CN208538827U - Power device with heat sinking function - Google Patents
Power device with heat sinking function Download PDFInfo
- Publication number
- CN208538827U CN208538827U CN201821193538.9U CN201821193538U CN208538827U CN 208538827 U CN208538827 U CN 208538827U CN 201821193538 U CN201821193538 U CN 201821193538U CN 208538827 U CN208538827 U CN 208538827U
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- CN
- China
- Prior art keywords
- chip substrate
- chip
- power device
- sinking function
- heat sinking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a kind of power device with heat sinking function, including being set to the intracorporal chip substrate of epoxy packages, at least two diode chip for backlight unit, at least two connection sheet and at least two negative pin, positive terminal positioned at the diode chip for backlight unit of chip substrate upper surface is electrically connected with chip substrate upper surface, the negative pole end of the diode chip for backlight unit is connect with negative pin one end by connection sheet, described chip substrate one end has a positive pin, also there is a cooling fin, this cooling fin is fixed on chip substrate lower surface by an epoxy layer, the surface that the chip substrate is contacted with diode chip for backlight unit is provided with an annular waterproof trough, at least two diode chip for backlight unit is installed on the region in the annular waterproof trough of chip substrate, epoxy resin is filled in this annular waterproof trough, the corner of this chip substrate has thinning part, this subtracts The thickness in thin portion is lower than the thickness of chip substrate.Finned again when the utility model eliminates subsequent use has saved installation procedure and convenient to use.
Description
Technical field
The utility model relates to a kind of power devices with heat sinking function, belong to semiconductor packing device technical field.
Background technique
As one of the electrical component that electronics industry is most widely used, power device be along high-power, high frequency,
Highly integrated direction is developed, so, whether there is good heat dissipation and electromagnetism interference design just to become influence power
The key factor of device working performance and service life.
Existing similar product lead frame is thickness copper material, and finned again is needed when client uses, and increases assembly cost,
Thickness copper material is special-shaped copper material, and material cost is high and the dosage of copper material is big, in addition, it is on-insulated between chip and cooling fin, exist
Some potential safety problems.
Summary of the invention
The purpose of the utility model is to provide a kind of power devices with heat sinking function, this has the power of heat sinking function
Finned again when device eliminates subsequent use has saved installation procedure and convenient to use.
In order to achieve the above objectives, the technical solution adopted in the utility model is: a kind of power device with heat sinking function,
Including being set to the intracorporal chip substrate of epoxy packages, at least two diode chip for backlight unit, at least two connection sheet and at least two cathode
Pin；
Positive terminal positioned at the diode chip for backlight unit of chip substrate upper surface is electrically connected with chip substrate upper surface, described
The negative pole end of diode chip for backlight unit is connect with negative pin one end by connection sheet, and there is an anode to draw for described chip substrate one end
Foot；
Also there is a cooling fin, this cooling fin is fixed on chip substrate lower surface by an epoxy layer；
The surface that the chip substrate is contacted with diode chip for backlight unit is provided with an annular waterproof trough, at least two diode
Chip is installed on the region in the annular waterproof trough of chip substrate, and epoxy resin is filled in this annular waterproof trough；
One end face of the chip substrate is provided at least one groove, and the corner of this chip substrate has thinning part, this
The thickness of thinning part is lower than the thickness of chip substrate.
Further improved scheme is as follows in above-mentioned technical proposal:
1. in above scheme, the upper surface of the thinning part is lower than the upper surface of chip substrate, the following table of the thinning part
Face is higher than the lower surface of chip substrate.
2. in above scheme, the groove is strip groove.
3. in above scheme, the thickness of the thinning part and the thickness ratio of chip substrate are 1:2~4.
4. in above scheme, the epoxy layer with a thickness of 0.2mm~1.0mm.
5. in above scheme, the cooling fin is aluminum alloy heat sink or copper radiating rib.
6. in above scheme, the fin thickness and chip substrate thickness ratio are 10:2~4.
