CN116056409B

CN116056409B - Shielding and radiating structure of main board and electronic equipment

Info

Publication number: CN116056409B
Application number: CN202210980905.4A
Authority: CN
Inventors: 李永勃; 唐奉; 陈金玉; 程路训
Original assignee: Honor Device Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2022-08-16
Filing date: 2022-08-16
Publication date: 2023-10-24
Anticipated expiration: 2042-08-16
Also published as: CN116056409A

Abstract

The embodiment of the application discloses a shielding component of a main board and electronic equipment, the shielding component of the main board can be applied to electronic equipment such as mobile phones, tablets, computers and the like, the shielding frame body, the shielding cover and the radiating plate are of split structures, the shielding cover is formed by assembling, the shielding function is achieved, the radiating plate is provided with a plurality of radiating protrusions, the radiating area is increased, the radiating requirement is met, the structure and the forming process are relatively simple, and the shielding frame body, the shielding cover and the radiating plate can be formed by different materials to optimize the supporting, radiating and other performances of the formed shielding radiating structure, so that the working performance of the electronic equipment is improved.

Description

Shielding and radiating structure of main board and electronic equipment

Technical Field

The present application relates to the field of electronic products, and in particular, to a shielding assembly for a motherboard and an electronic device.

Background

The main board is an important component of electronic equipment such as a mobile phone, a flat board, a notebook computer and the like, and is provided with electronic elements such as a circuit, a chip and the like, wherein certain heat can be generated when the electronic elements work, especially the heat productivity of the chip is relatively large when the chip works, and a heat dissipation component is required to be arranged for dissipating heat of the chip. The current main heat dissipation mode is a forced cooling heat dissipation module, and the forced cooling heat dissipation module has a complex structure and a larger overall size. And shielding members are often provided to maintain proper operation of the electronic components inside and outside the motherboard, which further increases the structural complexity of the electronic device.

Therefore, how to simplify the structure of the electronic device as much as possible under the premise of meeting the heat dissipation and shielding functions is a technical problem to be solved by those skilled in the art.

Disclosure of Invention

The embodiment of the application provides a shielding component of a main board and electronic equipment, wherein the shielding component is simple in structure and molding process.

The first aspect of the application provides a shielding and heat dissipation structure of a main board, which comprises a shielding frame body, a shielding cover and a heat dissipation plate, wherein the shielding frame body, the shielding cover and the heat dissipation plate are of a split type structure and can form a shielding cover,

the shielding frame body comprises a circumferential side wall which is used for being supported on the main board and surrounding a cavity for accommodating the heating electronic part of the main board, and a first opening communicated with the cavity is formed in one side, away from the main board, of the shielding frame body;

the shielding cover is supported on the shielding frame body and covers the first opening, the shielding cover is provided with a fixing structure which is connected and positioned with the main board or the shielding frame body, a through hole is formed in a region of the shielding cover corresponding to at least part of the heating electronic parts, the heat dissipation plate is positioned in the through hole and is arranged on the shielding cover through the positioning piece, and a plurality of heat dissipation protrusions which are fixedly connected or integrated with the heat dissipation plate are arranged on the surface of the heat dissipation plate, which is away from the cavity; the heat dissipation plate can be in direct or indirect contact with the heat-generating electronic component located in the cavity. The shielding frame body has a supporting function on the shielding cover, and needs to have certain strength, and the shielding frame body and the shielding cover can be made of the same material, but can also be made of different materials. The shielding cover and the heat dissipation plate can be made of materials with higher heat conductivity coefficients, such as red copper or materials with heat conductivity coefficients higher than 180W/m.K, so that the heat dissipation efficiency of the shielding cover and the heat dissipation plate is improved, and of course, the heat dissipation plate and the shielding cover can also be made of different materials, and particularly, the heat conductivity coefficient of the heat dissipation plate can be red copper or materials with heat conductivity coefficients higher than 380W/m.K.

The shielding frame body, the shielding cover and the radiating plate are of split type structures, the shielding cover is formed by assembling, the shielding function is achieved, the radiating plate is provided with a plurality of radiating protrusions, the radiating area is increased, the radiating requirement is met, the structure and the forming process are simple, and the shielding frame body, the shielding cover and the radiating plate can be formed by different materials to optimize the supporting, radiating and other performances of the formed shielding radiating structure, and further the working performance of the electronic equipment is improved.

Based on the first aspect, the present example also provides a first implementation manner of the first aspect: along the thickness direction of the heat radiation plate, the position of the shielding cover relative to the shielding frame body can be adjusted to adjust the pressure applied by the heat radiation plate to the heating electronic component. Therefore, the overall thermal resistance can be reduced, the pressure born by the heating electronic component can be controlled to be between 5N and 25N, and the height position of the heat dissipation plate can be adjusted according to the pressure value born by the heating electronic component.

Based on the first embodiment of the first aspect, the present example further provides a second embodiment of the first aspect: elastic heat conducting materials are filled between the heat radiating plate and the heat generating electronic part, and heat of the heat generating electronic part is conducted to the heat radiating plate through the elastic heat conducting materials. The heat dissipation plate is in contact with the heating electronic component through the elastic heat conduction material, the elastic heat conduction material plays a role in elastic buffering, and the heating electronic component is protected on the premise of heat transfer.

Based on the second implementation manner of the first aspect, the present example further provides a third implementation manner of the first aspect: the elastic heat-conducting material comprises heat-conducting gel, heat-conducting rubber pad, silicone grease or liquid metal.

Based on the first to third embodiments of the first aspect, the present examples further provide a fourth embodiment of the first aspect: the fixed knot constructs and is connected with the mainboard cooperation. The fixing structure may be a bolt or a screw. In this embodiment, during the equipment, the shielding lid is direct fixed with the mainboard connection, need not to set up other connection structure on shielding framework, simplifies the processing technology of shielding framework to the shielding lid is in the mainboard fixed time, also exerts pressure in shielding framework simultaneously, compresses tightly shielding framework and mainboard.

