CN211982303U

CN211982303U - Electronic equipment

Info

Publication number: CN211982303U
Application number: CN202020928154.8U
Authority: CN
Inventors: 王红梅; 王军
Original assignee: Shining Reality Wuxi Technology Co Ltd
Current assignee: Shining Reality Wuxi Technology Co Ltd
Priority date: 2020-05-22
Filing date: 2020-05-27
Publication date: 2020-11-20
Anticipated expiration: 2030-05-27

Abstract

The utility model discloses an electronic device, which comprises a device shell and an electronic device arranged in the device shell, wherein the disclosed electronic device also comprises a cavity shell, the cavity shell is arranged in the device shell, the cavity shell is provided with a first inlet and a first outlet, and the cavity shell forms a channel for fluid to pass through; a fluid drive device disposed in the channel; the equipment shell is respectively provided with a second inlet communicated with the first inlet and a second outlet communicated with the first outlet; the electronics are disposed between the chamber housing and the equipment housing. The scheme can solve the problem that the electronic equipment in the background technology cannot dissipate heat quickly.

Description

Electronic equipment

Technical Field

The utility model relates to a heat dissipation technical field especially relates to an electronic equipment.

Background

At present, electronic equipment (such as mobile phones, computers and the like) is inseparable from our lives and is visible everywhere in the lives, and the electronic equipment greatly improves the living standard of people.

With the coming of the 5G era, the rapid development of the internet can promote the rapid development of electronic equipment towards more intellectualization, so that the functions of the electronic equipment are more and more diversified. The diversification of functions can lead to more and more electronic components integrated on the circuit board, thereby increasing the heat productivity of electronic equipment. The heat dissipation problem is one of the main problems faced by current electronic devices, especially on intelligent wearable devices, if the heat dissipation design is not reasonable, not only the performance of key devices is affected, but also the wearing experience of users is affected due to too high temperature.

Generally, heat dissipation technologies used in electronic devices are mainly classified into active heat dissipation and passive heat dissipation. The active heat dissipation uses the fan to accelerate the air flow so as to achieve the purpose of fast heat dissipation; passive heat dissipation is mainly based on heat dissipation area or natural convection to dissipate heat. The passive heat dissipation has low heat dissipation efficiency and is generally used in electronic equipment with small heat productivity, and the active heat dissipation has high heat dissipation efficiency, so the passive heat dissipation has wide application.

Although the active heat dissipation can accelerate the air flow inside the electronic device, in the current practical application, because there are many devices inside the electronic device, the wind resistance is large, and thus the heat inside the electronic device cannot be dissipated out quickly.

Therefore, at present, more and more electronic components inside the electronic equipment cause larger wind resistance, and further the electronic equipment has the problem that heat cannot be dissipated quickly.

SUMMERY OF THE UTILITY MODEL

The utility model discloses an electronic equipment to solve in the background art electronic equipment have the problem that can't radiate the heat sooner.

In order to solve the problem, the utility model discloses a following technical scheme:

an electronic device comprising a device housing and electronics disposed within the device housing, the electronic device further comprising:

the cavity shell is arranged in the equipment shell, a first inlet and a first outlet are formed in the cavity shell, and a channel for fluid to pass through is formed in the cavity shell;

a fluid drive device disposed in the channel;

the equipment shell is respectively provided with a second inlet communicated with the first inlet and a second outlet communicated with the first outlet;

the electronics are disposed between the cavity housing and the device housing.

The utility model discloses a heat abstractor's technological effect as follows:

the embodiment of the utility model discloses among the electronic equipment, through set up the cavity shell in the equipment casing, the inside passageway that supplies the fluid to pass through that forms of cavity shell to form comparatively independent passageway in the equipment casing, the windage in this passageway is less, and has seted up first entry and first export on the cavity shell, the second entry intercommunication on first entry and the equipment casing, the second export intercommunication on first export and the equipment casing, so that passageway and electronic equipment outside intercommunication. Based on this, on the heat transfer on the electron device arrived the cavity shell, because the windage in the passageway is less, passive radiating effectual for under fluid drive arrangement's drive, make the fluid can pass through the passageway relatively fast, thereby can be with the heat that transmits to on the cavity shell relatively fast effluvium, and then can relatively fast with the produced heat effluvium of electronic equipment.

