CN206181696U - Cell -phone shielding heat radiation structure of low thermal resistance and cell -phone that has this structure - Google Patents
Cell -phone shielding heat radiation structure of low thermal resistance and cell -phone that has this structure Download PDFInfo
- Publication number
- CN206181696U CN206181696U CN201621195159.4U CN201621195159U CN206181696U CN 206181696 U CN206181696 U CN 206181696U CN 201621195159 U CN201621195159 U CN 201621195159U CN 206181696 U CN206181696 U CN 206181696U
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- China
- Prior art keywords
- radiator
- mobile phone
- chip
- thermal resistance
- radome
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A30/00—Adapting or protecting infrastructure or their operation
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model provides a cell -phone shielding heat radiation structure of low thermal resistance and cell -phone that has this structure, wherein cell -phone shielding heat radiation structure includes PCB board and radiator, the PCB board with form an installation cavity between the radiator, be provided with the shield cover in the installation cavity, the shield cover is installed on the PCB board, be equipped with the chip in the shield cover, install the chip is in on the PCB board, the shield cover include the roof and connect in curb plate on the roof, set up the through -hole of prescribed dimension size on the roof of shield cover, the through -hole coats and is stamped the fin, the fin with it is equipped with a series thermal silica to paste between the chip, the fin with it is equipped with the 2nd series thermal silica to paste between the radiator. The utility model discloses effectively reduce the thermal resistance of generating heat between device and the metal center, kept the blocking function of original shield cover, both promoted the radiating effect of cell -phone, still can realize the ultra -thin structure target of cell -phone.
Description
Technical field
This utility model is related to electronic product radiating technical field, more particularly to a kind of mobile phone shielding radiating knot of low thermal resistance
Structure and the mobile phone with the structure.
Background technology
At present, in existing mobile phone, it is considered to the function such as signal shielding, in the major power device such as master chip, radio-frequency devices table
Face is equipped with radome.And directly without thermal interfacial material between inside chip and screening cover, or directly air contact, or adopt
The boundary material contact of thermal conductive silicon rubber cushion, heat is generally transmitted by following path：
Heater members → radome → heat sink (metal center)
Or heater members → heat conductive silica gel → radome → heat sink (metal center)
Direct air contact between chip and screening cover, because the heat conductivity of air is very low, hinder significantly chip to
The heat transfer of metal center, increased the thermal resistance between chip and screening cover and heat dissipation metal center；Chip and screening cover it
Between fill thermal conductive silicon rubber cushion, due to the thickness requirement of thermal conductive silicon rubber cushion, general this space requirement is more than 0.2mm, increased core
Piece increases the thermal resistance between chip and heat sink material metal center the distance between to metal center.
Thermal resistance between heater members and metal center increases, and chip temperature can be caused too high, causes CPU frequency reducings, mobile phone
Outer surface is overheated, affects the overall performance and customer perception of mobile phone.
Utility model content
The purpose of this utility model is to reduce between heater members and radiator (metal center, mobile phone shell, heat sink)
Thermal resistance, on the premise of function of shielding is ensured, is more beneficial for the integral heat sink of mobile phone.
This utility model is achieved in that a kind of mobile phone shielding radiator structure of low thermal resistance, including pcb board and radiating
Body, forms an installation cavity between the pcb board and the radiator, the installation intracavity is provided with radome, the radome
On the pcb board, chip is provided with the radome, the chip is arranged on the pcb board, the radome bag
Top board and the side plate being connected on the top board are included, through hole is offered on the top board of the radome, the through hole is just to described
Chip, it is one more than or equal to 0.2 and less than 1 that the area of the through hole is the multiple scope of the top board area of the radome
Fin covers the through hole comprehensively, and being sticked between the fin and the chip has the first heat conductive silica gel, the fin
Being sticked and the radiator between has the second heat conductive silica gel.
Further, the radiator is metal center or mobile phone shell or heat sink.
Further, the fin covers the through hole and extends to the entire surface of the top board of the radome comprehensively
Product.
Further, the upper surface of first heat conductive silica gel flushes with the top board of the radome；Described first leads
Hot silica gel covers the whole upper surface of the chip.
Further, the surface-coated of the fin has electro-magnetic screen layer.
Further, the fin is graphite flake；The fin is copper foil；The fin is graphite flake Copper Foil
The combination of piece；Thickness of the thickness of the fin less than the radome.
