CN211860965U - Shielding case and electronic equipment - Google Patents
Shielding case and electronic equipment Download PDFInfo
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- CN211860965U CN211860965U CN201921415762.2U CN201921415762U CN211860965U CN 211860965 U CN211860965 U CN 211860965U CN 201921415762 U CN201921415762 U CN 201921415762U CN 211860965 U CN211860965 U CN 211860965U
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
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- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The embodiment of the application provides a shielding case and electronic equipment, relates to the technical field of electronic equipment, and can improve the height of the inner space of the shielding case so that electronic devices with larger height can be distributed in the shielding case. The shielding case comprises a shielding frame, a shielding cover and a shielding film; the shielding frame has relative first end and second end, and the shielding frame encloses into the cavity that has the terminal surface that runs through the first end and the terminal surface of second end, and the shielding lid is used for dismantling the terminal surface that covers the first end, and the position that corresponds the cavity on the shielding lid is equipped with the opening, and the shielding film covers the opening part in the surface of shielding lid, and shielding film and the shielding lid border fixed connection of opening part. The shielding case provided by the embodiment of the application is used for electronic devices on a circuit board.
Description
This application claims priority from a chinese patent application filed by the national intellectual property office on 29/07/2019 under application number 201910699642.8 entitled "a terminal shield and terminal," the entire contents of which are incorporated herein by reference.
Technical Field
The application relates to the technical field of electronic equipment, in particular to a shielding case and electronic equipment.
Background
On circuit boards of mobile phones and other electronic equipment, if no shielding structure exists between electronic devices of different functional units, the high-frequency and low-frequency circuits can generate mutual interference due to electromagnetic radiation, and normal operation of the electronic equipment is influenced. After the shielding structure is added, the electromagnetic waves radiated outside by the internal circuit of the shielding structure and the electromagnetic waves outside the shielding structure can be prevented from entering the inside of the shielding structure, so that the effects of not influencing other surrounding circuits and not being influenced by the surrounding circuits are achieved.
Fig. 1 is a shielding case in the prior art, as shown in fig. 1, the shielding case includes a shielding frame 01 and a shielding cover 02, the shielding frame 01 has a first surface 001 and a second surface 002 facing away from the first surface 001, the shielding frame 01 encloses a cavity 03 penetrating through the first surface 001 and the second surface 002, as shown in fig. 2, the first surface 001 of the shielding frame 01 is soldered on a circuit board 04, an electronic device 05 on the circuit board 04 is accommodated in the cavity 03, and the shielding cover 02 is fastened to the second surface 002 of the shielding frame 01 to cover the electronic device 05 in the cavity 03.
SUMMERY OF THE UTILITY MODEL
Embodiments of the present application provide a shield case and an electronic apparatus, which can improve the height of an internal space of the shield case, so that an electronic device with a larger height can be arranged inside the shield case.
In order to achieve the above purpose, the embodiment of the present application adopts the following technical solutions:
in a first aspect, embodiments of the present application provide a shielding case, including a shielding frame, a shielding cover, and a shielding film; the shielding frame has relative first end and second end, and the shielding frame encloses into the cavity that has the terminal surface that runs through the first end and the terminal surface of second end, and the shielding lid is used for dismantling the terminal surface that covers the first end, and the position that corresponds the cavity on the shielding lid is equipped with the opening, and the shielding film covers the opening part in the surface of shielding lid, and shielding film and the shielding lid border fixed connection of opening part.
