CN115243526A

CN115243526A - Electronic device

Info

Publication number: CN115243526A
Application number: CN202210950849.XA
Authority: CN
Inventors: 陈松林
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2022-08-09
Filing date: 2022-08-09
Publication date: 2022-10-25

Abstract

The application provides an electronic device. The electronic equipment of the embodiment of the application comprises a middle frame; the circuit board is arranged on the middle frame and comprises a substrate, a first heat source and a second heat source, the first heat source and the second heat source are arranged on two opposite surfaces of the substrate, and the second heat source is arranged to face the middle frame; the shell assembly is arranged on one side, provided with the circuit board, of the middle frame, is provided with a first air duct communicated with the outside, and is in heat conduction connection with the first heat source; the gas driving mechanism penetrates through the middle frame, is respectively communicated with the first air channel and the outside, and is used for driving gas to flow in the first air channel so as to dissipate heat of the first heat source; and the radiating fin is arranged on one side of the middle frame, which is far away from the shell component, and is in heat conduction connection with the gas driving mechanism and the second heat source respectively and used for radiating the second heat source. The electronic equipment of this application embodiment has better radiating efficiency.

Description

Electronic device

Technical Field

The application relates to the field of electronics, in particular to an electronic device.

Background

At present, electronic equipment's function is more and more, and consequently, the load of its system on chip (SOC chip), radio frequency chip, power chip etc. is bigger and bigger, leads to the calorific capacity of electronic equipment unit interval to be bigger and bigger, and current electronic equipment radiating component can not be fine satisfying electronic equipment's heat dissipation demand already.

Disclosure of Invention

In view of the above problems, embodiments of the present application provide an electronic device with better heat dissipation efficiency.

An embodiment of the present application provides an electronic device, which includes:

a middle frame;

the circuit board is arranged on the middle frame and comprises a substrate, a first heat source and a second heat source, wherein the first heat source and the second heat source are arranged on two opposite surfaces of the substrate, and the second heat source is arranged to face the middle frame;

the shell assembly is arranged on one side, provided with the circuit board, of the middle frame, is provided with a first air duct communicated with the outside, and is in heat conduction connection with the first heat source;

the gas driving mechanism penetrates through the middle frame, is respectively communicated with the first air channel and the outside, and is used for driving gas to flow in the first air channel so as to dissipate heat of the first heat source; and

and the radiating fin is arranged on one side of the middle frame, which is far away from the shell component, and is in heat conduction connection with the gas driving mechanism and the second heat source respectively and used for radiating the second heat source.

The electronic equipment of this application embodiment sets up first wind channel on the casing subassembly, and the casing subassembly is connected with first heat source heat conduction, and when gaseous actuating mechanism opened, gaseous actuating mechanism drive gas got into by first wind channel, discharged behind gaseous actuating mechanism to take out the electronic equipment outside with the heat that first heat source produced, dispel the heat to first heat source. In addition, the radiating fins are respectively in heat conduction connection with the gas driving mechanism and the second heat source, heat generated by the second heat source can be dissipated through the radiating fins, and when the gas flows through the gas driving mechanism, the heat on the radiating fins can be taken away, so that the heat on the radiating fins can be taken out of the electronic equipment, the heat dissipation of the second heat source is accelerated, and the heat dissipation efficiency of the radiating fins is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 2 is a schematic structural diagram of an electronic device according to an embodiment of the present application from another perspective.

Fig. 3 isbase:Sub>A schematic cross-sectional structure view of an electronic device according to an embodiment of the present application alongbase:Sub>A-base:Sub>A direction in fig. 2.

Fig. 4 is an exploded view of an electronic device according to an embodiment of the present application.

Fig. 5 is an enlarged view of the dotted box I in fig. 3 of the present application.

Fig. 6 is a schematic structural diagram of a middle frame according to an embodiment of the present application.

Fig. 7 is a schematic structural diagram of a housing assembly according to an embodiment of the present application.

Fig. 8 is a schematic structural diagram of a driving mechanism according to an embodiment of the present application.