It is thus clear that compare in the background art electronic equipment, the utility model discloses electronic equipment can solve the problem that can't radiate the heat faster.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments or the background art of the present invention, the drawings used in the description of the embodiments or the background art will be briefly described below, and it is obvious for those skilled in the art to obtain other drawings without inventive labor.

Fig. 1 is a schematic structural diagram of an electronic device disclosed in an embodiment of the present invention;

FIG. 2 is an enlarged schematic view of a portion of the structure of FIG. 1;

fig. 3 is a schematic view of a partial structure of an electronic device disclosed in an embodiment of the present invention;

FIG. 4 is a schematic structural diagram of an electronic device according to another embodiment of the disclosure;

FIG. 5 is an enlarged view of a portion of the structure of FIG. 4;

FIG. 6 is a graph of fan performance.

Description of reference numerals:

100-chamber housing, 110-first inlet, 120-first outlet, 130-channel, 140-plane, 150-first sub-housing, 160-second sub-housing, 170-first seal;

200-a fluid driving device;

300-device housing, 310-second inlet, 320-second outlet;

400-a second heat sink;

500-electronic device, 510-circuit board, 520-electronic component;

600-a thermally conductive layer;

700-a second seal;

800-device chamber.

Detailed Description

To make the purpose, technical solution and advantages of the present invention clearer, the following will combine the embodiments of the present invention and the corresponding drawings to clearly and completely describe the technical solution of the present invention. It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

The technical solutions disclosed in the embodiments of the present invention are described in detail below with reference to the accompanying drawings.

Referring to fig. 1 to 5, an electronic device according to an embodiment of the present invention includes a device housing 300, an electronic device 500, a chamber housing 100, and a fluid driving apparatus 200.

The device case 300 is a basic component of the electronic device, and the device case 300 can provide a mounting base for other components of the electronic device and also protect electronic devices inside the electronic device. The device housing 300 defines a second inlet 310 and a second outlet 320. The electronic device 500 is disposed in the equipment housing 300, and the electronic device 500 is generally a heat generating device (e.g., a chip, etc.) in the electronic equipment, and the electronic device 500 generates more heat during the operation of the electronic equipment.

The cavity housing 100 is disposed in the device housing 300, the cavity housing 100 is opened with a first inlet 110 and a first outlet 120, the cavity housing 100 forms a channel 130 for fluid to pass through, the electronic device 500 is located between the cavity housing 100 and the device housing 300, and the channel 130 is communicated with both the first inlet 110 and the first outlet 120. Specifically, the first inlet 110 is in communication with the second inlet 310, the first outlet 120 is in communication with the second outlet 320, and fluid outside the electronic device can enter the channel 130 through the second inlet 310 and the first inlet 110 and be discharged from the first outlet 120 and the second outlet 320 through the channel 130. The electronic device 500 is not arranged in the channel 130 formed by the cavity housing 100, so that the fluid circulating in the channel 130 is not blocked, and the heat dissipation effect is good. The material of the chamber housing 100 may be various, such as stainless steel, aluminum or copper, which is not limited in the embodiment of the present invention. Typically, the first inlet 110 and the first outlet 120 are opened at both ends of the chamber housing 100, respectively.

In the embodiment of the present invention, the fluid driving device 200 is disposed in the channel 130, and the fluid driving device 200 is used to accelerate the flow rate of the fluid in the channel 130, such as air, so that the air can pass through the channel 130 faster, and the air passing through the channel 130 in a shorter time is more, and further more heat can be taken away by the more air. In a preferred embodiment, the fluid driving device 200 may be a fan, which is simple and reliable, has a low cost, and has a good driving effect on the air flow.

The electronic device 500 is disposed between the chamber housing 100 and the apparatus case 300 such that heat transferred from the electronic device 500 to the chamber housing 100 is dissipated to the outside of the apparatus case 300 through the fluid.

The embodiment of the utility model discloses among the electronic equipment, through set up cavity shell 100 in equipment housing 300, thereby form comparatively independent passageway 130 in equipment housing 300, the windage in this passageway 130 is less, this passageway 130 specifically comprises cavity shell 100, and first entry 110 and first export 120 have been seted up on cavity shell 100, second entry 310 intercommunication on first entry 110 and the equipment housing 300, the fluid passes through second entry 310 and first entry 110 entering channel 130, first export 120 communicates with the second export 320 on the equipment housing 300, the fluid passes through first export 120 and the electronic equipment of second export 320 discharge, so that passageway 130 communicates with electronic equipment's outside. Based on this, heat on the electronic device 500 is transferred to the cavity housing 100, and due to the smaller wind resistance in the channel 130, and under the driving of the fluid driving device 200, the fluid can pass through the channel 130 faster, so that the heat transferred to the cavity housing 100 can be dissipated faster, and further the heat generated by the electronic device can be dissipated faster.