Because the shield that this application embodiment provided includes the shield frame, shielding lid and shielding film, the shield frame has relative first end and second end, the shield frame encloses into the cavity that has the terminal surface that runs through the terminal surface of first end and the terminal surface of second end, the shielding lid is used for dismantling the terminal surface that covers first end, therefore, when using the shield, can be fixed in the terminal surface of the second end of shield frame on the circuit board, and hold the electron device on the circuit board in the cavity, then cover the shield on the terminal surface of the first end of shield frame, in order to locate the electron device cover in the cavity, thereby play the shielding effect to electron device. And because the position of the corresponding cavity on the shielding cover is provided with the opening, the shielding film covers the opening on the outer surface of the shielding cover, and the shielding film is fixedly connected with the edge of the shielding cover at the opening, when the height of the shielding cover is fixed, the height of the inner space of the shielding cover is influenced by the thickness of the shielding film, the thinner the shielding film is, the larger the height of the inner space of the shielding cover is, compared with the wall thickness of the shielding cover in the prior art, the thickness of the shielding film in the embodiment of the application can be designed to be thinner, so that the height of the inner space of the shielding cover can be improved, and electronic devices with larger height can be distributed in the shielding cover.
With reference to the first aspect, in a first optional implementation manner of the first aspect, the shielding film includes an insulating substrate and a metal layer formed on the insulating substrate. Since the material price of the metal layer is generally high, and in the embodiment of the present application, the shielding film uses the insulating substrate as the base film to form the metal layer, the thickness of the metal layer can be set very thin, and the material consumption of the metal layer is small, so the material consumption cost of the shielding film can be reduced.
With reference to the first optional implementation manner of the first aspect, in a second optional implementation manner of the first aspect, the material of the insulating base material is polyimide or polyester film, and the material of the metal layer is copper. The polyimide and polyester film have high toughness, high temperature resistance and friction resistance, and can improve the structural strength of the insulating base material. The copper has better conductivity, and can improve the shielding effect of the metal layer.
With reference to the first aspect, in a third optional implementation manner of the first aspect, the shielding film is a metal film. The shielding film with the structure has simple structure and easy manufacture.
With reference to the third optional implementation manner of the first aspect, in a fourth optional implementation manner of the first aspect, the material of the shielding film is copper. The copper has excellent conductivity, and the shielding effect of the shielding film can be improved.
With reference to the first aspect or any one of the fourth optional implementation manners of the first aspect, in a fifth optional implementation manner of the first aspect, the shielding film is fixedly connected to the edge of the shielding cover at the opening by welding. Carry out fixed connection through the welding mode, the stability of connection is better.
With reference to the third or fourth optional implementation manner of the first aspect, in a sixth optional implementation manner of the first aspect, the shielding film is fixedly connected to the edge of the shielding cover at the opening by laser spot welding. The laser spot welding mode does not need to be filled with welding flux, has high welding speed, reliable joint, small deformation of workpieces and attractive forming.
With reference to the first aspect or any one of the fourth optional implementation manners of the first aspect, in a seventh optional implementation manner of the first aspect, the shielding film is fixedly connected to the edge of the shielding cover at the opening through a conductive adhesive. When the conductive adhesive is adopted for fixed connection, heating is not needed, and the operation is simple and convenient.
With reference to the first aspect to any one of the seventh optional implementation manners of the first aspect, in an eighth optional implementation manner of the first aspect, a sunken groove is formed in a position, corresponding to the opening, of the outer surface of the shielding cover, and the shielding film is located in the sunken groove. Thus, it is possible to prevent the shielding film from protruding the outer surface of the shield cover to affect the appearance of the shield cover.
With reference to the eighth optional implementation manner of the first aspect, in a ninth optional implementation manner of the first aspect, an outer surface of the shielding film is flush with an outer surface of the shielding cover. Therefore, the shielding film can be prevented from influencing the appearance of the shielding cover due to the fact that the shielding film protrudes out of the outer surface of the shielding cover, meanwhile, the shielding cover can have an inner space with larger height, and therefore electronic devices with larger height can be distributed in the shielding cover.
With reference to the first aspect to any one of the ninth optional implementation manners of the first aspect, in a tenth optional implementation manner of the first aspect, the shielding cover includes a top wall and a side wall disposed around a periphery of an inner surface of the top wall, a clamping groove is defined by the inner surface of the top wall and the inner surface of the side wall, and the first end of the shielding frame can be clamped in the clamping groove. Like this, the shielding lid can adopt the lock mode can dismantle to connect in the first end of shielding frame, and the installation between two parts that adopt the lock mode to connect is dismantled easy operation, and efficiency is higher, can improve the installation between shielding lid and the shielding frame from this and dismantle efficiency.
