CN104427841A - Shielding device - Google Patents
Shielding device Download PDFInfo
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- CN104427841A CN104427841A CN201310406872.3A CN201310406872A CN104427841A CN 104427841 A CN104427841 A CN 104427841A CN 201310406872 A CN201310406872 A CN 201310406872A CN 104427841 A CN104427841 A CN 104427841A
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- screening arrangement
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The embodiment of the invention provides a shielding device, relating to the field of electronic equipment and solving the problem of reduction of the performances of electronic equipment caused by poor shielding effects when electronic components are shielded by thin shielding devices with openings. The shielding device provided by the embodiment of the invention comprises a cover body used for covering an electronic component group on a printed circuit board and fixed on the printed circuit board, wherein an opening is formed in the position, corresponding to the highest electronic component in the electronic component group, on the top surface of the cover body, and the top surface of the highest electronic component and the top surface of the cover body are in a same horizontal plane. The shielding device also comprises an insulation element and a conductive element, wherein the opening is covered by the conductive element, and the insulation element is arranged between the conductive element and the top surface of the highest electronic component. The shielding device provided by the embodiment of the invention is used for shielding interference signals among the electronic components in the electronic equipment.
Description
Technical field
The present invention relates to field of electrical components, particularly relate to screening arrangement.
Background technology
In electronic equipment, integrated electronic component on a printed circuit can produce electric energy, magnetic energy and electromagnetic energy usually; the electric energy that multiple electronic component produces respectively, magnetic energy and electromagnetic energy can disturb the performance of other electron component in the electronic device; in order to protect electronic component, reduce interference, need to carry out shielding processing to electronic component.Device electronic component being carried out to shielding processing is called screening arrangement, and screening arrangement adopts electric conducting material to make usually.
As shown in Figure 1, screening arrangement mostly is cover body 11, is welded on printed circuit board (PCB) 13 on after the electric component group 12 formed with multiple electronic components that cover body 11 covers required shielding.When extruding the outer surface 111 of cover body 11 end face for preventing external force, this outer surface 111 deforms and causes the inner surface 113 of cover body 11 end face directly touch electronic component 12 and electronic component 12 is short-circuited, and therefore will leave gap between this inner surface 113 and electric component group 12.
Along with society is to the demand of electronic equipment slimization development trend, increasing producer can arrange opening 112 as shown in Figure 2 in order to the height reducing screening arrangement on cover body 11 end face, this opening 112 is arranged at the position of the cover body end face corresponding to electronic component the highest in electric component group, and the end face of this highly the highest electronic component need be made just to be positioned in same level with the outer surface 111 of cover body 11 end face; After end face arranges opening, the height of cover body 11 end face outer surface 111 equals the height of highly the highest electronic component, therefore the height space shared by thickness of cover body 11 end face itself is eliminated, also eliminate the inner surface 113 of cover body 11 end face and the height in electric component group 12 gap simultaneously, because this reducing the height of screening arrangement, thus the height of the electronic equipment holding this screening arrangement can be saved.
Because cover body end face is provided with opening, opening part does not have shielding material to play shielding action, therefore result in the electric component group of screening arrangement to required shielding and do not have best shield effectiveness, so that screening arrangement is inner is produced the interference of electric field, magnetic field and electromagnetic field between the electronic component of the electronic component that covers and screening arrangement outside, thus reduces the performance of electronic equipment.
Summary of the invention
Embodiments of the invention provide a kind of screening arrangement, solve when using the slim screening arrangement with opening to shield electronic component, and problem that cause electronic equipment performance reduce not good due to shield effectiveness.
For achieving the above object, embodiments of the invention adopt following technical scheme:
A kind of screening arrangement, comprise cover body, for covering the electric component group on printed circuit board (PCB), and in the corresponding described electric component group of fixing described cover body end face on the printed circuit board, the highest positions of electronic parts is provided with opening, and the end face of the highest described electronic component and the end face of described cover body are positioned in same level; Described screening arrangement also comprises insulating component and conductive member; Described conductive member covers described opening; Described insulating component is between described conductive member and the end face of the highest described electronic component, contactless to make between described conductive member and the highest electronic component.
The edge of described insulating component is greater than the edge of described opening, or, the top edge of electronic component the highest described in the edge of described insulating component is not less than.
In order to make insulating component have better insulation effect, the edge of described conductive member is not less than the edge of described insulating component.
In order to reduce the height of screening arrangement, the end face of described insulating component and described conductive member and the highest described electronic component bonds respectively.