Based on the fourth implementation manner of the first aspect, the present example further provides a fifth implementation manner of the first aspect: the shielding frame body is positioned on the main board under the action of the fixed connecting force of the shielding cover and the main board; the whole structure of the shielding heat dissipation structure is simple.

Or the shielding frame body is fixedly connected with the main board. The whole stability of the shielding heat dissipation structure is relatively high.

Based on the first aspect to the fifth implementation manner of the first aspect, the present examples further provide a sixth implementation manner of the first aspect: the shielding frame body material comprises copper oxide, red copper or copper alloy;

Or/and the shielding cover material is one of a five-series aluminum alloy or a six-series aluminum alloy;

or/and the material of the heat dissipation plate comprises red copper or metal with the heat conductivity coefficient of more than or equal to 180W/m.K;

or/and the material of the heat dissipation bulge comprises red copper or copper alloy with the heat conductivity coefficient of more than or equal to 380W/mK.

Based on the sixth implementation manner of the first aspect, the present examples further provide a seventh implementation manner of the first aspect: the shielding cover is fixedly connected with the radiating plate in a circumferential lap joint mode, so that the fixing reliability is relatively high.

Based on the seventh implementation manner of the first aspect, the present example further provides an eighth implementation manner of the first aspect: the shielding cover and the radiating plate are welded and fixed in the circumferential direction.

Based on the seventh or eighth implementation manners of the first aspect to the first aspect, the present examples further provide a ninth implementation manner of the first aspect: the joint edge of the heat radiation plate is in joint abutment with the surface of the shielding cover facing the cavity. Therefore, the outer surface formed after the heat dissipation plate and the shielding cover are connected can be smooth as much as possible, and external airflow can smoothly flow through the outer surfaces of the heat dissipation plate and the shielding cover.

Based on the ninth implementation manner of the first aspect, the present examples further provide a tenth implementation manner of the first aspect: the shielding cover is provided with a bending side wall bending towards one side of the main board, the bending side wall is located on the periphery of the circumferential side wall, one of the two surfaces corresponding to the bending side wall and the circumferential side wall is provided with a clamping block, and the other surface is provided with a clamping groove matched with the clamping block in a clamping mode. The shielding cover can be positioned on the shielding frame body in advance through the clamping connection, and then the shielding cover is fixedly connected with the main board, so that the installation efficiency and the position installation reliability of the shielding cover are improved.

Based on the first aspect to the tenth implementation manner of the first aspect, the present examples further provide an eleventh implementation manner of the first aspect: the circumference of the shielding cover is at least partially provided with an extension section parallel to the main board, and the extension section is fixedly connected with the main board through bolts or screws. The mode is simple in structure and reliable in fixation.

Based on the eleventh implementation manner of the first aspect, the present examples further provide a twelfth implementation manner of the first aspect: the electronic equipment further comprises fans, and the outer contours of the radiating protrusions are streamline so as to guide air flow at the air outlets of the fans to the air outlets of the electronic equipment shell. The outer contour of each heat radiation protrusion is streamline, so that the air flow of the air outlet of the fan can be guided to the air outlet of the electronic equipment shell. Through rationally setting up the bellied shape of heat dissipation for the heat dissipation is protruding except the effect of increase radiating area, can also play rectification and water conservancy diversion's effect. According to the embodiment, the air flow provided by the fan blows through the heat dissipation protrusions, heat transferred to the heat dissipation protrusions is taken away rapidly, the heat dissipation efficiency of the structure is improved, the resistance of streamline type of the heat dissipation protrusions to the air flow is smaller, the air flow is facilitated to pass through rapidly, and the heat dissipation efficiency is further improved.

Meanwhile, the mode that heating panel, heat dissipation arch and fan combine together is favorable to reducing the bellied quantity and the thickness of heating panel and heat dissipation, and then reduces heating panel and the bellied weight of heat dissipation.

Based on the twelfth implementation of the first aspect, the present example also provides a thirteenth implementation of the first aspect: the heat dissipation bulges are formed by a heat load topology optimization principle, wherein the heat load topology optimization principle adopts a variable density method, the minimum average temperature of a heat source is taken as an objective function, and the maximum heat dissipation efficiency is taken as a criterion.

Based on the thirteenth implementation manner of the first aspect, the present examples further provide a fourteenth implementation manner of the first aspect: the device also comprises a streamline convex body which is fixed on the outer wall of at least one of the shielding cover or the heat dissipation plate, a part of the streamline convex body is positioned on the shielding cover, the other part is positioned on the radiating plate, and the streamline convex body is used for rectifying and guiding part of air at the air outlet of the fan to the appointed position of the radiating plate.

The second aspect of the application also provides an electronic device, which comprises a shell, a main board and a shielding heat dissipation structure of the main board.

Based on the second aspect, the present examples further provide a first embodiment of the second aspect: the shell is provided with an air inlet and an air outlet, and the air inlet of the fan of the shielding heat dissipation structure of the main board is communicated with the air inlet of the shell.

Based on the second aspect to the first implementation manner of the second aspect, the present examples further provide a second implementation manner of the second aspect: a gap is arranged between one side surface of the main board, which is away from the shielding frame body, and the shell to form an air flow channel,

based on the second aspect to the second implementation manner of the second aspect, the present examples further provide a third implementation manner of the second aspect: the inner side wall of the shell is also provided with a baffle plate, the baffle plate separates the inner cavity of the shell into a first cavity and a second cavity, and the main board and the shielding heat dissipation structure are arranged in the first cavity; therefore, the air flow can be limited to flow in the first cavity, the heat dissipation efficiency is improved, the influence on the work of other electronic elements in the shell is avoided, and the overall performance of the electronic equipment is ensured. Thus, the heat dissipation efficiency of the main board can be improved.

