WO2020001195A1

WO2020001195A1 - Printed circuit board assembly and electronic apparatus

Info

Publication number: WO2020001195A1
Application number: PCT/CN2019/087549
Authority: WO
Inventors: 沈建伟
Original assignee: 维沃移动通信有限公司
Priority date: 2018-06-25
Filing date: 2019-05-20
Publication date: 2020-01-02
Also published as: CN108633170B; CN108633170A

Abstract

The present disclosure provides a printed circuit board assembly and an electronic apparatus. The printed circuit board assembly comprises a first printed circuit board, a second printed circuit board, and a substrate. The first printed circuit board is fixed on the substrate. A first electronic device and a first shield are welded to a side of the first printed circuit board facing away from the substrate. The first electronic device is located in the first shield. The second printed circuit board is fixed to a side of the first shield facing away from the first printed circuit board. A second electronic device is welded onto the second printed circuit board. The first printed circuit board is electrically connected to the second printed circuit board.

Description

Printed circuit board assembly and electronic equipment

Cross-reference to related applications

This application claims the priority of Chinese Patent Application No. 201810663051.0 filed in China on June 25, 2018, the entire contents of which are hereby incorporated by reference.

Technical field

The present disclosure relates to the technical field of printed circuit boards, and in particular, to a printed circuit board assembly and electronic equipment.

Background technique

In order to be portable, modern portable electronic products are getting smaller and smaller, and the internal design layout is becoming more and more compact, as is the layout of printed circuit boards. At present, in order to realize more functions of electronic products, more and more electronic devices are on the printed circuit board. Usually, a double-layer printed circuit board is required to realize the layout of more electronic devices.

The double-layer printed circuit boards in the related art are mostly fixed by installing screws on the edges of the two printed circuit boards. This causes the screws to occupy space on the printed circuit boards, which makes the printed circuit boards used for soldering electronic devices. Space becomes smaller, reducing space utilization of double-layer circuit boards.

Summary of the invention

Embodiments of the present disclosure provide a printed circuit board assembly and electronic equipment to solve the problem of low space utilization of a double-layer printed circuit board in the related art.

In a first aspect, an embodiment of the present disclosure provides a printed circuit board assembly including a first printed circuit board, a second printed circuit board, and a substrate. The first printed circuit board is fixed on the substrate, and the first A first electronic device and a first shielding cover are soldered on a side of the printed circuit board facing away from the substrate, the first electronic device is located in the first shielding cover, and the second printed circuit board is fixed to the A side of the first shielding cover facing away from the first printed circuit board, a second electronic device is soldered on the second printed circuit board, and the first printed circuit board is electrically connected to the second printed circuit board. .

In a second aspect, an embodiment of the present disclosure also provides an electronic device including the printed circuit board assembly as described in the first aspect.

In the technical solution provided by the embodiment of the present disclosure, a first shielding cover is soldered on the first printed circuit board, and the second printed circuit board is fixed on the first shielding cover, and thus there is no need to separately provide the first printed circuit board for The fixed device is used to fix the second printed circuit board, so that it does not occupy the layout space of the first printed circuit board, so that more electronic devices can be laid on the first printed circuit board. In this way, the printed circuit is improved. Space utilization of board components.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to explain the technical solutions of the embodiments of the present disclosure more clearly, the drawings used in the description of the embodiments of the present disclosure will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present disclosure. For those of ordinary skill in the art, other drawings can be obtained according to these drawings without paying creative labor.

1 is a structural diagram of a printed circuit board assembly provided by a first implementation manner of an embodiment of the present disclosure;

2 is a structural diagram of a printed circuit board assembly provided by a second implementation manner of an embodiment of the present disclosure;

FIG. 3 is a structural diagram of a printed circuit board assembly according to a third embodiment of the present disclosure; FIG.

4 is a structural diagram of another printed circuit board assembly according to a third implementation manner of the embodiment of the present disclosure;

FIG. 5 is a structural diagram of another printed circuit board assembly according to a third embodiment of the present disclosure.

detailed description

The technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, but not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by a person of ordinary skill in the art without creative efforts shall fall within the protection scope of the present disclosure.

