CN214014117U

CN214014117U - Portable small high-density high-power adapter

Info

Publication number: CN214014117U
Application number: CN202022998154.8U
Authority: CN
Inventors: 王本欣; 邹青; 谭伟文
Original assignee: Chenzhou Furuikang Electronic Co ltd
Current assignee: Chenzhou Furuikang Electronic Co ltd
Priority date: 2020-12-14
Filing date: 2020-12-14
Publication date: 2021-08-20
Anticipated expiration: 2030-12-14

Abstract

The utility model discloses a portable miniaturized high-power adapter with high density, which comprises an upper cover (1), an upper heat dissipation cover (2), an upper Mylar film (17), a circuit board, a lower Mylar film (18), a lower heat dissipation cover (3) and a lower cover (4) which are sequentially overlapped from top to bottom; the circuit board comprises a PCBA board (5) and a heating element welded on the PCBA board, wherein heat radiating fins (6) are adhered to the periphery or the top surface of the heating element, buckles are arranged on the peripheries of the upper heat radiating cover and the lower heat radiating cover, and the upper Mylar sheet and the lower Mylar sheet of the circuit board are clamped and then are wrapped in a cavity of the upper Mylar sheet and the lower Mylar sheet of the circuit board for heat radiation; the utility model adopts the concept of uniform heat dissipation to the layout of components, combines the radiating fins and reasonably arranges the heating devices, and fully utilizes the internal space; the product meets the requirement of ultrathin miniaturization, is convenient to install and carry, saves the production cost and the packaging and transportation cost, and has good user experience and considerable market competitiveness.

Description

Portable small high-density high-power adapter

Technical Field

The utility model relates to a power supply circuit especially relates to a high-power adapter of portable miniaturized high density.

Background

The high-power adapter is a necessary power supply device for all notebook computers and small-sized 5G base stations, particularly desktop products and outdoor communication equipment, and portability and reliability are the most basic requirements of the equipment on products, so that the volume, surface temperature rise and overall cost of the power adapter products are more important problems for all users and assembly workers. Most power adapters used for outdoor communication products and desktop computers in the market currently generally have the problems of large size, low power density, low space utilization rate, inconvenience in installation and placement, high product working temperature, high material process cost, poor user experience and the like. Therefore, how to design a power adapter with small size, high power density and high space utilization rate is an urgent technical problem to be solved in the industry.

SUMMERY OF THE UTILITY MODEL

In order to solve the above-mentioned defect that exists among the prior art, the utility model provides a high-power adapter of portable miniaturized high density.

The technical scheme adopted by the utility model is to design a portable miniaturized high-density high-power adapter, which comprises an upper cover, an upper heat dissipation cover, an upper Mylar film, a circuit board, a lower Mylar film, a lower heat dissipation cover and a lower cover which are sequentially overlapped from top to bottom; the circuit board comprises a PCBA board and a heating element welded on the PCBA board, radiating fins are attached to the periphery or the top surface of the heating element, buckles are arranged on the peripheries of the upper radiating cover and the lower radiating cover, and the upper and lower radiating covers are clamped to enable the Mylar sheet on the circuit board to be wrapped in the cavity of the Mylar sheet to radiate heat.

The PCBA board is used for mounting a power circuit, the power circuit comprises an alternating current input socket, a rectification filter module, a PFC module, a voltage conversion module and a synchronous rectification filter module which are sequentially connected in series, and a voltage feedback module and a PWM control module are connected between the synchronous rectification filter module and the voltage conversion module; the rectification filter module comprises an electrolytic capacitor, an X capacitor and a metal film capacitor; the PFC module comprises a PFC transformer and a PFC switching tube; the voltage conversion module comprises a main switching tube and a main transformer; the synchronous rectification filtering module comprises an output switch tube.

The radiating fin comprises a plurality of blocks; the PCBA is rectangular, and the PFC transformer and the PFC switch tube are arranged on the left side edge of the PCBA and share the first radiating fin for radiating; the first radiating fin comprises a vertical part, a bending part vertically connected with the vertical part and a pin extending from the bottom edge of the vertical part; the pin is welded on the PCBA and connected with the ground wire, so that the first radiating fin is fixed; the vertical part is tightly attached to the side surface of the PFC transformer for heat dissipation; the PFC switch tube is laid down and pasted on the PCBA board, and the top surface of the PFC switch tube is clung to the bent part for heat dissipation.