The electronic equipment comprises the shielding heat dissipation structure of the main board, so the electronic equipment also has the technical effects of the shielding heat dissipation structure of the main board.

Drawings

FIG. 1 is a schematic front view of an electronic device provided in one example of the application;

FIG. 2 is a schematic rear view of the electronic device of FIG. 1;

FIG. 3 is a schematic diagram illustrating an assembly of a heat dissipation structure of a motherboard in the electronic device shown in FIG. 2 to a housing;

FIG. 4 is a schematic cross-sectional view of A-A in FIG. 3;

FIG. 5 is a schematic diagram illustrating an assembly of the shielding and heat dissipating structure of the motherboard of FIG. 3;

FIG. 6 is a schematic cross-sectional view of B-B in FIG. 5;

FIG. 7 is a front view of the heat dissipating structure and motherboard assembly structure of FIG. 5;

FIG. 8 is a three-dimensional schematic view of the shielding heat dissipation structure of FIG. 5;

FIG. 9 is an exploded view of the shielding heat dissipation structure of FIG. 8;

FIG. 10 is a schematic view illustrating an assembly of a heat dissipation structure of a motherboard in an electronic device to a housing according to another embodiment of the present application;

FIG. 11 is a three-dimensional schematic view of the shielding heat dissipation structure of FIG. 10;

fig. 12 is another view of the shielding heat dissipation structure of fig. 10.

Wherein, the one-to-one correspondence between the reference numerals and the component names in fig. 1 to 12 is as follows:

100 electronic devices;

a 101 housing; 101a side wall portions; 101b rear cover portion; 1011 first air outlets; 1012 a second air outlet; an air inlet 1013;

102, displaying a screen;

103 fans;

104, a main board;

105 separator plates;

106 shielding assembly; 1, shielding a frame body; 1a cavity; 11 a first sidewall; 12 a second sidewall; 13 a third sidewall; 14 a fourth sidewall; 15 a first opening; 2, shielding cover; a top wall 21; 22 bending the side wall; 23a first extension; 23' a second extension; 23a first through hole; 23a' a second through hole; 24 through holes; 25 inclined planes; 3, a heat dissipation plate; 31 heat dissipation protrusions; 4 streamline convex bodies.

DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION

In the description of the present application, it should be noted that, in the embodiments of the present application, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature.

In describing embodiments of the present application, it should be noted that, unless explicitly stated and limited otherwise, the terms "mounted," "connected," and "connected" should be construed broadly, and for example, "connected" may be either detachably connected or non-detachably connected; may be directly connected or indirectly connected through an intermediate medium. Wherein, "fixedly connected" means that the relative positional relationship is unchanged after being connected with each other. "rotationally coupled" means coupled to each other and capable of relative rotation after coupling. "slidingly coupled" means coupled to each other and capable of sliding relative to each other after being coupled.

References to orientation terms, such as "inner", "outer", etc., in the embodiments of the present application are only with reference to the orientation of the drawings, and thus, the use of orientation terms is intended to better and more clearly describe and understand the embodiments of the present application, rather than to indicate or imply that the apparatus or elements being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the embodiments of the present application. In addition, unless otherwise indicated herein, the term "plurality" as used herein refers to two or more.

In the description of embodiments of the present application, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

In the embodiment of the present application, "and/or" is merely an association relationship describing an association object, and indicates that three relationships may exist, for example, a and/or B may indicate: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.

In order to make the technical solution of the present application better understood by those skilled in the art, the present application will be further described in detail with reference to the accompanying drawings and specific embodiments.

The middle frame provided by the embodiment of the application can be applied to electronic equipment, wherein the electronic equipment can be mobile phones, tablet computers, tablet computer accessories, wearable equipment, vehicle-mounted equipment, augmented reality (augmented reality, AR)/Virtual Reality (VR) equipment, notebook computers, ultra-mobile personal computer (UMPC), netbooks, personal digital assistants (personal digital assistant, PDA) and other mobile terminals, or can also be professional shooting equipment such as digital cameras, single-lens/micro-lens cameras, motion cameras, cradle head cameras, unmanned aerial vehicles and the like.

Referring to fig. 1 and 2, fig. 1 is a schematic front view of an electronic device according to an embodiment of the application; fig. 2 is a schematic back view of the electronic device shown in fig. 1.

The electronic device 100 provided by the embodiment of the application comprises a display screen 102 and a housing 101. The main functions of the housing 101 are two-way, one providing a mounting base for the components of the electronic device 100 and the other providing protection for parts. The housing 101 may be formed therein with a receiving chamber inside which various components of the electronic device 100 may be disposed. In one example, the case 101 may include a side wall portion 101a and a rear cover portion 101b, and the display screen 102 and the rear cover portion 101b are separated on both sides of the side wall portion 101a in the thickness direction thereof. The side wall portion 101a and the rear cover portion 101b may be formed integrally or may be formed separately. The material of the casing 101 is not limited herein, and in specific practice, those skilled in the art may select according to actual needs; for example, the material may be a metal material, a plastic material, a ceramic material, a glass material, or the like.

The housing 101 may be formed with a cavity for mounting components of the electronic device. Specifically, the components installed in the cavity of the housing 101 may include a main board 104, a battery module, a wireless communication module, a camera module, an audio playing module, etc., and the arrangement positions and the installation modes of these components are not particularly limited in the present application. It will be appreciated by those skilled in the art that an electronic device may include one or more of the components listed above, and of course may include components not limited to those listed herein above, and may include other components.

At least part of the display screen 102 can be supported above the side wall portion 101a and connected to the side wall portion 101 a. The display 102 may be an organic light emitting diode display or a liquid crystal display, etc. The display screen 102 may be a flexible display screen or a hard display screen, where the flexible display screen may have a foldable function, and may be capable of implementing operations such as folding of the electronic device 100 in cooperation with a structural design of the housing 101. The display screen 102 may be a regular screen or a special-shaped screen, for example, an outer edge portion of the display screen 102 may be configured in an arc shape to form a curved screen.