1 to FIG. 5, an embodiment of the present disclosure provides a printed circuit board assembly used in an electronic device. The printed circuit board assembly includes a first printed circuit board 10, a second printed circuit board 20, and a substrate 30. The first printed circuit board 10 is fixed on the substrate 30. The side of the first printed circuit board 10 facing away from the substrate 30 is soldered with a first electronic device 13 and a first shielding cover 11. The first electronic device 13 is located in the first shielding cover 11; the second printed circuit board 20 is fixed on a side of the first shielding cover 11 facing away from the first printed circuit board 10, and A second electronic device 22 is soldered on the second printed circuit board 20, and the first printed circuit board 10 is electrically connected to the second printed circuit board 20.

In the embodiment of the present disclosure, the first printed circuit board 10 and the second printed circuit board 20 are arranged on top of each other, which can further facilitate the development of electronic devices toward miniaturization. The first shielded cover 11 is soldered on the first printed circuit board 10, and the first electronic component 13 welded on the first printed circuit board 10 is housed in the first shielded cover 11, thereby shielding the interference problem of the electronic components. To improve the electronic performance of the first electronic device 13 in the first shielding cover 11. The second printed circuit board 20 is fixed on the first shielding cover 11, so that the second printed circuit board 20 need not be fixed by the first printed circuit board 10, and the layout space of the first printed circuit board 10 is not occupied. As a result, more electronic devices can be placed on the first printed circuit board 10, and thus the space utilization ratio of the printed circuit board assembly is improved.

For example, the second printed circuit board 20 may be soldered to the first shield cover 11, so that the second printed circuit board 20 does not need to be fixed to the first printed circuit board 10 by means of mounting screws, which saves the first The layout space on the second printed circuit board 20 allows more electronic devices to be laid on the second printed circuit board 20. Alternatively, a pin is provided on the first shielding cover 11, and the pin penetrates the second printed circuit board 20 to fix the second printed circuit board 20; the pin is smaller in volume than the screw, which saves The layout space on the second printed circuit board 20 is provided, so that more electronic devices can be laid on the second printed circuit board 20, and the space utilization ratio of the printed circuit board components is further improved.

In some embodiments, the first shielding cover 11 may be a closed structure, that is, the first shielding cover 11 is welded to the first printed circuit board 10 to form a closed receiving space, and the first electronic device 13 is received in the closed receiving space. The closed receiving space can better shield other electronic devices inside the electronic device and improve the electronic performance of the first electronic device 13. It should be noted that, in order to avoid the temperature difference between the inside and outside of the first shield cover 11 during the reflow soldering of the printed circuit board assembly to affect the soldering effect, the first shield cover 11 and the first printed circuit may be affected. Openings are formed on adjacent sides of the board 10 to make the internal temperature of the first shield cover 11 closer to the external temperature, thereby ensuring normal soldering of the first electronic device 13 inside the first shield cover 11.

It should be noted that the first printed circuit board 10 is soldered with a first electrical connector 15, the second printed circuit board 20 is soldered with a second electrical connector 25, the first electrical connector 15 and the second electrical connector 25 It is electrically connected to realize electrical signal transmission between the first printed circuit board 10 and the second printed circuit board 20.

In the embodiment of the present disclosure, the second electronic device 22 is soldered to a side of the second printed circuit board 20 facing away from the first shielding cover 11, and the second printed circuit board 20 faces away from the second printed circuit board 20. A second shield cover 21 is soldered to one side of the first shield cover 11, and the second electronic device 22 is located in the second shield cover 21. The second shielding cover 21 can protect the second electronic device 22 stored in the second shielding cover 21 and improve the electronic performance of the second electronic device 22. In addition, the second electronic device 22 and the second shielding cover 21 are both disposed on the side of the second printed circuit board 20 facing away from the first shielding cover 11, and the second printed circuit board 20 facing the first shielding cover 11 No electronic device is arranged on the side, so that the distance between the second printed circuit board 20 and the first shielding cover 11 is closer, and the height and installation space of the printed circuit board assembly are reduced, so as to facilitate the layout of the printed circuit board assembly in the electronic device.

