CN217562559U - Shock-resistant schottky diode - Google Patents
Shock-resistant schottky diode Download PDFInfo
- Publication number
- CN217562559U CN217562559U CN202220648239.XU CN202220648239U CN217562559U CN 217562559 U CN217562559 U CN 217562559U CN 202220648239 U CN202220648239 U CN 202220648239U CN 217562559 U CN217562559 U CN 217562559U
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- China
- Prior art keywords
- schottky diode
- conductive adhesive
- leg
- conducting plate
- current conducting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Abstract
The utility model provides an antidetonation schottky diode, including the insulating plastic-sealed body, the internal schottky chip that is equipped with of insulating plastic-sealed, both ends are connected with first current conducting plate, second current conducting plate respectively about the schottky chip, first current conducting plate include with the last electrically conductive part of connecting of schottky chip, connection are in the kink of electrically conductive part one end, connection are in the contact site of kink lower extreme, the lower pot head of contact site has first conductive adhesive, first conductive adhesive lower extreme is fixed with first leg, second current conducting plate one end downside covers there is the second conductive adhesive, the second conductive adhesive lower extreme is fixed with the second leg. The utility model discloses a schottky diode designs into dismantled and assembled structure with first leg, second welding, has adopted thicker first conducting resin, second conducting resin moreover, can promote schottky diode's shock resistance.
Description
Technical Field
The utility model relates to a diode technical field, concretely relates to shock-resistant schottky diode.
Background
A schottky diode is a diode in which a barrier is formed at an interface by a metal and an N-type semiconductor contact. The schottky diode of prior art, it is direct with leg and chip integration plastic envelope shaping usually to with leg lug beading on the circuit board, in leg welding process, if the condition such as damage appears in the leg lug, the leg lug can't be changed, lead to whole schottky diode to scrap. And the mode of direct welding, the shock resistance of schottky diode is not enough.
SUMMERY OF THE UTILITY MODEL
To above problem, the utility model provides an antidetonation schottky diode designs into dismantled and assembled structure with first leg, second welding, has adopted thicker first conducting resin, second conducting resin moreover, can promote schottky diode's shock resistance.
In order to achieve the above object, the present invention provides the following technical solutions:
the utility model provides an antidetonation schottky diode, includes the insulating plastic-sealed body, be equipped with the schottky chip in the insulating plastic-sealed body, schottky chip upper and lower both ends are connected with first current conducting plate, second current conducting plate respectively, first current conducting plate include with the last end connection of schottky chip conductive part, connection be in the kink of conductive part one end, connection be in the contact site of kink lower extreme, the contact site lower extreme covers there is first conductive adhesive, first conductive adhesive lower extreme is fixed with first leg, second current conducting plate one end downside covers there is the second conductive adhesive, the second conductive adhesive lower extreme is fixed with the second leg.
Specifically, the thickness of the first conductive adhesive and the second conductive adhesive is m, and m is larger than or equal to 3mm.
Specifically, the first conductive adhesive is fixedly connected with the first welding leg through a first screw.
Specifically, the second conductive adhesive is fixedly connected with the second solder leg through a second screw.
Specifically, a plurality of radiating fins are further arranged at the upper end of the inner side of the insulating plastic package body.
Specifically, a waterproof film is covered on the outer side of the insulating plastic package body.
The beneficial effects of the utility model are that:
the utility model discloses a schottky diode designs into dismantled and assembled structure with first leg, second welding, has adopted thicker first conducting resin, second conducting resin moreover, and first conducting resin, second conducting resin have good elasticity as middle electric conductor, can promote schottky diode's shock resistance.
Drawings
Fig. 1 is the utility model discloses a shock-resistant schottky diode's schematic structure diagram.
The reference signs are: the device comprises an insulating plastic package body 1, a Schottky chip 2, a first conductive plate 3, a conductive part 31, a bending part 32, a contact part 33, a second conductive plate 4, a first conductive adhesive 5, a first welding foot 6, a second conductive adhesive 7, a second welding foot 8, a first screw 9, a second screw 10, a radiating fin 11 and a waterproof film 12.