A heat-conducting silicone sheet is arranged between the vertical part and the side surface of the PFC transformer.

The top surface of kink sets up a heat conduction aluminium piece, all is equipped with the screw hole on heat conduction aluminium piece and the kink, and the fixed screw passes the screw hole and with heat conduction aluminium piece, kink and PFC switch tube zonulae occludens so that improve the heat dissipation.

The main switch tube is horizontally attached to the right side of the PCBA, the radiating fins comprise second radiating fins, the second radiating fins comprise a left vertical portion, a right vertical portion and a transverse connecting portion for connecting the left vertical portion and the right vertical portion, the bottom edges of the left vertical portion and the right vertical portion are provided with extending pin feet, and the pin feet are welded on the PCBA and connected with a ground wire, so that the second radiating fins are fixed; the transverse connecting part is tightly attached to the top surface of the main switch tube for heat dissipation.

The heat conduction aluminum block is arranged on the transverse connecting portion, screw holes are formed in the heat conduction aluminum block and the transverse connecting portion, and the fixing screws penetrate through the screw holes to enable the heat conduction aluminum block, the transverse connecting portion and the main switch tube to be tightly connected so as to improve heat dissipation.

The output switch tube is vertically arranged at the lower right corner of the PCBA, the radiating fins comprise third radiating fins, the third radiating fins comprise right vertical parts, lower vertical parts and fixing clamps, the right vertical parts and the lower vertical parts are perpendicular to each other, the bottom edges of the right vertical parts and the lower vertical parts are provided with extending pin feet, and the pin feet are welded on the PCBA and connected with a ground wire, so that the third radiating fins are fixed; the fixing clamp clamps the output switch pipe on the side wall of the right vertical part for heat dissipation.

The electrolytic capacitor is installed in a lying mode, and the PCBA board is provided with an avoiding notch in the place where the electrolytic capacitor lies down.

The top surfaces of the first radiating fin, the second radiating fin, the third radiating fin and the heat conducting aluminum block are located on the same plane.

The utility model provides a technical scheme's beneficial effect is:

the utility model is based on the traditional power adapter, adopts the heat radiation uniform idea to combine the heat radiation fins and the heat conduction silicon film to reasonably place the heating device by the optimized design of the internal structure, and fully utilizes the internal space; each device is controlled by adopting an accurate structure size, the assembly is simple, and the automation degree of the product is greatly improved; the whole design reasonably utilizes the internal space by the design concept and the design process of ultra-thin miniaturization, high power density, high efficiency and intelligence, meets the global safety regulation requirement, and ensures that the product has more stable structure, simpler operation and more reliable performance; the product meets the requirement of ultrathin miniaturization, is convenient to install and carry, saves the production cost and the packaging and transportation cost, and has good user experience and considerable market competitiveness.

Drawings

The invention is explained in more detail below with reference to exemplary embodiments and the accompanying drawings, in which:

FIG. 1 is an exploded view of the preferred embodiment of the present invention;

FIG. 2 is a schematic block diagram of the preferred embodiment of the present invention;

FIG. 3 is a perspective view of the circuit board according to the preferred embodiment of the present invention;

FIG. 4 is a perspective view of a first heat sink in accordance with a preferred embodiment of the present invention;

FIG. 5 is a perspective view of a second heat sink in accordance with a preferred embodiment of the present invention;

fig. 6 is a perspective view of a third heat sink according to a preferred embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

The utility model discloses use traditional power adapter as the basis, through inner structure's optimal design, adopt miniaturization, ultra-thin type selection to the components and parts type selection, adopt the even theory of heat dissipation to combine fin and heat conduction silicon film rationally to put heating device, make full use of inner space to the components and parts overall arrangement. Each device adopts accurate structure size control, and the equipment is simple, has promoted the degree of automation of product by a wide margin. The overall design reasonably utilizes the internal space with the design concept and design process of ultra-thin miniaturization, high power density and high-efficiency intelligence, meets the global safety requirements, and ensures that the product structure is more stable, the operation is simpler and the performance is more reliable. The product meets the requirement of ultrathin miniaturization, is convenient to install and carry, saves the production cost and the packaging and transportation cost, and has good user experience and considerable market competitiveness.