Please refer to FIG. 2. In a first implementation manner of the embodiment of the present disclosure, the first shielding cover 11 and the second printed circuit board 20 are fixed by soldering 41. Specifically, after the solder paste 41 is soldered on the side of the first shield cover 11 facing the second printed circuit board 20, the second printed circuit with the second electronic device 22 and the second shield cover 21 soldered quickly. The board 20 is attached to the first shield cover 11, and the second printed circuit board 20 is fixed by the solder paste 41. In order to ensure the stability of the connection between the first shielding cover 11 and the second printed circuit board 20, a complete circle of solder paste 41 can be soldered on the edge of the first shielding cover 11, or it can also be on the first shielding cover 11. Point solder paste 41 at different positions to enhance the stability of the first shield cover 11 and the second printed circuit board 20. The solder paste 41 may be a high-temperature solder paste 41 or a low-temperature solder paste 41.

Referring to FIG. 3, in a second implementation manner of the embodiment of the present disclosure, the printed circuit board assembly further includes at least two fixing members 42. The second printed circuit board 20 is provided with a fixing hole, and the fixing The number of holes is the same as the number of the fixing members 42, and each of the fixing members 42 passes through one of the fixing holes and is connected to the first shielding cover 11 one by one. It should be noted that the fixing member 42 may be a metal pin, and the metal pin penetrates the second printed circuit board 20 and is fixed on the first shielding cover 11 so as to achieve the fixation of the second printed circuit board 20 and the first shielding cover 11. connection. Alternatively, the metal pins may be integrally formed with the first shielding cover 11, and the fixing holes on the second printed circuit board 20 are aligned with the metal pins, so that the second printed circuit board 20 and the first shielding cover 11 are also realized. Connection. The metal pins have a small size, so that they do not take up too much space on the second printed circuit board 20, so as to ensure that the second printed circuit board 20 has a large space utilization rate, which is beneficial to the performance of the second printed circuit board 20 Layout more electronics.

It should be noted that the printed circuit board assembly further includes a limiting board 23, and the limiting board 23 is disposed on a side of the second shielding cover 21 facing away from the second printed circuit board 20. The positioning board 23 can generate a certain pressing force on the second printed circuit board 20, thereby preventing the second printed circuit board 20 from shaking up and down, and further ensuring the stability of the second printed circuit board 20. The limiting plate 23 and the second shielding cover 21 may be fixed by welding or bonding.

Referring to FIG. 1, in a third implementation manner of the embodiment of the present disclosure, a solder paste 41 is soldered between the first shielding cover 11 and the second printed circuit board 20; the printed circuit board assembly further includes: At least two fixing members 42. The second printed circuit board 20 is provided with fixing holes. The number of the fixing holes is the same as the number of the fixing members 42. Each of the fixing members 42 corresponds to one through one. The fixing hole is connected to the first shielding cover 11. Specifically, the fixing member 42 may be a metal pin, and the metal pin and the first shielding cover 11 may be integrally formed. The solder paste 41 is soldered on the first shield cover 11, and the fixing holes on the second printed circuit board 20 are aligned with the metal pins, and then the second printing on which the second electronic device 22 and the second shield cover 21 are soldered is quickly performed. The circuit board 20 is attached to the first shield cover 11, and the second printed circuit board 20 is fixed by the solder paste 41. In this way, the second printed circuit board 20 is restricted and connected by the metal pins, and the second printed circuit board 20 and the first shield cover 11 are further fixed by the solder paste 41, thereby ensuring the second printed circuit. Mounting stability of the board 20.

Optionally, referring to FIG. 4, a side of the first shield cover 11 facing the second printed circuit board 20 is provided with a through hole 101, and the second printed circuit board 20 faces the first A third electronic device 24 is soldered on one side of a printed circuit board 10, and the third electronic device 24 is embedded in the through hole 101. In other words, the electronic devices are soldered on two opposite sides of the second printed circuit board 20, which improves the space utilization rate of the second printed circuit board 20.

It should be noted that the connection between the second printed circuit board 20 and the first shield cover 11 may be fixed by soldering through solder paste 41; or may be fixed by a fixing member 42 penetrating the first shield cover 11 and the second printed circuit board 20. Alternatively, the connection can be achieved through the fixing member 42 penetrating the first shielding cover 11 and the second printed circuit board 20, and the soldering paste 41 can be used to strengthen the fixing effect between the first shielding cover 11 and the second printed circuit board 20.

