CN206181696U - Cell -phone shielding heat radiation structure of low thermal resistance and cell -phone that has this structure - Google Patents

Cell -phone shielding heat radiation structure of low thermal resistance and cell -phone that has this structure Download PDF

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Publication number
CN206181696U
CN206181696U CN201621195159.4U CN201621195159U CN206181696U CN 206181696 U CN206181696 U CN 206181696U CN 201621195159 U CN201621195159 U CN 201621195159U CN 206181696 U CN206181696 U CN 206181696U
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Prior art keywords
radiator
mobile phone
chip
thermal resistance
radome
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CN201621195159.4U
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修洪雨
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Branch Of Software Technology (shenzhen) Co Ltd
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Branch Of Software Technology (shenzhen) Co Ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02ATECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
    • Y02A30/00Adapting or protecting infrastructure or their operation

Abstract

The utility model provides a cell -phone shielding heat radiation structure of low thermal resistance and cell -phone that has this structure, wherein cell -phone shielding heat radiation structure includes PCB board and radiator, the PCB board with form an installation cavity between the radiator, be provided with the shield cover in the installation cavity, the shield cover is installed on the PCB board, be equipped with the chip in the shield cover, install the chip is in on the PCB board, the shield cover include the roof and connect in curb plate on the roof, set up the through -hole of prescribed dimension size on the roof of shield cover, the through -hole coats and is stamped the fin, the fin with it is equipped with a series thermal silica to paste between the chip, the fin with it is equipped with the 2nd series thermal silica to paste between the radiator. The utility model discloses effectively reduce the thermal resistance of generating heat between device and the metal center, kept the blocking function of original shield cover, both promoted the radiating effect of cell -phone, still can realize the ultra -thin structure target of cell -phone.