In the embodiment of the present invention, the structural form of the chamber housing 100 may be various, and in an alternative embodiment, the chamber housing 100 may be integrally formed, and of course, the chamber housing 100 may also be a split structure. In another alternative embodiment, the chamber body 100 may include a first sub-housing 150, a second sub-housing 160, and a first sealing portion 170, wherein the first sub-housing 150 and the second sub-housing 160 are hermetically abutted by the first sealing portion 170 to form the channel 130. In this case, the chamber housing 100 is an assembly structure, which facilitates installation and maintenance of the fluid driving device 200 in the channel 130, thereby improving assemblability of the electronic device. Specifically, the first sub-housing 150 and the second sub-housing 160 may be connected by snapping, adhering, connecting with a connector (e.g., a threaded connector), and the like, and the first sealing portion 170 may be clamped between the first sub-housing 150 and the second sub-housing 160.

In an alternative embodiment, the first sub-housing 150 may have a first side wall facing downward, the second sub-housing 160 may have a second side wall facing upward, a rim of the first side wall and a rim of the second side wall correspond in shape, and the rim of the first side wall and the rim of the second side wall are in sealing abutment by the first sealing portion 170; the first inlet 110 and the first outlet 120 are disposed where the rim of the first sidewall and the rim of the second sidewall meet. The scheme is a specific way that the first sub-housing 150 and the second sub-housing 160 are in sealed butt joint through the first sealing portion 170, the structure of the way is simple, the sealing effect after the edge of the first side wall and the edge of the second side wall are in sealed butt joint through the first sealing portion 170 is good, and the first inlet 110 and the first outlet 120 are convenient to open.

In order to transfer heat on the electronic device 500 to the chamber housing 100 more quickly, in an alternative embodiment, the outer side of the chamber housing 100 may include a flat surface 140 for thermally conductive connection of the electronic device 500, or the outer side of at least one of the first sub-housing 150 and the second sub-housing 160 may include a flat surface 140 for thermally conductive connection of the electronic device 500. The outer side of the chamber housing 100 may be elliptical or cylindrical as a whole, and the outer side for thermally connecting the electronic device 500 may be a planar structure. Alternatively, the outer side of the chamber housing 100 may be a rectangular parallelepiped, and the outer side to which the electronic device 500 is connected has the largest surface area. The electronic device 500 is connected with the plane 140 in a heat conducting manner, so that the contact area between the electronic device 500 and the plane 140 is large, heat on the electronic device 500 can be quickly transferred to the cavity housing 100, and heat generated by electronic equipment can be quickly dissipated.

Specifically, the electronic device 500 may include a circuit board 510 and an electronic component 520 disposed on the circuit board 510, and the circuit board 510 may be attached to the plane 140, so that heat generated by the electronic component 520 is directly transferred to the cavity housing 100 through the circuit board 510 to be dissipated, thereby dissipating heat on the electronic component 520.

The manner of thermally conductive connection of the circuit board 510 to the chamber housing 100 is not limited to such attachment, the heat-conducting connection mode of the heat-conducting connecting piece has various modes, can be bonding by glue or bolt connection, so that the circuit board 510 is thermally connected to the plane 140 of the chamber housing 100, which is not limited in the embodiment of the present invention, in an alternative embodiment, the circuit board 510 may be thermally connected to the plane 140 by a thermal conductive adhesive or a thermal conductive grease, since the thermal conductivity of the thermal conductive paste or grease is generally greater than that of the circuit board 510, the thermal conductive paste or grease can transfer heat from the circuit board 510 to the chamber body case 100 more quickly, so that the heat from the circuit board 510 is dissipated as efficiently as possible, therefore, the electronic component 520 is prevented from being incapable of working normally or being damaged due to overhigh temperature, and the reliability of the electronic equipment can be improved finally.

