US20050199367A1 - Method for heat dissipation in mobile radio devices, and a corresponding mobile radio device - Google Patents

Method for heat dissipation in mobile radio devices, and a corresponding mobile radio device Download PDF

Info

Publication number
US20050199367A1
US20050199367A1 US10/522,349 US52234905A US2005199367A1 US 20050199367 A1 US20050199367 A1 US 20050199367A1 US 52234905 A US52234905 A US 52234905A US 2005199367 A1 US2005199367 A1 US 2005199367A1
Authority
US
United States
Prior art keywords
heat
mobile radio
metal foil
honeycomb
corrugated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US10/522,349
Inventor
Jorg Romahn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE10234500A priority Critical patent/DE10234500A1/en
Priority to DE10234500.7 priority
Application filed by Siemens AG filed Critical Siemens AG
Priority to PCT/DE2003/002441 priority patent/WO2004017697A1/en
Assigned to SIEMENS AKTIENGESELLSCHAFT reassignment SIEMENS AKTIENGESELLSCHAFT ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ROMAHN, JORG
Publication of US20050199367A1 publication Critical patent/US20050199367A1/en
Abandoned legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/15Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets

Abstract

The present invention relates to a method for heat dissipation in mobile radio devices, with heat-radiating electrical components, whereby the heat-radiating components are brought into heat-dissipating contact with a metal film. The present invention further relates to a mobile radio device with heat-radiating electrical components, whereby each component is in effective heat-dissipating contact with a metal film.