The utility model discloses a portable miniaturized high-power adapter with high density, which refers to the exploded view of the preferred embodiment shown in figure 1, and comprises an upper cover 1, an upper heat dissipation cover 2, an upper mylar sheet 17, a circuit board, a lower mylar sheet 18, a lower heat dissipation cover 3 and a lower cover 4 which are sequentially overlapped from top to bottom; the circuit board comprises a PCBA board 5 and heating elements welded on the PCBA board, heat radiating fins 6 are attached to the periphery or the top surface of each heating element, buckles are arranged on the peripheries of an upper heat radiating cover and a lower heat radiating cover, the upper mylar pull-tab and the lower mylar pull-tab wrap the circuit board to play an insulating role, and then the circuit board is placed in a cavity behind the upper heat radiating cover and the lower heat radiating cover in a clamped mode to radiate heat. The heat dissipation cover is provided with a plurality of buckles around, so that the disassembly is convenient, and the assembled heat dissipation cover can be assembled up and down.

The PCBA board 5 is used for installing a power circuit, fig. 2 shows a schematic circuit block diagram of a preferred embodiment, the power circuit comprises an alternating current input socket 8, a rectification filter module, a PFC module, a voltage conversion module and a synchronous rectification filter module which are sequentially connected in series, and a voltage feedback module and a PWM control module are connected between the synchronous rectification filter module and the voltage conversion module; the rectification filter module comprises an electrolytic capacitor 9, an X capacitor 10 and a metal film capacitor 11; the PFC module comprises a PFC transformer 12 and a PFC switching tube 13; the voltage conversion module comprises a main switching tube 14 and a main transformer 15; the synchronous rectification filter module comprises an output switch tube 16. Each module is mounted on the PCBA board quite intensively, and the connection of the ground between each module can use pin legs of the heat sink as the grounding wire of Class I.

In combination with the perspective view of the circuit board of the preferred embodiment shown in fig. 3 and the perspective view of the first heat sink shown in fig. 4, the heat sink 6 comprises a plurality of pieces; the PCBA 5 is rectangular, and the PFC transformer 12 and the PFC switch tube 13 are arranged on the left side edge of the PCBA and share the first radiating fin 61 for radiating; the first radiating fin comprises a vertical part 61a, a bent part 61b vertically connected with the vertical part, and a pin 21 extending from the bottom edge of the vertical part; the pin is welded on the PCBA board 5 and connected with the ground wire, so that the first radiating fin is fixed; the vertical part is tightly attached to the side surface of the PFC transformer for heat dissipation; the PFC switch tube is laid down and pasted on the PCBA board, and the top surface of the PFC switch tube is clung to the bent part for heat dissipation. The PFC switch tube adopts the mode that crouches and falls can increase switch tube heat radiating area, can also better utilize the space, reduces the height of adapter.

It should be pointed out the utility model discloses the pin foot that utilizes the fin connects input earth and secondary as Class I's earth connection, has avoided using the space that the earth connection took, save material cost and cost of labor.

In the preferred embodiment, a heat-conducting silicone rubber sheet 19 is disposed between the vertical portion 61a and the side surface of the PFC transformer 12. The addition of the heat-conducting silicon rubber sheet reduces the use of white glue, reduces the waiting time for curing the white glue after production, improves the production efficiency, and is convenient for production, manufacture and maintenance.

In the preferred embodiment, a heat conducting aluminum block 20 is disposed on the top surface of the bending portion 61b, screw holes are disposed on the heat conducting aluminum block and the bending portion, and fixing screws are passed through the screw holes to tightly connect the heat conducting aluminum block, the bending portion and the PFC switch tube 13, thereby improving heat dissipation.

In combination with the perspective view of the circuit board of the preferred embodiment shown in fig. 3 and the perspective view of the second heat sink shown in fig. 5, the main switch tube 14 is attached to the right side of the PCBA board, the heat sink 6 includes a second heat sink 62, the second heat sink includes a left vertical portion 62a and a right vertical portion 62b, and a transverse connecting portion 62c connecting the left vertical portion and the right vertical portion, the bottom edges of the left vertical portion and the right vertical portion are provided with protruding pin legs 21, and the pin legs are welded to the PCBA board 5 and connected to the ground wire, so as to fix the second heat sink; the transverse connecting part is tightly attached to the top surface of the main switch tube for heat dissipation.