Preferably, described conductive member is aluminium film, copper film or conductive fabric.
Preferably, described insulating component is insulating cement.
Preferably, the bonding place of described insulating component and described opening is provided with adhesive glue.
Preferably, the surface of the relatively described opening of described insulating component is provided with adhesive glue.
Preferably, the surrounding of described conductive member and the surrounding of described insulating component are provided with adhesive glue.
Preferably, adhesive glue is provided with between the adhesive surface on described conductive member surface and described insulating component surface.。
In the screening arrangement that the embodiment of the present invention provides, due to the opening using conductive member to cover cover body, screening arrangement many employings electric conducting material is made, conductive member has conductivity, therefore the shield effectiveness of screening arrangement can be improved, simultaneously producing short circuit problem to prevent from directly contacting between conductive member with the highest electronic component top, between conductive member and the end face of the highest electronic component, being also provided with insulating component, thus to enable screening arrangement be reliably that electronic component shields interference signal.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below.
Fig. 1 is a kind of structural representation of screening arrangement in prior art;
Fig. 2 is the another kind of structural representation of screening arrangement in prior art;
A kind of structural representation of the screening arrangement that Fig. 3 provides for the embodiment of the present invention;
The another kind of structural representation of the screening arrangement that Fig. 4 provides for the embodiment of the present invention;
The another kind of structural representation of the screening arrangement that Fig. 5 provides for the embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described.
Embodiments providing a kind of screening arrangement, as shown in Figure 3, comprise cover body 31, for covering the electric component group 32 on printed circuit board (PCB) 33, and being fixed on printed circuit board (PCB) 33; In the corresponding electric component group of cover body end face, the highest positions of electronic parts is provided with opening 312, and the end face 311 of the end face of the highest electronic component and cover body is positioned in same level; This screening arrangement also comprises insulating component 34 and conductive member 35; Conductive member 35 covers opening 312; Insulating component 34 is between conductive member 35 and the end face of the highest electronic component, contactless to make between conductive member 35 and the highest electronic component.
In the screening arrangement that the embodiment of the present invention provides, due to the opening 312 using conductive member 35 to cover cover body, screening arrangement many employings electric conducting material is made, conductive member has conductivity, therefore the shield effectiveness of screening arrangement can be improved, produce short circuit problem to prevent from directly contacting between conductive member 35 with the highest electronic component top simultaneously, between conductive member 35 and the end face of the highest electronic component, be also provided with insulating component 34, thus enable screening arrangement be reliably electronic component shielding interference signal.
Because conductive member 35 covers opening 312; Insulating component 34 is between conductive member 35 and the end face of the highest electronic component; Indicate between conductive member 35 and the end face of the highest electronic component and there is gap, insulating component 34 is ascended the throne during the period in gap, gap can be there is between the end face of insulating component 34 and the highest electronic component, also gap can not be there is, and, can gap be there is between conductive member 35 and insulating component 34, also can not there is gap.
It should be noted that: the end face of the highest electronic component and the end face of cover body are positioned in same level, can by the minimum constructive height after the height reduction of cover body to containing electronic components group, namely now the height of screening arrangement is minimum, because the thickness of film body is under normal circumstances all less, the gross thickness of the above-mentioned two-layer film body that can realize at present can reach 0.1mm; And in the prior art, because the inner surface of shielding cover body end face is wanted and reserves the safe distance of more than 0.2mm between the highest electronic component, screening cover thickness is generally between 0.15mm-0.2mm, and the difference in height between therefore from the outer surface of shielding cover body end face to the highest electronic component is at least 0.35mm-0.4mm; When therefore adopting the conductive member of the application and insulating component to cover on opening, the thickness of screening arrangement increases seldom, larger impact can not be produced on the thickness of electronic equipment, thus while the screening arrangement that can ensure to have opening has less thickness, there is reinforced shield effectiveness.
In the screening arrangement that above-described embodiment describes, the edge of insulating component 34 can be greater than the edge of opening 312 as shown in Figure 3, or, also can be not less than the edge of the highest electronic component as shown in Figure 4.Compared to the screening arrangement shown in Fig. 4, in the screening arrangement shown in Fig. 3, insulating component 34 has covered opening 312 completely, and at opening 312, place serves better insulating effect.
In the screening arrangement that above-described embodiment describes, the edge of conductive member 35 can be greater than the edge of insulating component 34 as shown in Figures 3 and 4.Or, also can equal the edge of insulating component 34 as shown in Figure 5.Compared to the screening arrangement shown in Fig. 5, in the screening arrangement shown in Fig. 3 and Fig. 4, conductive member 35 has covered insulating component 34 completely, and at opening 312, place serves better shielding action.