Description

A kind of mobile phone shielding radiator structure and the mobile phone with the structure of low thermal resistance
Technical field
This utility model is related to electronic product radiating technical field, more particularly to a kind of mobile phone shielding radiating knot of low thermal resistance Structure and the mobile phone with the structure.
Background technology
At present, in existing mobile phone, it is considered to the function such as signal shielding, in the major power device such as master chip, radio-frequency devices table Face is equipped with radome.And directly without thermal interfacial material between inside chip and screening cover, or directly air contact, or adopt The boundary material contact of thermal conductive silicon rubber cushion, heat is generally transmitted by following path:
Heater members → radome → heat sink (metal center)
Or heater members → heat conductive silica gel → radome → heat sink (metal center)
Direct air contact between chip and screening cover, because the heat conductivity of air is very low, hinder significantly chip to The heat transfer of metal center, increased the thermal resistance between chip and screening cover and heat dissipation metal center;Chip and screening cover it Between fill thermal conductive silicon rubber cushion, due to the thickness requirement of thermal conductive silicon rubber cushion, general this space requirement is more than 0.2mm, increased core Piece increases the thermal resistance between chip and heat sink material metal center the distance between to metal center.
Thermal resistance between heater members and metal center increases, and chip temperature can be caused too high, causes CPU frequency reducings, mobile phone Outer surface is overheated, affects the overall performance and customer perception of mobile phone.
Utility model content
The purpose of this utility model is to reduce between heater members and radiator (metal center, mobile phone shell, heat sink) Thermal resistance, on the premise of function of shielding is ensured, is more beneficial for the integral heat sink of mobile phone.
This utility model is achieved in that a kind of mobile phone shielding radiator structure of low thermal resistance, including pcb board and radiating Body, forms an installation cavity between the pcb board and the radiator, the installation intracavity is provided with radome, the radome On the pcb board, chip is provided with the radome, the chip is arranged on the pcb board, the radome bag Top board and the side plate being connected on the top board are included, through hole is offered on the top board of the radome, the through hole is just to described Chip, it is one more than or equal to 0.2 and less than 1 that the area of the through hole is the multiple scope of the top board area of the radome Fin covers the through hole comprehensively, and being sticked between the fin and the chip has the first heat conductive silica gel, the fin Being sticked and the radiator between has the second heat conductive silica gel.
Further, the radiator is metal center or mobile phone shell or heat sink.
Further, the fin covers the through hole and extends to the entire surface of the top board of the radome comprehensively Product.
Further, the upper surface of first heat conductive silica gel flushes with the top board of the radome;Described first leads Hot silica gel covers the whole upper surface of the chip.
Further, the surface-coated of the fin has electro-magnetic screen layer.
Further, the fin is graphite flake;The fin is copper foil;The fin is graphite flake Copper Foil The combination of piece;Thickness of the thickness of the fin less than the radome.
Further, this utility model also provides another kind of implementation, a kind of mobile phone shielding radiator structure of low thermal resistance, Including pcb board, radiator and the buckle with function of shielding, the corresponding pcb board of buckle and the radiator two The equal hollow out in individual face, the radiator, the buckle, the pcb board form an installation cavity, and the installation intracavity is provided with chip, The chip is arranged on the pcb board, and between the chip and the radiator heat conductive silica gel is provided with.
Further, described heat conductive silica gel one end connects the upper surface of the chip, and the other end connects the radiator.
Further, the radiator is metal center or mobile phone shell or heat sink.
Another object of the present utility model is to provide a kind of mobile phone, including the low thermal resistance handss of any one of claim 1-9 Machine shields radiator structure.
This utility model having the technical effect that relative to prior art:Due to heater members (chip) and radiator (metal Center or mobile phone shell or heat sink) be joined directly together by heat conductive silica gel and fin and connect, effectively reduce heater members and radiator it Between thermal resistance, enable chip produce heat Quick diffusing go out;The through hole of predefined size is opened up on radome, is remained original The function of shielding of radome.So as to this structure evades the risk of CPU frequency reducings to reducing chip own temperature, reduces shell handss The temperature of machine, the comfort level and perceptibility aspect that lifting client uses plays vital effect, is also capable of achieving mobile phone ultra-thin Structural object.
Description of the drawings
Fig. 1 is the sectional structure chart of the low thermal resistance mobile phone radiator structure that this utility model embodiment one is provided.
Fig. 2 is the sectional structure chart of the low thermal resistance mobile phone radiator structure that this utility model embodiment two is provided.
Specific embodiment
In order that the purpose of this utility model, technical scheme and advantage become more apparent, below in conjunction with accompanying drawing and enforcement Example, is further elaborated to this utility model.It should be appreciated that specific embodiment described herein is only to explain This utility model, is not used to limit this utility model.
Before description specific embodiment, it should be noted that:If the expression of the quantity such as first, second is intended merely to difference Dry title identical element, is not used to limit this utility model.
Embodiment one
Refer to Fig. 1, a kind of mobile phone shielding radiator structure 10 of low thermal resistance that the present embodiment is provided, including pcb board 20, work For the metal center 30 of radiator, fin 40, radome 60, chip 50, the first heat conductive silica gel 70 and the second heat conductive silica gel 80.An installation cavity 90 is formed between the pcb board 20 and the metal center 30, radome 60 is located in the installation cavity 90 simultaneously It is fixed on pcb board 20, the chip 50 is installed on pcb board 20 and is located in the cavity volume that radome 60 is formed with pcb board 20, The radome 60 includes top board 61 and side plate 62, and top board 61 is just offering the through hole 611 of preliminary dimension to the position of chip 50, Fin 40 is coated with the through hole 611.The fin 40 covers whole top board 61 to the extension of surrounding.Radiating The first heat conductive silica gel 70 is provided between piece 40 and the chip 50, second is provided between fin 40 and metal center 30 and is led Hot silica gel 80.