In order to further enable the heat on the electronic device 500 to be transferred to the chamber housing 100 more quickly, in an alternative embodiment, the thermal conductivity of the material of the portion of the chamber housing 100 corresponding to the electronic device 500 may be higher than the thermal conductivity of the material of the other portion of the chamber housing 100, or the thermal conductivity of the material of the portion of at least one of the first sub-housing 150 and the second sub-housing 160 corresponding to the electronic device 500 may be higher than the thermal conductivity of the material of the other portion of the chamber housing 100. This approach clearly further enables faster heat transfer from the electronic device 500 to the chamber housing 100.

In the embodiment of the present invention, in order to dissipate the heat on the cavity housing 100 more quickly, the flow rate of the fluid in the channel 130 may be increased, and the heat dissipation area contacting with the fluid in the channel 130 may also be increased. Based on this, in an alternative embodiment, the inner side surface of the chamber housing 100 may include a curved surface, or the inner side surface of at least one of the first sub-housing 150 and the second sub-housing 160 includes a curved surface, the curved surface is disposed corresponding to the electronic device 500, and the inner side surface of the chamber housing 100 is disposed with a curved surface, which may increase the heat dissipation area, wherein the curved surface may be disposed with protrusions having different heights or the inner side surface is disposed with a rough surface, so as to increase the turbulence and increase the flow speed of the fluid. The first heat sink is disposed at a position corresponding to the electronic device 500 on the inner side of the cavity housing 100, or at a position corresponding to the electronic device 500 on the inner side of at least one of the first sub-housing 150 and the second sub-housing 160. The first heat sink can increase a heat dissipation area, and can allow heat transferred to the chamber housing 100 to be more rapidly dissipated. Meanwhile, the first heat sink arranged at the position of the cavity housing 100 corresponding to the curved surface is adapted to the curved surface, so that the area of the first heat sink in heat conduction connection with the cavity housing 100 can be increased, and thus the heat on the cavity housing 100 can be quickly transferred to the first heat sink.

Specifically, the first heat sink may be made of a material with good heat dissipation performance, so that heat on the cavity housing 100 can be quickly transferred to the first heat sink, and the heat can be quickly dissipated by the large heat dissipation area of the first heat sink, so that heat in the electronic device can be quickly dissipated.

In an alternative embodiment, the channel 130 formed by the first sub-housing 150 and the second sub-housing 160 may have a size of 4mm to 8mm in a top-to-bottom direction. Typically, the thickness of the via 130 is relatively thin and the surface of the via 130 that contacts the electronic device 500 is relatively large. Because the cavity housing 100 is thin, the fluid inside the channel can also achieve the purposes of increasing the fluid speed and increasing the contact area by colliding the upper and lower surfaces, the cavity housing 100 occupies a smaller space in the device housing 300, thereby facilitating the installation of other components in the device housing 300 and also improving the heat dissipation effect. In particular, the cavity housing 100 can be applied to a thinner electronic device, and is very suitable for the requirement of the electronic device for lightness and thinness. In particular, the electronic devices inside the device housing 300 are generally arranged in a layer, and the electronic devices are in contact with the outer surface of the chamber housing 100, and the channel 130 with such a thickness has a very good heat dissipation effect on the electronic device.

The direction of the channel 130 from top to bottom is the thickness direction of the cavity housing 100, and may be the thickness direction of the electronic device.

In order to further improve the heat dissipation performance of the cavity housing 100, in an alternative embodiment, the thermal conductivity of the first sub-housing 150 and the second sub-housing 160 may be 150W/(m × k) to 400W/(m × k), so that the thermal conductivity of the first sub-housing 150 and the second sub-housing 160 is higher, and the thermal conductivity of the first sub-housing 150 and the second sub-housing 160 can lead out heat more quickly.

Specifically, at least one of the first sub-housing 150 and the second sub-housing 160 may be an aluminum alloy housing or a magnesium aluminum alloy housing, which is good in heat conductivity and suitable in price, so that the electronic device can be produced in mass.

As described above, the first heat sink can increase a heat dissipation area, and can allow heat transferred to the chamber housing 100 to be more rapidly dissipated. In this regard, in an alternative embodiment, the electronic device may further include a second heat sink 400 positioned in the channel 130 and proximate to the first outlet 120. The second heat sink 400 is attached to the inner surface of the chamber housing 100. In this case, the second heat sink 400 can increase a heat dissipation area, and can dissipate heat transferred to the chamber housing 100 more quickly. Further, the second heat sink 400 may be made of a material with good heat dissipation performance, so that heat on the cavity housing 100 can be quickly transferred to the second heat sink 400, and the heat can be quickly dissipated by the large heat dissipation area of the second heat sink 400, so that heat on the cavity housing 100 can be quickly dissipated.