In a second aspect, an embodiment of the present application provides an electronic device, including a circuit board, an electronic device and a shielding case, where the electronic device is connected to the circuit board, the shielding case is the above-mentioned any technical solution, an end face of a second end of a shielding frame of the shielding case is fixed to the circuit board, the electronic device is located in a cavity of the shielding frame, and a shielding cover of the shielding case is detachably covered on an end face of a first end of the shielding frame.
Since the shielding case used in the electronic device according to the embodiment of the present application is the same as the shielding case described in any of the above technical solutions, both can solve the same technical problem and achieve the same intended effect.
Drawings
Fig. 1 is a schematic structural diagram of a shielding case provided in the prior art;
fig. 2 is a schematic structural diagram of an electronic device provided in the prior art;
fig. 3 is a schematic structural diagram of a shielding case according to an embodiment of the present application;
fig. 4 is a schematic structural diagram of a first electronic device according to an embodiment of the present disclosure;
fig. 5 is a schematic structural diagram of a second electronic device according to an embodiment of the present application;
fig. 6 is a schematic structural diagram of a third electronic device according to an embodiment of the present application.
Detailed Description
An embodiment of the present application provides an electronic device, as shown in fig. 4, 5, or 6, including a circuit board 2, an electronic device 3, and a shielding case 1, where the electronic device 3 is connected to the circuit board 2, and fig. 3 is the shielding case 1 provided in the embodiment of the present application, where the shielding case 1 includes a shielding frame 11, a shielding cover 12, and a shielding film 13; the shielding frame 11 has a first end 100 and a second end 200 opposite to each other, the shielding frame 11 defines a cavity 14 penetrating through an end surface of the first end 100 and an end surface of the second end 200, as shown in fig. 4, 5 or 6, the end surface of the second end 200 of the shielding frame 11 is fixed on the circuit board 2, the electronic device 3 is located in the cavity 14, the shielding cover 12 detachably covers the end surface of the first end 100 of the shielding frame 11, an opening 15 is disposed on the shielding cover 12 at a position corresponding to the cavity 14, the shielding film 13 covers the opening 15 on the outer surface of the shielding cover 12, and the shielding film 13 is fixedly connected to an edge of the shielding cover 12 at the opening 15.
In the above embodiments, the shielding frame 11 is a frame structure having a shielding function, and in order to provide the shielding function to the shielding frame 11, the shielding frame 11 should be partially or entirely made of a conductive material such as metal or graphite. The shield cover 12 is a cover structure having a shielding function, and in order to provide the shielding function to the shield cover 12, the shield cover 12 should be partially or entirely made of a conductive material such as metal or graphite. The shielding film 13 is a film structure having a shielding effect, and in order to provide the shielding film 13 with the shielding effect, the shielding film 13 should be partially or entirely made of a conductive material such as metal or graphite.
When the shielding can 1 is applied to the electronic device 3 on the circuit board 2, the shielding frame 11, the shielding cover 12 and the shielding film 13 may be electrically conductive or insulated from each other, and are not limited in this respect. When the shielding case 1 is applied to the electronic device 3 and the shielding frame 11, the shielding cover 12 and the shielding film 13 are insulated from each other, the shielding frame 11, the shielding cover 12 and the shielding film 13 should be connected to the ground on the circuit board 2, respectively, in order to shield the shielding case 1. When the shielding case 1 is applied to the electronic device 3 and the shielding frame 11, the shielding cover 12 and the shielding film 13 are electrically conductive to each other, in order to shield the shielding case 1, only the second end 200 of the shielding frame 11 (i.e. the end of the shielding frame 11 connected to the circuit board 2) needs to be connected to the ground on the circuit board 2, so that the grounding structure is simple and easy to implement. Specifically, in order to make the shielding case 1, when applied to the electronic device 3, the shielding frame 11, the shielding cover 12 and the shielding film 13 inside the shielding case are electrically conductive, when the shielding cover 12 is detachably covered on the end surface of the first end 100 of the shielding frame 11, the shielding cover 12 is electrically conductive in contact with the end surface of the first end 100 of the shielding frame 11, and the shielding cover 12 is electrically conductive in contact with the shielding film 13 through a conductive adhesive, a solder or directly.
