CN110740619A - kinds of electronic equipment - Google Patents

kinds of electronic equipment Download PDF

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Publication number
CN110740619A
CN110740619A CN201910978861.XA CN201910978861A CN110740619A CN 110740619 A CN110740619 A CN 110740619A CN 201910978861 A CN201910978861 A CN 201910978861A CN 110740619 A CN110740619 A CN 110740619A
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CN
China
Prior art keywords
heat dissipation
electronic device
heat
dissipation channel
fan
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Granted
Application number
CN201910978861.XA
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Chinese (zh)
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CN110740619B (en
Inventor
占文州
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oppo Chongqing Intelligent Technology Co Ltd
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Oppo Chongqing Intelligent Technology Co Ltd
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Publication date
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Priority to CN201910978861.XA priority Critical patent/CN110740619B/en
Publication of CN110740619A publication Critical patent/CN110740619A/en
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Publication of CN110740619B publication Critical patent/CN110740619B/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20172Fan mounting or fan specifications
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20145Means for directing air flow, e.g. ducts, deflectors, plenum or guides

Abstract

The invention provides electronic equipment which comprises a heating element and a middle frame, wherein the middle frame comprises a connecting plate and a frame arranged on the periphery of the connecting plate, the heating element is arranged on the side of the connecting plate, the frame is provided with an air inlet and an air outlet, a screen assembly is arranged on the other side of the middle frame, which is far away from the heating element, the screen assembly and the middle frame jointly form a heat dissipation channel, and a fan is arranged in the heat dissipation channel, so that heat generated by the heating element can be guided into the heat dissipation channel, and meanwhile, the fan is arranged in the heat dissipation channel, so that the air flow rate in the electronic equipment, particularly in the heat dissipation channel, can be accelerated through the rotation of the fan, and the heat accumulated in the heat dissipation channel can be timely discharged out of the electronic equipment.