Fig. 9 is an assembly relationship diagram of a driving mechanism, a heat sink and a first thermal conductive coating according to an embodiment of the present application.

Fig. 10 is an assembly relationship diagram of a circuit board, a first shielding assembly and a second shielding assembly according to an embodiment of the present application.

Description of the reference numerals:

100-electronic equipment, 10-middle frame, 101-air inlet channel, 1011-first air inlet sub-channel, 1012-second air inlet sub-channel, 102-air outlet channel, 103-through hole, 104-through hole, 20-circuit board, 21-substrate, 23-first heat source, 25-second heat source, 30-shell component, 301-first air duct, 302-second air duct, 31-shell, 33-heat conducting fin, 40-gas driving mechanism, 41-metal shell, 50-heat radiating fin, 60-display screen, 71-first heat conducting coating, 72-second heat conducting coating, 73-third heat conducting coating, 74-fourth heat conducting coating, 75-fifth heat conducting coating, 80-first shielding component, 81-first shielding piece, 83-second shielding piece, 90-second shielding component, 91-third shielding piece and 93-fourth shielding piece.

Detailed Description

In order to make the technical solutions of the present application better understood, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms "first," "second," and the like in the description and claims of the present application and in the above-described drawings are used for distinguishing between different objects and not for describing a particular order. Furthermore, the terms "include" and "have," as well as any variations thereof, are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus.

The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.

It should be noted that, for convenience of description, like reference numerals denote like parts in the embodiments of the present application, and a detailed description of the like parts is omitted in different embodiments for the sake of brevity.

A middle frame of an electronic device (e.g., a mobile phone, a tablet, etc.) generally includes a metal, which has good thermal conductivity, so that a chip with a large heat generation amount, such as a system on chip (SOC chip), on the electronic device is generally disposed on a surface of a circuit board facing the middle frame. In order to dissipate heat from a heat generating chip such as a system-on-chip, a heat sink such as a vapor chamber may be provided on the chip to dissipate heat from the heat generating chip.

In view of this, an embodiment of the present application provides an electronic device 100, where the electronic device 100 of the embodiment of the present application may be, but is not limited to, a portable electronic device 100 such as a mobile phone, a tablet computer, a notebook computer, a desktop computer, a smart band, a smart watch, an electronic reader, a game machine, and the like, and in the following embodiments of the present application, the electronic device 100 is exemplified by a mobile phone and should not be construed as limiting the electronic device 100 of the present application.

Referring to fig. 1 to 4, the present application provides an electronic device 100, which includes a middle frame 10, a circuit board 20, a housing assembly 30, a gas driving mechanism 40, and a heat sink 50. The circuit board 20 is arranged on the middle frame 10, the circuit board 20 comprises a substrate 21, and a first heat source 23 and a second heat source 25 which are arranged on two opposite surfaces of the substrate 21, and the second heat source 25 is arranged to face the middle frame 10; the shell assembly 30 is arranged on one side of the middle frame 10, where the circuit board 20 is arranged, the shell assembly 30 is provided with a first air duct 301 communicated with the outside, and the shell assembly 30 is in heat conduction connection with the first heat source 23; the gas driving mechanism 40 penetrates through the middle frame 10, is respectively communicated with the first air channel 301 and the outside, and is used for driving gas to flow in the first air channel 301 so as to dissipate heat of the first heat source 23; the heat sink 50 is disposed on a side of the middle frame 10 away from the housing assembly 30, and the heat sink 50 is connected to the gas driving mechanism 40 and the second heat source 25 in a heat conducting manner, respectively, for dissipating heat from the second heat source 25.

The term "thermally conductive connection" refers to a connection between two components that allows heat to be conducted between the two components, that may be directly connected, and that may be connected through other thermally conductive components. The term "in communication" means that a gas or gas stream can flow between two components in communication.

It is understood that the middle frame 10 is stacked with the housing assembly 30, and the circuit board 20 is disposed between the middle frame 10 and the housing assembly 30. The gas driving mechanism 40 and the circuit board 20 are disposed at an interval and are supported on the middle frame 10.

