat dissipation glue; The radiator is a U-shaped frame, the inside of which can be covered with insulating tape, and there are at least insulating sheets, circuit boards and electronic components above the radiator from bottom to top; The insulating sheet is placed above the U-shaped frame to prevent the circuit board from conducting electricity to the U-shaped frame; The circuit board is located above the U-shaped frame and the insulating sheet, which is used to connect electronic components in the form of plug-ins and provide circuit connections for electronic components; The electronic components are connected to the circuit board and include active components and passive components. The aforementioned active components are arranged under the circuit board in the form of plug-ins. The aforementioned passive components have the same efficiency or higher efficiency. arranged above the circuit board; The heat dissipation glue is installed inside the radiator and can be applied above the electronic components, below the circuit board and on both sides of the radiator. It allows the electronic components to be joined to the radiator, and the insulating sheet, circuit board and electronic components are joined and fixed. on the radiator to improve heat dissipation. As claimed in claim 1, 2 or 3, the improved device that can actively minimize the power module body, wherein the heat sink can be made of metal. As claimed in claim 1, 2 or 3, the improved device that can actively minimize the power module body, wherein the heat sink can be made of plastic material.