Description

kinds of electronic equipment
Technical Field
The invention relates to the technical field of communication, in particular to electronic equipment.
Background
With the development of technology, at present, the functions of electronic devices on the market are more and more, and the performances of electronic components inside the electronic devices are also more and more powerful, which also leads to the larger heat generation of the present electronic devices. However, most of the electronic devices on the market at present still adopt a passive heat dissipation design, and this heat dissipation manner is relatively dependent on the temperature of the external environment and has poor heat dissipation efficiency. Therefore, part of the components are easily damaged due to overhigh temperature, or the frequency is directly reduced after the temperature reaches the warning temperature, so that all the performance of the components cannot be exerted, and the performance is excessive.
Disclosure of Invention
aims to solve the technical problem of poor heat dissipation efficiency of electronic equipment in the prior art;
another objectives of the present invention are to provide electronic devices with active heat dissipation structure.
In order to solve the technical problems, the invention adopts the following technical scheme:
according to aspects of the invention, the invention provides electronic devices, comprising:
a heat generating member;
the heating element is arranged on the side of the connecting plate, and the frame is provided with an air inlet and an air outlet;
the screen assembly is positioned on the other side of the middle frame, which is away from the heating element, and the screen assembly and the middle frame jointly form the heat dissipation channel;
and the fan is arranged in the heat dissipation channel.
According to the technical scheme, the invention has at least the following advantages and positive effects:
in the invention, a heat dissipation channel is arranged between the middle frame and the screen component, and the heat dissipation channel is in contact with a heating element in the electronic equipment, so that heat generated by the heating element can be guided into the heat dissipation channel, meanwhile, a fan is arranged in the heat dissipation channel, so that the air flow rate in the electronic equipment, particularly in the heat dissipation channel, can be accelerated through the rotation of the fan, and the heat accumulated in the heat dissipation channel can be discharged out of the electronic equipment in time.
Drawings
Fig. 1 is an exploded view of an embodiment of an electronic device of the present invention.
Fig. 2 is a schematic structural diagram of an embodiment of an electronic device according to the invention.
Fig. 3 is a cross-sectional view of an embodiment of an electronic device of the present invention.
Fig. 4 is a cross-sectional view of an embodiment of an electronic device of the present invention.
Fig. 5 is an enlarged view of the cross-sectional view of fig. 4 of the present invention.
Fig. 6 is a schematic structural diagram of an embodiment of a fan according to the present invention.
Fig. 7 is a schematic structural diagram of an embodiment of a fan according to the present invention.
Fig. 8 is a schematic structural diagram of an embodiment of an electronic device according to the invention.
Detailed Description
Exemplary embodiments that embody features and advantages of the invention are described in detail below in the specification. It is to be understood that the invention is capable of other embodiments and that various changes in form and details may be made therein without departing from the scope of the invention and the description and drawings are to be regarded as illustrative in nature and not as restrictive.
The invention provides electronic devices, which may be a mobile phone, a tablet computer, an electronic book, a game device, a wearable device, etc., and is not limited herein.
Specifically, in the present embodiment, as shown in fig. 1-5, the electronic device includes a middle frame 10, a screen assembly 20, a heat generating element 40, and a fan 60, the screen assembly 20 is located on side of the middle frame 10 and forms a heat dissipating channel 50 together with the middle frame 10, the fan 60 is disposed in the heat dissipating channel 50, the heat generating element 40 is disposed on side of the middle frame 10 away from the screen assembly 20, when heat dissipation is performed, the heat generating element 40 guides the generated heat into the heat dissipating channel 50 through the middle frame 10, and then the heat guided into the heat dissipating channel is extracted from the electronic device by rotation of the fan 60.
If the heat dissipation channel is arranged between the rear shell and the middle frame, an air duct wall needs to be additionally arranged to ensure the smoothness of the boundary of the heat dissipation air duct, otherwise, air can be subjected to large wind resistance in the flowing process to influence the flowing speed of the air in the heat dissipation channel, and further influence the heat dissipation efficiency of the electronic equipment.
Meanwhile, because the electronic equipment modules such as the front camera module and the front fingerprint identification module of the electronic equipment are respectively positioned at two ends of the screen assembly, the heat dissipation channel does not need to be designed into a straight shape, so that the air can flow more smoothly in the heat dissipation channel.
The electronic device may further include a second heat conducting layer 62 and a shielding cover 70, the shielding cover 70 is disposed on the heat generating member 40 for shielding electromagnetic waves from the outside to the heat generating member 40 and preventing electromagnetic waves generated by the heat generating member 40 from radiating to the outside, the second heat conducting layer 62 is disposed on the second heat conducting layer 3870, and the second heat conducting layer 70 is made of a heat conducting grease or silicone grease, wherein the second heat conducting layer 70 is made of a silicone grease, and the second heat conducting layer 3860 is made of a silicone grease, and the silicone grease is disposed on the second heat conducting layer 70, and the silicone grease is disposed on the second heat conducting layer 70, wherein the silicone grease is disposed on the second heat conducting layer 62, the silicone grease is disposed on the second heat conducting layer 70, and the silicone grease is used for guiding the heat generated by the heat generating member 40 to the heat conducting layer 50, and the silicone grease is used for guiding the heat generated by the heat generating member 40 to the heat conducting layer 70 from the second heat conducting layer 70 to the heat conducting layer 70, and the silicone grease shielding cover 70, and the silicone grease is disposed on the second heat conducting layer 70, wherein the silicone grease is made of silicone grease, and the silicone grease shielding cover 3875.
The middle frame 10 includes a connecting plate 110 and a frame 120 disposed around the connecting plate 110, and the heating element 40 is disposed on the side of the connecting plate 110.
In embodiments, as shown in fig. 3, the air inlet 510 and the air outlet 520 are respectively disposed on the side frame 120 at two opposite sides of the middle frame 10, and at this time, the heat dissipation channel 50 traverses the electronic device, so that the heat dissipation channel 50 is easier to be disposed as straight heat dissipation channels, and contacts with all the heat generating elements 40 in the electronic device as much as possible, so that after entering the electronic device from side of the electronic device, the external air can more smoothly circulate in the heat dissipation channel 50, and as much as possible, the heat generated by the heat generating elements 40 is discharged from the other side of the electronic device.