Further, this utility model also provides another kind of implementation, a kind of mobile phone shielding radiator structure of low thermal resistance,
Including pcb board, radiator and the buckle with function of shielding, the corresponding pcb board of buckle and the radiator two
The equal hollow out in individual face, the radiator, the buckle, the pcb board form an installation cavity, and the installation intracavity is provided with chip,
The chip is arranged on the pcb board, and between the chip and the radiator heat conductive silica gel is provided with.
Further, described heat conductive silica gel one end connects the upper surface of the chip, and the other end connects the radiator.
Further, the radiator is metal center or mobile phone shell or heat sink.
Another object of the present utility model is to provide a kind of mobile phone, including the low thermal resistance handss of any one of claim 1-9
Machine shields radiator structure.
This utility model having the technical effect that relative to prior art：Due to heater members (chip) and radiator (metal
Center or mobile phone shell or heat sink) be joined directly together by heat conductive silica gel and fin and connect, effectively reduce heater members and radiator it
Between thermal resistance, enable chip produce heat Quick diffusing go out；The through hole of predefined size is opened up on radome, is remained original
The function of shielding of radome.So as to this structure evades the risk of CPU frequency reducings to reducing chip own temperature, reduces shell handss
The temperature of machine, the comfort level and perceptibility aspect that lifting client uses plays vital effect, is also capable of achieving mobile phone ultra-thin
Structural object.
Description of the drawings
Fig. 1 is the sectional structure chart of the low thermal resistance mobile phone radiator structure that this utility model embodiment one is provided.
Fig. 2 is the sectional structure chart of the low thermal resistance mobile phone radiator structure that this utility model embodiment two is provided.
Specific embodiment
In order that the purpose of this utility model, technical scheme and advantage become more apparent, below in conjunction with accompanying drawing and enforcement
Example, is further elaborated to this utility model.It should be appreciated that specific embodiment described herein is only to explain
This utility model, is not used to limit this utility model.
Before description specific embodiment, it should be noted that：If the expression of the quantity such as first, second is intended merely to difference
Dry title identical element, is not used to limit this utility model.
Embodiment one
Refer to Fig. 1, a kind of mobile phone shielding radiator structure 10 of low thermal resistance that the present embodiment is provided, including pcb board 20, work
For the metal center 30 of radiator, fin 40, radome 60, chip 50, the first heat conductive silica gel 70 and the second heat conductive silica gel
80.An installation cavity 90 is formed between the pcb board 20 and the metal center 30, radome 60 is located in the installation cavity 90 simultaneously
It is fixed on pcb board 20, the chip 50 is installed on pcb board 20 and is located in the cavity volume that radome 60 is formed with pcb board 20,
The radome 60 includes top board 61 and side plate 62, and top board 61 is just offering the through hole 611 of preliminary dimension to the position of chip 50,
Fin 40 is coated with the through hole 611.The fin 40 covers whole top board 61 to the extension of surrounding.Radiating
The first heat conductive silica gel 70 is provided between piece 40 and the chip 50, second is provided between fin 40 and metal center 30 and is led
Hot silica gel 80.
In the present embodiment, the area of the through hole be the multiple scope of the top board area of the radome be more than or equal to
0.2 and less than 1, it is possible to understand that ground, multiple can use 0.3,0.4,0.5,0.6,0.7,0.8,0.9 in this scope.
First heat conductive silica gel 70 covers the whole upper surface of chip 50 and height is flushed with the top board 61 of radome 60, not only
The heat produced by chip 50 is conducted as early as possible, and fin 40 is fully contacted with the first heat conductive silica gel 70, subtract
Few thermal contact resistance, is conducive to radiating.
The upper surface of fin 40 is right against at through hole 611 and is provided with the second heat conductive silica gel 80, the one end of the second heat conductive silica gel 80
Connection fin 40, other end connection metal center 30, so, by the second heat conductive silica gel 80, being delivered to fin 40
Heat is delivered to again on metal center 30.
Specifically, in assembling, the height of the first heat conductive silica gel 70 is equal to the height of radome 60, and metal center 30 passes through
The second heat conductive silica gel 80 is compressed, fin 40 is fully contacted with radome 60, be conducive to the transmission of heat；The opposing party
Face makes fin 40 be fixed between the heat conductive silica gel 80 of radome 60 and second.The heat transfer that euthermic chip 50 is produced is to first
Heat conductive silica gel 70, then fin 40 is passed to by the first heat conductive silica gel 70.Fin 40 is from the thermal conductive silicon of radome 60 and first
The heat that glue 70 is absorbed uniformly is opened, then is delivered to the second heat conductive silica gel 80, is finally delivered to metal by the second heat conductive silica gel 80
Center 30, this process carries out heat transfer not over air, so significantly reducing between chip 50 and metal center 30
Thermal resistance.