Please continue to refer to FIG. 4, the second printed circuit board 20 and the first shield cover 11 are connected through the first shield cover 11 and the second printed circuit board 20 through the fixing member 42, and the first shield cover 11 and the second printed circuit are connected. The solder paste 41 of the board 20 enhances the fixing effect. The first shielding cover 11 is provided with a through-hole 101, and the size of the through-hole 101 can make all the third electronic devices 24 on the second printed circuit board 20 be embedded in the through-holes 101, so that the third electronic device 24 and the The first electronic device 13 on the first printed circuit board 10 is disposed to face.

It should be noted that the solder paste 41 may be soldered to the edge of the first shield cover 11, for example, a circular or square solder paste 41 connection pattern is formed, so that the solder paste 41 and the first shield cover 11 form a receiving third electron. The enclosed space of the device 24 further functions as a shield for the third electronic device 24. The fixing member 42 may be a metal pin. The metal pin is closer to the through hole 101 than the solder paste 41, which makes the connection position of the metal pin and the second printed circuit board 20 closer to the second printing. The center of the circuit board 20 can further ensure the stability of the second printed circuit board 20. A shield can also be provided on the side of the second printed circuit board 20 facing the first shield cover 11 so as to shield the third electronic device 24 housed in the shield cover and enhance the third electronic device 24. Electronic performance.

Optionally, referring to FIG. 5, a groove 102 is formed on a side of the first shield cover 11 facing the second printed circuit board 20, and the second printed circuit board 20 faces the first A third electronic device 24 is soldered on one side of a printed circuit board 10, and the third electronic device 24 is embedded in the groove 102. It should be noted that the connection between the second printed circuit board 20 and the first shield cover 11 may be fixed by soldering through solder paste 41; or may be fixed by a fixing member 42 penetrating the first shield cover 11 and the second printed circuit board 20. Alternatively, the connection can be achieved through the fixing member 42 penetrating the first shielding cover 11 and the second printed circuit board 20, and the soldering paste 41 can be used to strengthen the fixing effect between the first shielding cover 11 and the second printed circuit board 20.

Referring to FIG. 5, the second printed circuit board 20 and the first shield cover 11 are connected through the first shield cover 11 and the second printed circuit board 20 through the fixing member 42, and the first shield cover 11 and the second printed circuit board are connected. 20 solder paste 41 strengthens the fixing effect. The first shielding cover 11 is welded to the first printed circuit board 10 to form a closed receiving space, and the first electronic device 13 is stored in the closed receiving space, so that the first electronic device 13 and the third electronic device 24 can be avoided. Electronic interference plays a good shielding and protecting role on the first electronic device 13 and also plays a certain shielding role on the third electronic device 24 to improve the electronic performance of the electronic device.

It should be noted that the size of the groove 102 enables the third electronic device 24 to be completely contained in the groove 102. The side of the first shielding cover 11 facing the second printed circuit board 20 is composed of a first surface forming a groove 102 and a second surface surrounding the groove 102. The solder paste 41 and the fixing member 42 are provided. On the second surface. The fixing member 42 may be a metal pin. The metal pin is closer to the groove 102 than the solder paste 41, which makes the connection position of the metal pin to the second printed circuit board 20 closer to the second printing. The center of the circuit board 20 can further ensure the stability of the second printed circuit board 20.

In the foregoing implementation manner of the embodiment of the present disclosure, a through hole is formed in a side surface of the first shielding cover 11, and the side surface is a surface of the first shielding cover 11 connected to the first printed circuit board 10. The arrangement of the through holes makes the first shield cover 11 not a fully closed structure, and can play a role of ventilation between the first shield cover 11 and the outside, and avoids the first shield during the reflow soldering of the printed circuit board assembly. The temperature difference between the inside and outside of the cover 11 affects the welding effect, so that the internal temperature of the first shielding cover 11 is closer to the external temperature, thereby ensuring the normal welding of the first electronic device 13 inside the first shielding cover 11.

In the foregoing implementation manners of the embodiments of the present disclosure, the orthographic projection of the second printed circuit board 20 on the first printed circuit board 10 is located in the first shielding cover 11. That is, the edge of the second printed circuit board 20 does not protrude beyond the first shield cover 11, which can prevent the second printed circuit board 20 from occupying too much space above the first printed circuit board 10, so that the first printed circuit board 10 The space other than the first shielding cover 11 can be better utilized, which facilitates the overall layout of the printed circuit board assembly installed in the electronic device.