The display screen 102 may be disposed on the front surface of the electronic device 100, may be disposed on the back surface of the electronic device 100, or may be disposed on both the front surface and the back surface of the electronic device 100. The front side of the electronic device 100 may be understood as the side facing the user when the user uses the electronic device 100, i.e. the side where the display screen 102 is located in fig. 1, and the back side of the electronic device 100 may be understood as the side facing away from the user when the user uses the electronic device 100.

Taking the front side of the electronic device 100 as an example, in terms of arrangement range, the display screen 102 may cover all areas on the front side of the electronic device 100, that is, the electronic device 100 may form a full screen, where the display screen 102 has not only a display function, but also a touch function, that is, the electronic device 100 may be operated by clicking the display screen 102; alternatively, the display screen 102 may cover only a partial area of the front surface of the electronic device 100, which is a possible choice in specific practice, and in this case, the display screen 102 may have a touch function or may have only a display function, and it is understood that, when only the display function is provided, a region of the housing 101 where the display screen 102 is not provided may be configured with corresponding man-machine operation components such as keys, so as to operate the electronic device 100, and these man-machine operation components may be provided at any position such as the front surface, the back surface, or the side surface of the electronic device 100.

The display screen 102 may include a display module and a transparent cover plate, which may be fixedly connected by an adhesive layer. The display module can display images, videos and the like, and the display module can comprise a touch screen, a luminous layer, a back plate layer, a substrate layer and other structural layers. The specific structure of the display module can be selected according to different products. The display module may be a liquid crystal display (liquid crystal display, LCD), an organic light-emitting diode (OLED), an active-matrix organic light-emitting diode (AMOLED) or an active-matrix organic light-emitting diode (matrix organic light emitting diode), a flexible light-emitting diode (flex), a quantum dot light-emitting diode (quantum dot light emitting diodes, QLED), or the like. The transparent cover plate covers the outer side of the display module and plays a role in protecting the display module. The transparent cover plate can be a glass cover plate, and can be other transparent materials with protection function.

For a mobile phone, the main board 104 may be a PCB (english Printed Circuit Board, chinese printed wiring board) which is composed of an insulating base board, connection wires and pads for assembling and soldering electronic components, and has the dual functions of a conductive line and an insulating base board. It can replace complex wiring, can realize wiring and electrical connection or electrical insulation between various electronic components, and provides required electrical characteristics. The electronics on motherboard 104 include chips, capacitors, resistors, etc., which generate heat during operation, and such electronics are collectively referred to herein as heat-generating electronics.

The motherboard 104 may be a single board, or may be a double or multi-layer board.

Referring to fig. 3 to 6, the present application provides a shielding and heat dissipating structure 106 of a motherboard, which includes a shielding frame 1, a shielding cover 2 and a heat dissipating plate 3, wherein the shielding frame 1, the shielding cover 2 and the heat dissipating plate 3 are in a split structure, that is, the shielding frame 1, the shielding cover 2 and the heat dissipating plate 3 are individually formed and assembled to form an integral structure. The shielding heat dissipation structure 106 serves two main purposes: the first and shielding heat dissipation structures 106 can isolate the heating electronic component (not shown in the figure) on the main board from the external environment, so that the mutual interference of signals when the heating electronic component and the components in the external environment work is avoided, and the normal work of the heating electronic component and the components in the external environment on the main board is ensured; and secondly, heat generated by the operation of the heating electronic parts on the main board is quickly conducted to the outside, so that heat accumulation of the main board is avoided, and the operation reliability of each heating electronic part on the main board is ensured.

Wherein the shielding frame 1, the shielding cover 2 and the heat dissipation plate 3 may be metals capable of playing a shielding role, wherein the shielding cover 2 is supported on the shielding frame 1, and the shielding frame 1 should have a predetermined strength to satisfy the supporting requirement. The heat generated by the operation of the heating electronic parts on the main board 104 is mainly and rapidly transferred to the heat dissipation plate 3, and rapidly dissipated through the heat dissipation plate 3, and meanwhile, the shielding cover 2 and the shielding frame body 1 can also play a role in assisting heat dissipation.

In the application, the shielding frame body 1 is provided with the circumferential side wall, the circumferential side wall is used for supporting the main board and enclosing a cavity 1a for accommodating the heating electronic component of the main board, namely, when the shielding frame body 1 is installed with the main board, the circumferential side wall is positioned at the periphery of the heating electronic component, and the heating electronic component can be positioned in the cavity 1a enclosed by the circumferential side wall. As will be appreciated in connection with fig. 8, in one example the shielding housing 1 is generally rectangular in cross-section, and the peripheral side walls include a first side wall 11, a second side wall 12, a third side wall 13 and a fourth side wall 14, the four side walls enclosing a cavity for receiving the heat generating electronic components. Of course, the shape of the opening surrounded by the circumferential side wall is related to the arrangement of the heat-generating electronic components on the motherboard 104, and may be, depending on the specific product, not limited to the rectangular structure described herein, but may be a circular or trapezoid structure. In one specific example, the length dimension is 45-100mm, the width is 20-50mm, the thickness is less than 0.4mm, the overall flatness is less than 25um, and the stamping forming is adopted.

The side of the shielding frame body 1 far away from the main board is further provided with a first opening 15, the first opening 15 is communicated with the accommodating cavity, that is, two ends of the shielding frame body 1 are opened, one end of the opening faces the main board to enable the heating electronic component on the main board to enter the cavity, and the other end of the opening (the first opening 15) is covered with the shielding cover 2, that is, the shielding cover 2 is supported on the shielding frame body 1 and covers the first opening 15. The shielding cover 2 has a fixing structure fixedly connected with the main board or the shielding frame 1, the shielding cover 2 can be fixed on the shielding frame 1 through the fixing structure, and the shielding cover 2 can be directly fixed on the main board through the fixing structure. The fixing structure can be in a detachable mode such as a screw or a bolt, so that the later maintenance of the heating electronic part in the cavity 1a is facilitated; of course, the fixing structure can also be in a non-detachable mode such as bonding or welding.

