CN211428141U - Discrete device - Google Patents
Discrete device Download PDFInfo
- Publication number
- CN211428141U CN211428141U CN202020267141.0U CN202020267141U CN211428141U CN 211428141 U CN211428141 U CN 211428141U CN 202020267141 U CN202020267141 U CN 202020267141U CN 211428141 U CN211428141 U CN 211428141U
- Authority
- CN
- China
- Prior art keywords
- copper
- ceramic plate
- radiator
- chip
- discrete device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000919 ceramic Substances 0.000 claims abstract description 60
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 35
- 229910052802 copper Inorganic materials 0.000 claims abstract description 35
- 239000010949 copper Substances 0.000 claims abstract description 35
- 239000000758 substrate Substances 0.000 claims description 11
- 230000017525 heat dissipation Effects 0.000 abstract description 11
- 239000006185 dispersion Substances 0.000 abstract description 4
- 238000009413 insulation Methods 0.000 abstract description 2
- 230000010354 integration Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 5
- 239000004519 grease Substances 0.000 description 4
- 229920001296 polysiloxane Polymers 0.000 description 4
- 239000002390 adhesive tape Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a discrete device, it is including the radiator that sets gradually, cover copper ceramic plate and chip, cover at least some setting of copper ceramic plate and be in the inside of radiator, the chip sets up cover on the copper ceramic plate. The utility model discloses an utilize the copper-clad ceramic plate to replace the copper frame, utilize the heat conductivity of copper-clad ceramic plate product itself to be good, from the characteristic of taking insulation, make the at least part setting of copper-clad ceramic plate in the inside of radiator, this discrete device compares with general copper frame product, only has the copper-clad ceramic plate between chip to the radiator, therefore the operation that possesses better coefficient of heat dissipation and application is more convenient, has effectively reduced the inefficacy of the product that leads to because of misoperation. Through covering the direct integration of copper ceramic plate inside the radiator, it is bigger to have increased the area of contact of covering copper ceramic plate and radiator, and heat dispersion also promotes greatly.
Description
Technical Field
The utility model relates to a chip heat dissipation technical field especially relates to a discrete device.
Background
Discrete devices on the market are welded through a copper frame at present, when the discrete devices are applied, the chip copper frame is welded to be insulated through an insulating adhesive tape, the insulating adhesive tape and a radiator are connected through heat-conducting silicone grease (as shown in figure 1), and heat-resistant substances such as the insulating adhesive tape exist between the chip and the radiator, so that the heat dissipation of the chip is not facilitated when the chip is applied, the heat dissipation performance of the discrete devices is poor, and particularly the heat dissipation performance of the discrete devices in the aspect of high-power products is poor.
SUMMERY OF THE UTILITY MODEL
Not good not enough to current discrete device heat dispersion, the utility model aims to provide a discrete device, it can make the chip have better heat dispersion when using.
The utility model provides a pair of discrete device, including the radiator that sets gradually, cover copper ceramic plate and chip, cover copper ceramic plate's at least partly setting in the inside of radiator, the chip sets up cover copper ceramic plate is last.
The copper-clad ceramic plate comprises a ceramic substrate and a copper layer covering the ceramic substrate, the copper layer is not in contact with the radiator, and the chip is arranged on the copper layer.
Preferably, the copper-clad ceramic plate is entirely disposed inside the heat sink.
Preferably, the top surface of the copper-clad ceramic plate is flush with the top surface of the heat sink.
Preferably, the top surface of the copper-clad ceramic board is lower than the top surface of the heat sink.
Preferably, the thickness of the copper layer is less than 0.3 mm.
Preferably, the discrete device further comprises a pin, the pin forming an electrical connection with the chip.
Preferably, the discrete device further comprises a plastic package shell, and the copper-clad ceramic plate, the chip and part of the pins are wrapped by the plastic package shell.
The utility model discloses an utilize the copper-clad ceramic plate to replace the copper frame, utilize the heat conductivity of copper-clad ceramic plate product itself to be good, from the characteristic of taking insulation, make the at least part setting of copper-clad ceramic plate in the inside of radiator, this discrete device compares with general copper frame product, only has the copper-clad ceramic plate between chip to the radiator, therefore the operation that possesses better coefficient of heat dissipation and application is more convenient, has effectively reduced the inefficacy of the product that leads to because of misoperation. Through covering the direct integration of copper ceramic plate inside the radiator, it is bigger to have increased the area of contact of covering copper ceramic plate and radiator, and heat dispersion also promotes greatly.
The above-mentioned technical characteristics can be combined in various suitable ways or replaced by equivalent technical characteristics as long as the purpose of the invention can be achieved.
Drawings
The invention will be described in more detail hereinafter on the basis of non-limiting examples only and with reference to the accompanying drawings. Wherein:
FIG. 1 is a schematic diagram of a prior art discrete device;
fig. 2 is a schematic structural diagram of a discrete device provided in the present invention;
fig. 3 is a schematic structural diagram of a heat sink according to the present invention;
fig. 4 is a schematic structural view of a copper-clad ceramic plate according to the present invention;
fig. 5 is a schematic structural diagram of another discrete device with pins welded thereon according to the present invention;
fig. 6 is a schematic structural diagram of another discrete device having pins and a plastic package housing provided in the present invention.
Description of reference numerals:
1. a heat sink; 2. a copper-clad ceramic plate; 3. a chip; 4. a pin; 5. plastic packaging the shell; 6. a copper frame; 7. an insulating tape; 8. heat-conducting silicone grease; 11. a groove; 21. a ceramic substrate; 22. a copper layer.
