CN103929933A - Structure for inhibition of electromagnetic wave interference and flexible printed circuit comprising same - Google Patents
Structure for inhibition of electromagnetic wave interference and flexible printed circuit comprising same Download PDFInfo
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- CN103929933A CN103929933A CN201310007805.4A CN201310007805A CN103929933A CN 103929933 A CN103929933 A CN 103929933A CN 201310007805 A CN201310007805 A CN 201310007805A CN 103929933 A CN103929933 A CN 103929933A
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Abstract
The invention discloses a structure for inhibition of electromagnetic wave interference, and a flexible printed circuit comprising the same. The structure for inhibition of electromagnetic wave interference is composed of an insulating layer, an electromagnetic wave absorbing layer, an electromagnetic wave shielding layer and a conductive adhesion layer. The electromagnetic wave shielding layer has a top surface and a bottom surface which are opposite to each other. The electromagnetic wave absorbing layer is formed on the top surface of the electromagnetic wave shielding layer. The insulating layer is formed on the top of the electromagnetic wave absorbing layer. The conductive adhesion layer is formed on the bottom surface of the electromagnetic wave shielding layer. The structure for inhibition of electromagnetic wave interference has electromagnetic wave interference shielding and absorbing functions, exhibits excellent softness and flexibility and is especially suitable for being applied to electronic communication products.
Description
Technical field
The present invention relates to a kind of inhibition Electromagnetic Interference structure, specifically about a kind of inhibition Electromagnetic Interference structure for flexible printed wiring board.
Background technology
For in response to personal computer and the multi-functional market demand of Mobile Communications product, the structure of flexible printed wiring board (Flexible Printed Circuit, FPC) needs lighter, thin, short, little; And in function, need powerful and high speed signal transmission.Because distance between soft support plate signal transmission circuit is more and more nearer; add that the electronic product of the communication such as intelligent mobile phone, flat computer in recent years operating frequency is broadband towards height; between each radio communication mold block assembly, between the GHz of operating frequency across the several MHz tremendously high frequencies from low frequency, cause from external electromagnetic radiation or internal noise (noise) electromagnetic interference (Electromagnetic Interference each other; EMI) situation is day by day serious.Therefore in, under constantly developing to multifunction and high-speedization, must overcome the problem of various Electromagnetic Interference.
Moreover, in the Electromagnetic Interference problem that solves soft board in the past except by a whole set of complete routing path design, make exactly apparatus electrically conductive, electrically magnetic wave screened film (EMI Shielding Film), be widely used in the small-sized electronic products such as intelligent mobile phone, flat computer, digital camera, digital camera at present.For example, the electromagnetic wave shielding membrane structure of 2007-294-918 Japanese patent laid-open publication gazette, disclose a kind of electromagnetic shielding film that the collocation of the thin silverskin of evaporation one deck and conduction adhesion layer are used as soft board on dielectric film, use conductivity electromagnetic shielding material can effectively isolate soft board and have problems because of electromagnetic wave external disturbance.This measure is the current the most frequently used frequency electromagnetic waves problem means that solve, but, still cannot solve soft board because the original paper equipment such as inner electronics, communication and computer are because reflecting, being full of Electromagnetic Interference to inner impact, as CPU, the LSI(Large-scale integration between the line of the coupling because of magnetic field, near region, contiguous FPC; Large scale integrated circuit) coupling between electronic building brick inside such as causes the problem of FPC Electromagnetic Interference.Especially in highly dense, highly integrated FPC plate, can interfere with each other under environment because being in for a long time High-frequency and low-frequency electromagnetism intersection, between each system, produce serious electromagnetic wave noise and disturb, and these interference sources are difficult to only depend on grounding technology or use conductivity electromagnetic shielding material to be blocked isolation.
Summary of the invention
In order to overcome above-mentioned defect, the invention provides a kind of flexible printed wiring board that suppresses Electromagnetic Interference structure and there is this structure, inhibition Electromagnetic Interference structure of the present invention has Electromagnetic Interference function of shielding and Electromagnetic Interference absorption function concurrently, and there is excellent flexibility and pliability, be particularly suitable in telecommunications product.