Description

    BACKGROUND OF THE INVENTION
  • The present invention relates to a method for heat dissipation in mobile radio devices, and to a corresponding mobile radio device. An operating range with an environmental temperature generally of +55° C. is specified in mobile telecommunications terminals and in mobile radio devices, such as mobile telephones, PDAs and laptops. These mobile radio devices are constructed like a shell for the electronic components, wherein the temperature rises from shell to shell towards the components. The maximum temperature is functionally limited. The temperature close to the individual components in this case may be an environmental temperature of 82° C., while the temperature of the component itself may be up to 100° C. The electronic components convert the majority of the energy/power supplied to them to heat, which heats not only the component itself but also its immediate surrounding area. The power that is converted to heat is, accordingly, a power loss.
  • In new, future mobile radio devices with the introduction of data services via GPRS with a so-called Class 10, the power with two transmission time slots is doubled, which also results in the power loss produced by the electronic components also being virtually doubled. The subdivision into “classes” relates to details of the configuration of the transmission and reception time slots. In Class 10, two transmission time slots are possible, wherein not only the transmission power but also the power loss is doubled.
  • In even higher GPRS classes, such as GPRS Class 12, the power loss is up to a multiple of this. This results in a threat of the components being overheated after a certain operating time.
  • The following table provides a rough overview of the GPRS classes:
    Multislot Transmission Reception Number of slots
    Class slots slots (usable)
    1 1 1 2
    .
    .
    .
    8 1 4 5
    .
    .
    .
    10  2 4 5
    .
    .
    .
    12  4 4 5
  • This type of problem has not occurred in the past in the field of mobile telecommunications since this technology is only now being introduced. In the past, mobile radio devices have been implemented and operated on the basis of GPRS Class 8.
  • In other electronic devices, such as desktop computers, heat sinks or fans have been mounted on the temperature-critical components. When fitting heat sinks, care must be taken to ensure that good thermal coupling is provided between the heat sink and the electrical component which is heated by the power loss. In order to exclude air, as a poor thermal conductor, spaces between the corresponding component and the heat sink are filled with thermally conductive sheets or thermally conductive pastes.
  • Furthermore, the distribution of the heat in electrical components can be influenced by a matched structure.
  • Thermally conductive sheets and thermally conductive pastes are admittedly better thermal conductors than air, but they are also not adequate to ensure satisfactory heat dissipation for electrical components.
  • Accordingly, the present invention seeks to provide a method which makes it possible to ensure good and satisfactory heat dissipation from electronic components in mobile radio devices, as well as a corresponding mobile radio device.
  • SUMMARY OF THE INVENTION
  • Accordingly, a method is provided for heat dissipation in mobile radio devices having heat-emitting, electrical components, in which the heat-emitting components are brought into heat-dissipating contact with a metal foil.
  • In one preferred embodiment of the method according to the present invention, the metal foil is corrugated and/or is structured in the form of a honeycomb. The use of a metal foil which is corrugated and/or is structured in the form of a honeycomb minimizes the resistance for heat dissipation. The capability of the metal foil that is corrugated and/or is structured in the form of a honeycomb to deform results in any intermediate spaces which occur being completely filled, thus ensuring optimum heat dissipation. The metal foil which is corrugated and/or in the form of a honeycomb can be arranged in an interlocking manner on the surfaces which can be brought into contact for heat dissipation.
  • In a further preferred embodiment of the method according to the present invention, the metal foil is brought into contact with a heat sink. The heat sink may, for example, be a metallic body which either has a large area for radiated emission and/or a large volume as a heat sink.
  • In another preferred embodiment of the present invention, the metal foil is itself used as a heat sink. The magnitude of the heat loss to be dissipated, in particular, determines whether the metal foil is itself adequate as a heat sink. The honeycomb and/or corrugated structure provided according to the present invention offers a very large heat-emitting surface area.
  • Furthermore, the present invention covers a mobile radio device having heat-emitting electrical components, in which the components are each in heat-dissipating contact with a metal foil.
  • The metal foil is preferably corrugated and/or has a honeycomb structure. The use of a metal foil which is corrugated or is structured in the form of a honeycomb enlarges the radiation-emitting surface area. The heat dissipation resistance is minimized, on the one hand, by the use of a metallic foil as well as by its structure, which is corrugated or is in the form of a honeycomb.
  • Furthermore, in a further preferred embodiment of the mobile radio device according to the present invention, the metal foil is in heat-dissipating contact with a heat sink.
  • In another preferred embodiment of the mobile radio device according to the present invention, the metal foil itself acts as a heat sink. Its honeycomb and/or corrugated structure results in it having a very large heat-emitting surface area.
  • Furthermore, the present invention covers the use of a metal foil which is corrugated and/or is structured in the form of a honeycomb for heat dissipation from heat-emitting electrical components in mobile radio devices.
  • Additional features and advantages of the present invention are described in, and will be apparent from, the following Detailed Description of the Invention and the Figures.
  • BRIEF DESCRIPTION OF THE FIGURES
  • FIG. 1 shows a schematic illustration of one implemented embodiment of the method according to the present invention.
  • FIG. 2 shows a schematic illustration of another implemented embodiment of the method according to the present invention.
  • FIG. 3 shows a schematic illustration of a further implemented embodiment of the method according to the present invention.
  • DETAILED DESCRIPTION OF THE INVENTION
  • FIG. 1 shows a printed circuit board 1 which is fitted on one side with components 2 which develop a large amount of heat. A heat sink 4 in the form of a cold plate is arranged on the other side of the printed circuit board 1 via suitable connecting elements 3 which, for example, may be screws or rivets. During the fitting of the heat sink 4, good thermal coupling between the heat sink and the electrical components 2 is a key factor ensuring that the components 2 are not excessively heated, which could possibly lead to destruction of the components 2. In order to avoid poor thermal conduction, a metal foil 5 or a metal paste is, according to the present invention, inserted in the space which occurs between the printed circuit board 1 and the heat sink 4.
  • FIG. 2 shows another possible implementation of the method according to the present invention. FIG. 2 once again shows a printed circuit board 1 which is fitted with a component 2, that produces heat losses, on one side. A shielding cover 6 is also provided above the component 2 for shielding. A heat sink 4 is arranged on the other side of the printed circuit board 1. This may be a heat sink, a battery or a chassis. According to the present invention, a metal foil 5, which is corrugated and/or structured in the form of a honeycomb, is arranged in the resultant spaces between the component 2 or the printed circuit board 1 and the shielding cover 6 or the heat sink 4. The capability of the metal foil 5, which is corrugated and/or structured in the form of a honeycomb, to deform allows very good contact for heat transfer. On the one hand, the metal foil 5 may provide only the junction to a heat sink 4, in this case, in the space between the heat sink 4 and the printed circuit board 1. Furthermore, the metal foil 5 could itself act as a heat sink. This is because the use of a metal foil 5 with a corrugated or honeycomb structure considerably enlarges the radiation-emitting surface area.
  • FIG. 3 shows a further possible implementation of the method according to the present invention. In this case as well, FIG. 3 shows a printed circuit board 1 with a lossy component 2 arranged on one side of the printed circuit board 1. Furthermore, a plastic part 7 is arranged on the other side of the printed circuit board 1. A metal foil 5 which is in the form of a honeycomb and/or is corrugated is provided between the plastic part 7 and the printed circuit board 1 and can be matched to the respective surfaces by virtue of its capability to be deformed well. By virtue of its structure, the metal foil 5 itself has a very large heat-emitting surface area, which represents an additional beneficial factor.
  • Although the present invention has been described with reference to specific embodiments, those of skill in the art will recognize that changes may be made thereto without departing from the spirit and scope of the present invention as set forth in the hereafter appended claims.