In a general case, the fluid passing through the second heat sink 400 takes away a part of the heat, which results in a higher temperature of the fluid passing through the second heat sink 400, and the part of the fluid passes through other positions of the channel 130, and the heat in the fluid with the higher temperature may be transferred to the chamber housing 100, and a part of the heat may be transferred to the chamber housing 100. Based on this situation, in the above scheme, the second heat sink 400 is close to the first outlet 120, so that the fluid taking away a part of heat on the second heat sink 400 directly flows out of the channel 130, and the heat on the second heat sink 400 can be directly dissipated out of the cavity housing 100, thereby preventing the fluid passing through the second heat sink 400 from affecting heat dissipation at other positions, and further improving the heat dissipation performance of the electronic device.

Further, the fluid driving device 200 may be located between the second heat sink 400 and the first inlet 110, so that the fluid with the faster flow rate after passing through the fluid driving device 200 is blown to the second heat sink 400, thereby enabling the fluid flowing through the second heat sink 400 to take away more heat, and the fluid with the faster flow rate may also be quickly dissipated while enabling the fluid flowing through the second heat sink 400 to take away more heat, which undoubtedly may improve the heat dissipation capability of the heat dissipation device to a greater extent.

Furthermore, the second heat sink 400 and the fluid driving device 200 have a gap or at least partially fit with each other, so that the fluid driving device 200 can accelerate the flow rate of the fluid on the surface of the second heat sink 400 as much as possible, and thus the heat on the second heat sink 400 can be dissipated at a faster rate, thereby improving the heat dissipation performance of the electronic device. Of course, considering the installation process, the size of the gap between the second heat sink 400 and the fluid driving device 200 may be 0mm to 0.2mm, and at this distance, the installation and setting by an installer may be facilitated, and the gap between the second heat sink 400 and the fluid driving device 200 may not be large, so as to avoid the air leakage in the gap to a large extent.

In general, the larger the volume of the second heat sink 400, the larger the heat dissipation surface area of the second heat sink 400, and thus the heat dissipation efficiency of the second heat sink 400 can be made higher. Based on this, in an alternative embodiment, at least one of the first sub-housing 150 and the second sub-housing 160 may be provided with a groove at a position opposite to the second heat sink 400, and a portion of the second heat sink 400 is located in the groove. Under the condition, the groove is matched with the second radiating fin 400, so that the size of the second radiating fin 400 can be increased to a greater extent, the contact area of the second radiating fin 400 is increased, heat conducted out from the sub-shell can be better absorbed, and the second radiating fin 400 can be better radiated.

In the embodiment of the present invention, the chamber body housing 100 has a first inlet 110 and a first outlet 120. Alternatively, the first inlet 110 may be disposed opposite to the first outlet 120, and this scheme makes the flow passage of the fluid as straight as possible, thereby reducing the resistance of the passage 130 and increasing the convection in the passage 130 to enhance the heat dissipation efficiency.

Further, the fluid driving device 200 may be disposed opposite to the first outlet 120, so that the fluid driving device 200 can be directly opposite to the first outlet 120, thereby enabling the fluid driving device 200 to greatly promote heat exchange in the channel 130.

As described above, the fluid driving device 200 is disposed in the channel 130, and the fluid driving device 200 may occupy a certain space of the channel 130. Thus, in an alternative embodiment, the fluid driving device 200 may be disposed obliquely to the channel 130. Specifically, the fluid driving device 200 is obliquely disposed on the channel 130, so that the air flow direction in the fluid driving device 200 and the extending direction of the channel 130 form an included angle. This scheme can increase the space of passageway 130, makes fluid flow more smooth and easy, and the velocity of flow is faster to can promote electronic equipment radiating effect.