It is understood that, as shown in fig. 8, when the battery 30 of the electronic device is in contact with the th border 121 of the middle frame 10, the heat generating member 40 is disposed between the battery 30 and the second border 122 opposite to the th border 121, in this case, in order to bypass the battery 30 and contact as much of the heat generating member 40 as possible, the heat dissipation channel 50 is disposed between the second border 122 and the battery 30, respectively, to ensure that the heat generated by the heat generating member 40 is introduced into the heat dissipation channel 50 as much as possible, so that the fan 60 can draw the heat out of the electronic device from the heat dissipation channel 50, since the heat dissipation channel 50 is only in contact with the second border 122, the air inlet 510 and the air outlet 520 are simultaneously disposed on the second border 122, it is understood that, in this embodiment, when the user holds the electronic device, the air inlet 510 is located above the air outlet, so that when the external air enters the heat dissipation channel 50 through the air inlet 510, the air inlet 510 and the air outlet 520 are relatively lower in temperature than the heat dissipation channel 50, and the air outlet 520 is located above the heat dissipation channel 510, so that the heat of the electronic device is more evenly discharged through the heat dissipation channel 510.
As shown in fig. 3 to 7, the connecting plate 110 may be provided with a guide portion 111 near the air inlet 510 or the air outlet 520, and forms a guide channel 550 with the screen assembly 20. In the present embodiment, taking the example of providing the guide portion 111 at the intake vent 510 as an example, the guide channel 550 communicates with the intake vent 510.
It is understood that the guiding portion 111 may be provided with inclined planes, which extend from the end of the frame 120 facing away from the screen assembly 20 to separate the air inlet 510 from the heat generating element 40. since electronic devices in the market are thin and light, the heat generating element 40 0 is generally located at the middle position in the thickness direction of the electronic device, and thus the heat dissipation channel 50 is formed by the screen assembly 20 and the middle frame 10, it is located at the side close to the side of the screen assembly 20 in the thickness direction of the electronic device, and the air inlet 510 and the air outlet 520 are generally open at the middle position in the thickness direction of the middle frame 10, and the diameter is generally not less than half of the thickness of the electronic device or slightly less than half of the thickness of the electronic device, if the air inlet 510 is communicated with the heat dissipation channel 50, it is necessary that the guiding portion 111 extends from the air inlet 510 to the screen assembly 20 to the air outlet 510 to the heat dissipation channel 50 from the air inlet 510 to the heat dissipation channel 50, so that the air outlet 510 is connected to the heat dissipation channel 50, and then the heat dissipation channel 520 is kept connected to the air outlet via the fan , so that the heat dissipation channel 520 is kept connected to the heat dissipation channel 520, and thus the heat dissipation channel 520, and the fan 60 is kept in the heat dissipation channel 520, and the heat dissipation channel 520.
It is understood that the guiding portion 111 may also be disposed at the air outlet 520, and the guiding channel 550 is communicated with the air outlet 520, and the fan 60 may be disposed at the side of the heat dissipating channel 50 near the air inlet 510 and is in contact with and communicated with the air inlet 510.
The side of the connecting plate 110 facing the screen assembly 20 is provided with a plurality of heat dissipation fins 112 arranged in parallel, and the fan 60 can be arranged at the end of the heat dissipation fins 112, so that the heat dissipation channel 50 can be divided into a plurality of sub heat dissipation channels, the heat dissipation area of the heat dissipation channel 50 can be increased, the heat dissipation efficiency of the electronic device is further enhanced at , and meanwhile, the fan can timely discharge air passing through the heat dissipation fins 112 outside the electronic device.
It can be understood that the side of the connection board 110 facing the screen assembly 20 is provided with a groove 115, the bottom of the groove 115 is provided with a concave portion 1151, and the heat dissipation fins 112 can be disposed on the concave portion 1151, wherein the groove 115 can deepen the depth of the heat dissipation channel 50, so that the heat dissipation space of the heat dissipation channel 50 can be increased, and the heat dissipation efficiency of the electronic device can be improved, and the concave portion 1151 can further deepen the depth of the heat dissipation channel 50 by , so that the heat dissipation space of the heat dissipation channel 50 is further increased by , and thus the heat dissipation efficiency of the electronic device is further increased by .
, the well 1151 may include a ramp 11511 and a flat bottom 11512, with the fins 112 being disposed on the flat bottom 11512, the ramp 11511 facilitating a smoother transition between the well 1151 and the rest of the groove 115.
It is understood that the guiding portion 111 can be connected to the end of the groove 115, so that after the air enters the heat dissipation channel 50, the air is guided by the guiding portion 111, directly enters the groove 115, and passes through the heat dissipation fins 112, and the heat accumulated on the heat dissipation fins 112 is carried out of the electronic device.
Meanwhile, the bottom of the groove 115 may further be provided with a mounting groove 1152, the mounting groove 1152 is located at an side of the lower concave portion 1151, the fan 60 is mounted in the mounting groove 1152 and is provided with an air inlet surface 610 and an air outlet surface 620, the mounting groove 1152 is provided with a vent 1155, the air inlet surface 610 of the fan 60 is in contact communication with the vent 1155, and the air outlet surface 620 of the fan 60 is in contact communication with the air outlet 520.
It can be understood that the electronic device may further include a graphite sheet 80 and a sealing foam 90, the graphite sheet 80 is disposed between the screen assembly 20 and the middle frame 10 and is in contact with the middle frame 10, so that heat accumulated on the middle frame 10 can be conducted to the graphite sheet 80, and the heat dissipation efficiency of the electronic device is further increased , the sealing foam 90 is disposed between the screen assembly 20 and the graphite sheet 80, the graphite sheet 80 is provided with a graphite sheet hole 81 adapted to the heat dissipation channel 50, and the sealing foam 90 is also provided with a foam hole 91 adapted to the heat dissipation channel 50, the graphite sheet hole 81, the foam hole 91 and the middle frame 10 and the screen assembly 20 together form a boundary of the heat dissipation channel 50, so that the height of the heat dissipation channel 50 is further increased through the graphite sheet hole 81 and the foam hole 91, so that the heat dissipation space of the heat dissipation channel 50 is further increased , and thus the heat dissipation efficiency of the electronic device is further increased .
Since the present invention may be embodied in several forms without departing from the spirit or essential characteristics thereof, it should also be understood that the above-described embodiments are not limited by any of the details of the foregoing description, but rather should be construed broadly within its spirit and scope as defined in the appended claims, and therefore all changes and modifications that fall within the meets and bounds of the claims, or equivalences of such meets and bounds are therefore intended to be embraced by the appended claims.