In addition, a third shielding cover 12 and a fourth electronic device 14 are soldered on a side of the first printed circuit board 10 facing the substrate 30, and the fourth electronic device 14 is located in the third shielding cover 12. . It should be noted that the first printed circuit board 10 and the substrate 30 may be fixed by screws, and an installation space is formed between the first printed circuit board 10 and the substrate 30 so that the first printed circuit board 10 faces the substrate 30 The fourth electronic device 14 can be soldered on one side, thereby improving the utilization rate of the first printed circuit board 10 so that the first printed circuit board 10 can lay out more electronic devices. A third shielding cover 12 is soldered on the side of the first printed circuit board 10 facing the substrate 30, and the fourth electronic device 14 is located in a space formed by the shielding cover, thereby shielding and protecting the fourth electronic device 14. Function to enhance the electronic performance of the fourth electronic device 14.

An embodiment of the present disclosure further provides an electronic device including the printed circuit board assembly as described in the above embodiment. Since the technical solution of this embodiment includes all the technical solutions of the above-mentioned printed circuit board assembly embodiments, at least all the technical effects of the above-mentioned embodiments can be achieved, which will not be repeated one by one here.

Electronic devices may include: mobile phones, tablet computers, e-book readers, MP3 players, MP4 players, digital cameras, laptops, portable computers, in-vehicle computers, desktop computers, set-top boxes, smart TVs, and wearable devices. One item.

The above are only specific implementations of the present disclosure, but the scope of protection of the present disclosure is not limited to this. Any person skilled in the art can easily think of changes or replacements within the technical scope disclosed in the present disclosure. Within the scope of this disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims

A printed circuit board assembly includes a first printed circuit board, a second printed circuit board, and a substrate. The first printed circuit board is fixed on the substrate. The back of the first printed circuit board faces the substrate. A first electronic device and a first shielding cover are soldered on one side, and the first electronic device is located in the first shielding cover; the second printed circuit board is fixed to the first shielding cover facing away from the first shielding cover. One side of a printed circuit board, a second electronic device is soldered on the second printed circuit board, and the first printed circuit board is electrically connected to the second printed circuit board.
The printed circuit board assembly according to claim 1, wherein the second electronic device is soldered to a side of the second printed circuit board facing away from the first shield cover, and the second printed circuit board A second shielding case is soldered to a side of the second shielding case, and the second electronic device is located in the second shielding case.
The printed circuit board assembly according to claim 1, wherein the first shield cover and the second printed circuit board are fixed by soldering.
The printed circuit board assembly according to claim 2, wherein the printed circuit board assembly further comprises at least two fixing members, and fixing holes are formed in the second printed circuit board, and the number of the fixing holes is the same as that of the fixing holes. The number of the fixing members is the same. Each of the fixing members penetrates one of the fixing holes and is connected to the first shielding cover.
The printed circuit board assembly according to claim 4, wherein the printed circuit board assembly further comprises a limiting board, and the limiting board is disposed on a side of the second shielding cover facing away from the second printed circuit board. .
The printed circuit board assembly according to claim 1, wherein a solder paste is soldered between the first shield cover and the second printed circuit board; the printed circuit board assembly further comprises at least two fixing members, and The second printed circuit board is provided with fixing holes. The number of the fixing holes is the same as the number of the fixing members. Each of the fixing members passes through the fixing holes one by one and is connected to the first shield. Hood.
The printed circuit board assembly according to claim 1, wherein a side of the first shield case facing the second printed circuit board is provided with a through hole, and the second printed circuit board faces the A third electronic device is soldered on one side of the first printed circuit board, and the third electronic device is embedded in the through hole.
The printed circuit board assembly according to claim 1, wherein a side of the first shield cover facing the second printed circuit board is formed with a groove, and the second printed circuit board faces the A third electronic device is soldered on one side of the first printed circuit board, and the third electronic device is embedded in the groove.
The printed circuit board assembly according to any one of claims 1 to 8, wherein a side surface of the first shielding cover is provided with a through hole, and the side surface is a connection of the first shielding cover to the first The surface of a printed circuit board.
The printed circuit board assembly according to any one of claims 1 to 8, wherein a third shield cover and a fourth electronic device are soldered to a side of the first printed circuit board facing the substrate, and A fourth electronic device is located in the third shielding case.
An electronic device comprising the printed circuit board assembly according to any one of claims 1 to 10.