Referring to fig. 9, in the present application, the area of the shielding cover 2 corresponding to at least part of the heat-generating electronic components is provided with a through hole 24, and the projection of the through hole 24 on the motherboard can completely cover the heat-generating electronic components located inside the cavity, or can cover only part of the heat-generating electronic components inside the cavity. The heat dissipation plate 3 is located in the through hole and is mounted on the shielding cover 2 through the positioning piece, the heat dissipation plate 3 can completely block the through hole, and of course, only part of the through hole area can be blocked, and the heat dissipation plate 3 can be positioned on the shielding cover 2 through welding or bolts or screws. In this way, the shield case 1, the shield cover 2, and the heat dissipation plate 3 can be assembled to form a shield case, and can play a shielding role.

The surface of the heat dissipation plate 3 facing away from the cavity is provided with a plurality of heat dissipation protrusions 31 fixedly connected or integrated with the heat dissipation plate, wherein the broken line in fig. 5 is an integral structure formed by the heat dissipation protrusions. The heat dissipation protrusions 31 may be integrally formed with the heat dissipation plate 3, for example, the heat dissipation protrusions 31 and the heat dissipation plate 3 may be manufactured by CNC (english full name: computer numerical control, chinese is computer numerical control), etching, 3D printing or die casting, or of course, each heat dissipation protrusion 31 may be formed separately and then fixedly connected with the heat dissipation plate 3 by a welding process or a mechanical connector. The heat dissipation plate 3 can directly or indirectly contact with the heat-generating electronic component located in the cavity, so that most of heat of the heat-generating electronic component can be quickly conducted to the heat dissipation plate 3, and the heat is transferred to the outside through the heat dissipation protrusions 31 on the heat dissipation plate 3 and the outer wall, and of course, a small part of heat can be conducted to the outside through the shielding frame body 1 and the shielding cover 2.

As can be seen from the above description, the shielding frame 1, the shielding cover 2 and the heat dissipation plate 3 are in a split structure, and are assembled to form the shielding cover, so that the processing technology is relatively simple, and the three can be formed by different materials to optimize the supporting and heat dissipation performances of the formed shielding heat dissipation structure 106, so as to further improve the working performance of the electronic device.

In one example, the material of the shielding frame body 1 may be any one of copper oxide, red copper or copper alloy, and the shielding cover material is one of a five-series aluminum alloy or a six-series aluminum alloy; the heat conductivity of the shielding cover 2 can be 140-400W/m·k, i.e., the heat conductivity of the shielding cover 2 can be any value in the above range. Of course, the thermal conductivity of the shield case 1 may be 140W/mK-400W/mK.

In the application, the radiating plate 3 and the radiating protrusions 31 can adopt red copper, the red copper heat conduction system is usually 380-400W/m.K, and of course, the radiating plate 3 can also adopt metal with the heat conduction coefficient more than or equal to 180W/m.K; the heat dissipating protrusion 31 may be made of a metal having a thermal conductivity of 280W/m·k or more, and in one example, the heat conducting system of the heat dissipating plate 3 and the heat dissipating protrusion 31 may be 340W/m·k or more. In theory, the higher the heat conductivity coefficient of the heat dissipation plate 3 is, the more favorable the heat spontaneous heating electronic component is transferred to the heat dissipation plate 3 rapidly, and the use environment requirement and the use cost are considered, so that a person skilled in the art can reasonably select a proper material according to the disclosure. In one example, the heat dissipating bump material may be a copper alloy having a thermal conductivity greater than or equal to 380W/mK.

In the application, along the thickness direction of the heat radiation plate 3, the position of the shielding cover 2 relative to the shielding frame body 1 can be adjusted to adjust the pressure applied to the heat radiation plate 3 on the heat radiation electronic components, so that the overall thermal resistance can be reduced, the pressure born by the heat radiation electronic components can be controlled between 5N and 25N, and the height position of the heat radiation plate 3 can be adjusted according to the pressure value born by the heat radiation electronic components.

As described above, the heat dissipation plate 3 applies a predetermined pressure to the heat-generating electronic component, so in order to avoid damage to the heat-generating electronic component caused by direct contact between the heat dissipation plate 3 and the heat-generating electronic component, an elastic heat conduction material (not shown in the figure) may be filled between the heat dissipation plate 3 and the heat-generating electronic component, and the heat of the heat-generating electronic component is conducted to the heat dissipation plate 3 through the elastic heat conduction material, so that the heat dissipation plate 3 contacts with the heat-generating electronic component through the elastic heat conduction material, and the elastic heat conduction material plays a role of elastic buffering, so that the heat-generating electronic component is protected under the premise of playing a role of heat transfer.

The resilient thermally conductive material may comprise a thermally conductive gel, a thermally conductive gel pad, silicone grease, or liquid metal.

The surface of the heat dissipation plate 3 facing the elastic heat conductive material may be a plane, and in one example, the thickness of the heat dissipation plate 3 ranges from 0.4mm to 1mm.

In the application, the fixing structure of the shielding cover 2 is matched with the main board 104 for connection and positioning, and the fixing structure can be a bolt or a screw. In this embodiment, when assembling, the shielding cover 2 is directly connected and fixed with the motherboard 104, no other connection structure is required to be arranged on the shielding frame 1, so as to simplify the processing technology of the shielding frame 1, and when the shielding cover 2 is fixed on the motherboard 104, pressure is applied to the shielding frame 1 at the same time, so as to compress the shielding frame 1 and the motherboard 104.