7. in above scheme, the connection sheet has a bending part.
8. in above scheme, the negative pin and positive pin are set to same level.
9. in above scheme, the width of the negative pin and connection sheet junction is greater than connection sheet width.
Due to the application of the above technical scheme, the utility model has the advantage that compared with prior art
1, the utility model has the power device of heat sinking function, also has a cooling fin, this cooling fin passes through a ring
Oxygen layer is fixed on chip substrate lower surface, cooling fin it is integrally disposed, finned again when eliminating subsequent use is saved
Installation procedure and convenient to use；In addition, being provided with epoxy layer between cooling fin and chip substrate for insulating, so that heat dissipation metal
It insulate between piece and chip substrate, positive and negative anodes pin, guarantees the safety that device uses；Again, the setting of cooling fin, instead of
The heat sinking function of chip substrate itself greatly reduces so that the thin copper material of homogeneous thickness can be used in chip substrate and pin
The usage amount of copper material and be standard copper material has saved cost, improves and produces and uses efficiency.
2, the utility model has the power device of heat sinking function, and the surface that chip substrate is contacted with diode chip for backlight unit is opened
There is an annular waterproof trough, at least two diode chip for backlight unit is installed on the region in the annular waterproof trough of chip substrate, this waterproof
Buffer action is played to steam by the setting of capillary groove filled with epoxy resin in slot, prevent external moisture enter chip and
The performance for influencing chip, extends the service life of chip；Secondly, its negative pin and the width of connection sheet junction are greater than connection
Piece width, guarantees the bonding area of connection sheet and negative pin and facilitate connection sheet is placed in welding.
3, the utility model has the power device of heat sinking function, and it is recessed that an end face of chip substrate is provided at least one
Slot, the corner of this chip substrate have thinning part, and the thickness of this thinning part is lower than the thickness of chip substrate, groove and thinning part
Setting, increase the bonded area between chip substrate and epoxy packages body, enhance the lock ring oxygen ability of chip substrate, make
The binding force obtained between chip substrate and epoxy packages body is stronger, to enhance the waterproofness of device entirety, also avoids device
There is crack between epoxy packages body and chip substrate and leads to air-tightness and against weather variation etc. after passing through high/low temperature in part
Situation.
Detailed description of the invention
Attached drawing 1 is the power unit structure schematic diagram that the utility model has heat sinking function；
Attached drawing 2 is the power device partial structure sectional view that the utility model has heat sinking function；
Attached drawing 3 is that the utility model has thinning part structure sectional view in the power device of heat sinking function.
In the figures above: 1, epoxy packages body；2, chip substrate；3, diode chip for backlight unit；4, connection sheet；5, negative pin；
6, epoxy layer；7, positive pin；9, cooling fin；10, annular waterproof trough；11, groove；12, thinning part.
Specific embodiment
Embodiment 1: a kind of power device with heat sinking function, including the chip substrate being set in epoxy packages body 1
2, at least two diode chip for backlight unit 3, at least two connection sheet 4 and at least two negative pin 5；
Positive terminal positioned at the diode chip for backlight unit 3 of 2 upper surface of chip substrate is electrically connected with 2 upper surface of chip substrate,
The negative pole end of the diode chip for backlight unit 3 is connect with 5 one end of negative pin by connection sheet 4, and described 2 one end of chip substrate has one
Positive pin 7；
Also there is a cooling fin 9, this cooling fin 9 is fixed on 2 lower surface of chip substrate by an epoxy layer 6；
The surface that the chip substrate 2 is contacted with diode chip for backlight unit 3 is provided with an annular waterproof trough 10, described at least two two
Pole pipe chip 3 is installed on the region in the annular waterproof trough 10 of chip substrate 2, and asphalt mixtures modified by epoxy resin is filled in this annular waterproof trough 10
Rouge；
One end face of the chip substrate 2 is provided at least one groove 11, and the corner of this chip substrate 2 has thinning part
12, the thickness of this thinning part 12 is lower than the thickness of chip substrate 2.