Claims (4)

1-3. (canceled)
4. A method for heat dissipation in mobile radio devices having heat-emitting electrical components, the method comprising:
providing that the heat-emitting electrical components be brought into heat-dissipating contact with a metal foil, wherein the metal foil is structured in at least one of corrugated form and honeycomb form; and
providing that the metal foil be brought into contact with a heat sink.
5. A mobile radio device having heat-emitting electrical components, comprising:
a metal foil which is structured in at least one of corrugated form and honeycomb form, wherein the heat-emitting electrical components are each in heat-dissipating contact with the metal foil; and
a heat sink, wherein the metal foil is in heat-dissipating contact with the heat sink.
6. A metal foil for heat dissipation from heat-emitting electrical components in a mobile radio device, comprising a structure which is in at least one of corrugated form and honeycomb form, wherein the heat-emitting electrical components are brought into heat-dissipating contact with the metal foil and the metal foil is in heat-dissipating contact with a heat sink.
US10/522,349 2002-07-23 2003-07-16 Method for heat dissipation in mobile radio devices, and a corresponding mobile radio device Abandoned US20050199367A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE10234500A DE10234500A1 (en) 2002-07-23 2002-07-23 Heat extraction in mobile radio equipment involves bringing electrical components into heat extraction contact with metal film with corrugated and/or honeycomb structure in contact with cooling body
DE10234500.7 2002-07-23
PCT/DE2003/002441 WO2004017697A1 (en) 2002-07-23 2003-07-16 Method for heat dissipation in mobile radio devices and a corresponding mobile radio device

Publications (1)

Publication Number Publication Date
US20050199367A1 true US20050199367A1 (en) 2005-09-15

Family

ID=30469148

Family Applications (1)

Application Number Title Priority Date Filing Date
US10/522,349 Abandoned US20050199367A1 (en) 2002-07-23 2003-07-16 Method for heat dissipation in mobile radio devices, and a corresponding mobile radio device

Country Status (7)

Country Link
US (1) US20050199367A1 (en)
EP (1) EP1523870A1 (en)
JP (1) JP2005534197A (en)
CN (1) CN1669376A (en)
AU (1) AU2003250308A1 (en)
DE (1) DE10234500A1 (en)
WO (1) WO2004017697A1 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050105584A1 (en) * 2002-03-20 2005-05-19 Ngk Insulators Ltd Method of measuring thermal conductivity of honeycomb structure
US20070159799A1 (en) * 2007-01-09 2007-07-12 Lockheed Martin Corporation High Performance Large Tolerance Heat Sink
CN105141727A (en) * 2015-10-13 2015-12-09 太仓市和准电子科技有限公司 Mobile phone shell
US20160320815A1 (en) * 2008-06-27 2016-11-03 Hewlett-Packard Development Company, L.P. Dissipating heat within housings for electrical components
CN107305292A (en) * 2016-04-20 2017-10-31 佳能株式会社 Head mounted display and grasping device
US20190289745A1 (en) * 2018-03-13 2019-09-19 Rosemount Aerospace Inc. Flexible heat sink for aircraft electronic units

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007125718A1 (en) 2006-04-27 2007-11-08 Kyocera Corporation Electronic device
JP2007300222A (en) * 2006-04-27 2007-11-15 Kyocera Corp Electronic apparatus
KR101390082B1 (en) 2007-08-01 2014-05-28 삼성전자주식회사 Mobile communication terminal with projector
DE102015207893B3 (en) * 2015-04-29 2016-10-13 Robert Bosch Gmbh Electronic assembly, in particular for a transmission control module