In the preferred embodiment, the transverse connection portion 62c is provided with a heat conducting aluminum block 20, screw holes are formed on the heat conducting aluminum block and the transverse connection portion, and fixing screws are passed through the screw holes to tightly connect the heat conducting aluminum block, the transverse connection portion and the main switch tube 14, so as to improve heat dissipation.

In combination with the perspective view of the circuit board of the preferred embodiment shown in fig. 3 and the perspective view of the third heat sink shown in fig. 6, the output switch tube 16 is vertically mounted at the lower right corner of the PCBA board, the heat sink 6 includes a third heat sink 63, the third heat sink includes a right vertical portion 63a and a lower vertical portion 63b, which are perpendicular to each other, and a fixing clip 63c, and the bottom edges of the right vertical portion and the lower vertical portion are provided with extended pins 21, which are welded to the PCBA board 5 and connected to the ground wire, so as to fix the third heat sink; the fixing clamp clamps the output switch pipe on the side wall of the right vertical part for heat dissipation.

Referring to the perspective view shown in fig. 3, the electrolytic capacitor 9 is installed in a horizontal position, and the PCBA board 5 is provided with an avoidance gap at the position where the electrolytic capacitor is horizontal. This can reduce the thickness of the entire power adapter. In the figure 3, the AC input socket 8 is arranged at the upper end part of the PCBA board, and the lead of the AC input socket 8 is directly fixed by adopting a riveting terminal mode, so that rubber coating and a sleeve for secondary fixing are omitted, and a large amount of labor hour is saved. The dc output line 22 is attached to the lower end of the PCBA board. The magnetic inductance devices and the transformer in the circuit board are in a loose S-shaped layout mode, so that the heating devices of the whole product are uniformly distributed, sufficient heat diffusion spaces are reserved respectively, all the magnetic elements are designed into a die structure by self, and the thickness of the whole power adapter is controlled to be about 15 mm.

In the preferred embodiment, the top surfaces of the first heat sink 61, the second heat sink 62, the third heat sink 63 and the thermally conductive aluminum block 20 are located on the same plane. Therefore, when the circuit board is wrapped by the upper mylar film and the lower mylar film, the circuit board can be wrapped into a cuboid, and a good heat dissipation effect can be obtained in the upper heat dissipation cover and the lower heat dissipation cover. Because of the heat dissipation cover fully covering the PCBA, the working temperature in the power supply can be fully diffused through the heat dissipation cover, the situation that the local temperature of the power adapter is too high is avoided, and the performance reliability and the use safety of the product are improved.

In a preferred embodiment, the upper cover 1 and the lower cover 4 are made of environment-friendly insulating plastic, the overall height of the plastic is about 20 mm, and the edges and corners of the plastic are processed by small circular arcs, so that the plastic has good hand feeling. The upper heat dissipation cover (2) and the lower heat dissipation cover (3) are made of heat dissipation metal materials.

The foregoing examples are illustrative only and are not intended to be limiting. Any equivalent modifications or variations without departing from the spirit and scope of the present application should be included in the claims of the present application.

Claims

1. The utility model provides a high-power adapter of portable miniaturized high density which characterized in that: comprises an upper cover (1), an upper heat dissipation cover (2), an upper Mylar film (17), a circuit board, a lower Mylar film (18), a lower heat dissipation cover (3) and a lower cover (4) which are sequentially overlapped from top to bottom; the circuit board comprises a PCBA board (5) and a heating element welded on the PCBA board, wherein heat radiating fins (6) are attached to the periphery or the top surface of the heating element, buckles are arranged on the peripheries of an upper heat radiating cover and a lower heat radiating cover, and the upper Mylar sheet and the lower Mylar sheet of the circuit board are clamped to be wrapped in a cavity of the upper Mylar sheet and the lower Mylar sheet of the circuit board to radiate heat.