In the screening arrangement that above-described embodiment describes, as shown in Figure 3, insulating component 34 can bond respectively with the end face of conductive member 35 and the highest electronic component, insulating component 34 can be made after bonding minimum with the triangular height of end face of conductive member 35 and the highest electronic component, thus the height of screening arrangement can be reduced.
In the screening arrangement that above-described embodiment describes, conductive member 35 is preferably aluminium film, copper film or conductive fabric.The thickness of usual aluminium film, copper film or conductive fabric is less compared with the thickness of other electric conducting material, thickness as aluminium film and copper film is generally 0.05mm-0.1mm, the thickness of conductive fabric also can reach 0.05mm, and the thickness of other electric conducting material as normally used foreign copper-nickel alloy is in the industry 0.15mm-0.2mm, aluminium film, copper film or conductive fabric is therefore used to cover the height that screening arrangement opening can reduce further screening arrangement.
In the screening arrangement that above-described embodiment describes, insulating component is preferably insulating cement.Insulating cement not only can play insulation has effect can also play the effect of bonding simultaneously, uses a kind of material just can play two kinds of effects, does not just need to be coated with layer of adhesive again on insulating component, save operating procedure and operating time.
In the screening arrangement that above-described embodiment describes, insulating component 34 can be provided with adhesive glue with the bonding place of opening 312, just insulating component 34 and opening 312 can be bonded together, so arrange the use amount that can reduce adhesive glue, thus save production cost.
In the screening arrangement that above-described embodiment describes, the surface of insulating component 34 opposed open 312 can be provided with adhesive glue, so arranging can except can being bonded together insulating component 34 and opening 312, the end face of insulating component 34 with the highest electronic component can also be bonded together, gapless between the end face that can ensure insulating component 34 and the highest electronic component further, thus the thickness of screening arrangement can be reduced.
In the screening arrangement that above-described embodiment describes, the surrounding of conductive member 35 and the surrounding of insulating component 34 can be provided with adhesive glue, just conductive member 35 and insulating component 34 can be bonded together, the use amount that can reduce adhesive glue be so set, thus save production cost.
In the screening arrangement that above-described embodiment describes, adhesive glue can be provided with between the adhesive surface on conductive member 35 surface and insulating component 34 surface, so arranging can except can being bonded together conductive member 35 and insulating component 34, gapless between conductive member 35 and insulating component 34 can also be ensured further, thus the thickness of screening arrangement can be reduced.
The above; be only the specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, is anyly familiar with those skilled in the art in the technical scope that the present invention discloses; the change that can expect easily or replacement, all should be encompassed within protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion with the protection range of described claim.
Claims (10)
1. a screening arrangement, comprises cover body, for covering the electric component group on printed circuit board (PCB), and fixes on the printed circuit board; In the corresponding described electric component group of described cover body end face, the highest positions of electronic parts is provided with opening, and the end face of the highest described electronic component and the end face of described cover body are positioned in same level;
It is characterized in that, described screening arrangement also comprises insulating component and conductive member;
Described conductive member covers described opening;
Described insulating component is between described conductive member and the end face of the highest described electronic component, contactless to make between described conductive member and the highest electronic component.
2. screening arrangement according to claim 1, is characterized in that, the edge of described insulating component is greater than the edge of described opening, or, the edge of electronic component end face the highest described in the edge of described insulating component is not less than.
3. screening arrangement according to claim 1, is characterized in that, the edge of described conductive member is not less than the edge of described insulating component.
4. screening arrangement according to claim 1, is characterized in that, the end face of described insulating component and described conductive member and the highest described electronic component bonds respectively.
5. the screening arrangement according to claim 1 or 4, is characterized in that, described conductive member is aluminium film, copper film or conductive fabric.
6. the screening arrangement according to claim 1 or 4, is characterized in that, described insulating component is insulating cement.
7. screening arrangement according to claim 4, is characterized in that, the bonding place of described insulating component and described opening is provided with adhesive glue.
8. screening arrangement according to claim 4, is characterized in that, the surface of the relatively described opening of described insulating component is provided with adhesive glue.
9. screening arrangement according to claim 4, is characterized in that, the surrounding of described conductive member and the surrounding of described insulating component are provided with adhesive glue.