Alternatively, the first heat source 23 may be, but is not limited to, at least one of a radio frequency chip, a power management chip, and the like. Optionally, the number of the first heat sources 23 may be one or more, when the number of the first heat sources 23 is plural, the plural first heat sources 23 are disposed at intervals on the surface of the substrate 21 facing the housing assembly 30, and the plural first heat sources 23 are all in heat conduction connection with the housing assembly 30.

Alternatively, the second heat source 25 may be, but is not limited to, a system on chip (SOC chip) or the like. Alternatively, the number of the second heat sources 25 may be one or more, and when the number of the second heat sources 25 is multiple, multiple second heat sources 25 are arranged at intervals on the surface of the substrate 21 facing the middle frame 10, and the multiple second heat sources 25 are all in heat conduction connection with the heat sink 50.

Alternatively, the gas driving mechanism 40 may be, but is not limited to, a fan (such as a micro fan), a blower (micro blower), or other devices capable of driving gas to flow.

It is to be understood that the heat sink 50 is carried by the middle frame 10, and the heat sink 50 may be bonded to the middle frame 10 by gluing or the like.

Alternatively, the heat sink 50 may be, but is not limited to, a heat dissipating member having high thermal conductivity, such as a vapor chamber, a heat dissipating metal plate, or the like. The vapor chamber has good heat dissipation performance, and can improve the heat dissipation effect of the second heat source 25.

Optionally, the heat sink 50 extends from a side of the second heat source 25 facing away from the gas drive mechanism 40 to a side of the gas drive mechanism 40 facing away from the heat sink 50. This can improve the heat radiation efficiency of the heat radiation fins 50 and the heat radiation effect of the second heat source 25.

The electronic device 100 according to the embodiment of the application is provided with the first air duct 301 on the housing assembly 30, the housing assembly 30 is in heat conduction connection with the first heat source 23, when the gas driving mechanism 40 is opened, the gas driving mechanism 40 drives the gas to enter from the first air duct 301 and to be discharged after passing through the gas driving mechanism 40, so that the heat generated by the first heat source 23 is taken out of the electronic device 100 to dissipate the heat of the first heat source 23. In addition, the heat sink 50 is respectively connected with the gas driving mechanism 40 and the second heat source 25 in a heat conducting manner, and heat generated by the second heat source 25 is dissipated through the heat sink 50, and when the gas flows through the gas driving mechanism 40, the heat on the heat sink 50 can be taken away, so that the heat on the heat sink 50 can be taken out of the electronic device 100, the heat dissipation of the second heat source 25 is accelerated, and the heat dissipation efficiency of the heat sink 50 is improved.

It should be noted that, in the electronic device 100 of the present application, two heat dissipation paths are respectively formed on two opposite sides of the middle frame 10, one of the heat dissipation paths is located on the housing assembly 30, and the other heat dissipation path (the heat dissipation plate 50) is located on one side of the middle frame 10 away from the housing assembly 30, so that all heat sources carried on the middle frame 10 can be dissipated. Therefore, it can be understood that the two heat dissipation paths can not only dissipate the heat of the first heat source 23 and the second heat source 25 on the circuit board 20, but also dissipate the heat of other heat generating members carried on the middle frame 10.

In some embodiments, the electronic device 100 of the present application further includes a display screen 60, and the display screen 60 is disposed on a side of the heat sink 50 facing away from the middle frame 10 for displaying. The side of the middle frame 10 is exposed from the display screen 60 and the housing assembly 30. It is understood that the heat sink 50 is disposed between the middle frame 10 and the display screen 60.

Alternatively, the display screen 60 may be, but is not limited to, one or more of a liquid crystal display screen, a light emitting diode display screen (LED display screen), a Micro light emitting diode display screen (Micro LED display screen), a sub-millimeter light emitting diode display screen (Mini LED display screen), an organic light emitting diode display screen (OLED display screen), and the like.

In some embodiments, the middle frame 10 has an air inlet channel 101 and an air outlet channel 102; the air inlet channel 101 is located on one side of the middle frame 10 away from the air driving mechanism 40 and is communicated with the first air duct 301 so as to communicate the first air duct 301 with the outside; the air outlet channel 102 is located on one side of the middle frame 10 close to the air driving mechanism 40, and is communicated with the air driving mechanism 40 to communicate the air driving mechanism 40 with the outside; the air driving mechanism 40 is configured to drive air to flow into the first air duct 301 and the air driving mechanism 40 from the air inlet channel 101, and flow out through the air outlet channel 102, so as to transfer heat generated by the first heat source 23 and heat transferred from the second heat source 25 to the heat dissipation fins 50 to the outside through air flow. It can be understood that the air driving mechanism 40 is disposed between the air outlet channel 102 and the first air duct 301, and the air driving mechanism 40 is communicated with the outside through the air outlet channel 102.

Gaseous actuating mechanism 40 sets up between inlet air duct 101 and first wind channel 301, or at the other positions in wind channel, can also realize the radiating effect to first heat source 23, however, when gaseous actuating mechanism 40 set up between inlet air duct 101 and first wind channel 301, when gaseous actuating mechanism 40 starts, electronic equipment 100 is inside to be in the pressure boost state (namely the inside atmospheric pressure of electronic equipment 100 is greater than external atmospheric pressure), if the seal nature of first wind channel 301 is not good, the dust that flows into first wind channel 301 can blow to electronic equipment 100's circuit board 20 side, lead to electronic equipment 100 to charge easily, loudspeaker sound outlet is blocked, the sound is more miscellaneous, it is unclear to make a call, also have impurity on electronic equipment 100's the camera, lead to shooing unclear etc.. When the air driving mechanism 40 is disposed between the air outlet channel 102 and the first air duct 301, and the air driving mechanism 40 is activated, the inside of the electronic device 100 is in a negative pressure state, so that dust flowing into the first air duct 301 can be better prevented from entering the circuit board 20 side of the electronic device 100, and the function of the electronic device 100 is affected.

Optionally, the air inlet channel 101 and the air outlet channel 102 are respectively disposed at two opposite ends of the middle frame 10, so that when the air driving mechanism 40 is started, an area or a path through which an air flow flows in the electronic device 100 is larger, and thus the electronic device 100 can be better cooled, and the cooling efficiency of the electronic device 100 can be improved.

Referring to fig. 3 and fig. 5, optionally, the air intake channel 101 includes a first air intake sub-channel 1011 and a second air intake sub-channel 1012 connected in a bent manner, the first air intake sub-channel 1011 is communicated with the first air duct 301, and the second air intake sub-channel 1012 is communicated with the outside. When the air driving mechanism 40 is started, the air flow enters from the second air inlet sub-channel 1012, sequentially flows through the first air inlet sub-channel 1011, the first air duct 301 and the air driving mechanism 40, and flows out from the air outlet channel 102, so that the heat generated by the first heat source 23 and the heat transferred by the heat dissipation fins 50 are continuously taken away, and the first heat source 23 and the second heat source 25 are cooled.

Alternatively, the middle frame 10 may be, but is not limited to, a metal middle frame 10, such as at least one of an aluminum alloy middle frame, a magnesium alloy middle frame, and the like. The metal middle frame 10 can better transfer the heat generated by the second heat source 25 to the whole electronic device 100, so that the second heat source 25 can be better radiated.

Optionally, the heat generated by second heat source 25 is greater than the heat generated by first heat source 23. The middle frame 10 is generally made of metal, and has good thermal conductivity, and the second heat source 25 with large heat productivity is arranged on the side of the substrate 21 facing the middle frame 10, so that the heat generated by the second heat source 25 can be better transferred to the whole electronic device 100, and the second heat source 25 can be better radiated.

Referring to fig. 6, the middle frame 10 may optionally have a through hole 103 along the stacking direction of the housing assembly 30 and the middle frame 10, and the through hole 103 may be used for installing the gas driving mechanism 40. Alternatively, the gas driving mechanism 40 may be fixed to the middle frame 10 by glue, adhesive, fasteners, or the like, and the fixing manner of the gas driving mechanism 40 is not particularly limited in the present application.

Optionally, the middle frame 10 has a through hole 104 at a position corresponding to the second heat source 25. The through hole 104 is formed in the position of the middle frame 10 corresponding to the second heat source 25, so that the second heat source 25 and the heat sink 50 can be better in heat conduction connection, heat generated by the second heat source 25 can be better dissipated through the heat sink 50, and the heat dissipation effect on the second heat source 25 is improved.

Referring to fig. 7, in some embodiments, the housing assembly 30 includes a housing 31 and a heat conducting sheet 33, the heat conducting sheet 33 is disposed between the housing 31 and the circuit board 20, the housing 31 and the heat conducting sheet 33 define the first air duct 301, and the heat conducting sheet 33 is in heat conducting connection with the first heat source 23. The housing 31 and the heat conducting sheet 33 define the first air duct 301, so that the air flow in the first air duct 301 can be better prevented from passing through the first air duct 301 and entering the side of the heat conducting sheet 33 close to the circuit board 20, which affects the performance of the electronic device 100. In addition, by using the heat conduction sheet 33 as a part of the first air duct 301, the heat generated by the first heat source 23 can be better transferred to the heat conduction sheet 33, so as to improve the heat dissipation effect of the first heat source 23.

It should be noted that, except for the inlet (i.e., the connection with the air intake channel 101) and the outlet of the first air duct 301, the space between the housing 31 and the heat conducting sheet 33 is sealed by a back adhesive, an adhesive, or the like, so as to prevent the first air duct 301 from leaking air and prevent the air from flowing to the circuit board 20 or other positions, which affects the performance of the electronic device 100.

Alternatively, the heat conductive sheet 33 may be, but is not limited to, a metal sheet, such as stainless steel, an iron sheet, a copper sheet, an aluminum sheet, and the like, having a high heat conductivity coefficient. When the heat conducting sheet 33 is a metal sheet, the heat conducting sheet has better heat conductivity, and the heat generated by the first heat source 23 can be better transferred to the heat conducting sheet 33, so as to improve the heat dissipation effect of the first heat source 23.

Referring to fig. 3 again, in some embodiments, the housing 31 and the middle frame 10 define a second air duct 302, the second air duct 302 is disposed corresponding to the air driving mechanism 40, and the second air duct 302 is respectively communicated with the air driving mechanism 40 and the first air duct 301. When the air driving mechanism 40 is turned on, air enters the first air channel 301 through the air inlet channel 101, sequentially flows through the second air channel 302 and the air driving mechanism 40, and flows out of the air outlet channel 102.

It should be noted that the housing 31 and the middle frame 10 correspond to the periphery of the second air duct 302, and are sealed by a back adhesive, an adhesive, and the like outside an inlet and an outlet (not shown) of the second air duct 302, so as to improve the sealing property of the second air duct 302, and prevent the second air duct 302 from leaking air and the air from flowing to the circuit board 20 and the like, which affects the performance of the electronic device 100.

It should be noted that the electronic device 100 of the present application may have both the first air duct 301 and the second air duct 302, or may have only the first air duct 301. When the electronic device 100 only has the first air channel 301, the heat conducting sheet 33 extends from the end of the air inlet channel 101 to a position corresponding to the air driving mechanism 40, and the heat conducting sheet 33 has a through hole at a position overlapping with the air inlet of the air driving mechanism 40, so that the air driving mechanism 40 is communicated with the first air channel 301.

Referring to fig. 8, in some embodiments, the gas driving mechanism 40 includes a metal housing 41, and the metal housing 41 is thermally connected to the heat sink 50. The metal casing 41 is adopted in the gas driving mechanism 40, so that the heat of the heat sink 50 can be better transferred to the airflow flowing through the gas driving mechanism 40 through the metal casing 41, and the heat can be taken away by the airflow, thereby increasing the speed of the heat sink 50 to the second heat source 25 and improving the heat dissipation effect.

Alternatively, the metal housing 41 may be, but is not limited to, at least one of a stainless steel housing, a copper housing, and the like.

Referring to fig. 9, in some embodiments, the electronic device 100 of the present application further includes a first thermal conductive coating 71, where the first thermal conductive coating 71 is disposed between the metal housing 41 and the heat sink 50 and respectively connects the metal housing 41 and the heat sink 50. Even if the metal housing 41 is abutted against the heat sink 50, since the flatness of the metal housing 41 and the heat sink 50 is usually limited, and there are some gaps between the metal housing 41 and the heat sink 50, and the air in these gaps has a heat insulation effect, therefore, the first heat conducting coating 71 is disposed between the metal housing 41 and the heat sink 50, and the metal housing 41 and the heat sink 50 are connected by the first heat conducting coating 71 in a heat conducting manner, so that the heat of the heat sink 50 can be better transferred to the metal housing 41 through the first heat conducting coating 71, and further transferred to the air flow passing through the air driving mechanism 40.

Alternatively, the first thermal conductive coating 71 may be, but is not limited to, at least one of thermal conductive gel, thermal conductive silicone grease, and the like having good thermal conductive properties.

Referring to fig. 10, in some embodiments, the electronic device 100 further includes a first shielding assembly 80, the first shielding assembly 80 includes a first shielding member 81 and a second shielding member 83, the first shielding member 81 is disposed on an outer periphery of the first heat source 23, the second shielding member 83 is disposed on a side of the first heat source 23 facing away from the substrate 21, and the second shielding member 83 is thermally connected to the first heat source 23 and the heat conducting sheet 33 respectively.

It is understood that the first shielding member 80 covers the first heat source 23 like a shielding case to prevent the radiated signal of the first heat source 23 from leaking and generating the radiation interference with other signals of the electronic apparatus 100.

By providing the first shielding member 80, the signal leakage of the radiation of the first heat source 23 and the radiation interference with other signals of the electronic apparatus 100 can be prevented. In addition, the first shielding assembly 80 can also play a role in preventing water and dust from the first heat source 23, and prevent water vapor and dust from affecting the performance of the first heat source 23. Furthermore, the first shielding assembly 80 is usually made of metal, and has a good thermal conductivity, so as to better conduct the heat generated by the first heat source 23 to the heat conducting sheet 33, and be carried away by the airflow flowing through the first air duct 301.

Optionally, the first shield 81 is electrically connected to the second shield 83, and the first shield 81 is grounded.

Alternatively, the first shielding member 81 may be, but not limited to, a conductive metal member such as copper, iron, aluminum, etc., and the second shielding member 83 may be, but not limited to, a conductive metal sheet such as copper foil, silver foil, aluminum foil, etc.

In some embodiments, the electronic device 100 further comprises a second thermally conductive coating 72 and a third thermally conductive coating 73; the second heat conducting coating 72 is disposed between the second shielding member 83 and the first heat source 23, and is respectively connected to the second shielding member 83 and the first heat source 23; the third thermal conductive coating 73 is disposed between the second shielding member 83 and the thermal conductive sheet 33, and respectively connects the second shielding member 83 and the thermal conductive sheet 33.

The flatness of the surface of the first heat source 23, the surface of the second shielding member 83, and the surface of the heat conducting sheet 33 is usually limited, even if the three are stacked and abutted in sequence, a gap is still formed at the joint of each two of the first heat source 23, the second shielding member 83, and the heat conducting sheet 33, and air in the gap has a heat insulation effect, so that the second heat conducting coating 72 is disposed between the second shielding member 83 and the first heat source 23, the third heat conducting coating 73 is disposed between the second shielding member 83 and the heat conducting sheet 33, the first heat source 23, the second shielding member 83, and the heat conducting sheet 33 can be better connected in a heat conducting manner through the second heat conducting coating 72 and the third heat conducting coating 73, and heat generated by the first heat source 23 can be better transferred into the first air duct 301, so as to be transferred to the outside of the electronic device 100 through the air flow passing through the first air duct 301.

It is understood that the heat generated by the first heat source 23 is eventually carried out of the electronic device 100 through the following path: the second heat conducting coating 72, the second shielding member 83, the third heat conducting coating 73, the heat conducting fin 33, and the air in the first air duct 301 sequentially flow through the second air duct 302, the air driving mechanism 40, and the air outlet channel 102 and are discharged out of the electronic device 100.

Alternatively, the second thermal conductive coating 72 may be, but is not limited to, at least one of a thermal conductive gel, a thermal conductive silicone grease, and the like having good thermal conductive properties.

Alternatively, the third thermal conductive coating 73 may be, but is not limited to, at least one of thermal conductive gel, thermal conductive silicone grease, and the like having good thermal conductive properties.

In some embodiments, the electronic device 100 of the present application further includes a second shielding assembly 90, the second shielding assembly 90 includes a third shielding member 91 and a fourth shielding member 93, the third shielding member 91 is disposed at the periphery of the second heat source 25, the fourth shielding member 93 is disposed at a side of the second heat source 25 departing from the substrate 21, and the fourth shielding member 93 is thermally conductive connected to the second heat source 25 and the heat sink 50, respectively.

It is understood that the second shielding member 90 covers the second heat source 25 like a shielding case to prevent the signal leakage of the radiation of the second heat source 25 and the radiation interference with other signals of the electronic apparatus 100.

By providing the second shielding assembly 90, the signal leakage of the radiation of the second heat source 25 and the radiation interference with other signals of the electronic device 100 can be better prevented. In addition, the second shielding component 90 can also play a role in preventing water and dust from the second heat source 25, and prevent water vapor and dust from affecting the performance of the second heat source 25. Furthermore, the second shielding assembly 90 is usually made of metal, and has a better heat conduction performance, so as to better conduct the heat generated by the second heat source 25 to the heat sink 50, and then to the airflow flowing through the gas driving mechanism 40 for carrying away through the gas driving mechanism 40.

Optionally, the third shield 91 is electrically connected to the fourth shield 93, and the third shield 91 is grounded.

Alternatively, the third shielding member 91 may be, but not limited to, a conductive metal member such as copper, iron, aluminum, etc., and the fourth shielding member 93 may be, but not limited to, a conductive metal sheet such as copper foil, silver foil, aluminum foil, etc.

In some embodiments, the electronic device 100 of the present embodiment further includes a fourth thermal conductive coating 74 and a fifth thermal conductive coating 75; the fourth thermal conductive coating 74 is disposed between the fourth shielding member 93 and the second heat source 25, and is respectively connected to the fourth shielding member 93 and the second heat source 25; the fifth thermal conductive coating 75 is disposed between the fourth shielding member 93 and the heat sink 50, and respectively connects the fourth shielding member 93 and the heat sink 50.

The flatness of the surface of the second heat source 25, the surface of the fourth shielding member 93, and the surface of the heat sink 50 is usually limited, even if the three are stacked and abutted in sequence, a gap is still formed at the joint of every two of the second heat source 25, the fourth shielding member 93, and the heat sink 50, and air in the gap has a heat insulation effect, so that the fourth heat conduction coating 74 is disposed between the fourth shielding member 93 and the second heat source 25, the fifth heat conduction coating 75 is disposed between the fourth shielding member 93 and the heat sink 50, the fourth heat source 25, the fourth shielding member 93, and the heat sink 50 can be better connected in a heat conduction manner through the fourth heat conduction coating 74 and the fifth heat conduction coating 75, heat generated by the second heat source 25 can be better transferred into the heat sink 50, and further transferred to the gas driving mechanism 40 through the heat sink 50, so as to be transferred to the outside of the electronic device 100 through the air flow passing through the gas driving mechanism 40.

It is understood that the heat generated by the second heat source 25 is finally carried out outside the electronic device 100 through the following paths: the fourth heat conducting coating 74, the fourth shielding member 93, the fifth heat conducting coating 75, the heat sink 50, the metal housing 41 of the gas driving mechanism 40, the gas in the gas driving mechanism 40, and the air outlet channel 102 are discharged outside the electronic device 100.