Material used by fin 40 is the compositionss of graphite, Copper Foil or graphite and Copper Foil, and the thickness of fin is less than
The thickness of radome.Heat conductive silica gel can also be replaced with other Heat Conduction Materials, such as heat conduction mud.
In order to reach reasonable shield effectiveness, it is coated with electro-magnetic screen layer on the surface of fin 40 and (does not mark in figure
Show).Specifically, can be according to the intensity of internal electromagnetic radiation, by techniques such as PVD (physical vapour deposition (PVD)), in fin 40
Plated surface on desired thickness electro-magnetic screen layer, electro-magnetic screen layer for heat conduction metal material so that fin 40 have leads
Heat and the effect of shielding.Thermal resistance can be so reduced, shield effectiveness is can guarantee that again.
Multiple chips 50 can be set in the cavity volume that radome 60 is formed with pcb board 20, radome 60 is just to each chip
50 upper end opens up through hole 611.Multiple radomes 60 can also be arranged on pcb board 20 to be applied in combination.The shape of radome 60
Shape can be the other shapes such as hemisphere.
The present embodiment additionally provides a kind of mobile phone that radiator structure is shielded with low thermal resistance as above, and the mobile phone is lighter
Thin, shielding radiating effect is good, long service life, low production cost.
Embodiment two
Refer to Fig. 2, the present embodiment again there is provided a kind of mobile phone shielding radiator structure 11 of low thermal resistance, including pcb board 20,
Metal center 30, buckle 60 as radiator, chip 50, heat conductive silica gel 70.The opposing metallic of buckle 60 with function of shielding
The equal hollow out in two faces of center 30 and pcb board, metal center 30 and pcb board 20 are arranged on two hollow out faces of buckle 60.Institute
State metal center 30, the buckle 60, the pcb board 20 and form an installation cavity 90, the installation intracavity 90 is provided with chip 50,
The chip 50 is arranged on the pcb board 20, and between the chip 50 and the metal center 30 heat conductive silica gel 70 is provided with.
This utility model enables the heat that chip 50 is produced quickly to be delivered on metal center 30 by heat conductive silica gel 70, from
And reduce the thermal resistance between chip 50 and metal center 30.Because buckle 60 has function of shielding, so as to remain original screen
Cover the function of shielding of cover.Thermal resistance can be so reduced, shield effectiveness is can guarantee that again.
Specifically, in assembling, one end of heat conductive silica gel 70 is connected to the upper surface of chip 50 and covers whole upper surface,
Other end connection metal center 30, the heat that such chip 50 is produced can quickly be delivered to metal center along heat conductive silica gel 70
On 30, so as to distribute.Due to this process not by air carrying out the transmission of heat, so significantly reducing heat generating core
Thermal resistance between piece 50 and metal center 30.There was only heat conductive silica gel 70 between chip 50 and metal center 30, significantly save
The fin of mobile phone and the thickness space of screening cover, realization of this kind of scheme to ultra thin handset also has larger contribution function
Preferably, metal center 30 can be other heat sink, such as mobile phone shell.Heat conductive silica gel can also lead for other
Hot material, such as heat conduction mud.The material of buckle 60 is preferably plastics, it is also possible to the material with function of shielding such as metal.
Multiple chips 50 can be set in installation cavity 90, the upper surface of multiple chips 50 is by heat conductive silica gel 70 and gold
Category center 30 is joined directly together and connects.Can also multiple installation cavitys 90 be applied in combination.
The present embodiment additionally provides a kind of mobile phone that radiator structure is shielded with low thermal resistance as above, and the mobile phone is lighter
Thin, shielding radiating effect is good, long service life, low production cost.
Preferred embodiment of the present utility model is the foregoing is only, it is all at this not to limit this utility model
Any modification, equivalent and improvement made within the spirit and principle of utility model etc., should be included in this utility model
Protection domain within.
Claims (10)
1. the mobile phone shielding radiator structure of a kind of low thermal resistance, it is characterised in that：Including pcb board and radiator, the pcb board and institute
State and formed between radiator an installation cavity, the installation intracavity is provided with radome, the radome is arranged on the pcb board
On, chip is provided with the radome, the chip is arranged on the pcb board, and the radome includes top board and is connected to
Side plate on the top board, offers through hole on the top board of the radome, the through hole just to the chip, the through hole
It is that, more than or equal to 0.2 and less than 1, a fin covers institute comprehensively that area is the multiple scope of the top board area of the radome
Through hole is stated, being sticked between the fin and the chip has the first heat conductive silica gel, between the fin and the radiator
Being sticked has the second heat conductive silica gel.