The upper surface of the thinning part 12 is lower than the upper surface of chip substrate 2, and the lower surface of the thinning part 12 is higher than core
The lower surface of plate base 2.
Above-mentioned groove 11 is strip groove；Above-mentioned negative pin 5 and positive pin 7 are set to same level；It is above-mentioned to subtract
The thickness in thin portion 12 and the thickness ratio of chip substrate 2 are 1:2；Above-mentioned epoxy layer 6 with a thickness of 0.4mm；Above-mentioned cooling fin 9 is
Aluminum alloy heat sink；Above-mentioned 9 thickness of cooling fin and 2 thickness ratio of chip substrate are 10:2.
Embodiment 2: a kind of power device with heat sinking function, including the chip substrate being set in epoxy packages body 1
2, at least two diode chip for backlight unit 3, at least two connection sheet 4 and at least two negative pin 5；
Positive terminal positioned at the diode chip for backlight unit 3 of 2 upper surface of chip substrate is electrically connected with 2 upper surface of chip substrate,
The negative pole end of the diode chip for backlight unit 3 is connect with 5 one end of negative pin by connection sheet 4, and described 2 one end of chip substrate has one
Positive pin 7；
Also there is a cooling fin 9, this cooling fin 9 is fixed on 2 lower surface of chip substrate by an epoxy layer 6；
The surface that the chip substrate 2 is contacted with diode chip for backlight unit 3 is provided with an annular waterproof trough 10, described at least two two
Pole pipe chip 3 is installed on the region in the annular waterproof trough 10 of chip substrate 2, and asphalt mixtures modified by epoxy resin is filled in this annular waterproof trough 10
Rouge；
One end face of the chip substrate 2 is provided at least one groove 11, and the corner of this chip substrate 2 has thinning part
12, the thickness of this thinning part 12 is lower than the thickness of chip substrate 2.
The upper surface of the thinning part 12 is lower than the upper surface of chip substrate 2, and the lower surface of the thinning part 12 is higher than core
The lower surface of plate base 2.
Above-mentioned connection sheet 4 has a bending part；Above-mentioned negative pin 5 and the width of 4 junction of connection sheet are greater than connection sheet 4
Width；The thickness of above-mentioned thinning part 12 and the thickness ratio of chip substrate 2 are 1:3；Above-mentioned epoxy layer 6 with a thickness of 0.7mm；On
Stating cooling fin 9 is copper radiating rib；Above-mentioned 9 thickness of cooling fin and 2 thickness ratio of chip substrate are 10:34.
When using the above-mentioned power device with heat sinking function, cooling fin it is integrally disposed, when eliminating subsequent use
Finned again has been saved installation procedure and has been easy to use；In addition, being provided with epoxy layer use between cooling fin and chip substrate
In insulation, so that insulating between metal fin and chip substrate, positive and negative anodes pin, guarantee the safety that device uses；Again,
The setting of cooling fin, instead of the heat sinking function of chip substrate itself, so that uniform thickness can be used in chip substrate and pin
The thin copper material of degree, greatly reduces the usage amount of copper material and is standard copper material, has saved cost, improves and produces and uses efficiency；Again
It is secondary, by the setting of capillary groove, buffer action is played to steam, prevents external moisture from entering chip and influences the performance of chip,
Extend the service life of chip；Again, guarantee the bonding area of connection sheet and negative pin and facilitate connection sheet is placed in weldering
It connects；Again, the setting of groove and thinning part increases the bonded area between chip substrate and epoxy packages body, enhances core
The lock ring oxygen ability of plate base, so that the binding force between chip substrate and epoxy packages body is stronger, so that it is whole to enhance device
The waterproofness of body also avoids device by occurring crack between epoxy packages body and chip substrate after high/low temperature and leading to gas
Situations such as close property and against weather are deteriorated.