It should be noted that the outer surface of the shielding cover 12 refers to a surface of the shielding cover 12 away from the cavity 14 when the shielding cover 12 is detachably covered on the end surface of the first end 100 of the shielding frame 11.
As shown in fig. 3, the shield case 1 provided by the embodiment of the present application includes a shield frame 11, a shield cover 12, and a shield film 13; when the shielding case 1 is used, as shown in fig. 4, 5 or 6, firstly, the end face of the second end 200 of the shielding frame 11 is fixed on the circuit board 2, and the electronic device 3 on the circuit board 2 is accommodated in the cavity 14, and then the shielding cover 12 is covered on the end face of the first end 100 of the shielding frame 11, so as to cover the electronic device 3 in the cavity 14, thereby shielding the electronic device 3. Since the opening 15 is disposed on the shielding cover 12 corresponding to the cavity 14, the shielding film 13 covers the opening 15 on the outer surface of the shielding cover 12, and the shielding film 13 is fixedly connected to the edge of the shielding cover 12 at the opening 15, when the height of the shielding cover 1 is fixed, the height of the inner space of the shielding cover 1 is affected by the thickness of the shielding film 13, and the smaller the thickness of the shielding film 13 is, the larger the height of the inner space of the shielding cover 1 is, compared with the wall thickness of the shielding cover 12 in the prior art, the thickness of the shielding film 13 in the embodiment of the present application can be designed to be thinner, so that the height of the inner space of the shielding cover 1 can be increased, and the electronic device 3 with a larger height can be laid out inside the shielding cover 1.
Since the shield can 1 used in the electronic apparatus of the embodiment of the present application is the same as the shield can 1 described in the above embodiments, both can solve the same technical problem and achieve the same intended effect.
In some embodiments, as shown in fig. 5, the shielding film 13 includes an insulating substrate 131 and a metal layer 132 formed on the insulating substrate 131. Since the material price of the metal layer 132 is high, and in the embodiment of the present application, the shielding film 13 uses the insulating substrate 131 as a base film to mold the metal layer 132, the thickness of the metal layer 132 can be set to be very thin, and the material used for the metal layer 132 is small, so that the material cost of the shielding film 13 can be reduced.
In the above embodiments, the metal layer 132 may be located on a side of the insulating substrate 131 away from the opening 15, or located on a side of the insulating substrate 131 close to the opening 15, which is not limited in detail herein. However, in order to achieve the conductive connection between the shielding film 13 and the shielding cover 12, in some embodiments, as shown in fig. 5, the metal layer 132 is located on one side of the insulating substrate 131 near the opening 15, so that the metal layer 132 is opposite to or in direct contact with the edge of the shielding cover 12 at the opening 15, and the metal layer 132 is conductively connected to the edge of the shielding cover 12 at the opening 15 through solder, conductive adhesive or direct contact.
In some embodiments, the material of the insulating substrate 131 is polyimide or mylar, and the material of the metal layer 132 is copper. The polyimide and polyester films have high toughness, are resistant to high temperature and friction, and can improve the structural strength of the insulating base material 131. The copper has excellent conductivity, and can improve the shielding effect of the metal layer 132.
In other embodiments, as shown in FIG. 6, the shielding film 13 is a metal film. The shielding film 13 of this structure is simple in structure and easy to manufacture.
In the above embodiment, the material of the shielding film 13 may be copper, aluminum, stainless steel, etc., and is not particularly limited herein. In some embodiments, the material of the shielding film 13 is copper. The copper has excellent conductivity and can improve the shielding effect of the shielding film 13.