In the present embodiment, the area of the through hole be the multiple scope of the top board area of the radome be more than or equal to 0.2 and less than 1, it is possible to understand that ground, multiple can use 0.3,0.4,0.5,0.6,0.7,0.8,0.9 in this scope.
First heat conductive silica gel 70 covers the whole upper surface of chip 50 and height is flushed with the top board 61 of radome 60, not only The heat produced by chip 50 is conducted as early as possible, and fin 40 is fully contacted with the first heat conductive silica gel 70, subtract Few thermal contact resistance, is conducive to radiating.
The upper surface of fin 40 is right against at through hole 611 and is provided with the second heat conductive silica gel 80, the one end of the second heat conductive silica gel 80 Connection fin 40, other end connection metal center 30, so, by the second heat conductive silica gel 80, being delivered to fin 40 Heat is delivered to again on metal center 30.
Specifically, in assembling, the height of the first heat conductive silica gel 70 is equal to the height of radome 60, and metal center 30 passes through The second heat conductive silica gel 80 is compressed, fin 40 is fully contacted with radome 60, be conducive to the transmission of heat;The opposing party Face makes fin 40 be fixed between the heat conductive silica gel 80 of radome 60 and second.The heat transfer that euthermic chip 50 is produced is to first Heat conductive silica gel 70, then fin 40 is passed to by the first heat conductive silica gel 70.Fin 40 is from the thermal conductive silicon of radome 60 and first The heat that glue 70 is absorbed uniformly is opened, then is delivered to the second heat conductive silica gel 80, is finally delivered to metal by the second heat conductive silica gel 80 Center 30, this process carries out heat transfer not over air, so significantly reducing between chip 50 and metal center 30 Thermal resistance.
Material used by fin 40 is the compositionss of graphite, Copper Foil or graphite and Copper Foil, and the thickness of fin is less than The thickness of radome.Heat conductive silica gel can also be replaced with other Heat Conduction Materials, such as heat conduction mud.
In order to reach reasonable shield effectiveness, it is coated with electro-magnetic screen layer on the surface of fin 40 and (does not mark in figure Show).Specifically, can be according to the intensity of internal electromagnetic radiation, by techniques such as PVD (physical vapour deposition (PVD)), in fin 40 Plated surface on desired thickness electro-magnetic screen layer, electro-magnetic screen layer for heat conduction metal material so that fin 40 have leads Heat and the effect of shielding.Thermal resistance can be so reduced, shield effectiveness is can guarantee that again.
Multiple chips 50 can be set in the cavity volume that radome 60 is formed with pcb board 20, radome 60 is just to each chip 50 upper end opens up through hole 611.Multiple radomes 60 can also be arranged on pcb board 20 to be applied in combination.The shape of radome 60 Shape can be the other shapes such as hemisphere.
The present embodiment additionally provides a kind of mobile phone that radiator structure is shielded with low thermal resistance as above, and the mobile phone is lighter Thin, shielding radiating effect is good, long service life, low production cost.
Embodiment two
Refer to Fig. 2, the present embodiment again there is provided a kind of mobile phone shielding radiator structure 11 of low thermal resistance, including pcb board 20, Metal center 30, buckle 60 as radiator, chip 50, heat conductive silica gel 70.The opposing metallic of buckle 60 with function of shielding The equal hollow out in two faces of center 30 and pcb board, metal center 30 and pcb board 20 are arranged on two hollow out faces of buckle 60.Institute State metal center 30, the buckle 60, the pcb board 20 and form an installation cavity 90, the installation intracavity 90 is provided with chip 50, The chip 50 is arranged on the pcb board 20, and between the chip 50 and the metal center 30 heat conductive silica gel 70 is provided with.
This utility model enables the heat that chip 50 is produced quickly to be delivered on metal center 30 by heat conductive silica gel 70, from And reduce the thermal resistance between chip 50 and metal center 30.Because buckle 60 has function of shielding, so as to remain original screen Cover the function of shielding of cover.Thermal resistance can be so reduced, shield effectiveness is can guarantee that again.
Specifically, in assembling, one end of heat conductive silica gel 70 is connected to the upper surface of chip 50 and covers whole upper surface, Other end connection metal center 30, the heat that such chip 50 is produced can quickly be delivered to metal center along heat conductive silica gel 70 On 30, so as to distribute.Due to this process not by air carrying out the transmission of heat, so significantly reducing heat generating core Thermal resistance between piece 50 and metal center 30.There was only heat conductive silica gel 70 between chip 50 and metal center 30, significantly save The fin of mobile phone and the thickness space of screening cover, realization of this kind of scheme to ultra thin handset also has larger contribution function
Preferably, metal center 30 can be other heat sink, such as mobile phone shell.Heat conductive silica gel can also lead for other Hot material, such as heat conduction mud.The material of buckle 60 is preferably plastics, it is also possible to the material with function of shielding such as metal.
Multiple chips 50 can be set in installation cavity 90, the upper surface of multiple chips 50 is by heat conductive silica gel 70 and gold Category center 30 is joined directly together and connects.Can also multiple installation cavitys 90 be applied in combination.
The present embodiment additionally provides a kind of mobile phone that radiator structure is shielded with low thermal resistance as above, and the mobile phone is lighter Thin, shielding radiating effect is good, long service life, low production cost.
Preferred embodiment of the present utility model is the foregoing is only, it is all at this not to limit this utility model Any modification, equivalent and improvement made within the spirit and principle of utility model etc., should be included in this utility model Protection domain within.