The above embodiments are only for explaining the technical ideas and features of the present invention, and its object is to allow be familiar with technique
Personage can understand the content of the utility model and implement accordingly, do not limit the protection scope of the present invention.
All equivalent change or modifications according to made by the spirit of the present invention essence, should all cover the protection scope of the utility model it
It is interior.
Claims (10)
1. a kind of power device with heat sinking function, it is characterised in that: including the chip base being set in epoxy packages body (1)
Plate (2), at least two diode chip for backlight unit (3), at least two connection sheet (4) and at least two negative pin (5)；
Positive terminal positioned at the diode chip for backlight unit (3) of chip substrate (2) upper surface is electrically connected with chip substrate (2) upper surface
It connects, the negative pole end of the diode chip for backlight unit (3) is connect with negative pin (5) one end by connection sheet (4), the chip substrate
(2) one end has a positive pin (7)；
Also there are a cooling fin (9), this cooling fin (9) is fixed on chip substrate (2) lower surface by an epoxy layer (6)；
The surface that the chip substrate (2) contacts with diode chip for backlight unit (3) is provided with an annular waterproof trough (10), described at least two
Diode chip for backlight unit (3) is installed on the region in the annular waterproof trough (10) of chip substrate (2), filling in this annular waterproof trough (10)
There is epoxy resin；
One end face of the chip substrate (2) is provided at least one groove (11), and the corner of this chip substrate (2), which has, to be thinned
Portion (12), the thickness of this thinning part (12) are lower than the thickness of chip substrate (2).
2. the power device according to claim 1 with heat sinking function, it is characterised in that: the thinning part (12) it is upper
Surface is lower than the upper surface of chip substrate (2), and the lower surface of the thinning part (12) is higher than the lower surface of chip substrate (2).
3. the power device according to claim 1 with heat sinking function, it is characterised in that: the groove (11) is bar shaped
Groove.
4. the power device according to claim 1 with heat sinking function, it is characterised in that: the thickness of the thinning part (12)
The thickness ratio of degree and chip substrate (2) is 1:2~4.
5. the power device according to claim 1 with heat sinking function, it is characterised in that: the thickness of the epoxy layer (6)
Degree is 0.2mm~1.0mm.
6. the power device according to claim 1 with heat sinking function, it is characterised in that: the cooling fin (9) is aluminium
Alloy heat-sink piece or copper radiating rib.
7. the power device according to claim 1 with heat sinking function, it is characterised in that: cooling fin (9) thickness
It is 10:2~4 with chip substrate (2) thickness ratio.
8. the power device according to claim 1 with heat sinking function, it is characterised in that: the connection sheet (4) has
One bending part.
9. the power device according to claim 1 with heat sinking function, it is characterised in that: the negative pin (5) and
Positive pin (7) is set to same level.
10. the power device according to claim 1 with heat sinking function, it is characterised in that: the negative pin (5) with
The width of connection sheet (4) junction is greater than connection sheet (4) width.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821193538.9U CN208538827U (en) | 2018-07-26 | 2018-07-26 | Power device with heat sinking function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821193538.9U CN208538827U (en) | 2018-07-26 | 2018-07-26 | Power device with heat sinking function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208538827U true CN208538827U (en) | 2019-02-22 |
Family
ID=65385695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821193538.9U Active CN208538827U (en) | 2018-07-26 | 2018-07-26 | Power device with heat sinking function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208538827U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108766947A (en) * | 2018-07-26 | 2018-11-06 | 苏州固锝电子股份有限公司 | Power device with heat sinking function |
-
2018
- 2018-07-26 CN CN201821193538.9U patent/CN208538827U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108766947A (en) * | 2018-07-26 | 2018-11-06 | 苏州固锝电子股份有限公司 | Power device with heat sinking function |
| CN108766947B (en) * | 2018-07-26 | 2024-01-26 | 苏州固锝电子股份有限公司 | Power device with heat dissipation function |
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