Specifically, referring to fig. 6, the main criteria of the fluid driving device 200 are: the rotation speed may be 10000 ± 25% RPM (revolutions per minute); when the static wind pressure is 0, the maximum air flow can be 0.1-0.4 CFM (cubic feet per minute)(ii) a When the air flow is 0, the maximum wind pressure can be 3.6-6.4 mmH₂O (millimeter water column); the operating voltage of the fluid driving apparatus 200 is 3V, and the positions indicated by arrows in the figure are parameters corresponding to the fluid driving apparatus 200 when the fluid driving apparatus 200 is in normal operation. Alternatively, when the static wind pressure is 0, the maximum air flow rate of the fluid driving device 200 may be 0.21-0.28 CFM (cubic feet per minute), and the air flow rate of the fluid driving device 200 is larger, so that more air can pass through the channel 130.

As described above, the device case 300 is provided with the second inlet 310 and the second outlet 320, which may cause foreign substances (e.g., liquid, dust) to enter the device case 300 through the second inlet 310 or the second outlet 320 and cause a functional failure of the electronic device, and thus, the second inlet 310 and the second outlet 320 need to be sealed.

Based on this, the electronic device further includes: a first connection wall disposed between the first inlet 110 and the second inlet 310 and connecting the first inlet 110 and the second inlet 310 such that fluid entering from the second inlet 310 directly enters the first inlet 110 through the first connection wall; and a second connection wall disposed between the first outlet port 120 and the second outlet port 320 and connecting the first outlet port 120 and the second outlet port 320 such that the fluid flowing out of the second outlet port 320 directly flows out of the first outlet port 120 through the second connection wall. The fluid enters the channel 130 through the second inlet 310, the first connecting wall, and the first inlet 110, and then flows out of the electronic device through the first outlet 120, the second connecting wall, and the first outlet 120, and does not enter the electronic device 500 between the device housing 300 and the chamber housing 100.

In an alternative embodiment, the second inlet 310 is disposed opposite to the first inlet 110, the second outlet 320 is disposed opposite to the first outlet 120, and the second inlet 310 and the first inlet 110 and the second outlet 320 and the first outlet 120 are in sealing contact with each other through the second sealing portion 700; the device case 300, the chamber body housing 100, and the second sealing part 700 are sealed to form the device chamber 800, and the electronic device 500 is sealed in the device chamber 800. So that the foreign matters cannot enter the device cavity 800 of the apparatus housing 300 through the second inlet 310 or the second outlet 320, and thus the electronic apparatus has certain waterproof and dustproof performances, and the reliability of the electronic apparatus can be improved.

The chamber body housing 100 and the device case 300 form a device chamber 800 therebetween, and the device chamber 800 is used for disposing electronic components in the electronic device.

Specifically, the first sealing portion 170 and the second sealing portion 700 described above may be a sealing gasket (e.g., a sealing foam sheet), a sealing adhesive layer, etc., and the embodiments of the present invention do not limit the specific types of the first sealing portion 170 and the second sealing portion 700.

In an alternative embodiment, the electronic device may further include a heat conductive layer 600, the heat conductive layer 600 being attached to the inner side of the cavity housing 100. The heat conducting layer 600 can transfer heat quickly, and meanwhile, the heat conducting layer 600 can enable the heat distribution on the cavity housing 100 to be uniform, so that local overheating of the cavity housing 100 is avoided, and the heat distribution is uniformly improved, so that the heat dissipation rate of the cavity housing 100 is facilitated.

Generally, the temperature of the fluid just entering the channel 130 is lower, so that the fluid can take away more heat, and the heat dissipation effect of the part of the fluid passing through the position is better. Therefore, in an alternative embodiment, the distance between the electronic device 500 and the first inlet 110 may be smaller than the distance between the electronic device 500 and the first outlet 120, so that more heat on the electronic device 500 is transferred to a position on the cavity housing 100 close to the first inlet 110, where the position is firstly contacted with the fluid with lower temperature that has just entered the channel 130, so that more heat is taken away by the fluid with lower temperature, and this scheme is directed to dissipate heat of the electronic device 500, thereby greatly improving the heat dissipation effect of the electronic device 500. In embodiments of the present application, the fluid may be air, water, or the like. When the device chamber 800 is formed between the chamber body housing 100 and the apparatus housing 300, even if the fluid in the channel 130 is water, the operation of the electronic device in the device chamber 800 is not affected.

Further, the heat conduction layer 600 at least extends from the electronic device 500 to the fluid driving apparatus 200, and the heat conduction layer 600 transfers heat at the electronic device 500 to other positions, so as to avoid excessive heat on the cavity housing 100 at the electronic device 500, which leads to heat accumulation at the position, and further makes heat distribution on the cavity housing 100 more uniform.

