CN211860965U - A shield and electronic equipment - Google Patents

Abstract

The embodiment of the application provides a shielding case and electronic equipment, relates to the technical field of electronic equipment, and can improve the height of the inner space of the shielding case so that electronic devices with larger height can be distributed in the shielding case. The shielding case comprises a shielding frame, a shielding cover and a shielding film; the shielding frame has relative first end and second end, and the shielding frame encloses into the cavity that has the terminal surface that runs through the first end and the terminal surface of second end, and the shielding lid is used for dismantling the terminal surface that covers the first end, and the position that corresponds the cavity on the shielding lid is equipped with the opening, and the shielding film covers the opening part in the surface of shielding lid, and shielding film and the shielding lid border fixed connection of opening part. The shielding case provided by the embodiment of the application is used for electronic devices on a circuit board.

Description

A shield and electronic equipment

This application claims the priority of a Chinese patent application with an application number of 201910699642.8 and an invention title of "A Terminal Shield and a Terminal", which was submitted to the State Intellectual Property Office on July 29, 2019, the entire contents of which are incorporated herein by reference. middle.

technical field

The present application relates to the technical field of electronic equipment, and in particular, to a shielding case and electronic equipment.

Background technique

On the circuit boards of mobile phones and other electronic devices, if there is no shielding structure between the electronic devices of different functional units, the high-frequency and low-frequency circuits will interfere with each other due to electromagnetic radiation, affecting the normal operation of the electronic devices. After the shielding structure is added, it can prevent the internal circuit of the shielding structure from radiating electromagnetic waves outward and the external electromagnetic waves of the shielding structure from entering the interior, so as to achieve the effect of not affecting other surrounding circuits and not being affected by the surrounding circuits.

FIG. 1 is a shielding cover in the prior art. As shown in FIG. 1 , the shielding cover includes a shielding frame 01 and a shielding cover 02 . The shielding frame 01 has a first surface 001 and a second surface 002 away from the first surface 001 , the shielding frame 01 is surrounded by a cavity 03 penetrating the first surface 001 and the second surface 002, as shown in FIG. 05 is accommodated in the cavity 03, and the shielding cover 02 is fastened to the second surface 002 of the shielding frame 01 to cover the electronic device 05 in the cavity 03. When the total height of the shielding The height is limited, thereby limiting the height of the electronics that can be placed inside the shield.

Utility model content

Embodiments of the present application provide a shielding case and an electronic device, which can increase the height of the interior space of the shielding case, so that electronic devices with a larger height can be arranged inside the shielding case.

To achieve the above object, the embodiments of the present application adopt the following technical solutions:

In a first aspect, an embodiment of the present application provides a shielding case, including a shielding frame, a shielding cover, and a shielding film; the shielding frame has a first end and a second end opposite to each other, and the shielding frame is surrounded by an end face and a second end that penetrate through the first end. The cavity on the end face of the two ends, the shielding cover is used to detachably cover the end face of the first end, and the shielding cover is provided with an opening at the position corresponding to the cavity, the shielding film covers the opening on the outer surface of the shielding cover, and the shielding film and The edge of the shield cover at the opening is fixedly connected.

Since the shielding case provided by the embodiment of the present application includes a shielding frame, a shielding cover and a shielding film, the shielding frame has opposite first ends and second ends, and the shielding frame encloses a void passing through the end face of the first end and the end face of the second end. The shielding cover is used to detachably cover the end face of the first end. Therefore, when the shielding case is used, the end face of the second end of the shielding frame can be fixed on the circuit board, and the electronic devices on the circuit board can be accommodated in the cavity. Then, the shielding cover is covered on the end face of the first end of the shielding frame, so as to cover the electronic device in the cavity, so as to shield the electronic device. In addition, because the shielding cover is provided with an opening at the position corresponding to the cavity, the shielding film covers the opening on the outer surface of the shielding cover, and the shielding film is fixedly connected to the edge of the shielding cover at the opening. Therefore, when the height of the shielding cover is constant, The height of the inner space of the shielding case is affected by the thickness of the shielding film. The thinner the shielding film is, the greater the height of the inner space of the shielding case is. Compared with the wall thickness of the shielding cover in the prior art, the thickness of the shielding film in the embodiment of the present application is It can be designed to be thinner, so the height of the inner space of the shield can be increased, so that electronic devices with a larger height can be arranged inside the shield.