The present invention for the technical scheme that solves its technical problem and adopt is:
A kind of inhibition Electromagnetic Interference structure, by insulating barrier, electromagnetic wave absorbing layer, electromagnetic wave shielding and conduction adhesion layer, formed, described electromagnetic wave shielding has relative end face and bottom surface, described electromagnetic wave absorbing layer is formed on the end face of described electron waves screen, described insulating barrier is formed on the end face of described electromagnetic wave absorbing layer, and described conduction adhesion layer is formed on the bottom surface of the broken screen of described electromagnetism.
Say further, described electromagnetic wave absorbing layer is the electromagnetic wave absorbing layer that contains soft magnetic material.
Wherein, described soft magnetic material is the soft magnetism powder of at least one formation in ferrite, sendust, permalloy, iron silicochromium nickel alloy.
Say further, described electromagnetic wave shielding is copper layer.
Be preferably, the thickness of described electromagnetic wave absorbing layer is 12 to 35 microns.
Be preferably, the thickness of described electromagnetic wave shielding is 3 to 5 microns.
Be preferably, the thickness of described insulating barrier is 5 to 10 microns.
Be preferably, the thickness of described conduction adhesion layer is 8 to 30 microns.
The invention also discloses a kind of flexible printed wiring board with above-mentioned inhibition Electromagnetic Interference structure, described inhibition Electromagnetic Interference structure is covered in printed circuit board (PCB) body layer in its conduction adhesion layer place.
Be preferably, the gross thickness of described inhibition Electromagnetic Interference structure is 28 to 80 microns.
The invention has the beneficial effects as follows: because Electromagnetic Interference generates, be because of due to electric field and magnetic field reciprocation, therefore, the present invention utilizes inhibition Electromagnetic Interference structure that Electromagnetic Interference source is isolated and suppressed, inhibition Electromagnetic Interference structure of the present invention is mainly to utilize the electromagnetic wave absorbing layer that contains soft magnetic material, form by inner incident low-frequency disturbance electromagnetic wave with decrease uptake mode energy transform into heat energy, weakens interference source object and reach; Utilize as the electromagnetic wave shielding of ultra-thin conductive copper layer and so on simultaneously, frequency electromagnetic waves interference source is covered to form with reflection and reach and block interference source object, therefore, inhibition Electromagnetic Interference structure of the present invention have concurrently electromagnetic interference shielding functional with Electromagnetic Interference absorption function, be particularly suitable in telecommunications product; In addition, inhibition Electromagnetic Interference structure of the present invention has preferably flexibility and pliability.
Accompanying drawing explanation
Fig. 1 is the cross-sectional view of inhibition Electromagnetic Interference structure of the present invention;
Fig. 2 is the cross-sectional view with the flexible printed wiring board that suppresses Electromagnetic Interference structure of the present invention.
Embodiment
Below in conjunction with accompanying drawing, preferred embodiment of the present invention is described in detail, thereby so that advantages and features of the invention can be easier to be it will be appreciated by those skilled in the art that, protection scope of the present invention is made to more explicit defining.
Embodiment: as shown in Figure 1, for inhibition Electromagnetic Interference structure 100 of the present invention, by insulating barrier 111, electromagnetic wave absorbing layer 112, electromagnetic wave shielding 113 and conduction adhesion layer 114, formed, described electromagnetic wave shielding 113 has relative end face and bottom surface, described electromagnetic wave absorbing layer 112 is formed on the end face of described electron waves screen 113, described insulating barrier 111 is formed on the end face of described electromagnetic wave absorbing layer 112, and described conduction adhesion layer 114 is formed on the bottom surface of the broken screen 113 of described electromagnetism.Wherein, described electromagnetic wave absorbing layer 112 contains soft magnetic material; The broken screen 113 of this electromagnetism is copper layers, and the example of this copper layer comprises cathode copper, calendering copper etc.
As shown in Figure 2, for the flexible printed wiring board with above-mentioned inhibition Electromagnetic Interference structure 100 of the present invention, described inhibition Electromagnetic Interference structure 100 is covered in printed circuit board (PCB) body layer 200 in its conduction adhesion layer 114 places, and this body layer 200 has line construction (not shown).Wherein, the gross thickness of described inhibition Electromagnetic Interference structure is 28 to 80 microns.