As described above, the electronic apparatus further includes the second heat sink 400, and the second heat sink 400 can more quickly dissipate heat on the cavity case 100. In view of this, in an alternative embodiment, one end of the heat conductive layer 600 extends to the region opposite to the electronic device 500, and the other end of the heat conductive layer 600 extends to the region opposite to the second heat sink 400 and is in heat conductive connection with the second heat sink 400, so that the heat on the electronic device 500 is more quickly transferred to the second heat sink 400 through the heat conductive layer 600, and the heat dissipation performance of the second heat sink 400 is better, so that the heat on the electronic device 500 can be efficiently and quickly dissipated through the second heat sink 400.

Specifically, the cavity housing 100 may be an aluminum case, and the heat conducting layer 600 may be a copper layer, because the thermal conductivity of copper and aluminum are both large, the cavity housing 100 and the heat conducting layer 600 can transfer heat quickly, but because the thermal conductivity of copper is greater than the thermal conductivity of aluminum, the heat conducting layer 600 that needs to have faster thermal conductivity may be the copper layer, and the cost of copper is higher, and the density is large, and is not suitable for a large number of uses, so the cavity housing 100 may be an aluminum case with lower cost and smaller density. Of course, the cavity housing 100 may also be made of other metals with good thermal conductivity, and the embodiment of the present invention does not limit the specific material of the cavity housing 100.

In the embodiment of the present invention, the fluid driving device 200 may be located between the second heat sink 400 and the electronic device 500, and at first, the mounting positions of the fluid driving device 200 and the second heat sink 400 can be made to avoid the inner wall area opposite to the electronic device 500, and this inner wall area has a greater influence on the heat dissipation efficiency of the electronic device 500, so that the influence on the heat dissipation efficiency of the electronic device 500 can be avoided, so that the fluid with lower temperature in the inlet channel 130 firstly passes through this partial area, and further the heat dissipation efficiency of the electronic device 500 is improved. In addition, the fluid driving device 200 is disposed between the second heat sink 400 and the electronic device 500, so that the fluid having a fast flow rate after passing through the fluid driving device 200 flows toward the second heat sink 400, thereby enabling the heat on the second heat sink 400 to be dissipated faster.

The embodiment of the utility model provides an electronic equipment can be smart mobile phone, panel computer, electronic book reader, wearable equipment (for example intelligent wrist-watch, intelligent AR or VR glasses), electronic game machine, handle, equipment such as computational unit, the embodiment of the utility model provides a do not restrict electronic equipment's specific kind.

In the present specification, the respective preferred embodiments are only described with emphasis on differences from other embodiments, and the respective preferred embodiments may be arbitrarily combined as long as they do not conflict with each other, and the embodiments formed by combining are also within the scope disclosed in the present specification, and in view of the brevity of the present specification, the embodiments formed by combining are not separately described herein.

The above description is only exemplary of the invention, and is intended to enable those skilled in the art to understand and implement the invention. Various combinations of these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An electronic apparatus comprising an apparatus housing (300) and an electronic device (500) disposed within the apparatus housing (300), characterized in that the electronic apparatus further comprises:

the cavity shell (100), the cavity shell (100) is arranged in the equipment shell (300), the cavity shell (100) is provided with a first inlet (110) and a first outlet (120), and the cavity shell (100) forms a channel (130) for fluid to pass through;

a fluid drive device (200), the fluid drive device (200) being disposed in the channel (130);

the equipment shell (300) is respectively provided with a second inlet (310) communicated with the first inlet (110) and a second outlet (320) communicated with the first outlet (120);

the electronics (500) are disposed between the cavity housing (100) and the device housing (300).

2. The electronic device of claim 1, wherein the cavity housing (100) comprises a first sub-housing (150), a second sub-housing (160), and a first sealing portion (170), wherein the first sub-housing (150) and the second sub-housing (160) are in sealing interface via the first sealing portion (170); alternatively, the chamber housing (100) is integrally formed.

3. The electronic device according to claim 2, characterized in that the outer side of the cavity housing (100) comprises a plane (140) for thermally conductive connection of the electronic component (500), or,

an outer side of at least one of the first sub-housing (150) and the second sub-housing (160) comprises a plane (140) for thermally conductive connection of the electronic device (500).