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4246597A (en) * 1979-06-29 1981-01-20 International Business Machines Corporation Air cooled multi-chip module having a heat conductive piston spring loaded against the chips
US4712159A (en) * 1986-04-14 1987-12-08 Thermalloy Incorporated Heat sink clip assembly
US5020138A (en) * 1989-04-03 1991-05-28 Sony Corporation Radio communication apparatus having cooling means
US5030793A (en) * 1990-05-07 1991-07-09 Motorola Inc. Integrated EMI filter and thermal heat sink
US5175612A (en) * 1989-12-19 1992-12-29 Lsi Logic Corporation Heat sink for semiconductor device assembly
US5323294A (en) * 1993-03-31 1994-06-21 Unisys Corporation Liquid metal heat conducting member and integrated circuit package incorporating same
US5369879A (en) * 1992-06-05 1994-12-06 Eaton Corporation Method of mounting a semiconductor device to a heat sink
US5548090A (en) * 1995-08-21 1996-08-20 Northern Telecom Limited Heat sink and printed circuit board combination
US5582240A (en) * 1994-09-19 1996-12-10 Motorola, Inc. Pneumatically coupled heat sink assembly
US5783862A (en) * 1992-03-20 1998-07-21 Hewlett-Packard Co. Electrically conductive thermal interface
US6121680A (en) * 1999-02-16 2000-09-19 Intel Corporation Mesh structure to avoid thermal grease pump-out in integrated circuit heat sink attachments
US6131646A (en) * 1998-01-19 2000-10-17 Trw Inc. Heat conductive interface material
US6257328B1 (en) * 1997-10-14 2001-07-10 Matsushita Electric Industrial Co., Ltd. Thermal conductive unit and thermal connection structure using the same
US6545352B1 (en) * 2002-02-15 2003-04-08 Ericsson Inc. Assembly for mounting power semiconductive modules to heat dissipators

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3694699A (en) * 1970-03-30 1972-09-26 Nat Beryllia Corp Ceramic based substrates for electronic circuits with improved heat dissipating properties and circuits including the same
JP2794154B2 (en) * 1993-06-04 1998-09-03 ダイヤモンド電機 株式会社 heatsink
US5812374A (en) * 1996-10-28 1998-09-22 Shuff; Gregg Douglas Electrical circuit cooling device
DE19734110C1 (en) * 1997-08-07 1998-11-19 Bosch Gmbh Robert Electrical device with heat sink mat for electronic component board
KR200239827Y1 (en) * 1998-03-06 2001-09-25 구자홍 Radiating plate for television
US6031727A (en) * 1998-10-26 2000-02-29 Micron Technology, Inc. Printed circuit board with integrated heat sink
DE60035798T2 (en) * 1999-12-01 2008-04-30 Cool Options, Inc. STRUCTURE OF A HEAT-RELATED MATERIAL

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4246597A (en) * 1979-06-29 1981-01-20 International Business Machines Corporation Air cooled multi-chip module having a heat conductive piston spring loaded against the chips
US4712159A (en) * 1986-04-14 1987-12-08 Thermalloy Incorporated Heat sink clip assembly
US5020138A (en) * 1989-04-03 1991-05-28 Sony Corporation Radio communication apparatus having cooling means
US5175612A (en) * 1989-12-19 1992-12-29 Lsi Logic Corporation Heat sink for semiconductor device assembly
US5030793A (en) * 1990-05-07 1991-07-09 Motorola Inc. Integrated EMI filter and thermal heat sink
US5783862A (en) * 1992-03-20 1998-07-21 Hewlett-Packard Co. Electrically conductive thermal interface
US5369879A (en) * 1992-06-05 1994-12-06 Eaton Corporation Method of mounting a semiconductor device to a heat sink
US5323294A (en) * 1993-03-31 1994-06-21 Unisys Corporation Liquid metal heat conducting member and integrated circuit package incorporating same
US5582240A (en) * 1994-09-19 1996-12-10 Motorola, Inc. Pneumatically coupled heat sink assembly
US5548090A (en) * 1995-08-21 1996-08-20 Northern Telecom Limited Heat sink and printed circuit board combination
US6257328B1 (en) * 1997-10-14 2001-07-10 Matsushita Electric Industrial Co., Ltd. Thermal conductive unit and thermal connection structure using the same
US6131646A (en) * 1998-01-19 2000-10-17 Trw Inc. Heat conductive interface material
US6121680A (en) * 1999-02-16 2000-09-19 Intel Corporation Mesh structure to avoid thermal grease pump-out in integrated circuit heat sink attachments
US6545352B1 (en) * 2002-02-15 2003-04-08 Ericsson Inc. Assembly for mounting power semiconductive modules to heat dissipators