Claims (10)

1. the mobile phone shielding radiator structure of a kind of low thermal resistance, it is characterised in that:Including pcb board and radiator, the pcb board and institute State and formed between radiator an installation cavity, the installation intracavity is provided with radome, the radome is arranged on the pcb board On, chip is provided with the radome, the chip is arranged on the pcb board, and the radome includes top board and is connected to Side plate on the top board, offers through hole on the top board of the radome, the through hole just to the chip, the through hole It is that, more than or equal to 0.2 and less than 1, a fin covers institute comprehensively that area is the multiple scope of the top board area of the radome Through hole is stated, being sticked between the fin and the chip has the first heat conductive silica gel, between the fin and the radiator Being sticked has the second heat conductive silica gel.
2. the mobile phone shielding radiator structure of low thermal resistance according to claim 1, it is characterised in that:The radiator is metal Center or mobile phone shell or heat sink.
3. the mobile phone shielding radiator structure of low thermal resistance according to claim 1, it is characterised in that:The fin covers comprehensively Cover the through hole and extend to the whole area of the top board of the radome.
4. the mobile phone shielding radiator structure of the low thermal resistance according to any one of claim 1-3, it is characterised in that:Described first The upper surface of heat conductive silica gel flushes with the top board of the radome;First heat conductive silica gel cover the chip it is whole on Surface.
5. the mobile phone shielding radiator structure of the low thermal resistance according to any one of claim 1-3, it is characterised in that:The radiating The surface-coated of piece has electro-magnetic screen layer.
6. the mobile phone shielding radiator structure of the low thermal resistance according to any one of claim 1-3, it is characterised in that:The radiating Piece is graphite flake or for copper foil or the combination for graphite flake and copper foil;The thickness of the fin is less than the radome Thickness.
7. the mobile phone shielding radiator structure of a kind of low thermal resistance, it is characterised in that:Including pcb board, radiator and with function of shielding Buckle, the equal hollow out in two faces of the corresponding pcb board of buckle and the radiator, the radiator, the buckle, The pcb board forms an installation cavity, and the installation intracavity is provided with chip, and the chip is arranged on the pcb board, the core Heat conductive silica gel is provided between piece and the radiator.
8. the mobile phone shielding radiator structure of low thermal resistance according to claim 7, it is characterised in that:Described heat conductive silica gel one end Connect and cover the upper surface of the chip, the other end connects the radiator.
9. the mobile phone shielding radiator structure of low thermal resistance according to claim 7, it is characterised in that:The radiator is metal Center or mobile phone shell or heat sink.
10. a kind of mobile phone, it is characterised in that:Including the mobile phone shielding radiator structure of the low thermal resistance of any one of claim 1-9.
CN201621195159.4U 2016-10-28 2016-10-28 Cell -phone shielding heat radiation structure of low thermal resistance and cell -phone that has this structure Active CN206181696U (en)

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CN201621195159.4U CN206181696U (en) 2016-10-28 2016-10-28 Cell -phone shielding heat radiation structure of low thermal resistance and cell -phone that has this structure

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Application Number Priority Date Filing Date Title
CN201621195159.4U CN206181696U (en) 2016-10-28 2016-10-28 Cell -phone shielding heat radiation structure of low thermal resistance and cell -phone that has this structure

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107911521A (en) * 2017-12-21 2018-04-13 贵州大学 A kind of mobile phone shell easy to heat dissipation
CN108200752A (en) * 2018-03-05 2018-06-22 昇业科技股份有限公司 Has the radiator of EMI suppression masking structure
CN108513515A (en) * 2018-06-11 2018-09-07 Oppo广东移动通信有限公司 Housing unit and electronic device
CN109040379A (en) * 2018-09-28 2018-12-18 北京小米移动软件有限公司 Transparent mobile terminal
CN109640588A (en) * 2018-10-15 2019-04-16 华为技术有限公司 Terminal device
CN110325019A (en) * 2019-07-02 2019-10-11 华为技术有限公司 A kind of electronic equipment
CN110337230A (en) * 2019-04-23 2019-10-15 维沃移动通信有限公司 A kind of shielding case and terminal
CN111148406A (en) * 2019-12-31 2020-05-12 北京升哲科技有限公司 Heat dissipation shielding system of Internet of things base station and Internet of things base station

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107911521A (en) * 2017-12-21 2018-04-13 贵州大学 A kind of mobile phone shell easy to heat dissipation
CN108200752A (en) * 2018-03-05 2018-06-22 昇业科技股份有限公司 Has the radiator of EMI suppression masking structure
CN108513515A (en) * 2018-06-11 2018-09-07 Oppo广东移动通信有限公司 Housing unit and electronic device
CN109040379A (en) * 2018-09-28 2018-12-18 北京小米移动软件有限公司 Transparent mobile terminal
CN109640588A (en) * 2018-10-15 2019-04-16 华为技术有限公司 Terminal device
CN109640588B (en) * 2018-10-15 2020-05-29 华为技术有限公司 Terminal device
CN110337230A (en) * 2019-04-23 2019-10-15 维沃移动通信有限公司 A kind of shielding case and terminal
CN110325019A (en) * 2019-07-02 2019-10-11 华为技术有限公司 A kind of electronic equipment
CN110325019B (en) * 2019-07-02 2020-12-04 华为技术有限公司 Electronic equipment
WO2021000880A1 (en) * 2019-07-02 2021-01-07 华为技术有限公司 Electronic device
CN111148406A (en) * 2019-12-31 2020-05-12 北京升哲科技有限公司 Heat dissipation shielding system of Internet of things base station and Internet of things base station

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