In inhibition Electromagnetic Interference structure of the present invention, the thickness of the electromagnetic wave absorbing layer that this contains soft magnetic material is 12 to 35 microns, and the material of this soft magnetic material can be the soft magnetism powder of ferrite (Ferrite), sendust (SENDUST), permalloy (PERMALLOY) or iron silicochromium nickel alloy etc.Above-mentioned soft magnetism powder can be used separately or combine two or more uses, and the shape of this soft magnetism powder can be ball-type or flat, is preferably flat powder, and wherein, the average grain diameter of this soft magnetism powder is 1 to 35 micron, is preferably 2 to 20 microns.In an instantiation, electromagnetic wave absorbing layer of the present invention can disperse to form by above-mentioned soft magnetism powder is mixed with thermosetting resin.
Conduction adhesion layer of the present invention can contain conducting metal powder, and this conducting metal powder can be silver powder, copper powder, nickel powder, silver-coated copper powder or silver coated nickel powder, and better system is used silver-coated copper powder.This kind of conducting metal powder can be used separately or combine two or more uses, and wherein, the average grain diameter of this conducting metal powder is between 1 to 20 micron, is preferably 3 to 15 microns.
In inhibition Electromagnetic Interference structure of the present invention, because the thermal stability of epoxy resin or polyimide resin is high, and there is excellent insulating properties, mechanical strength and resistance to chemical corrosion, therefore can be used in insulating barrier, and the thickness of this insulating barrier is generally 5 to 10 microns, be more preferred from 5 to 8 microns.
In inhibition Electromagnetic Interference structure of the present invention, be to use copper layer as electromagnetic wave shielding, and this thickness as the copper layer of electromagnetic shielding material is between 3 to 5 microns.Conventionally, electromagnetic wave shielding layer material can takeup type transmission technology (Roll To Roll) carry out producing fast continuously.
In inhibition Electromagnetic Interference structure of the present invention, the thickness of this conduction adhesion layer is 8 to 30 microns.
The present invention utilizes the electromagnetic wave absorbing layer that contains soft magnetic material as electromagnetic wave inhibiting material, due to incident electromagnetic wave and magnetic material generation electrical interaction, electromagnetic wave is absorbed and consumed with form of heat, the disturbing effect that the electromagnetic wave that avoids overflowing reason inside produces, reaches and weakens Electromagnetic Interference object; And surpass thin copper layer as electromagnetic shielding material by use, and incident electromagnetic wave is reached to the interference source effect of blocking with reflected version, effectively reduce and isolating electromagnetic external disturbance problem.Therefore, inhibition Electromagnetic Interference structure of the present invention can shield inner in electronic product equipment and outside produced electromagnetic interference, and this inhibition Electromagnetic Interference structure also has good flexibility and pliability, therefore be applicable to renovate, in slide phone and flattening electronic product.
Inhibition Electromagnetic Interference structure of the present invention, can make through the following steps: first, by the permalloy soft magnetism powder of 30 mass parts thermosetting epoxy resin mixtures, 70 mass parts, add the mixed solvent of propylene glycol monomethyl ether and methylethylketone (PGME/MEK=1/1) to be diluted to the electro-magnetic wave absorption cold coating that solid is divided into 50 weight ratios, coat the thickness with supporter and be on the copper foil base material as electromagnetic wave shielding of 3 microns, be placed in the electromagnetic wave absorbing layer that baking oven heat drying forms 12 microns of thickness.Afterwards, on this electromagnetic wave absorbing layer, be coated with for example insulating barrier of epoxy resin of material.Further, in order to make this inhibition Electromagnetic Interference structure can be attached on the flexible printed wiring board that has completed configuration or other pressure programmings uses, in another side coating or the laminating conductive adhesive layer of above-mentioned copper foil base material, to form, suppress Electromagnetic Interference structure sample, as shown in Figure 1.
Accordingly, the present invention utilizes the electromagnetic wave absorbing layer contain soft magnetic material as electromagnetic wave inhibiting material and use extra thin copper foil metal level as electromagnetic wave shielding (isolation) layer, this this structure can usable reflection radiation Electromagnetic Interference noise, reach shielding and block interference source object; Utilize the electromagnetic wave absorbing layer of tool soft magnetism to suppress interference source simultaneously, this structure can effectively block and weaken the advantage of Electromagnetic Interference noise, this electromagnetic wave suppresses structure and can possess good flexibility simultaneously, is applicable in the consumption electronic products such as personal computer and Mobile Communications.
According to the data in following table 1, prepare the inhibition Electromagnetic Interference structure of the embodiment of the present invention 1 to 5, and prepare comparative example 1 and 2.