Detailed Description
For making the purpose, technical solution and advantages of the present invention clearer, it will be right below that the technical solution of the present invention is clearly and completely described, based on the specific embodiments of the present invention, all other embodiments obtained by the ordinary skilled person in the art without creative work belong to the scope protected by the present invention.
As shown in fig. 2, the discrete device provided by the present invention includes a heat sink 1, a copper-clad ceramic plate 2 and a chip 3, which are sequentially disposed. Wherein the chip 3 is disposed on the copper clad ceramic board 2, and at least a part of the copper clad ceramic board 2 is disposed inside the heat sink 1. As shown in fig. 3, the heat sink 1 is provided with a groove 11 having the same shape and size as the copper-clad ceramic plate 2, and the copper-clad ceramic plate 2 is embedded in the groove 11 and closely attached to the inner wall of the groove 11, so that the contact area between the copper-clad ceramic plate 2 and the heat sink 1 is increased, which is beneficial to heat dissipation of the chip 3. As shown in fig. 4, the copper-clad ceramic plate 2 is composed of a ceramic substrate 21 and a copper layer 22 covering the ceramic substrate 21, the copper layer 22 is not in contact with the heat sink 1, and the chip 3 is disposed on the copper layer 22. During the manufacturing process, the groove 11 of the heat spreader 1 may be covered with a ceramic substrate 21 by a sintering technique, and the ceramic substrate 21 may be covered with a piece of copper 22 by a sintering technique. The thickness of copper layer 22 is less than 0.3mm, and copper layer 22 all leaves certain interval with ceramic substrate 21's border all around, leaves the interval therefore contactless between copper layer 22 and the radiator 1, avoids the product inefficacy, therefore makes copper-clad ceramic plate 2 both can partially set up inside radiator 1, also can all set up inside radiator 1.
In order to increase the contact area between the copper-clad ceramic plate 2 and the heat sink 1 and facilitate heat dissipation of the chip 3, the copper-clad ceramic plate 2 may be completely disposed inside the heat sink 1, that is, the copper-clad ceramic plate 2 is completely embedded in the groove 11, and at this time, as shown in fig. 2, the top surface of the copper-clad ceramic plate 2 may be flush with the top surface of the heat sink 1; the top surface of the copper-clad ceramic plate 2 may be slightly lower than the top surface of the heat sink 1.
As shown in fig. 5, the discrete device may further have a pin 4, and the pin 4 is electrically connected to the chip 3 by soldering. And integrally plastic-packaging the discrete device welded with the chip 3 and the pins 4 to form the discrete device with a plastic-packaged shell 5 (as shown in fig. 6), wherein the chip 3 and the copper-clad ceramic plate 2 are completely wrapped by the plastic-packaged shell 5, and the pins 4 are partially wrapped by the plastic-packaged shell 5.
Because only the ceramic substrate 21 is arranged between the chip 3 and the heat sink 1, compared with the existing discrete device, the chip is closer to the heat sink 1 in terms of heat conduction and heat dissipation, and heat-resistant substances such as the insulating tape 7 are reduced, so that the chip 3 of a high-power product is more beneficial to heat dissipation. The copper-clad ceramic plate 2 is directly integrated inside the radiator 1, so that the contact area between the copper-clad ceramic plate 2 and the radiator 1 is larger, and the heat dissipation performance is also improved greatly. In the aspect of the installation, current discrete device product need paste insulating tape 7 by oneself, applies paint a series of actions such as heat conduction silicone grease 8 with a brush, and in operation, the human factor is many, easily causes the product to lead to the product to become invalid because of the human factor misoperation, and the utility model provides a discrete device has got rid of insulating tape 7 and heat conduction silicone grease 8, makes the operation of application end more convenient, has effectively reduced the inefficacy of the product that leads to because of misoperation.
Finally, it should be noted that: the above embodiments and examples are only used to illustrate the technical solution of the present invention, but not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments and examples, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments or examples may still be modified, or some of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the embodiments or examples of the present invention.
Claims (8)
1. The discrete device is characterized by comprising a radiator, a copper-clad ceramic plate and a chip which are sequentially arranged, wherein at least one part of the copper-clad ceramic plate is arranged inside the radiator, and the chip is arranged on the copper-clad ceramic plate.
2. The discrete device according to claim 1, wherein the copper-clad ceramic board includes a ceramic substrate and a copper layer overlying the ceramic substrate, the copper layer being not in contact with the heat sink, the chip being disposed on the copper layer.
3. The discrete device according to claim 2, wherein the copper-clad ceramic board is entirely disposed inside the heat sink.
4. The discrete device of claim 3, wherein a top surface of the copper-clad ceramic board is flush with a top surface of the heat spreader.
5. The discrete device according to claim 3, wherein a top surface of the copper-clad ceramic board is lower than a top surface of the heat sink.
6. The discrete device according to any of claims 2-5, characterized in that the thickness of the copper layer is less than 0.3 mm.
7. The discrete device according to any of claims 1-5, further comprising a pin, the pin forming an electrical connection with the chip.
8. The discrete device according to claim 7, further comprising a plastic package encasing the copper-clad ceramic board, the chip, and a portion of the leads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020267141.0U CN211428141U (en) | 2020-03-06 | 2020-03-06 | Discrete device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020267141.0U CN211428141U (en) | 2020-03-06 | 2020-03-06 | Discrete device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211428141U true CN211428141U (en) | 2020-09-04 |
Family
ID=72281076
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020267141.0U Active CN211428141U (en) | 2020-03-06 | 2020-03-06 | Discrete device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211428141U (en) |
-
2020
- 2020-03-06 CN CN202020267141.0U patent/CN211428141U/en active Active
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