With reference to the first aspect, in a first optional implementation manner of the first aspect, the shielding film includes an insulating base material and a metal layer formed on the insulating base material. Since the material price of the metal layer is usually high, in the embodiment of the present application, the shielding film uses an insulating substrate as the base film to form the metal layer, the thickness of the metal layer can be set to be very thin, and the metal layer uses less material. Therefore, the material cost of the shielding film can be reduced.

In combination with the first optional implementation manner of the first aspect, in the second optional implementation manner of the first aspect, the material of the insulating substrate is polyimide or polyester film, and the material of the metal layer is copper. Polyimide and polyester films have high toughness, high temperature resistance and friction resistance, which can improve the structural strength of insulating substrates. Copper has better electrical conductivity and can improve the shielding effect of the metal layer.

With reference to the first aspect, in a third optional implementation manner of the first aspect, the shielding film is a metal film. The shielding film of this structure has a simple structure and is easy to manufacture.

With reference to the third optional implementation manner of the first aspect, in a fourth optional implementation manner of the first aspect, the material of the shielding film is copper. Copper has better electrical conductivity and can improve the shielding effect of the shielding film.

With reference to any one of the optional implementation manners of the first aspect to the fourth optional implementation manner of the first aspect, in the fifth optional implementation manner of the first aspect, between the shielding film and the edge of the shielding cover at the opening The connection is fixed by welding. The fixed connection is made by welding, and the stability of the connection is better.

In combination with the third or fourth optional implementation manner of the first aspect, in a sixth optional implementation manner of the first aspect, the shielding film and the edge of the shielding cover at the opening are fixedly connected by laser spot welding. The laser spot welding method does not need filler solder, the welding speed is high, the contact is reliable, the deformation of the workpiece is small, and the shape is beautiful.

With reference to any one of the optional implementation manners of the first aspect to the fourth optional implementation manner of the first aspect, in the seventh optional implementation manner of the first aspect, between the shielding film and the edge of the shielding cover at the opening Secure the connection with conductive glue. When the conductive adhesive is used for fixed connection, no heating is required, and the operation is simple and convenient.

In combination with any one of the optional implementation manners of the first aspect to the seventh optional implementation manner of the first aspect, in the eighth optional implementation manner of the first aspect, the outer surface of the shielding cover is provided with a position corresponding to the opening. A sink in which the shielding film is located. In this way, it can be avoided that the shielding film protrudes from the outer surface of the shielding cover and affects the appearance of the shielding cover.

With reference to the eighth optional implementation manner of the first aspect, in a ninth optional implementation manner of the first aspect, the outer surface of the shielding film is flush with the outer surface of the shielding cover. In this way, the appearance of the shielding cover can be prevented from being affected by the shielding film protruding from the outer surface of the shielding cover, and at the same time, the shielding cover can be provided with a relatively high internal space, so that electronic devices with a relatively large height can be arranged inside the shielding cover .

With reference to any one of the optional implementation manners of the first aspect to the ninth optional implementation manner of the first aspect, in the tenth optional implementation manner of the first aspect, the shielding cover includes a top wall and a shield surrounding the top wall. A side wall is arranged around the edge of the inner surface, the inner surface of the top wall and the inner surface of the side wall form a clamping groove, and the first end of the shielding frame can be clamped in the clamping groove. In this way, the shielding cover can be detachably connected to the first end of the shielding frame in a snap-fit manner, and the installation and disassembly operations between the two components connected by the snap-fit manner are simple and efficient, thereby improving the performance of the shielding cover and the shielding frame. Efficiency between installation and removal.

In a second aspect, an embodiment of the present application provides an electronic device, including a circuit board, an electronic device, and a shielding cover, the electronic device is connected to the circuit board, and the shielding cover is the shielding cover described in any of the above technical solutions, and the shielding cover of the shielding cover The end surface of the second end of the frame is fixed on the circuit board, the electronic device is located in the cavity of the shielding frame, and the shielding cover of the shielding cover is detachably covered on the end surface of the first end of the shielding frame.

Since the shielding cover used in the electronic device of the embodiment of the present application is the same as the shielding cover described in any of the above technical solutions, the two can solve the same technical problem and achieve the same expected effect.