Detailed Description
The present invention will be described in further detail with reference to the following examples and drawings, but the present invention is not limited thereto.
As shown in fig. 1:
the utility model provides an antidetonation schottky diode, including the insulating plastic-sealed body 1, be equipped with schottky chip 2 in the insulating plastic-sealed body 1, both ends are connected with first current conducting plate 3 respectively about schottky chip 2, second current conducting plate 4, first current conducting plate 3 includes the conductive part 31 of being connected with schottky chip 2 upper end, connect the kink 32 in conductive part 31 one end, connect the contact site 33 at kink 32 lower extreme, the lower cover of contact site 33 has first conducting resin 5, first conducting resin 5 lower extreme is fixed with first leg 6, first conducting resin 5 is as the middle electric conductor between first current conducting plate 3 and the first leg 6, second current conducting plate 4 one end downside covers there is second conducting resin 7, second conducting resin 7 lower extreme is fixed with second leg 8, second conducting resin 7 is as the middle electric conductor between second current conducting plate 4 and the second leg 8, the thickness more than or equal to 3mm of first conducting resin 5 and second conducting resin 7, through increaseing first conducting resin 5, the thickness of second conducting resin 7, promote first conducting resin, the elasticity effect of second conducting resin, thereby promote the diode after-welding ability.
Preferably, the first conductive paste 5 and the first solder tail 6 are fixedly connected by a first screw 9.
Preferably, the second conductive paste 7 and the second solder tail 8 are fixedly connected by a second screw 10.
Preferably, in order to improve the heat dissipation performance of the schottky diode, a plurality of heat dissipation fins 11 are further disposed at the upper end of the inner side of the insulating plastic package body 1.
Preferably, in order to improve the waterproof performance of the insulating plastic package 1, the insulating plastic package 1 is covered with a waterproof film 12 on the outside.
The above embodiments only express 1 implementation manner of the present invention, and the description thereof is more specific and detailed, but not to be understood as the limitation of the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (6)
1. The utility model provides an antidetonation schottky diode, its characterized in that, includes the insulating plastic-sealed body (1), be equipped with schottky chip (2) in the insulating plastic-sealed body (1), both ends are connected with first current conducting plate (3), second current conducting plate (4) respectively about schottky chip (2), first current conducting plate (3) include with conductive part (31) of schottky chip (2) upper end connection, connect kink (32), the connection of conductive part (31) one end are in contact site (33) of kink (32) lower extreme, the lower pot head of contact site (33) has first conductive adhesive (5), first conductive adhesive (5) lower extreme is fixed with first leg (6), second current conducting plate (4) one end downside covers there is second conductive adhesive (7), second conductive adhesive (7) lower extreme is fixed with second leg (8).
2. An earthquake-resistant schottky diode according to claim 1, wherein the thickness of the first conductive adhesive (5) and the second conductive adhesive (7) is m, and m is greater than or equal to 3mm.
3. An earthquake-resistant schottky diode as claimed in claim 1, characterized in that the first electrically conductive glue (5) is fixedly connected to the first leg (6) by means of a first screw (9).
4. An earthquake-resistant schottky diode according to claim 1, characterized in that the second conductive paste (7) is fixedly connected to the second leg (8) by means of a second screw (10).
5. An earthquake-resistant schottky diode as claimed in claim 1, characterized in that the insulating plastic package (1) is further provided with a plurality of heat sinks (11) at the upper inner side.
6. An earthquake-resistant schottky diode as claimed in claim 1, characterized in that the insulating plastic package (1) is covered on the outside with a waterproof film (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220648239.XU CN217562559U (en) | 2022-03-23 | 2022-03-23 | Shock-resistant schottky diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220648239.XU CN217562559U (en) | 2022-03-23 | 2022-03-23 | Shock-resistant schottky diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217562559U true CN217562559U (en) | 2022-10-11 |
Family
ID=83471510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220648239.XU Active CN217562559U (en) | 2022-03-23 | 2022-03-23 | Shock-resistant schottky diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217562559U (en) |
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2022
- 2022-03-23 CN CN202220648239.XU patent/CN217562559U/en active Active
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