2. The portable miniaturized high-power adapter for high density as set forth in claim 1, wherein: the PCBA board (5) is used for mounting a power circuit, the power circuit comprises an alternating current input socket (8), a rectifying and filtering module, a PFC module, a voltage conversion module and a synchronous rectifying and filtering module which are sequentially connected in series, and a voltage feedback module and a PWM control module are connected between the synchronous rectifying and filtering module and the voltage conversion module; the rectification filter module comprises an electrolytic capacitor (9), an X capacitor (10) and a metal film capacitor (11); the PFC module comprises a PFC transformer (12) and a PFC switching tube (13); the voltage conversion module comprises a main switching tube (14) and a main transformer (15); the synchronous rectification filter module comprises an output switch tube (16).

3. The portable miniaturized high-power adapter for high density as set forth in claim 2, wherein: the radiating fin (6) comprises a plurality of pieces; the PCBA (5) is rectangular, and the PFC transformer (12) and the PFC switch tube (13) are arranged on the left side edge of the PCBA and share the first radiating fin (61) for radiating; the first radiating fin comprises a vertical part (61 a), a bent part (61 b) vertically connected with the vertical part, and a pin (21) extending from the bottom edge of the vertical part; the pin is welded on the PCBA board (5) and is connected with the ground wire, so that the first radiating fin is fixed; the vertical part is tightly attached to the side surface of the PFC transformer for heat dissipation; the PFC switch tube is laid down and pasted on the PCBA board, and the top surface of the PFC switch tube is clung to the bent part for heat dissipation.

4. The portable miniaturized high-power adapter for high power according to claim 3, wherein: a heat conductive silicone sheet (19) is provided between the vertical portion (61 a) and the side surface of the PFC transformer (12).

5. The portable miniaturized high-power adapter for high power according to claim 4, wherein: the top surface of the bending part (61 b) is provided with a heat conduction aluminum block (20), screw holes are formed in the heat conduction aluminum block and the bending part, and fixing screws penetrate through the screw holes to tightly connect the heat conduction aluminum block, the bending part and the PFC switch tube (13) so as to improve heat dissipation.

6. The portable miniaturized high-power adapter for high power according to claim 5, wherein: the main switch tube (14) is horizontally attached to the right side of the PCBA, the radiating fins (6) comprise second radiating fins (62), each second radiating fin comprises a left vertical portion (62 a), a right vertical portion (62 b) and a transverse connecting portion (62 c) for connecting the left vertical portion and the right vertical portion, protruding pin feet (21) are arranged on the bottom edges of the left vertical portion and the right vertical portion, and the pin feet are welded on the PCBA (5) and connected with a ground wire, so that the second radiating fins are fixed; the transverse connecting part is tightly attached to the top surface of the main switch tube for heat dissipation.

7. The portable miniaturized high-power adapter for high power according to claim 6, wherein: the heat-conducting aluminum block (20) is arranged on the transverse connecting portion (62 c), screw holes are formed in the heat-conducting aluminum block and the transverse connecting portion, and fixing screws penetrate through the screw holes to tightly connect the heat-conducting aluminum block, the transverse connecting portion and the main switch tube (14) so as to improve heat dissipation.

8. The portable miniaturized high-power adapter for high power according to claim 7, wherein: the output switch tube (16) is vertically arranged at the lower right corner of the PCBA, the radiating fin (6) comprises a third radiating fin (63), the third radiating fin comprises a right vertical part (63 a), a lower vertical part (63 b) and a fixing clamp (63 c), the right vertical part and the lower vertical part are perpendicular to each other, the bottom edges of the right vertical part and the lower vertical part are provided with extended pin pins (21), and the pin pins are welded on the PCBA (5) and connected with a ground wire, so that the third radiating fin is fixed; the fixing clamp clamps the output switch pipe on the side wall of the right vertical part for heat dissipation.

9. The portable miniaturized high-power adapter for high power according to claim 8, wherein: electrolytic capacitor (9) are installed in a lying mode, PCBA board (5) are provided with avoiding notches in the place where electrolytic capacitor lies down.

10. The portable miniaturized high-power adapter for high power of claim 9, wherein: the top surfaces of the first radiating fin (61), the second radiating fin (62), the third radiating fin (63) and the heat conducting aluminum block (20) are located on the same plane.