Description of drawings

1 is a schematic structural diagram of a shielding case provided by the prior art;

2 is a schematic structural diagram of an electronic device provided by the prior art;

3 is a schematic structural diagram of a shielding case provided by an embodiment of the present application;

FIG. 4 is a schematic structural diagram of a first electronic device provided by an embodiment of the present application;

FIG. 5 is a schematic structural diagram of a second electronic device provided by an embodiment of the present application;

FIG. 6 is a schematic structural diagram of a third electronic device according to an embodiment of the present application.

Detailed ways

The embodiment of the present application provides an electronic device, as shown in FIG. 4 , FIG. 5 or FIG. 6 , including a circuit board 2 , an electronic device 3 and a shielding cover 1 , and the electronic device 3 is connected to the circuit board 2 , and FIG. 3 is the application The embodiment provides a shielding cover 1. The shielding cover 1 includes a shielding frame 11, a shielding cover 12 and a shielding film 13; The cavity 14 of the end face of one end 100 and the end face of the second end 200, as shown in FIG. 4, FIG. 5 or FIG. 6, the end face of the second end 200 of the shielding frame 11 is fixed on the circuit board 2, and the electronic device 3 is located in In the cavity 14 , the shielding cover 12 is detachably covered on the end face of the first end 100 of the shielding frame 11 , and an opening 15 is provided on the shielding cover 12 corresponding to the cavity 14 , and the shielding film 13 covers the outer surface of the shielding cover 12 . The opening 15 is located at the opening, and the shielding film 13 is fixedly connected to the edge of the shielding cover 12 at the opening 15 .

In the above embodiment, the shielding frame 11 refers to a frame structure with shielding function. In order to make the shielding frame 11 have a shielding function, the shielding frame 11 should be partially or entirely made of conductive materials such as metal and graphite. The shielding cover 12 refers to a cover structure with a shielding effect. In order to make the shielding cover 12 have a shielding effect, the shielding cover 12 should be partially or entirely made of conductive materials such as metal and graphite. The shielding film 13 refers to a film structure with a shielding effect. In order to make the shielding film 13 have a shielding effect, the shielding film 13 should be partially or entirely made of conductive materials such as metal and graphite.

When the shielding case 1 is applied to the electronic device 3 on the circuit board 2 , the shielding frame 11 , the shielding cover 12 and the shielding film 13 can be electrically conductive or insulated from each other, which is not specifically limited here. When the shielding cover 1 is applied to the electronic device 3 and the shielding frame 11 , the shielding cover 12 and the shielding film 13 are insulated, in order to make the shielding cover 1 play a shielding role, the shielding frame 11 , the shielding cover 12 and the shielding film 13 The ground on board 2 should be connected separately. When the shielding cover 1 is applied to the electronic device 3, and the shielding frame 11, the shielding cover 12 and the shielding film 13 are conductive to each other, in order to make the shielding cover 1 play a shielding role, only the second end of the shielding frame 11 needs to be connected 200 (that is, one end of the shielding frame 11 connected to the circuit board 2 ) only needs to be connected to the ground on the circuit board 2 , so the grounding structure is simple and easy to implement. Specifically, in order to make the shielding frame 11 , the shielding cover 12 and the shielding film 13 inside the shielding cover 1 conductive to each other when the shielding cover 1 is applied to the electronic device 3 , when the shielding cover 12 is detachably covered on the first part of the shielding frame 11 When the end face of one end 100 is in contact with the shield cover 12 and the end face of the first end 100 of the shield frame 11 , the shield cover 12 and the shield film 13 conduct electricity through conductive glue, solder or direct contact.

It should be noted that the outer surface of the shielding cover 12 refers to the surface of the shielding cover 12 away from the cavity 14 when the shielding cover 12 is detachably covered on the end surface of the first end 100 of the shielding frame 11 .