In some embodiments, the shielding film 13 is fixedly connected with the edge of the shielding cover 12 at the opening 15 by welding, the structural stability after the welding is good, and the shielding film 13 and the edge of the shielding cover 12 at the opening 15 can conduct electricity. Specifically, when the shielding film 13 is a metal film, the shielding film 13 and the edge of the shielding cover 12 at the opening 15 can be fixedly connected by adopting a laser spot welding mode, solder does not need to be filled in the laser spot welding mode, the welding speed is high, the joint is reliable, the workpiece deformation is small, and the forming is attractive. When the shielding film 13 includes the insulating substrate 131 and the metal layer 132 formed on the insulating substrate 131, the shielding film 13 and the edge of the shielding cover 12 at the opening 15 may be fixedly connected by reflow soldering.
In other embodiments, the shielding film 13 is fixedly connected to the edge of the shielding cover 12 at the opening 15 by a conductive adhesive. When the conductive adhesive is used for fixed connection, heating is not needed, the operation is simple and convenient, the danger is low, and the shielding film 13 and the edge of the shielding cover 12 at the opening 15 can be conducted.
In some embodiments, as shown in fig. 5 or fig. 6, a sunken groove 16 is formed on the outer surface of the shielding cover 12 at a position corresponding to the opening 15, and the shielding film 13 is located in the sunken groove 16. In this way, it is possible to avoid the influence of the shielding film 13 on the appearance of the shield cover 12 by protruding the outer surface of the shield cover 12.
In the above embodiment, the depth of the sinking groove 16 may be equal to the thickness of the shielding film 13, or may be greater than the thickness of the shielding film 13, and is not limited in detail herein. In some embodiments, as shown in fig. 6, the outer surface of the shielding film 13 is flush with the outer surface of the shielding cover 12. Thus, the depth of the sinking groove 16 is equal to the thickness of the shielding film 13, which can prevent the shielding film 13 from affecting the appearance of the shielding cover 12 due to the protrusion of the shielding film 13 from the outer surface of the shielding cover 12, and at the same time, the shielding cover 1 can have an inner space with a larger height, so that the electronic device 3 with a larger height can be arranged in the shielding cover 1.
The shielding cover 12 and the first end 100 of the shielding frame 11 may be detachably connected by a screw thread or a snap structure, and is not particularly limited herein. In some embodiments, as shown in fig. 5 or fig. 6, the shielding cover 12 includes a top wall 121 and a side wall 122 disposed around a periphery of an inner surface of the top wall 121, the inner surface of the top wall 121 and an inner surface of the side wall 122 form a slot, and the first end 100 of the shielding frame 11 can be snapped into the slot. In this way, the shielding cover 12 can be detachably connected to the first end 100 of the shielding frame 11 in a buckling manner, and the assembly and disassembly operations between the two components connected in the buckling manner are simple and efficient, so that the assembly and disassembly efficiency between the shielding cover 12 and the shielding frame 11 can be improved.
It should be noted that the inner surface of the top wall 121 refers to a surface of the top wall 121 close to the cavity 14 when the shielding cover 12 is detachably covered on the end surface of the first end 100 of the shielding frame 11; the inner surface of the side wall 122 refers to the surface of the side wall 122 that meets the inner surface of the top wall 121.
In the description herein, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions in the embodiments of the present application.
Claims (10)
1. A shielding case is characterized by comprising a shielding frame, a shielding cover and a shielding film;
the shielding frame has relative first end and second end, the shielding frame encloses to become to run through the terminal surface of first end with the cavity of the terminal surface of second end, the shielding lid is used for dismantling the cover the terminal surface of first end, just correspond on the shielding lid the position of cavity is equipped with the opening, the shielding membrane cover in the surface of shielding lid the opening part, just the shielding membrane with the opening part shielding lid border fixed connection.
2. The shielding cage of claim 1, wherein said shielding film comprises an insulating substrate and a metal layer formed on said insulating substrate.