10. screening arrangement according to claim 4, is characterized in that, is provided with adhesive glue between the adhesive surface on described conductive member surface and described insulating component surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310406872.3A CN104427841A (en) | 2013-09-09 | 2013-09-09 | Shielding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310406872.3A CN104427841A (en) | 2013-09-09 | 2013-09-09 | Shielding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104427841A true CN104427841A (en) | 2015-03-18 |
Family
ID=52975425
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310406872.3A Pending CN104427841A (en) | 2013-09-09 | 2013-09-09 | Shielding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104427841A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105828592A (en) * | 2016-05-27 | 2016-08-03 | 努比亚技术有限公司 | Shielding cover and mobile terminal |
| CN107787176A (en) * | 2017-10-19 | 2018-03-09 | 广东欧珀移动通信有限公司 | Radome, circuit board assemblies and mobile terminal |
| WO2019105278A1 (en) * | 2017-11-29 | 2019-06-06 | 北京搜狗科技发展有限公司 | Mainboard and translation machine |
| CN110213882A (en) * | 2019-06-27 | 2019-09-06 | 广德通灵电子有限公司 | A kind of aluminum substrate |
| CN110446406A (en) * | 2019-06-27 | 2019-11-12 | 华为技术有限公司 | The production method of shielding case, electronic equipment and shielding case |
| CN111800995A (en) * | 2019-04-09 | 2020-10-20 | 北京小米移动软件有限公司 | Shielding case structure and electronic equipment |
| WO2021018061A1 (en) * | 2019-07-29 | 2021-02-04 | 华为技术有限公司 | Shielding case and electronic equipment |
| CN113179576A (en) * | 2021-04-22 | 2021-07-27 | 维沃移动通信有限公司 | Circuit board assembly and electronic equipment |
| WO2023015953A1 (en) * | 2021-08-12 | 2023-02-16 | 荣耀终端有限公司 | Shielding cover, circuit board assembly and electronic device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2641994Y (en) * | 2003-08-27 | 2004-09-15 | 广达电脑股份有限公司 | Shell door cover of electronic device |
| CN1780550A (en) * | 2004-11-22 | 2006-05-31 | 日本电气株式会社 | Electronic apparatus |
| CN102892280A (en) * | 2012-09-20 | 2013-01-23 | 华为终端有限公司 | PCB (Printed Circuit Board) shielding piece and user equipment |
| US20130201650A1 (en) * | 2012-02-04 | 2013-08-08 | Quanta Computer Inc. | Molded radio-frequency structure with selective electromagnetic shielding and forming method thereof |
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2013
- 2013-09-09 CN CN201310406872.3A patent/CN104427841A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2641994Y (en) * | 2003-08-27 | 2004-09-15 | 广达电脑股份有限公司 | Shell door cover of electronic device |
| CN1780550A (en) * | 2004-11-22 | 2006-05-31 | 日本电气株式会社 | Electronic apparatus |
| US20130201650A1 (en) * | 2012-02-04 | 2013-08-08 | Quanta Computer Inc. | Molded radio-frequency structure with selective electromagnetic shielding and forming method thereof |
| CN102892280A (en) * | 2012-09-20 | 2013-01-23 | 华为终端有限公司 | PCB (Printed Circuit Board) shielding piece and user equipment |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105828592A (en) * | 2016-05-27 | 2016-08-03 | 努比亚技术有限公司 | Shielding cover and mobile terminal |
| CN107787176A (en) * | 2017-10-19 | 2018-03-09 | 广东欧珀移动通信有限公司 | Radome, circuit board assemblies and mobile terminal |
| WO2019105278A1 (en) * | 2017-11-29 | 2019-06-06 | 北京搜狗科技发展有限公司 | Mainboard and translation machine |
| CN111800995A (en) * | 2019-04-09 | 2020-10-20 | 北京小米移动软件有限公司 | Shielding case structure and electronic equipment |
| CN110213882A (en) * | 2019-06-27 | 2019-09-06 | 广德通灵电子有限公司 | A kind of aluminum substrate |
| CN110446406A (en) * | 2019-06-27 | 2019-11-12 | 华为技术有限公司 | The production method of shielding case, electronic equipment and shielding case |
| WO2021018061A1 (en) * | 2019-07-29 | 2021-02-04 | 华为技术有限公司 | Shielding case and electronic equipment |
| CN113179576A (en) * | 2021-04-22 | 2021-07-27 | 维沃移动通信有限公司 | Circuit board assembly and electronic equipment |
| WO2023015953A1 (en) * | 2021-08-12 | 2023-02-16 | 荣耀终端有限公司 | Shielding cover, circuit board assembly and electronic device |
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| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150318 |