As shown in FIG. 3 , since the shielding cover 1 provided by the embodiment of the present application includes a shielding frame 11 , a shielding cover 12 and a shielding film 13 ; the shielding frame 11 has opposite first ends 100 and second ends 200 , and the shielding frame 11 surrounds There is a cavity 14 penetrating the end face of the first end 100 and the end face of the second end 200. The shielding cover 12 is used to detachably cover the end face of the first end 100. When the shielding cover 1 is used, as shown in FIG. 4, FIG. 5 or FIG. 6, firstly, the end face of the second end 200 of the shielding frame 11 is fixed on the circuit board 2, and the electronic device 3 on the circuit board 2 is accommodated in the cavity 14, and then the shielding cover 12 is covered on the shielding frame 11. On the end face of the first end 100 of the electronic device 3 to cover the electronic device 3 in the cavity 14 , so as to shield the electronic device 3 . Since the shielding cover 12 is provided with an opening 15 at a position corresponding to the cavity 14, the shielding film 13 covers the opening 15 on the outer surface of the shielding cover 12, and the shielding film 13 is fixedly connected to the edge of the shielding cover 12 at the opening 15. Therefore, , when the height of the shielding cover 1 is constant, the height of the inner space of the shielding cover 1 is affected by the thickness of the shielding film 13. The smaller the thickness of the shielding film 13, the greater the height of the inner space of the shielding cover 1. Compared with the prior art The wall thickness of the middle shielding cover 12 and the thickness of the shielding film 13 in the embodiment of the present application can be designed to be thinner, so the height of the inner space of the shielding can 1 can be increased, so that the interior of the shielding can 1 can be arranged with larger height electrons Device 3.

Since the shielding case 1 used in the electronic device of the embodiment of the present application is the same as the shielding case 1 described in the above embodiment, the two can solve the same technical problem and achieve the same expected effect.

In some embodiments, as shown in FIG. 5 , the shielding film 13 includes an insulating substrate 131 and a metal layer 132 formed on the insulating substrate 131 . Due to the high material price of the metal layer 132, in the embodiment of the present application, the shielding film 13 uses the insulating substrate 131 as the base film to form the metal layer 132, the thickness of the metal layer 132 can be set very thin, and the thickness of the metal layer 132 The material used is less, so the material cost of the shielding film 13 can be reduced.

In the above embodiment, the metal layer 132 may be located on the side of the insulating substrate 131 away from the opening 15 , or may be located on the side of the insulating substrate 131 close to the opening 15 , which is not specifically limited here. However, in order to realize the conductive connection between the shielding film 13 and the shielding cover 12, in some embodiments, as shown in FIG. The edges of the shielding cover 12 at the opening 15 are opposite or in direct contact, so that the metal layer 132 is conductively connected to the edge of the shielding cover 12 at the opening 15 through solder, conductive glue or direct contact.

In some embodiments, the material of the insulating substrate 131 is polyimide or polyester film, and the material of the metal layer 132 is copper. Polyimide and polyester films have high toughness, high temperature resistance, and friction resistance, which can improve the structural strength of the insulating substrate 131 . Copper has better electrical conductivity and can improve the shielding effect of the metal layer 132 .

In other embodiments, as shown in FIG. 6 , the shielding film 13 is a metal film. The shielding film 13 of this structure has a simple structure and is easy to manufacture.

In the above embodiment, the material of the shielding film 13 can be copper, aluminum, stainless steel, etc., which is not specifically limited herein. In some embodiments, the material of the shielding film 13 is copper. Copper has better electrical conductivity and can improve the shielding effect of the shielding film 13 .

In some embodiments, the shielding film 13 and the edge of the shielding cover 12 at the opening 15 are fixedly connected by welding. conduct electricity between them. Specifically, when the shielding film 13 is a metal film, the shielding film 13 and the edge of the shielding cover 12 at the opening 15 can be fixedly connected by laser spot welding. The laser spot welding method does not require filler solder, the welding speed is high, and the contact point is reliable , The workpiece deformation is small, and the molding is beautiful. When the shielding film 13 includes an insulating base material 131 and a metal layer 132 formed on the insulating base material 131 , the shielding film 13 and the edge of the shielding cover 12 at the opening 15 can be fixedly connected by reflow soldering.

In other embodiments, the shielding film 13 and the edge of the shielding cover 12 at the opening 15 are fixedly connected by conductive glue. When the conductive adhesive is used for fixed connection, no heating is required, the operation is simple and convenient, and the risk is low.