4. The electronic device of claim 3, wherein the electronic device (500) comprises a circuit board (510) and an electronic component (520) disposed on the circuit board (510), the circuit board (510) being attached to the plane (140).

5. The electronic device of claim 4, wherein the circuit board (510) is thermally connected to the planar surface (140) by a thermally conductive glue or a thermally conductive grease.

6. The electronic device of claim 2, wherein the inner side of the cavity housing (100) comprises a curved surface, or the inner side of at least one of the first sub-housing (150) and the second sub-housing (160) comprises a curved surface, and the curved surface is disposed corresponding to the electronic component (500);

a first cooling fin is arranged at a position, corresponding to the electronic device (500), of the inner side surface of the cavity shell (100), or the first cooling fin is arranged at a position, corresponding to the electronic device (500), of the inner side surface of at least one of the first sub-shell (150) and the second sub-shell (160);

the curved surface is provided with protrusions with different heights or the inner side surface is a rough surface.

7. The electronic device according to claim 2, wherein a material of a portion of the cavity housing (100) corresponding to the electronic device (500) has a higher thermal conductivity than a material of other portions of the cavity housing (100), or wherein a material of a portion of at least one of the first sub-housing (150) and the second sub-housing (160) corresponding to the electronic device (500) has a higher thermal conductivity than a material of other portions of the cavity housing (100).

8. The electronic device of claim 2, wherein the first sub-housing (150) has a first side wall facing downward, the second sub-housing (160) has a second side wall facing upward, a rim of the first side wall and a rim of the second side wall correspond in shape, and the rim of the first side wall and the rim of the second side wall are in sealing abutment by the first sealing portion (170);

the first inlet (110) and the first outlet (120) are disposed at an interface of a rim of the first sidewall and a rim of the second sidewall.

9. The electronic device of claim 8, wherein the channel (130) formed by the first sub-housing (150) and the second sub-housing (160) has a dimension in a top-to-bottom direction of 4mm to 8 mm.

10. The electronic device of claim 8, wherein the first and second sub-housings (150, 160) have a thermal conductivity of 150W/(m k) to 400W/(m k).

11. The electronic device of claim 10, wherein at least one of the first sub-housing (150) and the second sub-housing (160) is an aluminum alloy housing or a magnesium aluminum alloy housing.

12. The electronic device of any of claims 1-11, further comprising a second heat sink (400) located in the channel (130) and proximate to the first outlet (120), the fluid driving device (200) being located between the second heat sink (400) and the first inlet (110), the second heat sink (400) having a gap or being at least partially conformable to the fluid driving device (200).

13. The electronic device according to claim 12, wherein the fluid driving device (200) is obliquely disposed to the channel (130).

14. The electronic device of claim 12, wherein when the static wind pressure is 0mmH₂And O, the maximum air flow of the fluid driving device (200) is 0.1 CFM-0.4 CFM.

15. The electronic device of claim 1, wherein the second inlet (310) is disposed opposite to the first inlet (110), the second outlet (320) is disposed opposite to the first outlet (120), and the second inlet (310) and the first inlet (110) and the second outlet (320) and the first outlet (120) are hermetically abutted by a second sealing portion (700), respectively;

the equipment housing (300), the chamber body housing (100) and the second sealing part (700) are sealed to form a device cavity (800), and the electronic device (500) is sealed in the device cavity (800).

16. The electronic device of claim 1, further comprising a thermally conductive layer (600), the thermally conductive layer (600) affixed to an inner side of the cavity housing (100).

17. An electronic device according to claim 16, characterized in that the distance of the electronic device (500) from the first inlet (110) is smaller than the distance of the electronic device (500) from the first outlet (120), the thermally conductive layer (600) extending at least from the electronic device (500) to the fluid driving means (200).

18. The electronic device of claim 16, wherein the thermally conductive layer (600) is a copper layer.

19. The electronic device of claim 1, further comprising:

a first connecting wall disposed between the first inlet (110) and the second inlet (310) and connecting the first inlet (110) and the second inlet (310) such that fluid entering from the second inlet (310) enters the first inlet (110) directly through the first connecting wall;

a second connecting wall disposed between the first outlet (120) and the second outlet (320) and connecting the first outlet (120) and the second outlet (320) such that fluid flowing out of the second outlet (320) directly flows out of the first outlet (120) through the second connecting wall.