Table 1
Test: respectively the circuit board sample of above-described embodiment 1 to embodiment 5 and comparative example 1,2 made different-thickness is cut into the test sample of suitable size, carry out electromagnetic wave shielding performance, electromagnetic wave absorbability test.
One, electromagnetic wave shielding performance:
Prepare the round inhibition Electromagnetic Interference of 13cm structure sample, according to ASTM4935 method, carry out electromagnetic shielding efficiency test.Test result is recorded in to table 1.
Two, electromagnetic wave absorbability:
Prepare the inhibition Electromagnetic Interference structure sample of 5 cm x 10 cm sizes, according to microstrip line test I EC-62333 law regulation, measure.Test result is recorded in to table 1.
By table 1, can be confirmed, the electromagnetism wave-wave shielding of embodiments of the invention 1 to 5 is at least higher than more than 62dB, and more than electromagnetic wave absorbability has 3 dB values in this test, has good electromagnetic wave rejection.
Test data from embodiment 5 with comparative example 1, the inhibition Electromagnetic Interference structure sample of comparative example 1 is insulating barrier, copper foil layer and conduction adhesion layer only, there is no the electromagnetic wave absorbing layer of filling soft magnetism powder, although more than the electromagnetic wave shielding performance of comparative example 1 can be greater than 50dB, and cannot absorb interference electromagnetic wave.
Test data from embodiment 2 with comparative example 2, the inhibition Electromagnetic Interference structure sample of comparative example 2 is insulating barrier, electromagnetic wave absorbing layer and conduction adhesion layer only, while there is no the copper foil layer of electromagnetic shielding, although more than the electro-magnetic wave absorption performance of comparative example 2 can be greater than 3 dB, and cannot reach effective shielding electromagnetic interference performance.
In sum, inhibition Electromagnetic Interference structure of the present invention can block and weaken Electromagnetic Interference noise, is therefore applicable to the EMI shielding material in electronic product.
Above-described embodiment is illustrative principle of the present invention and effect thereof only, but not for limiting the present invention.Protection scope of the present invention should be as listed in claims.
Claims (10)
1. one kind is suppressed Electromagnetic Interference structure, it is characterized in that: by insulating barrier, electromagnetic wave absorbing layer, electromagnetic wave shielding and conduction adhesion layer, formed, described electromagnetic wave shielding has relative end face and bottom surface, described electromagnetic wave absorbing layer is formed on the end face of described electron waves screen, described insulating barrier is formed on the end face of described electromagnetic wave absorbing layer, and described conduction adhesion layer is formed on the bottom surface of the broken screen of described electromagnetism.
2. inhibition Electromagnetic Interference structure as claimed in claim 1, is characterized in that: described electromagnetic wave absorbing layer is the electromagnetic wave absorbing layer that contains soft magnetic material.
3. inhibition Electromagnetic Interference structure as claimed in claim 2, is characterized in that: described soft magnetic material is the soft magnetism powder of at least one formation in ferrite, sendust, permalloy, iron silicochromium nickel alloy.
4. inhibition Electromagnetic Interference structure as claimed in claim 1, is characterized in that: described electromagnetic wave shielding is copper layer.
5. inhibition Electromagnetic Interference structure as claimed in claim 1, is characterized in that: the thickness of described electromagnetic wave absorbing layer is 12 to 35 microns.
6. inhibition Electromagnetic Interference structure as claimed in claim 1, is characterized in that: the thickness of described electromagnetic wave shielding is 3 to 5 microns.
7. inhibition Electromagnetic Interference structure as claimed in claim 1, is characterized in that: the thickness of described insulating barrier is 5 to 10 microns.
8. inhibition Electromagnetic Interference structure as claimed in claim 1, is characterized in that: the thickness of described conduction adhesion layer is 8 to 30 microns.
9. a flexible printed wiring board with the inhibition Electromagnetic Interference structure as described in any one in claim 1 to 8, is characterized in that: described inhibition Electromagnetic Interference structure is covered in printed circuit board (PCB) body layer in its conduction adhesion layer place.
10. the flexible printed wiring board with inhibition Electromagnetic Interference structure as claimed in claim 9, is characterized in that: the gross thickness of described inhibition Electromagnetic Interference structure is 28 to 80 microns.