As described above, the shielding frame 1 can be positioned on the motherboard 104 under the fixed connection force of the shielding cover 2 and the motherboard 104; of course, the shielding frame 1 and the motherboard 104 may be separately and fixedly connected, for example, the shielding frame 1 is fixedly connected with the motherboard 104 by welding. In this way, the fixing reliability of the shield case 1 to the motherboard 104 is relatively high.

Referring to fig. 6, in the present application, the shielding cover 2 and the heat dissipation plate 3 may be fixedly connected in a lap joint manner, that is, the shielding cover 2 and the heat dissipation plate 3 are circumferentially overlapped, and the overlapped parts are fixedly connected, and the fixed connection manner may be a welding manner, or may be a screw or other manners. The width S of the overlapping portion may be selected reasonably according to the product.

In a specific example, the overlapping edge of the heat dissipation plate 3 abuts against the surface of the shielding cover 2 facing the cavity in a lap joint manner, that is, the overlapping edge of the heat dissipation plate 3 abuts against the surface of the shielding cover 2 facing the main board 104, so that the external surface formed by connecting the heat dissipation plate 3 and the shielding cover 2 can be as smooth as possible, and external airflow smoothly flows through the external surfaces of the heat dissipation plate 3 and the shielding cover 2.

Referring to fig. 5, in the present application, the shielding cover 2 includes a top wall 21 and a bent side wall 22 connected to the top wall 21, the bent side wall 22 is bent towards one side of the main board 104, the bent side wall 22 is located at the periphery of the peripheral side wall, one of two surfaces corresponding to the bent side wall 22 and the peripheral side wall is provided with a clamping block (not shown in the figure), and the other one is provided with a clamping groove in clamping engagement with the clamping block, wherein the bent side wall may be a side wall with 360-degree circumferential continuity from the shielding cover, or may be a side wall section formed by bending at a partial circumferential position of the shielding cover 2, and two or more side wall sections are circumferentially provided. The side wall of bending can be provided with a clamping block and a clamping groove, and the number of the clamping blocks or the clamping grooves can be determined according to specific conditions.

In the above embodiment, the shielding cover 2 may be pre-positioned on the shielding frame 1 through the matching of the clamping block and the clamping groove, and then the shielding cover 2 is fixedly connected with the motherboard 104, so as to improve the installation efficiency of the shielding cover 2.

The specific form of the clamping block and the clamping groove is not limited, and the clamping connection of the clamping block and the clamping groove can be realized. For example, the clamping block can be an arc-shaped convex block, and the clamping groove is an arc-shaped concave surface.

In the present application, at least part of the peripheral edge of the shielding cover 2 is further provided with an extension section parallel to the main board 104, the extension section is fixedly connected with the main board 104 through bolts or screws, as shown in fig. 5 to 9, through holes for the bolts or screws to pass through are formed in the extension section, and the connection end of the screws can pass through the through holes in the extension section and be fixedly connected with the main board 104. The extension in fig. 5 includes two types: a first extension 23 and a second extension 23', the first extension 23 being provided with a first through hole 23a for a bolt or screw to pass through. The second extension section 23' has a second through hole 23a ', the position of the shielding cover 2 in the height direction is adjustable as described above, and the bolt passes through the second through hole 23a ' and the corresponding through hole on the main board 104 to connect with the lock nut, and the position of the shielding cover 2 is adjusted by adjusting the position of the lock nut on the bolt. Of course, it is also possible to provide only the first extension 23, as shown in fig. 10 and 11.

For bolting, through holes may also be pre-machined in the main plate 104, and bolts are passed through both the through holes in the extension and the through holes in the main plate 104 to connect the lock nuts.

The shielding and heat dissipating structure 106 of the present application further includes a fan, the fan is mounted inside the housing, the housing is provided with an air inlet and an air outlet, please refer to fig. 2 again, the air inlet may be disposed at a rear cover portion of the housing, the air outlet may be disposed at a side wall portion, a first air outlet 1011 and a second air outlet 1012 are disposed on two side walls of the side wall portion, respectively, and of course, the disposition positions of the air inlet and the air outlet may not be limited to the form described herein, and may be reasonably disposed according to specific electronic products. Referring to fig. 3 and 4, an air inlet of the fan is communicated with an air inlet of the housing, and an air outlet 103a of the fan faces the shielding cover formed by the shielding frame, the heat dissipation plate 3 and the shielding cover 2.

The outer contour of each heat dissipating boss 31 is streamline in the present application, so as to guide the air flow from the air outlet of the fan to the air outlet of the electronic device housing. Through the shape of reasonable setting heat dissipation protruding 31 for heat dissipation protruding 31 can also play rectification and water conservancy diversion's effect in addition to the effect of increase radiating area. In this embodiment, the air flow provided by the fan blows over the heat dissipation protrusions, so that heat transferred to the heat dissipation protrusions is taken away quickly, the heat dissipation efficiency of the structure is improved, and the streamline resistance of the heat dissipation protrusions 31 to the air flow is smaller, so that the air flow can pass through quickly, and the heat dissipation efficiency is further improved.

Meanwhile, the mode that heating panel 3, heat dissipation protruding 31 and fan combine together is favorable to reducing the size of heating panel 3 and the quantity and the thickness of heat dissipation protruding 31, and then reduces the weight of heating panel 3 and heat dissipation protruding 31.

In a specific example, each heat dissipating bump 31 may be formed by a heat load topology optimization principle, wherein the heat load topology optimization principle is to use a variable density method, and a minimum heat source average temperature is taken as an objective function, and a maximum heat dissipating efficiency is taken as a criterion. The minimum heat source average temperature is the temperature to which the heat radiation plate 3 and the heat radiation protrusion 31 are integrally exposed, which is related to the arrangement, type, fan outlet position, and case outlet position of the heat generating electric device.