In some embodiments, as shown in FIG. 5 or FIG. 6 , a recess 16 is provided on the outer surface of the shielding cover 12 at a position corresponding to the opening 15 , and the shielding film 13 is located in the recess 16 . In this way, it can be avoided that the shielding film 13 protrudes from the outer surface of the shielding cover 12 and affects the appearance of the shielding cover 12 .

In the above embodiment, the depth of the sink groove 16 may be equal to the thickness of the shielding film 13, or may be greater than the thickness of the shielding film 13, which is not specifically limited herein. In some embodiments, as shown in FIG. 6 , the outer surface of the shielding film 13 is flush with the outer surface of the shielding cover 12 . In this way, the depth of the recessed groove 16 is equal to the thickness of the shielding film 13, which can prevent the shielding film 13 from protruding from the outer surface of the shielding cover 12 and affect the appearance of the shielding cover 12. space, so that electronic devices 3 with a larger height can be arranged inside the shielding case 1 .

The shielding cover 12 and the first end 100 of the shielding frame 11 may be detachably connected through a screw thread or a snap-fit structure, which is not specifically limited herein. In some embodiments, as shown in FIG. 5 or FIG. 6 , the shielding cover 12 includes a top wall 121 and a side wall 122 disposed around the edge of the inner surface of the top wall 121 . The inner surface of the top wall 121 and the side wall 122 The inner surface of the shielding frame 11 forms a card slot, and the first end 100 of the shielding frame 11 can be clipped into the card slot. In this way, the shielding cover 12 can be detachably connected to the first end 100 of the shielding frame 11 in a snap-fit manner, and the installation and disassembly operations between the two components connected by the snap-fit manner are simple and efficient, thereby improving the shielding cover. Installation and removal efficiency between 12 and shield frame 11.

It should be noted that the inner surface of the top wall 121 refers to the surface of the top wall 121 close to the cavity 14 when the shielding cover 12 is detachably covered on the end surface of the first end 100 of the shielding frame 11 ; the inner surface of the side wall 122 It refers to the surface on the side wall 122 that is in contact with the inner surface of the top wall 121 .

In the description of this specification, the particular features, structures, materials or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: it can still be The technical solutions described in the foregoing embodiments are modified, or some technical features thereof are equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions in the embodiments of the present application.

Claims (10)

1. A shielding case, characterized in that, comprising a shielding frame, a shielding cover and a shielding film; The shielding frame has an opposite first end and a second end, the shielding frame encloses a cavity passing through the end face of the first end and the end face of the second end, and the shielding cover is used for detachable covering The end face of the first end, and the shielding cover is provided with an opening at a position corresponding to the cavity, the shielding film covers the opening on the outer surface of the shielding cover, and the shielding film is connected to the opening. The edge of the shielding cover at the opening is fixedly connected. 2 . The shielding case of claim 1 , wherein the shielding film comprises an insulating base material and a metal layer formed on the insulating base material. 3 . 3 . The shielding case according to claim 2 , wherein the material of the insulating base material is polyimide or polyester film, and the material of the metal layer is copper. 4 . 4. The shielding case of claim 1, wherein the shielding film is a metal film. 5 . The shielding case according to claim 4 , wherein the material of the shielding film is copper. 6 . 6 . The shielding cover according to claim 1 , wherein the shielding film and the edge of the shielding cover at the opening are fixedly connected by welding. 7 . 7 . The shielding cover according to claim 1 , wherein a sinking groove is provided on the outer surface of the shielding cover at a position corresponding to the opening, and the shielding film is located in the sinking slot. 8 . . 8. The shielding case of claim 7, wherein the outer surface of the shielding film is flush with the outer surface of the shielding cover. 9 . The shielding cover according to claim 1 , wherein the shielding cover comprises a top wall and a side wall arranged around an edge of an inner surface of the top wall, and the top wall The inner surface of the shielding frame and the inner surface of the side wall form a slot, and the first end of the shielding frame can be clipped into the slot. 10 . An electronic device, characterized in that it comprises a circuit board, an electronic device and a shielding cover, the electronic device is connected to the circuit board, and the shielding cover is the one according to any one of claims 1 to 9 . a shielding cover, the end face of the second end of the shielding frame of the shielding cover is fixed on the circuit board, the electronic device is located in the cavity of the shielding frame, and the shielding cover of the shielding cover is detachably covered on the on the end face of the first end of the shielding frame.

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