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| CN201310007805.4A CN103929933B (en) | 2013-01-10 | 2013-01-10 | Structure for inhibition of electromagnetic wave interference and flexible printed circuit comprising same |
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| CN201310007805.4A CN103929933B (en) | 2013-01-10 | 2013-01-10 | Structure for inhibition of electromagnetic wave interference and flexible printed circuit comprising same |
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| CN103929933A true CN103929933A (en) | 2014-07-16 |
| CN103929933B CN103929933B (en) | 2017-04-12 |
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| CN104538167A (en) * | 2014-12-16 | 2015-04-22 | 华南理工大学 | Method for preparing magnetically soft alloy and ferrite laminated composite electromagnetic shielding magnet |
| WO2018077180A1 (en) * | 2016-10-31 | 2018-05-03 | 北京北方华创微电子装备有限公司 | Magnetic thin film laminate structure deposition method, magnetic thin film laminate structure and micro-inductor device |
| CN108307612A (en) * | 2017-01-13 | 2018-07-20 | 上海量子绘景电子股份有限公司 | A kind of the FCCL materials and its manufacturing method of ferrite base material |
| CN110799027A (en) * | 2018-08-02 | 2020-02-14 | 加川清二 | Electromagnetic wave absorption composite board |
| CN111066141A (en) * | 2017-06-23 | 2020-04-24 | ams国际有限公司 | Radiation resistant package for electronic devices |
| CN111410920A (en) * | 2020-03-23 | 2020-07-14 | 苏州微邦材料科技有限公司 | Wave-absorbing shielding adhesive film and preparation method thereof |
| CN111642065A (en) * | 2020-06-11 | 2020-09-08 | 江西省信合新材料科技有限公司 | Novel multilayer structure high-shielding electromagnetic shielding film for flexible circuit board |
| CN113063340A (en) * | 2021-03-30 | 2021-07-02 | 天津飞旋科技股份有限公司 | Inductance type displacement sensor |
| CN108307612B (en) * | 2017-01-13 | 2024-04-26 | 上海量子绘景电子股份有限公司 | FCCL material of ferrite substrate and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104538167A (en) * | 2014-12-16 | 2015-04-22 | 华南理工大学 | Method for preparing magnetically soft alloy and ferrite laminated composite electromagnetic shielding magnet |
| KR102159893B1 (en) * | 2016-10-31 | 2020-09-24 | 베이징 나우라 마이크로일렉트로닉스 이큅먼트 씨오., 엘티디. | Magnetic thin film laminated structure manufacturing method, magnetic thin film laminated structure and micro inductor device |
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| CN108022751A (en) * | 2016-10-31 | 2018-05-11 | 北京北方华创微电子装备有限公司 | Deposition process, thin magnetic film lamination and the micro-inductor device of thin magnetic film lamination |
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| CN108022751B (en) * | 2016-10-31 | 2022-01-11 | 北京北方华创微电子装备有限公司 | Deposition method of magnetic thin film lamination, magnetic thin film lamination and micro-inductance device |
| CN108307612A (en) * | 2017-01-13 | 2018-07-20 | 上海量子绘景电子股份有限公司 | A kind of the FCCL materials and its manufacturing method of ferrite base material |
| CN108307612B (en) * | 2017-01-13 | 2024-04-26 | 上海量子绘景电子股份有限公司 | FCCL material of ferrite substrate and manufacturing method thereof |
| CN111066141A (en) * | 2017-06-23 | 2020-04-24 | ams国际有限公司 | Radiation resistant package for electronic devices |
| CN111066141B (en) * | 2017-06-23 | 2023-10-10 | ams国际有限公司 | Radiation-resistant package for electronic devices |
| CN110799027A (en) * | 2018-08-02 | 2020-02-14 | 加川清二 | Electromagnetic wave absorption composite board |
| CN111410920A (en) * | 2020-03-23 | 2020-07-14 | 苏州微邦材料科技有限公司 | Wave-absorbing shielding adhesive film and preparation method thereof |
| CN111642065A (en) * | 2020-06-11 | 2020-09-08 | 江西省信合新材料科技有限公司 | Novel multilayer structure high-shielding electromagnetic shielding film for flexible circuit board |
| CN113063340A (en) * | 2021-03-30 | 2021-07-02 | 天津飞旋科技股份有限公司 | Inductance type displacement sensor |
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