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050105584A1 (en) * 2002-03-20 2005-05-19 Ngk Insulators Ltd Method of measuring thermal conductivity of honeycomb structure
US7682072B2 (en) * 2002-03-20 2010-03-23 Ngk Insulators, Ltd. Method of measuring thermal conductivity of honeycomb structure
US20070159799A1 (en) * 2007-01-09 2007-07-12 Lockheed Martin Corporation High Performance Large Tolerance Heat Sink
US7995344B2 (en) * 2007-01-09 2011-08-09 Lockheed Martin Corporation High performance large tolerance heat sink
US20160320815A1 (en) * 2008-06-27 2016-11-03 Hewlett-Packard Development Company, L.P. Dissipating heat within housings for electrical components
US10234916B2 (en) * 2008-06-27 2019-03-19 Hewlett-Packard Development Company, L.P. Dissipating heat within housings for electrical components
CN105141727A (en) * 2015-10-13 2015-12-09 太仓市和准电子科技有限公司 Mobile phone shell
CN107305292A (en) * 2016-04-20 2017-10-31 佳能株式会社 Head mounted display and grasping device
EP3239762A1 (en) * 2016-04-20 2017-11-01 Canon Kabushiki Kaisha Head-mounted display and gripping apparatus
US10477730B2 (en) 2016-04-20 2019-11-12 Canon Kabushiki Kaisha Head-mounted display and gripping apparatus
US20190289745A1 (en) * 2018-03-13 2019-09-19 Rosemount Aerospace Inc. Flexible heat sink for aircraft electronic units

Also Published As

Publication number Publication date
CN1669376A (en) 2005-09-14
JP2005534197A (en) 2005-11-10
DE10234500A1 (en) 2004-02-19
EP1523870A1 (en) 2005-04-20
WO2004017697A1 (en) 2004-02-26
AU2003250308A1 (en) 2004-03-03

Similar Documents

Publication Publication Date Title
US5818693A (en) Heat dissipating computer case having oriented fibers and heat pipe
US6347035B1 (en) Low profile EMI shield with heat spreading plate
US6366486B1 (en) Power supply device for enhancing heat-dissipating effect
US5557500A (en) Heat dissipating arrangement in a portable computer
US6603665B1 (en) Heat dissipating assembly with thermal plates
US6740968B2 (en) Power source unit for driving magnetron and heatsink to be mounted on printed circuit board thereof
US6408934B1 (en) Cooling module
JP3180151B2 (en) Portable power supply
US6862186B2 (en) Stack up assembly
CN102573417B (en) Shell structure and electronic device having the same
US6058012A (en) Apparatus, method and system for thermal management of an electronic system having semiconductor devices
US6943293B1 (en) High power electronic package with enhanced cooling characteristics
EP1533840B1 (en) A heat radiating system and method for a mobile communication terminal
TW556471B (en) Electronic apparatus
US4979074A (en) Printed circuit board heat sink
US6757170B2 (en) Heat sink and package surface design
CN203136420U (en) Terminal and shield with heat radiation structure
US7321491B2 (en) Heat sink for a portable computer
US20060133043A1 (en) Heat spreader with multiple stacked printed circuit boards
US9204575B2 (en) Apparatus for and method of cooling molded electronic circuits
US20080155990A1 (en) Socket enabled current delivery to a thermoelectric cooler to cool an in-substrate voltage regulator
JP4093479B2 (en) Power supply
CN100359676C (en) Heat spreader with down set leg attachment feature
JP4337955B2 (en) Battery module and charging module
TW556475B (en) A cover apparatus for dissipating heat and shielding electromagnetic interference

Legal Events

Date Code Title Description
AS Assignment

Owner name: SIEMENS AKTIENGESELLSCHAFT, GERMANY

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:ROMAHN, JORG;REEL/FRAME:016718/0683

Effective date: 20041126

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION