CN116704883B - Electronic equipment - Google Patents

Electronic equipment Download PDF

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Publication number
CN116704883B
CN116704883B CN202211450968.5A CN202211450968A CN116704883B CN 116704883 B CN116704883 B CN 116704883B CN 202211450968 A CN202211450968 A CN 202211450968A CN 116704883 B CN116704883 B CN 116704883B
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CN
China
Prior art keywords
heating element
electronic device
folding screen
screen
display screen
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Active
Application number
CN202211450968.5A
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Chinese (zh)
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CN116704883A (en
Inventor
严斌
宋本南
石聪
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Honor Device Co Ltd
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Honor Device Co Ltd
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Publication date
Application filed by Honor Device Co Ltd filed Critical Honor Device Co Ltd
Priority to CN202211450968.5A priority Critical patent/CN116704883B/en
Publication of CN116704883A publication Critical patent/CN116704883A/en
Application granted granted Critical
Publication of CN116704883B publication Critical patent/CN116704883B/en
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Classifications

    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0206Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings
    • H04M1/0208Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings characterized by the relative motions of the body parts
    • H04M1/0214Foldable telephones, i.e. with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
    • H04M1/0216Foldable in one direction, i.e. using a one degree of freedom hinge
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20954Modifications to facilitate cooling, ventilating, or heating for display panels

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

The application provides electronic equipment, and relates to the technical field of electronic equipment. The method is used for solving the problems that the display effect is affected due to the fact that the display color of the display area of the display screen is deviated due to the fact that larger temperature differences occur at different positions of the display screen. The electronic device comprises a shell, a display screen, a circuit board, an SoC chip and a heating element. The display screen is arranged on the shell. The circuit board is arranged in the shell, and the display screen is electrically connected with the circuit board. The SoC chip is arranged on the circuit board and is electrically connected with the circuit board. The heating element is arranged inside the shell and is electrically connected with the circuit board. The vertical projection of the SoC chip on the display screen and the vertical projection of the heating element on the display screen are staggered.

Description

Electronic equipment
Technical Field
The application relates to the technical field of electronic equipment, in particular to electronic equipment.
Background
The folding screen mobile phone is more popular with more and more users because the display screen is larger when the folding screen mobile phone is in an unfolding state and the folding screen mobile phone is convenient to carry when the folding screen mobile phone is in a folding state. However, when the folding screen mobile phone is in an unfolding state, the display screen of the folding screen mobile phone is larger; and the inside components and parts of cell-phone generate heat the degree different, consequently, can lead to the great difference in temperature to appear in different positions on the display screen, and then lead to the display area of display screen to show that the colour appears deviating, influences the display effect.
Disclosure of Invention
The embodiment of the application provides a folding screen mobile phone, which is used for solving the problem that the display color of a display area of a display screen is deviated and the display effect is affected due to larger temperature differences of different positions of the display screen of the folding screen mobile phone.
In order to achieve the above purpose, the embodiment of the present application adopts the following technical scheme:
The application provides an electronic device, which comprises a shell, a display screen, a circuit board, an SoC chip and a heating element. The display screen is arranged on the shell. The circuit board is arranged in the shell, and the display screen is electrically connected with the circuit board. The SoC chip is arranged on the circuit board and is electrically connected with the circuit board. The heating element is arranged inside the shell and is electrically connected with the circuit board. The vertical projection of the SoC chip on the display screen and the vertical projection of the heating element on the display screen are staggered.
According to the electronic equipment provided by the application, the heating element is arranged in the shell, and the vertical projections of the heating element and the SoC chip on the display screen are mutually staggered, namely, the vertical projections of the heating element and the SoC chip on the display screen are not mutually overlapped. Therefore, when the heat of the heating element and the heat generated by the SoC chip are transferred to the display screen, the temperatures of different areas of the display screen are respectively increased, so that the large temperature difference between the areas on the display screen corresponding to the SoC chip and other areas can be avoided, the display area of the display screen is ensured not to display the color, and the display effect of the display screen is improved.
In some embodiments of the present invention, a display includes a first portion, a second portion, and a third portion disposed between the first portion and the second portion. The shell comprises a first frame, a second frame and a rotating mechanism arranged between the first frame and the second frame; the first part is arranged on the first frame body, the second part is arranged on the second frame body, and the third part is arranged on the rotating mechanism. The heating element comprises a first heating element, the first heating element is arranged in the second frame, and the SoC chip is arranged in the first frame. That is, for the folding screen mobile phone, because the screen area is larger when the folding screen mobile phone is unfolded, the SoC chip is arranged in the first frame body, and the first heating element is arranged in the second frame body, so that the large temperature difference between the corresponding area of the SoC chip and the area far from the SoC chip can be avoided when the folding screen mobile phone is in the large screen display mode, and the color displayed in the display area of the display screen can not deviate.
In some embodiments of the invention, the first heating element is attached to the second portion. Through laminating first heating element in the second part to be convenient for heat the second part of display screen through first heating element, so that the difference in temperature between second part and the first part of display screen reduces, thereby avoid the display effect that the display color difference in the different regions of display screen is great to take place to be favorable to guaranteeing the terminal.
In some embodiments of the invention, the first heating element is fixedly connected to the second housing. The first heating element is fixedly connected with the second frame body, namely, the first heating element is fixed in the second frame body, and when the first heating element heats, the heat of the first heating element can still be transferred to the second part of the display screen, so that the temperature difference between the first part and the second part of the display screen is reduced.
In some embodiments of the invention, the first heating element is integrated within the second portion of the display screen. Therefore, other components are not required to be arranged in the second frame, so that the space in the second frame is saved; and moreover, the first heating element integrated in the second part of the display screen can heat the second part of the display screen, so that the temperature difference between the second part and the first part of the display screen can be reduced, and the display effect of the terminal is improved.
In some embodiments of the invention, the first heating element is provided in plurality and the plurality of first heating elements are distributed in a direction parallel to the second portion. In this way, the first heating element can be arranged for the region with lower temperature on the second part, namely when a plurality of regions with lower temperature exist, one first heating element is arranged for each region, so that on one hand, the material cost is saved; on the other hand, only heat to the lower region of temperature, be favorable to the homogeneity of the whole temperature of display screen more to can further promote the display effect.
In some embodiments of the present invention, the first portion of the display screen includes a first region and a second region, and a vertical projection of the SoC chip on the first portion is located in the first region. The heating element further comprises a second heating element, the second heating element is arranged in the first frame body, and the vertical projection of the second heating element on the first part is positioned in the second area. Therefore, the second heating element is arranged in the first frame body, and the area, far away from the SoC chip, of the first part of the display screen can be heated, so that the temperature of the first part of the display screen can be kept balanced, and the overall display effect of the display screen can be further improved.
In some embodiments of the invention, the second heating element is attached to the second region of the first portion. Through laminating the second heating element on the second region, can heat the second region of first part to ensure that great difference in temperature can not appear in second region and first region, thereby further promote the display effect.
In some embodiments of the invention, the second heating element is fixedly connected to the first housing. The heating element is fixedly connected with the middle frame, and the second area of the display screen is heated through the second heating element, so that the second area and the first area of the display screen cannot have larger temperature difference, and the display effect is improved.
In some embodiments of the invention, a second heating element is integrated within a second region of the first portion of the display screen. Therefore, elements are not required to be added in the first frame, so that the space in the first frame is saved; and can heat the second region through the second heating element integrated in the second region to make second region and first region can not produce great difference in temperature, thereby be favorable to promoting the demonstration.
In some embodiments of the invention, the second heating element is provided in plurality, the plurality of heating elements being distributed in a direction parallel to the first portion. In this way, the second heating elements can be respectively arranged for the areas with lower temperature on the second area of the first part, so that on one hand, the materials can be saved, and the cost can be reduced; on the other hand, only the area with lower temperature is heated, so that the uniformity of the whole temperature of the display screen is more facilitated.
In some embodiments of the invention, the heating element comprises a third heating element, the display screen comprises a third region and a fourth region, a vertical projection of the SoC chip on the display screen is located in the third region, and a vertical projection of the third heating element on the display screen is located in the fourth region. Therefore, the third heating element is arranged in the straight-plate mobile phone, so that the whole temperature distribution of the display screen is uniform, and the display effect of the display screen is improved.
In some embodiments of the invention, the third heating element is provided in plurality, the plurality of third heating elements being distributed in a direction parallel to the display screen. Therefore, the third heating elements can be respectively arranged in the areas with lower temperature on the fourth area of the display screen, so that on one hand, the materials can be saved, and the cost can be reduced; on the other hand, only the area with lower temperature is heated, so that the uniformity of the whole temperature of the display screen is more facilitated.
In some embodiments of the invention, the heating element comprises a substrate and a heating layer, the substrate is fixed inside the shell, the heating layer is arranged on the substrate, and the heating layer is electrically connected with the circuit board. In this way, the substrate is fixed in the shell, and the heating layer is electrified to generate heat, so that the areas except the SoC chip can be heated, the heating temperature of each area of the display screen is balanced, and the display effect of the display screen can be improved.
In some embodiments of the invention, the heat generating layer comprises a conductive metal layer.
In some embodiments of the invention, the heat generating layer comprises a graphene layer.
In some embodiments of the invention, the heating element initiates heating when the local temperature of the display screen is greater than or equal to 40 ℃. In this way, the heating element does not need to be started after the electronic equipment is started, which is beneficial to reducing power consumption. And whether the heating element is started to heat or not is controlled according to the local temperature of the display screen, so that the control is more intelligent, and the display effect of the display screen is further improved.
Drawings
Fig. 1 is a block diagram of an electronic device according to an embodiment of the present application;
FIG. 2 is a front view of the electronic device provided in FIG. 1 in an expanded position;
FIG. 3 is a front view of the electronic device provided in FIG. 1 in a folded position;
FIG. 4 is a cross-sectional view of the electronic device provided in FIG. 1 in a folded position;
Fig. 5 is a structural view of the electronic device provided in fig. 1 in an unfolded state in the internal accommodating space (back view angle of the electronic device);
FIG. 6 is a schematic view of a temperature distribution of a folding screen of the electronic device provided in FIG. 1;
FIG. 7 is a cross-sectional view of another electronic device provided by the present application in a folded position;
FIG. 8 is a partial structural cross-sectional view of the electronic device provided in FIG. 7;
FIG. 9 is a block diagram of a first heating element according to an embodiment of the present application;
FIG. 10 is a block diagram of another first heating element provided in accordance with an embodiment of the present application;
FIG. 11 is a cross-sectional view of yet another electronic device in a folded position provided by an embodiment of the present application;
FIG. 12 is a partial structural cross-sectional view of the electronic device provided in FIG. 11;
Fig. 13 is a temperature distribution diagram of a folding screen of another electronic device according to an embodiment of the present application;
FIG. 14 is a block diagram of yet another electronic device provided by an embodiment of the present application;
fig. 15 is a block diagram of still another electronic device according to an embodiment of the present application;
FIG. 16 is an exploded view of the electronic device provided in FIG. 15;
FIG. 17 is a block diagram of an area distribution on the display screen of the electronic device provided in FIG. 15;
Fig. 18 is a block diagram of another area distribution pattern on a display screen in the electronic device provided in fig. 15.
Reference numerals: 10-an electronic device; 100-folding screen; 110-a first part; 111-a first region; 112-a second region; 120-a second part; 130-a third part; 200-a first housing; 211-a first frame; 212-a first rear cover; 221-a second frame; 222-a second rear cover; 223-outer screen; 224-a support plate; 230-a rotation mechanism; 300-a main circuit board; 310-a secondary circuit board; 320-cell; 330-a motherboard; 400-SoC chip; 500-heating elements; 510—a first heating element; 511-a substrate; 512-a heat generating layer; 520-a second heating element; 530-a third heating element; 600-a second housing; 610-middle frame; 620-backshell; 700-display screen; 710-a third region; 720-fourth region; 721-subregion.
Detailed Description
The following description of the technical solutions according to the embodiments of the present application will be given with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, but not all embodiments.
Hereinafter, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature.
Furthermore, in the present application, directional terms "upper", "lower", etc. are defined with respect to the orientation in which the components are schematically disposed in the drawings, and it should be understood that these directional terms are relative concepts, which are used for description and clarity with respect thereto, and which may be changed accordingly in accordance with the change in the orientation in which the components are disposed in the drawings.
In the present application, unless explicitly specified and limited otherwise, the term "connected" is to be construed broadly, and for example, "connected" may be either fixedly connected, detachably connected, or integrally formed; can be directly connected or indirectly connected through an intermediate medium.
The application provides an electronic device. In particular, the electronic device may be a portable electronic apparatus or other type of electronic apparatus. For example, the electronic device may be a cell phone or tablet (tab let persona l computer) or the like. When the electronic device is a mobile phone, it may be a folding mobile phone or a bar mobile phone.
The following embodiments are described using an electronic device as an example of a folding screen mobile phone. Specifically, referring to fig. 1, fig. 2, and fig. 3, fig. 1 is a block diagram of an electronic device 10 according to an embodiment of the present application, fig. 2 is a front view of the electronic device 10 in an unfolded position provided in fig. 1, and fig. 3 is a front view of the electronic device 10 in a folded position provided in fig. 1. The electronic device 10 may include a folding screen 100, a first housing 200, and electronic components.
The folding screen 100 is used for displaying images, videos, and the like. The folding screen 100 includes a first portion 110, a second portion 120, and a third portion 130, the third portion 130 being disposed between the first portion 110 and the second portion 120, the third portion 130 being folded when the folding screen 100 is folded, and the first portion 110 being opposite the second portion 120. At least a third portion 130 of the folding screen 100 is made of a flexible material. The first portion 110 and the second portion 120 may be made of a flexible material, may be made of a rigid material, may be made of a flexible material, and may be made of a rigid material.
The folding screen 100 may be an organic light emitting diode (organ ic l ight-EMITT ING D iode, OLED) screen, a micro organic light emitting diode (micro organ ic l ight-EMITT ING D iode) display screen, a quantum dot L IGHT EMITT ING D iodes (QLED) display screen, a liquid crystal display screen (l iqu ID CRYSTA LD I SP L AY, LCD), or the like.
The folding screen 100 is supported on the first housing 200. The first housing 200 may include a first frame 211, a first rear cover 212, a second frame 221, a second rear cover 222, and a rotation mechanism 230, wherein the rotation mechanism 230 is connected between the first frame 211 and the second frame 221. The first portion 110 of the folding screen 100 is attached to the side of the first frame 211 away from the first rear cover 212, the second portion 120 of the folding screen 100 is attached to the side of the second frame 221 away from the second rear cover 222, and the third portion 130 of the folding screen 100 is attached to the rotating mechanism 230. The first housing 211 and the second housing 221 are rotatably coupled by a rotation mechanism 230, thereby enabling the electronic device 10 to rotate between an extended position and a collapsed position.
When the electronic device 10 is in the unfolded position as shown in fig. 2, the folding screen 100 is in the unfolded state, that is, the display surfaces of the first portion 110, the second portion 120, and the third portion 130 of the folding screen 100 are located in the same plane, that is, a large screen display mode is formed, so as to bring a better use experience to the user.
When the electronic device 10 is in the folded position as shown in fig. 3, the folding screen 100 is in a folded state, that is, the third portion 130 of the folding screen 100 is folded, and the first portion 110 is disposed opposite to the second portion 120. The first case 200 is protected outside the folding screen 100, and the folding screen 100 is not visible to the user, so that the folding screen 100 can be prevented from being scratched or damaged, and the folding screen 100 can be effectively protected.
Further, the first case 200 and the folding screen 100 together define an internal accommodating space for accommodating the electronic component. Wherein a portion of the interior space may be collectively enclosed by the first frame 211, the first rear cover 212, and the first portion 110 of the folding screen 100, and another portion of the interior space may be collectively enclosed by the second frame 221, the second rear cover 222, and the second portion 120 of the folding screen 100.
In some embodiments, referring to fig. 4, fig. 4 is a cross-sectional view of the electronic device 10 provided in fig. 1 in a folded position. The electronic device 10 may further include an external screen 223, where the external screen 223 is a non-folding display screen. The outer panel 223 may be disposed on the first frame 211 or the second frame 221, and disposed on a side of the first frame 211 or the second frame 221 away from the folding screen 100, i.e., the first rear cover 212 or the second rear cover 222 may be replaced by the outer panel 223. Illustratively, the outer screen 223 is disposed at a side of the second frame 221 remote from the second portion 120 of the folding screen 100, that is, the outer screen 223 is used in place of the second rear cover 222, so that another portion of the inner receiving space is defined by the outer screen 223, the second frame 221, and the second portion 120 of the folding screen 100. When the electronic device 10 is in the folded position, the user can view the mobile phone information through the external screen 223, which is beneficial to further improving the use experience of the user.
With continued reference to fig. 4, and with reference to fig. 5 in combination, fig. 5 is a block diagram of the electronic device 10 provided in fig. 1 in an unfolded state in the internal accommodating space (back view of the electronic device 10). The electronic components may include a main circuit board 300, a sub circuit board 310, an SoC chip 400, a battery 320, and the like. The main circuit board 300 is disposed in the first frame 211, the sub circuit board 310 is disposed in the second frame 221, the SoC chip 400 is disposed on the main circuit board 300, and the main circuit board 300 and the sub circuit board 310 can be electrically connected through an FPC board; the battery 320 may be provided with two batteries, and disposed in the first and second housings 211 and 221, respectively, and power electronic components disposed in the first and second housings 211 and 221, respectively.
The above-mentioned installation positions of the electronic components are only one possible example, and may be adjusted according to actual situations (e.g., design requirements), and are not considered as limiting the actual installation positions of the electronic components.
Since some electronic components generate heat during operation, the heat generated by the electronic components in the electronic device 10 during operation may cause the temperature of the electronic components in the vertical projection area on the folding screen 100 to increase. When the electronic device 10 is in the extended position, the folding screen 100 is in the extended state. Since the area of the folding screen 100 is large, and the heat generated by the electronic components located in the first frame 211 and the electronic components located in the second frame 221 are different, the temperature difference is easily generated due to the difference between the temperatures of the first portion 110 and the second portion 120 of the folding screen 100.
Referring to fig. 6, fig. 6 is a schematic diagram illustrating a temperature distribution of a folding screen 100 of the electronic device 10 provided in fig. 1. Among the electronic components inside the electronic device 10, the electronic component having a large heat generation amount is the SoC chip 400, and therefore, when the electronic device 10 is in the extended position, the temperature of the vertical projection area of the SoC chip 400 on the folding screen 100 is high. For example, when the folding screen 100 displays a video, the temperature of the area a of the folding screen 100 corresponding to the SoC chip 400 is 45 ℃, and the area a is gradually extended in a direction away from the area a, and the temperature of the folding screen 100 gradually decreases. Wherein the temperature of the region of the second portion 120 of the folding screen 100 that is further from the region a is 35 c, i.e. in this use scenario the temperature difference between the region of the folding screen 100 that is the highest temperature and the region that is the lowest temperature reaches 10 c.
In this way, the difference between the aging speed of the display pixels in the higher temperature region and the aging speed of the display pixels in the lower temperature region of the folding screen 100 is larger due to the larger temperature difference between the different positions of the folding screen 100. Therefore, differences in display color and brightness of the display area of the folding screen 100 may occur, which affect the display effect of the folding screen 100, thereby affecting the user experience.
In order to solve the above-mentioned problems, referring to fig. 7, fig. 7 is a cross-sectional view of another electronic device 10 in a folded position according to the present application, the electronic device 10 includes the folding screen 100, the first housing 200, and electronic components (hereinafter, the electronic components are referred to as SoC chip 400).
In addition, the electronic device 10 further includes a heating element 500 disposed in the first housing 200, and a vertical projection of the heating element 500 on the folding screen 100 and a vertical projection of the SoC chip 400 on the folding screen 100 are offset from each other. Since the electronic device 10 is a folding-screen mobile phone, the above-mentioned vertical projection misalignment means that the electronic device 10 is in the unfolded position, that is, the vertical projection of the heating element 500 and the SoC chip 400 on the folding screen 100 are misaligned when the folding screen 100 is in the unfolded state.
Specifically, the heating element 500 may include a first heating element 510, and the first heating element 510 is disposed in the second frame 221 and electrically connected to the main circuit board 300 or the sub circuit board 310. For example, the first heating element 510 may be electrically connected with the sub-circuit board 310 and electrically connected with the main circuit board 300 through the sub-circuit board 310, thereby realizing that the heating element 500 is controlled by the SoC chip 400. Or the heating element 500 may be directly electrically connected to the main circuit board 300 through a flexible connection (e.g., FPC board). The present application is not particularly limited thereto.
In this way, the first heating element 510 is arranged in the second casing 221, i.e. the vertical projection of the first heating element 510 on the folding screen 100 is located on the second portion 120; further, since the SoC chip 400 is disposed in the first housing 211 and the vertical projection thereof onto the folding screen 100 is located on the first portion 110, the vertical projections of the first heating element 510 and the SoC chip 400 onto the folding screen 100 are offset from each other when the folding screen 100 is in the unfolded state. Therefore, in the working process of the electronic device 10, when the heat productivity of the SoC chip 400 is larger, and the temperature difference between the first portion 110 and the second portion 120 of the folded screen 100 is larger, the second portion 120 of the folded screen 100 can be heated by the first heating element 510, so that the temperature of the second portion 120 of the folded screen 100 is increased, and the temperature difference between the first portion 110 and the second portion 120 can be reduced, so that the situation that the aging speed difference of the display pixels is large due to different temperatures in different areas of the folded screen 100 is avoided, and further, the display color and brightness of the folded screen 100 are not greatly different is ensured, and the display effect of the folded screen 100 is improved.
Or when the local temperature of the folding screen 100 is greater than the set temperature, the first heating element 510 is activated to heat a corresponding area on the folding screen 100. For example, when the temperature of a certain area on the folding screen 100 is greater than or equal to 40 ℃, the first heating element is controlled to start heating, so that the situation that the aging speed of the display pixels is large due to different temperatures of different areas of the folding screen 100 is avoided. It will be appreciated that the set temperature may also be set to different temperatures, for example, 42 ℃, 45 ℃, 48 ℃, 50 ℃, 60 ℃, etc., depending on the actual use requirements.
Specifically, referring to fig. 8, fig. 8 is a partial sectional view of the electronic device 10 provided in fig. 7. The first heating element 510 may include a substrate 511 and a heat generating layer 512, the substrate 511 is fixed in the second frame 221, the heat generating layer 512 is disposed on a surface of the substrate 511 facing the folding screen 100, and the heat generating layer 512 is electrically connected to the main circuit board 300 or the sub circuit board 310 shown in fig. 5. That is, the substrate 511 is fixed in the second frame 221, so as to support the heat-generating layer 512, and the heat-generating layer 512 is electrically connected with the control circuit, when the temperature difference between the first portion 110 and the second portion 120 of the folding screen 100 is large, the control circuit can energize the heat-generating layer 512, so that the heat-generating layer 512 generates heat to heat the second portion 120 of the folding screen 100, thereby reducing the temperature difference between the first portion 110 and the second portion 120 of the folding screen 100, and ensuring that the display color and the brightness of the folding screen 100 are greatly different.
Referring to fig. 9, fig. 9 is a schematic diagram of a first heating element 510 according to an embodiment of the present application, where the heat generating layer 512 may include conductive wires. For example, the resistance wire with smaller width is bent and arranged on the substrate 511, so that the uniformly distributed metal wires have larger impedance, and when the control circuit supplies power to the conductive metal layer, the conductive metal layer can generate larger heat to heat the second portion 120 of the folding screen 100.
Or referring to fig. 10, fig. 10 is a schematic diagram of another first heating element 510 according to an embodiment of the present application, where the heat generating layer 512 may further include a graphene layer. For example, when the graphene layer is energized, the graphene itself has good electric and thermal conductivity, and thus the energized graphene can generate heat, thereby heating the second portion 120 of the folding screen 100.
In one possible embodiment, the first heating element 510 may be directly attached to the second portion 120 of the folding screen 100, that is, the heat-generating layer 512 is disposed between the substrate 511 and the second portion 120 of the folding screen 100 (as shown in fig. 7 and 8), and the heat-generating layer 512 may be directly contacted with the second portion 120 of the folding screen 100 so as to heat the second portion 120 of the folding screen 100.
The substrate 511 may be fixedly connected to the second housing 221; or may be fixed to other structural members inside the second frame 221. For example, referring to fig. 11 and 12, fig. 11 is a cross-sectional view of still another electronic device 10 in a folded position according to an embodiment of the present application, and fig. 12 is a partial cross-sectional view of the electronic device 10 shown in fig. 11, in which a support plate 224 is disposed in the second housing 221, and the support plate 224 is used to support the folding screen 100 so as to improve the flatness of the folding screen 100. The substrate 511 and the heat generating layer 512 may be disposed on a surface of the support plate 224 away from the second portion 120 of the folding screen 100, and the heat generating layer 512 is disposed between the substrate 511 and the support plate 224. In this way, the temperature generated by the heat-generating layer 512 may be transferred to the second portion 120 of the folding screen 100 through the support plate 224, thereby achieving heating of the second portion 120.
In another possible embodiment, the first heating element 510 may also be integrated into the folding screen 100, i.e. the first heating element 510 is integrated into the second portion 120 of the folding screen 100. For example, the first heating element 510 may include only the heat-generating layer 512 described above, and the heat-generating layer 512 is integrated within the second portion 120 of the folding screen 100 and electrically connected to the control circuit described above. In this way, the second portion 120 can be heated by the heat generating layer 512; on the other hand, the overall thickness of the electronic device 10 can be reduced.
In other embodiments, the first heating element 510 provided by embodiments of the present application may directly cover the second portion 120 of the folding screen 100, i.e., the first heating element 510 is provided only one and covers the display area of the second portion 120 of the folding screen 100. It is also possible to cover a local area on the second portion 120 of the folding screen 100 with one first heating element 510, for example, the first heating element 510 may cover only a region on the second portion 120 with a larger temperature difference (for example, a temperature difference exceeding 10 ℃) from the first portion 110, so as to avoid that the display color and the brightness on the folding screen 100 are greatly different due to the larger temperature difference, and influence the display effect.
Alternatively, a plurality of first heating elements 510 may be provided, and the plurality of first heating elements 510 may be distributed in a direction parallel to the second portion 120 of the folding screen 100, i.e., the plurality of first heating elements 510 may be provided corresponding to a plurality of localized areas of the second portion 120 of the folding screen 100.
Specifically, referring to fig. 13, fig. 13 is a diagram showing a temperature distribution diagram of a folding screen 100 of another electronic device 10 according to an embodiment of the present application, wherein a region with a temperature difference of more than 10 ℃ from a region a shown in fig. 6 is referred to as a low temperature region (as a region shown by a dashed box in fig. 13), and a plurality of low temperature regions are provided on a second portion 120 of the folding screen 100, so that a first heating element 510 may be provided corresponding to each low temperature region. In this way, the plurality of first heating elements 510 can be controlled to heat each low-temperature region respectively, so that the region with lower temperature on the folding screen 100 can be heated more accurately, the region with smaller temperature difference with the region a shown in fig. 6 on the folding screen 100 can be avoided from being heated, the overall temperature on the folding screen 100 can be more balanced, and the display effect of the folding screen 100 can be further improved.
For example, with continued reference to fig. 13, at two top corners of the second portion 120 of the folding screen 100 away from the first portion 110, namely, region B in the drawing, since the region B corresponds to the electronic component disposed in the space in the internal accommodating space (i.e., the second housing 221) and generates less heat or no electronic component is disposed, the temperature of the region B on the second portion 120 of the folding screen 100 is lower (e.g., 35 ℃), and therefore, the first heating element 510 shown in fig. 9 or 10 may be disposed in the second housing 221 corresponding to the two regions B. On one hand, the two areas B can be heated respectively, and on the other hand, the material is saved, and the overall cost is reduced. Meanwhile, other areas (the areas with smaller temperature differences with the area a shown in fig. 6) on the second portion 120 are not heated, so that the overall uniformity of the temperature of the folding screen 100 is further improved, and the display effect of the folding screen 100 can be further improved.
Referring now to fig. 14, therein is shown a block diagram of another electronic device 10 in accordance with the embodiment of the present application. The first portion 110 of the folded screen 100 may include a first area 111 and a second area 112, where a vertical projection of the soc chip 400 on the first portion 110 of the folded screen 100 is located in the first area 111, so as to further improve the uniformity of the overall temperature of the folded screen 100. The heating element 500 may further include a second heating element 520 (the first heating element 510 and the second heating element 520 are respectively shown in hatching in fig. 14), the second heating element 520 is disposed in the first frame 211, and a vertical projection of the second heating element 520 on the first portion 110 of the folding screen 100 is located in the second region 112. In this way, the second heating element 520 is disposed in the second frame 221, and the second area 112 on the first portion 110 of the folding screen 100 can be heated by the second heating element 520, so as to reduce the temperature difference between the first area 111 and the second area 112 of the first portion 110 of the folding screen 100, so that the temperatures of the areas of the first portion 110 of the folding screen 100 are more balanced, and the uniformity of the overall temperature of the folding screen 100 is further ensured.
The specific structure of the second heating element 520 and the installation manner in the first frame 211 are the same as those of the first heating element 510. Also, one second heating element 520 may be provided, and one second heating element 520 may cover the second region 112 of the first portion 110, or may cover a partial region of the second region 112; alternatively, the second heating element 520 may be provided in plural in the second region 112 of the first portion 110, so as to be capable of heating the regions of the second region 112 having a lower temperature. Therefore, a description thereof will not be repeated.
On this basis, in the electronic device 10 according to the embodiment of the present application, the first heating element 510 and the second heating element 520 may be controlled by the SoC chip 400 to be simultaneously energized to heat the corresponding area on the folding screen 100. Or may be separately controlled, that is, individual areas may be selectively heated according to the local temperature on the display 700.
For example, when the temperature of the first region 111 of the first portion 110 corresponding to the SoC chip 400 exceeds a preset temperature, for example, 45 ℃, the first heating element 510 and the second heating element 520 are controlled to be energized to generate heat, so as to heat the corresponding regions, thereby reducing the temperature difference between different regions of the folding screen 100.
Or, it may be set that when the temperature difference between the first area 111 of the first portion 110 and a certain area corresponding to the SoC chip 400 reaches a preset temperature difference, for example, the temperature difference between the first area 111 of the first portion 110 of the folded screen 100 and the second portion 120 of the folded screen 100 reaches 10 ℃, the first heating element 510 is controlled to be energized to generate heat, so as to heat the second portion 120 of the folded screen 100, so as to reduce the temperature difference between the second portion 120 and the first area 111 of the first portion 110, thereby ensuring the overall temperature balance of the folded screen 100.
When the first heating element 510 or the second heating element 520 is provided in plural, and the first heating element 510 and the second heating element 520 are provided in plural, it is possible to control all of the first heating element 510 and the second heating element 520 to be energized at the same time to generate heat. Alternatively, the first heating elements 510 and the second heating elements 520 may be controlled to be energized to generate heat, respectively, that is, some of the first heating elements 510 or some of the second heating elements 520 may be controlled to be energized to generate heat at the same time. The control logic may be adjusted according to the actual use requirements, and thus, embodiments of the present application are not limited in particular.
The electronic device 10 is a folding mobile phone, and the electronic device 10 is a bar mobile phone. Referring to fig. 15 and 16, fig. 15 is a block diagram of still another electronic device 10 according to an embodiment of the present application, and fig. 16 is an exploded view of the electronic device 10 shown in fig. 15.
Specifically, the electronic device 10 is a straight-plate mobile phone as shown in fig. 15, having an approximately rectangular plate-like structure. The electronic device 10 may include a second housing 600 and a display screen 700, where the second housing 600 may include a middle frame 610 and a rear case 620, the display screen 700 and the rear case 620 are respectively fixed on two sides of the middle frame 610, and the display screen 700, the middle frame 610 and the rear case 620 jointly enclose an internal accommodating space, and a main board 330, an SoC chip 400 and a third heating element 530 are disposed in the internal accommodating space, and the SoC chip 400 and the third heating element 530 are electrically connected with the main board 330.
Wherein, the vertical projection of the SoC chip 400 on the display screen 700 and the vertical projection of the third heating element 530 on the display screen 700 are offset from each other. With continued reference to fig. 16, and with continued reference to fig. 17, fig. 17 is a block diagram illustrating an area distribution manner on a display screen 700 of the electronic device 10 provided in fig. 15, where the display screen 700 has a third area 710 and a fourth area 720, a vertical projection of the soc chip 400 on the display screen 700 is located in the third area 710, and a vertical projection of the third heating element 530 on the display screen 700 is located in the fourth area 720.
In this way, the fourth area 720 of the display screen 700 can be heated by the third heating element 530, so that the temperature of the fourth area 720 of the display screen 700 is similar to the temperature of the third area 710, that is, the temperature difference between the fourth area 720 and the third area 710 of the display screen 700 is reduced, so that the whole temperature of the display screen 700 can be kept balanced, larger deviation of the color and brightness displayed in different areas of the display screen 700 is avoided, and the display effect of the display screen 700 is improved.
In some embodiments, the third heating element 530 may cover the entire fourth region 720, while ensuring that the temperatures of the fourth region 720 and the third region 710 remain balanced. Alternatively, only a local area on the fourth area 720 may be covered, for example, the temperature of the area of the fourth area 720 adjacent to the third area 710 is less different from the temperature of the third area 710, so that the third heating element 530 may not be provided, and only the area farther from the third area 710 may be provided with the third heating element 530, thereby being beneficial to saving materials and reducing costs.
For example, with continued reference to fig. 17, the fourth region 720 includes a sub-region 721 (the region shown by the dashed box in the figure), and since the sub-region 721 is far from the third region 710 and no electronic component with a large heat generation amount is present in the space corresponding to the sub-region 721, the temperature of the sub-region 721 in the fourth region 720 is low when the electronic device 10 is in operation, so that a large temperature difference is formed between the sub-region 721 and the third region 710. Based on this, the sub-area 721 may be heated by the third heating element 530, so that a temperature difference between the sub-area 721 and the third area 710 is reduced, so that the temperature of each area of the display screen 700 is kept balanced, and deviation of the color and brightness displayed by the display screen 700 in different areas is avoided.
In other embodiments, referring to fig. 18, fig. 18 is a block diagram illustrating another area distribution pattern on a display screen 700 of the electronic device 10 provided in fig. 15. The fourth region 720 may have a plurality of sub-regions 721 having a relatively low temperature, and thus, a plurality of third heating elements 530 may be disposed corresponding to the plurality of sub-regions 721 to heat each sub-region 721. In this way, on the one hand, each sub-area 721 can be heated separately to ensure that the overall temperature of the display screen 700 is balanced; on the other hand, the material of the third heating element 530 can be saved, which is beneficial to cost reduction.
In addition, the third heating element 530 has the same structure as the first heating element 510 and the second heating element 520 provided in the folding mobile phone, that is, the third heating element 530 includes the substrate 511 and the heat generating layer 512. The substrate 511 is fixed in the middle frame 610, and the heat generating layer 512 is disposed on the substrate 511. Also, the substrate 511 may be fixedly connected to the middle frame 610; or may be attached to the display 700; the substrate 511 may not be provided, and the heat generating layer 512 may be integrated in the display 700, which is the same as the folding mobile phone described above.
On this basis, in the straight mobile phone provided in this embodiment, the control manner and the distance for the third heating element 530 are the same as those of the folded mobile phone. Therefore, the description is not repeated.
In the description of the present specification, a particular feature, structure, material, or characteristic may be combined in any suitable manner in one or more embodiments or examples.
The foregoing is merely illustrative of the present application, and the present application is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (14)

1. An electronic device, comprising:
The shell comprises a first frame body, a second frame body and a rotating mechanism connected between the first frame body and the second frame body, wherein the first frame body and the second frame body are rotationally connected through the rotating mechanism;
The display screen is arranged on the shell and comprises a folding screen, the folding screen comprises a first part, a second part and a third part, the third part is arranged between the first part and the second part, the first part is arranged on the first frame, the second part is arranged on the second frame, and the third part is arranged on the rotating mechanism;
The circuit board is arranged in the shell, and the folding screen is electrically connected with the circuit board;
The SoC chip is arranged on the circuit board and is electrically connected with the circuit board, and the SoC chip is arranged in the first frame body;
the heating element is arranged inside the shell and is electrically connected with the circuit board; the heating element comprises a first heating element, and the first heating element is arranged in the second frame body;
The electronic equipment can rotate between a folding position and an unfolding position, when the electronic equipment is in the unfolding position, the folding screen is in an unfolding state, and the vertical projection of the SoC chip on the folding screen and the vertical projection of the first heating element on the folding screen are staggered.
2. The electronic device of claim 1, wherein the first heating element is attached to the second portion.
3. The electronic device of claim 1, wherein the first heating element is disposed on the second housing.
4. The electronic device of claim 1, wherein the first heating element is integrated within the second portion of the folding screen.
5. The electronic device of any one of claims 1-4, wherein a plurality of the first heating elements are provided and the plurality of first heating elements are distributed in a direction parallel to the second portion.
6. The electronic device of any one of claims 1-4, wherein the first portion of the folding screen comprises a first region and a second region, a perpendicular projection of the SoC chip on the first portion being located within the first region;
the heating element further comprises a second heating element, the second heating element is arranged in the first frame body, and the vertical projection of the second heating element on the first part is positioned in the second area.
7. The electronic device of claim 6, wherein the second heating element is attached to the second region of the first portion.
8. The electronic device of claim 6, wherein the second heating element is disposed on the first housing.
9. The electronic device of claim 6, wherein the second heating element is integrated within a second region of the first portion of the folding screen.
10. The electronic device of claim 6, wherein the second heating element is provided in plurality, the plurality of heating elements being distributed in a direction parallel to the first portion.
11. The electronic device of any one of claims 1-4, wherein the heating element comprises a substrate and a heat generating layer, the substrate is fixed inside the housing, the heat generating layer is disposed on the substrate, and the heat generating layer is electrically connected to the circuit board.
12. The electronic device of claim 11, wherein the heat-generating layer comprises a conductive metal layer.
13. The electronic device of claim 11, wherein the heat-generating layer comprises a graphene layer.
14. The electronic device of any one of claims 1-4, wherein the heating element initiates heating when the local temperature of the folding screen is greater than or equal to 40 ℃.
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