2. the mobile phone shielding radiator structure of low thermal resistance according to claim 1, it is characterised in that：The radiator is metal
Center or mobile phone shell or heat sink.
3. the mobile phone shielding radiator structure of low thermal resistance according to claim 1, it is characterised in that：The fin covers comprehensively
Cover the through hole and extend to the whole area of the top board of the radome.
4. the mobile phone shielding radiator structure of the low thermal resistance according to any one of claim 1-3, it is characterised in that：Described first
The upper surface of heat conductive silica gel flushes with the top board of the radome；First heat conductive silica gel cover the chip it is whole on
Surface.
5. the mobile phone shielding radiator structure of the low thermal resistance according to any one of claim 1-3, it is characterised in that：The radiating
The surface-coated of piece has electro-magnetic screen layer.
6. the mobile phone shielding radiator structure of the low thermal resistance according to any one of claim 1-3, it is characterised in that：The radiating
Piece is graphite flake or for copper foil or the combination for graphite flake and copper foil；The thickness of the fin is less than the radome
Thickness.
7. the mobile phone shielding radiator structure of a kind of low thermal resistance, it is characterised in that：Including pcb board, radiator and with function of shielding
Buckle, the equal hollow out in two faces of the corresponding pcb board of buckle and the radiator, the radiator, the buckle,
The pcb board forms an installation cavity, and the installation intracavity is provided with chip, and the chip is arranged on the pcb board, the core
Heat conductive silica gel is provided between piece and the radiator.
8. the mobile phone shielding radiator structure of low thermal resistance according to claim 7, it is characterised in that：Described heat conductive silica gel one end
Connect and cover the upper surface of the chip, the other end connects the radiator.
9. the mobile phone shielding radiator structure of low thermal resistance according to claim 7, it is characterised in that：The radiator is metal
Center or mobile phone shell or heat sink.
10. a kind of mobile phone, it is characterised in that：Including the mobile phone shielding radiator structure of the low thermal resistance of any one of claim 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621195159.4U CN206181696U (en) | 2016-10-28 | 2016-10-28 | Cell -phone shielding heat radiation structure of low thermal resistance and cell -phone that has this structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621195159.4U CN206181696U (en) | 2016-10-28 | 2016-10-28 | Cell -phone shielding heat radiation structure of low thermal resistance and cell -phone that has this structure |
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| Publication Number | Publication Date |
|---|---|
| CN206181696U true CN206181696U (en) | 2017-05-17 |
Family
ID=58682104
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621195159.4U Active CN206181696U (en) | 2016-10-28 | 2016-10-28 | Cell -phone shielding heat radiation structure of low thermal resistance and cell -phone that has this structure |
Country Status (1)
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107172872A (en) * | 2017-06-26 | 2017-09-15 | 上海传英信息技术有限公司 | The heat abstractor and electric terminal of electric terminal |
| CN107295782A (en) * | 2017-07-05 | 2017-10-24 | 华勤通讯技术有限公司 | The structure and terminal of a kind of silicagel pad suitable for terminal |
| CN107911521A (en) * | 2017-12-21 | 2018-04-13 | 贵州大学 | A kind of mobile phone shell easy to heat dissipation |
| CN108200752A (en) * | 2018-03-05 | 2018-06-22 | 昇业科技股份有限公司 | Has the radiator of EMI suppression masking structure |
| CN108513515A (en) * | 2018-06-11 | 2018-09-07 | Oppo广东移动通信有限公司 | Housing unit and electronic device |