Claims (14)

  1. An electronic device of the type , comprising:
    a heat generating member;
    the heating element is arranged on the side of the connecting plate, and the frame is provided with an air inlet and an air outlet;
    a screen component which is positioned on another side of the middle frame departing from the heating element and forms a heat dissipation channel together with the middle frame, and
    and the fan is arranged in the heat dissipation channel.
  2. 2. The electronic device of claim 1, wherein a guide portion is disposed on the connecting board near the air inlet or the air outlet, the guide portion and the screen assembly define a guide channel, and the guide channel is communicated with the air inlet or the air outlet.
  3. 3. The electronic device of claim 1, wherein the connecting board is provided with a plurality of heat dissipating fins on a side facing the screen assembly, and the fan is provided on a side of the heat dissipating fins.
  4. 4. The electronic device of claim 3, wherein the plurality of heat dissipating fins are arranged in parallel with each other.
  5. 5. The electronic device of claim 3, wherein the side of the connecting board facing of the screen assembly is provided with a groove, and the fan and the heat dissipation fin are arranged in the groove.
  6. 6. The electronic device of claim 3, wherein the bottom of the groove is provided with a lower recess, and the heat dissipation fin is arranged in the lower recess.
  7. 7. The electronic device of claim 6, wherein a mounting groove for mounting the fan is formed at the bottom of the groove, the mounting groove is provided with a vent, an air inlet surface of the fan is communicated with the vent, and an air outlet surface of the fan is communicated with the air outlet.
  8. 8. The electronic device of claim 1, wherein the fan is in contact with the air outlet.
  9. 9. The electronic device of claim 1, wherein the air outlet and the air inlet are respectively disposed on the frames at two sides of the middle frame.
  10. 10. The electronic device of claim 1, wherein the bezel comprises an -th bezel and a second bezel disposed opposite to the -th bezel, a battery of the electronic device is in abutting contact with the -th bezel, and the air outlet and the air inlet are both disposed on the second bezel.
  11. 11. The electronic device of claim 1, further comprising:
    the heat conduction layer is arranged on the heat generating piece and the surface facing the heat dissipation channel and used for timely conducting heat generated by the heat generating piece to the heat dissipation channel.
  12. 12. The electronic device of claim 11, further comprising a shield covering the heat generating element, and a second heat conducting layer covering the shield facing away from the heat generating element .
  13. 13. The electronic device of claim 1, further comprising:
    the graphite sheet is arranged between the screen assembly and the middle frame, a graphite sheet hole matched with the heat dissipation channel is formed in the graphite sheet, and the graphite sheet hole, the middle frame and the screen assembly jointly form the boundary of the heat dissipation channel.
  14. 14. The electronic device of claim 1, further comprising:
    the sealed foam is arranged between the screen component and the middle frame, foam holes matched with the heat dissipation channel are formed in the sealed foam, and the foam holes jointly form the boundary of the heat dissipation channel with the middle frame and the screen component.
CN201910978861.XA 2019-10-15 2019-10-15 Electronic equipment Active CN110740619B (en)