Alternatively, the fourth thermal conductive coating 74 may be, but is not limited to, at least one of a thermal conductive gel, a thermal conductive silicone grease, and the like having good thermal conductive properties.

Alternatively, the fifth thermal conductive coating 75 may be, but is not limited to, at least one of thermal conductive gel, thermal conductive silicone grease, and the like having good thermal conductive properties.

Reference in the specification to "an embodiment" or "an implementation" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the specification. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by a person skilled in the art that the embodiments described herein can be combined with other embodiments. Furthermore, it should be understood that the features, structures, or characteristics described in the embodiments of the present application may be combined arbitrarily without contradiction between them to form another embodiment without departing from the spirit and scope of the technical solution of the present application.

Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present application and not for limiting, and although the present application is described in detail with reference to the above preferred embodiments, it should be understood by those skilled in the art that the technical solutions of the present application can be modified or substituted by equivalents without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. An electronic device, comprising:

a middle frame;

the circuit board is arranged on the middle frame and comprises a substrate, a first heat source and a second heat source, the first heat source and the second heat source are arranged on two opposite surfaces of the substrate, and the second heat source is arranged to face the middle frame;

2. The electronic device of claim 1, wherein the middle frame has an air inlet channel and an air outlet channel; the air inlet channel is positioned on one side of the middle frame, which is far away from the gas driving mechanism, and is communicated with the first air channel; the air outlet channel is located on one side, close to the gas driving mechanism, of the middle frame and communicated with the gas driving mechanism, and the gas driving mechanism is used for driving gas to flow into the first air channel and the gas driving mechanism from the air inlet channel and then flow out from the air outlet channel.

3. The electronic device of claim 1, wherein the gas driving mechanism comprises a metal housing, and further comprising a first thermally conductive coating disposed between and connecting the metal housing and the heat sink, respectively.

4. The electronic device of claim 1, wherein the housing assembly comprises a housing and a thermal conductive sheet, the thermal conductive sheet disposed between the housing and the circuit board, the housing and the thermal conductive sheet defining the first air channel, the thermal conductive sheet in thermal conductive connection with the first heat source.

5. The electronic device according to claim 4, further comprising a first shielding assembly, wherein the first shielding assembly comprises a first shielding member and a second shielding member, the first shielding member is disposed at an outer periphery of the first heat source, the second shielding member is disposed at a side of the first heat source facing away from the substrate, and the second shielding member is thermally connected to the first heat source and the heat conductive sheet, respectively.

6. The electronic device of claim 5, further comprising a second thermally conductive coating and a third thermally conductive coating; the second heat conduction coating is arranged between the second shielding piece and the first heat source and is respectively connected with the second shielding piece and the first heat source; the third heat-conducting coating is arranged between the second shielding part and the heat-conducting fin and is respectively connected with the second shielding part and the heat-conducting fin.

7. The electronic apparatus according to claim 4, wherein the heat conductive sheet is a metal sheet, and the heat dissipating sheet is a soaking plate.

8. The electronic device according to claim 1, further comprising a second shielding assembly, wherein the second shielding assembly comprises a third shielding member and a fourth shielding member, the third shielding member is disposed at an outer periphery of the second heat source, the fourth shielding member is disposed at a side of the second heat source facing away from the substrate, and the fourth shielding member is thermally conductive connected to the second heat source and the heat sink, respectively.

9. The electronic device of claim 8, wherein the middle frame has a through hole at a position corresponding to the second heat source, and the electronic device further comprises a fourth thermal conductive coating and a fifth thermal conductive coating; the fourth heat conduction coating is arranged between the fourth shielding piece and the second heat source and is respectively connected with the fourth shielding piece and the second heat source; the fifth heat conduction coating is arranged between the fourth shielding part and the radiating fin and is respectively connected with the fourth shielding part and the radiating fin.

10. The electronic device according to claim 2, wherein the housing and the middle frame define a second air duct, the second air duct is disposed corresponding to the gas driving mechanism, and the second air duct communicates with the gas driving mechanism and the first air duct, respectively.