The topology optimization is to determine the spatial distribution of the limited material in the design domain (i.e. the spatial distribution of the material in the design domain is used as a design variable), so that the topology structure meets optimization criteria such as maximum rigidity or full stress, maximum heat dissipation efficiency and the like under specific conditions.

In the design area Ω, under the conditions of a certain material quantity V and n constraints fn (ρ), searching for an optimal solution ρ that makes the objective function f0 (ρ) reach an extremum, wherein the mathematical model is as follows:

wherein x= { X ₁ ，x ₂ ，……,x _i ，……,x _N The design vector can be relative density, relative thickness or relative elastic modulus, etc., and the minimum value is slightly more than 0 to prevent singular;

N is the total unit number;

F. u and K are respectively an integral load matrix, a displacement matrix and an integral rigidity matrix;

u _e and k _e The unit displacement array and the unit stiffness array are respectively arranged;

f is the volume coefficient;

v (X) and V ₀ The optimized material volume and the initial material volume are respectively;

ρ is a penalty factor.

The variable density method involves a difference method, finite element analysis, elastic mechanics and OC optimization criteria, firstly, after the model is meshed, the density in each grid is designed to be 0 or 1 (wherein 0 represents no material in the grid and 1 represents filling material), the problem becomes a discrete problem, interpolation is performed between 0 and 1, the problem becomes a continuity problem, but only the grid with the density of 0 or 1 needs to be left after optimization, and all intermediate density units finally tend to be 0 or 1 by using a penalty function.

From the description herein above, those skilled in the art will be able to ascertain how to implement the above-described embodiments based on their own basic knowledge in the art.

The shape and arrangement form of the heat dissipation protrusions 31 have a certain relation with the air inlet, the air outlet and the above parameters, and the shape and arrangement form of the heat dissipation protrusions 31 are different according to different parameter settings, and specific structures of the two heat dissipation protrusions 31 are given herein, please refer to fig. 7 and 9 for one arrangement form of the heat dissipation protrusions 31 formed by topology optimization, and fig. 10 to 11 for another arrangement form of the heat dissipation protrusions 31 formed by topology optimization. The shielding cover 2 is further provided with a bevel 25 at a position close to the air outlet of the fan for guiding the fluid.

When the air outlet of the fan is far from the heat radiation protrusion 31, the present application may be further arranged as follows.

The shielding and heat dissipation structure 106 in the application further comprises a streamline convex body 4 which is fixed on the outer wall of at least one of the shielding cover 2 or the heat dissipation plate 3, one part of the streamline convex body 4 is positioned on the shielding cover 2, the other part of the streamline convex body is positioned on the heat dissipation plate 3, the streamline convex body 4 is used for rectifying and guiding part of the air at the air outlet of the fan to the appointed position of the heat dissipation plate 3, the streamline convex body 4 increases the heat dissipation area of the shielding and heat dissipation structure 106 to a certain extent, on the other hand, the streamline convex body can play a role in rectifying and guiding the air flow blown by the fan, the air flow resistance is reduced, the air flow better flows through the channels among the heat dissipation convex bodies 31, and the heat dissipation efficiency is further improved.

The rectifying and drainage functions can be realized by reasonably arranging the shape of the streamline convex body 4, for example, a part of the streamline convex body 4 close to the air outlet position of the fan has the rectifying function, and a section far away from the air outlet position has the drainage function.

The streamline convex body 4 can be made of the same material as the heat dissipation plate 3 or the shielding cover 2, the streamline convex body 4 and the heat dissipation plate 3 or the streamline convex body 4 and the shielding cover 2 can be integrally formed, of course, the streamline convex body 4 can also be independently formed, for example, manufactured by CNC (computerized numerical control of English: computer numerical control), etching, 3D printing or die casting, and then fixed with the heat dissipation plate 3 or the shielding cover 2 by welding, and the forming process is simple.

In one example, the streamlined nose 4 has a cross-sectional width of 0.3-3mm and a height of 0.2-1.5mm.

The heights of the heat radiation protrusions 31 and the streamline protrusions 4 are not higher than the upper edge of the air outlet of the fan, that is, the heat radiation protrusions 31 and the streamline protrusions 4 are located in the height range of the air outlet of the fan as much as possible, so that the air flow of the fan is better contacted with the heat radiation protrusions 31 and the streamline protrusions 4.

The streamline convex body 4 and each radiating convex body 31 are parallel to the two sides of the main board and are planes, and the vertical surface between the two planes is set to be streamline for rectification or diversion.

In the application, a gap is formed between one side surface of the main board 104, which is away from the shielding frame body 1, and the shell so as to form an air flow channel, and an air flow part blown out by the fan can flow between the main board 104 and the shell, so that the side surface of the main board 104, which faces the shell, can be further cooled, and the effect of rapid heat dissipation of the main board 104 is achieved. The main board 104 may be supported to the housing by a support member to form an airflow channel, and the specific structure of the support member is not described herein.

In order to avoid the influence of the air flow generated by the fan on the operation of other parts in the shell, the application can also be arranged as follows.

The inner side wall of the shell is also provided with a partition plate 105, the partition plate 105 separates the inner cavity of the shell into a first cavity and a second cavity, and the main board 104 is provided with a shielding and heat dissipation structure 106 in the first cavity. The air inlet 1013 and the air outlet are arranged on the cavity wall of the first cavity, so that air flow can be limited to flow in the first cavity, the heat dissipation efficiency is improved, the influence on the work of other electronic elements in the shell is avoided, and the integral performance of the electronic equipment is ensured.

It should be noted that, the welding may be spot welding, laser welding, resistance welding, diffusion welding, or the like.

Furthermore, the present application also provides an electronic device 100, including the shielding heat dissipation structure 106 described in any one of the above.

The electronic device 100 in this application includes a shielding heat dissipation structure, so both also have the above-mentioned technical effects of the shielding heat dissipation structure.