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Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
CN201910978861.XA CN110740619B (en) 2019-10-15 2019-10-15 Electronic equipment

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CN110740619A true CN110740619A (en) 2020-01-31
CN110740619B CN110740619B (en) 2020-12-29

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111182775A (en) * 2020-03-10 2020-05-19 昆山工研院新型平板显示技术中心有限公司 Display screen
CN112333992A (en) * 2020-11-23 2021-02-05 Oppo广东移动通信有限公司 Electronic device
CN112739145A (en) * 2020-11-16 2021-04-30 Oppo(重庆)智能科技有限公司 Electronic device
CN112864111A (en) * 2020-12-31 2021-05-28 南昌黑鲨科技有限公司 Heat dissipation structure for intelligent terminal and intelligent terminal
CN113784596A (en) * 2021-09-26 2021-12-10 维沃移动通信有限公司 Functional module and electronic equipment
WO2022262383A1 (en) * 2021-06-18 2022-12-22 华为技术有限公司 Electronic device
WO2023035987A1 (en) * 2021-09-10 2023-03-16 荣耀终端有限公司 Electronic device

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CN201035489Y (en) * 2007-03-20 2008-03-12 纬创资通股份有限公司 Electronic equipment and heat radiator thereof
CN207352550U (en) * 2017-07-21 2018-05-11 深圳海兰电子有限公司 High efficiency and heat radiation computer all-in-one machine
CN108990364A (en) * 2017-06-05 2018-12-11 北京小米移动软件有限公司 Electronic equipment
CN208903169U (en) * 2018-04-19 2019-05-24 科大讯飞股份有限公司 A kind of electronic equipment
CN110167324A (en) * 2019-06-21 2019-08-23 Oppo广东移动通信有限公司 Housing unit and preparation method thereof and electronic equipment

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201035489Y (en) * 2007-03-20 2008-03-12 纬创资通股份有限公司 Electronic equipment and heat radiator thereof
CN108990364A (en) * 2017-06-05 2018-12-11 北京小米移动软件有限公司 Electronic equipment
CN207352550U (en) * 2017-07-21 2018-05-11 深圳海兰电子有限公司 High efficiency and heat radiation computer all-in-one machine
CN208903169U (en) * 2018-04-19 2019-05-24 科大讯飞股份有限公司 A kind of electronic equipment
CN110167324A (en) * 2019-06-21 2019-08-23 Oppo广东移动通信有限公司 Housing unit and preparation method thereof and electronic equipment

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111182775A (en) * 2020-03-10 2020-05-19 昆山工研院新型平板显示技术中心有限公司 Display screen
CN112739145A (en) * 2020-11-16 2021-04-30 Oppo(重庆)智能科技有限公司 Electronic device
CN112739145B (en) * 2020-11-16 2023-06-30 Oppo(重庆)智能科技有限公司 Electronic equipment
CN112333992A (en) * 2020-11-23 2021-02-05 Oppo广东移动通信有限公司 Electronic device
CN112333992B (en) * 2020-11-23 2023-07-14 Oppo广东移动通信有限公司 Electronic equipment
CN112864111A (en) * 2020-12-31 2021-05-28 南昌黑鲨科技有限公司 Heat dissipation structure for intelligent terminal and intelligent terminal
WO2022262383A1 (en) * 2021-06-18 2022-12-22 华为技术有限公司 Electronic device
WO2023035987A1 (en) * 2021-09-10 2023-03-16 荣耀终端有限公司 Electronic device
EP4171187A4 (en) * 2021-09-10 2024-02-28 Honor Device Co Ltd Electronic device
CN113784596A (en) * 2021-09-26 2021-12-10 维沃移动通信有限公司 Functional module and electronic equipment
CN113784596B (en) * 2021-09-26 2024-01-30 维沃移动通信有限公司 Functional module and electronic equipment

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