3. The shielding case of claim 2, wherein the insulating substrate is made of polyimide or mylar, and the metal layer is made of copper.
4. The shielding cage of claim 1, wherein said shielding film is a metal film.
5. The shielding cage of claim 4, wherein said shielding film is copper.
6. The shielding case according to any one of claims 1 to 5, wherein the shielding film is fixedly connected with the edge of the shielding cover at the opening by welding.
7. The shielding case according to any one of claims 1 to 5, wherein a sunken groove is formed in a position, corresponding to the opening, of an outer surface of the shielding cover, and the shielding film is located in the sunken groove.
8. The shielding cage of claim 7, wherein an outer surface of said shielding film is flush with an outer surface of said shield cover.
9. The shielding case according to any one of claims 1 to 5, wherein the shielding cover includes a top wall and a side wall disposed around a periphery of an inner surface of the top wall, a clamping groove is defined by the inner surface of the top wall and the inner surface of the side wall, and the first end of the shielding frame can be clamped in the clamping groove.
10. An electronic device, characterized in that, includes circuit board, electron device and shield cover, electron device connect in on the circuit board, the shield cover of any claim 1 ~ 9, the terminal surface of the second end of the shield frame of shield cover is fixed in on the circuit board, electron device is located in the cavity of shield frame, the shield lid of shield cover can dismantle cover in on the terminal surface of the first end of shield frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2020/104652 WO2021018061A1 (en) | 2019-07-29 | 2020-07-24 | Shielding case and electronic equipment |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2019106996428 | 2019-07-29 | ||
| CN201910699642 | 2019-07-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211860965U true CN211860965U (en) | 2020-11-03 |
Family
ID=73130204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921415762.2U Active CN211860965U (en) | 2019-07-29 | 2019-08-27 | Shielding case and electronic equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN211860965U (en) |
| WO (1) | WO2021018061A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116056409A (en) * | 2022-08-16 | 2023-05-02 | 荣耀终端有限公司 | Shielding and radiating structure of main board and electronic equipment |
| CN118450685A (en) * | 2023-09-19 | 2024-08-06 | 荣耀终端有限公司 | Shielding assembly, preparation method of shielding assembly, electronic device and clamp |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202435781U (en) * | 2011-12-27 | 2012-09-12 | 华为终端有限公司 | Terminal and electromagnetic shield thereof |
| US9105899B2 (en) * | 2012-09-07 | 2015-08-11 | Apple Inc. | Electronic device subassemblies |
| CN104427841A (en) * | 2013-09-09 | 2015-03-18 | 联想(北京)有限公司 | Shielding device |
| CN107787176A (en) * | 2017-10-19 | 2018-03-09 | 广东欧珀移动通信有限公司 | Radome, circuit board assemblies and mobile terminal |
-
2019
- 2019-08-27 CN CN201921415762.2U patent/CN211860965U/en active Active
-
2020
- 2020-07-24 WO PCT/CN2020/104652 patent/WO2021018061A1/en active Application Filing
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116056409A (en) * | 2022-08-16 | 2023-05-02 | 荣耀终端有限公司 | Shielding and radiating structure of main board and electronic equipment |
| CN116056409B (en) * | 2022-08-16 | 2023-10-24 | 荣耀终端有限公司 | Shielding and radiating structure of main board and electronic equipment |
| CN118450685A (en) * | 2023-09-19 | 2024-08-06 | 荣耀终端有限公司 | Shielding assembly, preparation method of shielding assembly, electronic device and clamp |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021018061A1 (en) | 2021-02-04 |
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Effective date of registration: 20210508 Address after: Unit 3401, unit a, building 6, Shenye Zhongcheng, No. 8089, Hongli West Road, Donghai community, Xiangmihu street, Futian District, Shenzhen, Guangdong 518040 Patentee after: Honor Device Co.,Ltd. Address before: 518129 Bantian HUAWEI headquarters office building, Longgang District, Guangdong, Shenzhen Patentee before: HUAWEI TECHNOLOGIES Co.,Ltd. |