The principles and embodiments of the present application have been described herein with reference to specific examples, the description of which is intended only to facilitate an understanding of the method of the present application and its core ideas. It should be noted that it will be apparent to those skilled in the art that various modifications and adaptations of the application can be made without departing from the principles of the application and these modifications and adaptations are intended to be within the scope of the application as defined in the following claims.

Claims

1. A shielding and heat dissipation structure of a main board is characterized by comprising a shielding frame body, a shielding cover and a heat dissipation plate, wherein the shielding frame body, the shielding cover and the heat dissipation plate are of split type structure and can form a shielding cover,

the shielding frame body comprises a circumferential side wall which is used for being supported on the main board and enclosing a cavity for accommodating the heating electronic part of the main board, and one side of the shielding frame body, which is far away from the main board, is also provided with a first opening communicated with the cavity;

The shielding cover is supported on the shielding frame body and covered on the first opening, the shielding cover is provided with a fixing structure which is connected and positioned with the main board or the shielding frame body, a through hole is formed in a region of the shielding cover corresponding to at least part of the heating electronic parts, the heat dissipation plate is positioned in the through hole and is installed on the shielding cover through a positioning piece, and a plurality of heat dissipation protrusions which are fixedly connected with or integrated with the heat dissipation plate are arranged on the surface of the heat dissipation plate, which is away from the cavity; the heat dissipation plate can be directly or indirectly contacted with the heating electronic component positioned in the cavity;

the outer contour of each radiating protrusion is streamline so as to guide the air flow of the air outlet of the fan to the air outlet of the electronic equipment shell;

the fan cooling device comprises a fan, a shielding cover, a cooling plate, a streamline convex body, a fan air outlet, a fan cover and a cooling plate, wherein the fan is arranged at the periphery of the cooling plate, the cooling plate is arranged at the periphery of the fan air outlet, and the cooling plate is arranged at the periphery of the fan air outlet.

2. The shielding and heat dissipating structure of the motherboard of claim 1, wherein the position of the shielding cover relative to the shielding frame is adjustable along the thickness direction of the heat dissipating plate to adjust the pressure applied by the heat dissipating plate to the heat generating electronic component.

3. The shielding and heat dissipating structure of the motherboard of claim 2, wherein an elastic heat conducting material is filled between the heat dissipating plate and the heat generating electronic component, and heat of the heat generating electronic component is conducted to the heat dissipating plate through the elastic heat conducting material.

4. The motherboard shielding heat dissipation structure of claim 3 wherein said elastic heat conductive material comprises a heat conductive gel, a heat conductive gel pad, silicone grease, or a liquid metal.

5. The shielding and heat dissipating structure of a motherboard of any of claims 2 to 4, wherein the securing structure is cooperatively coupled to the motherboard.

6. The shielding and heat dissipating structure of the motherboard of claim 5, wherein said shielding frame is positioned on said motherboard under a fixed connection force of said shielding cover to said motherboard;

or, the shielding frame body is directly and fixedly connected with the main board.

7. The shielding and heat dissipating structure of a motherboard according to any one of claims 1 to 4, wherein the shielding frame material comprises copper oxide, red copper or copper alloy;

Or/and the material of the heat dissipation bulge comprises red copper or copper alloy with the heat conduction coefficient of more than or equal to 380W/m.K.

8. The shielding and heat dissipating structure of a motherboard according to any one of claims 1 to 4, wherein the shielding cover and the heat dissipating plate are fixedly connected in a lap joint in a circumferential direction.

9. The shielding and heat dissipating structure of the motherboard of claim 8, wherein said shielding cover and said heat dissipating plate are welded and fixed circumferentially.

10. The shielding heat dissipating structure of claim 9, wherein the joining edge of the heat dissipating plate is joined to and abuts against a surface of the shielding cover facing the cavity.

11. The shielding and heat dissipating structure of a motherboard as set forth in any one of claims 1 to 4, wherein the shielding cover has a bent sidewall bent toward one side of the motherboard, the bent sidewall being located at the periphery of the peripheral sidewall, one of two surfaces of the bent sidewall and the peripheral sidewall corresponding to each other being provided with a clip block, and the other one being provided with a clip groove in snap fit with the clip block.

12. The shielding and heat dissipating structure of a motherboard according to any one of claims 1 to 4, wherein at least part of the peripheral edge of the shielding cover further has an extension parallel to the motherboard, and the extension is fixedly connected to the motherboard by a bolt or a screw.

13. The shielding and heat dissipating structure of the motherboard of claim 11, wherein at least part of the peripheral edge of the shielding cover further has an extension parallel to the motherboard, and the extension is fixedly connected to the motherboard by a bolt or a screw.

14. The motherboard shielding heat dissipation structure of claim 11 further comprising a fan having an air outlet facing said shield.

15. The shielding and heat dissipating structure of the motherboard of any of claims 1 to 4, wherein each of the heat dissipating protrusions is formed by a thermal load topology optimization principle, wherein the thermal load topology optimization principle is a variable density method, and a minimum heat source average temperature is an objective function, and a maximum heat dissipating efficiency is a criterion.

16. An electronic device comprising a housing, a motherboard, and a shielding heat dissipation structure of the motherboard of any one of claims 1 to 15.

17. The electronic device of claim 16, wherein the housing has an air inlet and an air outlet, and the air inlet of the fan of the shielded heat dissipating structure of the motherboard is in communication with the air inlet of the housing.

18. The electronic device of claim 16 or 17, wherein a side of the motherboard facing away from the shielding frame has a gap with the housing to form an airflow channel.

19. The electronic device of claim 16 or 17, wherein the interior side wall of the housing further has a partition separating the housing interior cavity into a first cavity and a second cavity, the motherboard and the shielded heat dissipation structure being mounted to the first cavity.

20. The electronic device of claim 18, wherein the interior side wall of the housing further has a partition separating the housing interior cavity into a first cavity and a second cavity, the motherboard and the shielded heat dissipation structure being mounted to the first cavity.