| CN108762451A (en) * | 2018-07-10 | 2018-11-06 | 深圳市优必选科技有限公司 | Heat radiation structure of CPU |
| CN109040379A (en) * | 2018-09-28 | 2018-12-18 | 北京小米移动软件有限公司 | Transparent mobile terminal |
| CN109640588A (en) * | 2018-10-15 | 2019-04-16 | 华为技术有限公司 | Terminal device |
| CN109936971A (en) * | 2019-04-18 | 2019-06-25 | 成都智明达电子股份有限公司 | It is a kind of for reducing the method for thermal contact resistance, structure and component heat dissipation equipment |
| CN110325019A (en) * | 2019-07-02 | 2019-10-11 | 华为技术有限公司 | A kind of electronic equipment |
| CN110337230A (en) * | 2019-04-23 | 2019-10-15 | 维沃移动通信有限公司 | A kind of shielding case and terminal |
| CN111148406A (en) * | 2019-12-31 | 2020-05-12 | 北京升哲科技有限公司 | Heat dissipation shielding system of Internet of things base station and Internet of things base station |
| CN111937135A (en) * | 2018-04-04 | 2020-11-13 | 迪睿合电子材料有限公司 | Semiconductor device with a plurality of semiconductor chips |
| CN112236857A (en) * | 2018-06-21 | 2021-01-15 | 迪睿合电子材料有限公司 | Semiconductor device and method for manufacturing semiconductor device |
| CN113923966A (en) * | 2021-10-20 | 2022-01-11 | Oppo广东移动通信有限公司 | Circuit board assembly and electronic equipment |
| CN114206090A (en) * | 2021-11-30 | 2022-03-18 | 四川天邑康和通信股份有限公司 | Method capable of effectively solving mutual winding of PON/all-optical gateway heating and shielding signals |
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| CN107172872A (en) * | 2017-06-26 | 2017-09-15 | 上海传英信息技术有限公司 | The heat abstractor and electric terminal of electric terminal |
| CN107295782B (en) * | 2017-07-05 | 2024-02-23 | 华勤技术股份有限公司 | Silica gel pad structure suitable for terminal and terminal |
| CN107295782A (en) * | 2017-07-05 | 2017-10-24 | 华勤通讯技术有限公司 | The structure and terminal of a kind of silicagel pad suitable for terminal |
| CN107911521A (en) * | 2017-12-21 | 2018-04-13 | 贵州大学 | A kind of mobile phone shell easy to heat dissipation |
| CN108200752A (en) * | 2018-03-05 | 2018-06-22 | 昇业科技股份有限公司 | Has the radiator of EMI suppression masking structure |
| CN111937135A (en) * | 2018-04-04 | 2020-11-13 | 迪睿合电子材料有限公司 | Semiconductor device with a plurality of semiconductor chips |
| CN108513515A (en) * | 2018-06-11 | 2018-09-07 | Oppo广东移动通信有限公司 | Housing unit and electronic device |
| CN112236857A (en) * | 2018-06-21 | 2021-01-15 | 迪睿合电子材料有限公司 | Semiconductor device and method for manufacturing semiconductor device |
| CN108762451A (en) * | 2018-07-10 | 2018-11-06 | 深圳市优必选科技有限公司 | Heat radiation structure of CPU |
| CN109040379A (en) * | 2018-09-28 | 2018-12-18 | 北京小米移动软件有限公司 | Transparent mobile terminal |
| CN109640588A (en) * | 2018-10-15 | 2019-04-16 | 华为技术有限公司 | Terminal device |
| CN109640588B (en) * | 2018-10-15 | 2020-05-29 | 华为技术有限公司 | Terminal device |
| CN109936971A (en) * | 2019-04-18 | 2019-06-25 | 成都智明达电子股份有限公司 | It is a kind of for reducing the method for thermal contact resistance, structure and component heat dissipation equipment |
| CN110337230A (en) * | 2019-04-23 | 2019-10-15 | 维沃移动通信有限公司 | A kind of shielding case and terminal |
| WO2021000880A1 (en) * | 2019-07-02 | 2021-01-07 | 华为技术有限公司 | Electronic device |
| CN110325019B (en) * | 2019-07-02 | 2020-12-04 | 华为技术有限公司 | Electronic equipment |
| CN110325019A (en) * | 2019-07-02 | 2019-10-11 | 华为技术有限公司 | A kind of electronic equipment |
| CN111148406A (en) * | 2019-12-31 | 2020-05-12 | 北京升哲科技有限公司 | Heat dissipation shielding system of Internet of things base station and Internet of things base station |
| CN113923966A (en) * | 2021-10-20 | 2022-01-11 | Oppo广东移动通信有限公司 | Circuit board assembly and electronic equipment |
| CN114206090A (en) * | 2021-11-30 | 2022-03-18 | 四川天邑康和通信股份有限公司 | Method capable of effectively solving mutual winding of PON/all-optical gateway heating and shielding signals |
| CN114206090B (en) * | 2021-11-30 | 2024-04-16 | 四川天邑康和通信股份有限公司 | Method capable of effectively solving mutual winding of PON/all-optical gateway heating and shielding signals |
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