CN109040379A - Transparent mobile terminal - Google Patents
Transparent mobile terminal Download PDFInfo
- Publication number
- CN109040379A CN109040379A CN201811142943.2A CN201811142943A CN109040379A CN 109040379 A CN109040379 A CN 109040379A CN 201811142943 A CN201811142943 A CN 201811142943A CN 109040379 A CN109040379 A CN 109040379A
- Authority
- CN
- China
- Prior art keywords
- transparent
- circuit
- main board
- mobile terminal
- circuit main
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
Abstract
The disclosure is directed to a kind of transparent mobile terminals, belong to technical field of mobile terminals.The transparent mobile terminal includes shell, the intracorporal circuit main board of the shell, the circuit structure being arranged on the circuit main board is arranged in and is embedded screen on the housing；The shell includes center and transparent rear shell；The circuit main board has towards the back side of the transparent rear shell, at least part of the circuit structure is arranged on the back side of the circuit main board, the back side of the circuit main board is provided with Transparent shielding cover, and at least part positioned at the circuit structure at the back side of the circuit main board is located in the Transparent shielding cover；Heating column is provided between the back side of the circuit main board and the transparent rear shell.
Description
Technical field
This disclosure relates to field of mobile terminals more particularly to a kind of transparent mobile terminal.
Background technique
With the development of electronic equipment, the development of mobile terminal technology is also increasingly accelerated.Transparent mobile terminal is to move at present
One direction of dynamic terminal development.Transparent mobile terminal refers to that design has a mobile terminal of transparent rear shell, and user is by after transparent
Shell can see mobile terminal internal structure.
Currently, the back side of circuit main board is provided with circuit structure in transparent mobile terminal, then pass through setting metallic shield
Layer carries out signal shielding and the heat dissipation of circuit structure.One layer of carving is provided on the metal screen layer of transparent mobile terminal again
The circuit pattern come is carved, the circuit part that user sees from transparent rear shell is really the circuit pattern carved.
Circuit pattern of this transparent mobile terminal due to needing to be arranged engraving, leads to the thickness of entire transparent mobile terminal
All become larger with weight.
Summary of the invention
The disclosure provides a kind of transparent mobile terminal, and the original circuit of mobile terminal can be exposed from transparent rear shell.
According to the first aspect of the embodiments of the present disclosure, a kind of transparent mobile terminal is provided, the transparent mobile terminal includes
Shell is arranged in the intracorporal circuit main board of the shell, the circuit structure being arranged on the circuit main board and is embedded in the shell
Screen on body；The shell includes center and transparent rear shell；The circuit main board has towards the back side of the transparent rear shell,
At least part of the circuit structure is arranged on the back side of the circuit main board, and the back side of the circuit main board is provided with
Bright shielding case, at least part positioned at the circuit structure at the back side of the circuit main board are located at the Transparent shielding cover
It is interior；Heating column is provided between the back side of the circuit main board and the transparent rear shell.
The embodiment of the present disclosure, by the way that at least part circuit structure to be arranged in the back side of circuit main board, after transparent
Shell shows the back side and at least part circuit structure of the circuit main board, and then guarantees that the transparent mobile terminal shows really
Internal circuit.Meanwhile being located in Transparent shielding cover positioned at least part of the circuit structure at the back side of circuit main board, thus real
Now to the shielding of the interference signal between circuit structure and outside mobile terminal.The back side of circuit main board and transparent rear shell it
Between be provided with heating column, the heat that the circuit structure on circuit main board generates is transmitted in transparent rear shell, to guarantee entire
The heat dissipation of circuit main board.By above-mentioned shielding and heat dissipation design, guarantee can show real internal circuit by transparent rear shell,
It is not necessary that the circuit pattern of engraving is additionally arranged, the thickness and weight of entire transparent mobile terminal are alleviated.
In a kind of implementation of the disclosure, the Transparent shielding cover includes: the back side that the circuit main board is arranged in
Bracket and fitting Transparent shielding film on the bracket.
In this implementation, Transparent shielding cover is made of bracket and Transparent shielding film two parts, Transparent shielding film
It is fitted on bracket and forms shielding case, realize the function of signal shielding.
In a kind of implementation of the disclosure, the Transparent shielding film is carbon nano-fiber thin film, carbon nano-fiber
Film not only can guarantee the transparent effect of shielding case, but also can play good shielding action.
In a kind of implementation of the disclosure, the circuit structure positioned at the back side of the circuit main board includes processing
Device, the processor are located in the Transparent shielding cover.
In this implementation, processor is arranged in the back side of circuit main board, since processor is mobile terminal internal medicine
The highest component of skill content, so designing the technology sense that can be improved transparent mobile terminal in this way.Meanwhile processor being arranged
In Transparent shielding cover, thus the signal interference between shielding processing device and other circuits.
In a kind of implementation of the disclosure, the heating column between the processor and the transparent rear shell,
And the heating column passes through the Transparent shielding cover.
Since processor is the maximum component of calorific value in circuit structure, so by heating column setting in processor and thoroughly
Between bright rear shell, heat dissipation can be better achieved.
In a kind of implementation of the disclosure, the circuit structure further includes Common Flash Memory, power management chip, radio frequency
Circuit and clock circuit, at least one of the Common Flash Memory, power management chip, radio circuit and clock circuit position
In the back side of the circuit main board.
In this implementation, circuit main board the back side setting Common Flash Memory, power management chip, radio circuit and
On the one hand at least one of clock circuit can guarantee the beauty of the transparent side of mobile terminal, on the other hand can guarantee to lead to
Cross scientific and technological content possessed by the part that transparent rear shell is exposed.
In a kind of implementation of the disclosure, the power management chip is located at the back side of the circuit main board, described
The back side of circuit main board is provided with multiple Transparent shielding covers, and the power management chip and the processor are located at
In the different Transparent shielding covers.
In this implementation, power management chip can also generate noise jamming radio frequency electrical due to will receive external interference
Road, so needing to carry out signal shielding using shielding case；Meanwhile in order to avoid the signal between processor and power management chip
Interference, processor and power management chip is arranged in different shielding cases.
In a kind of implementation of the disclosure, the power management chip includes the radio frequency powered to the radio circuit
Power management chip and the sensor power supply management chip powered to sensor.
In this implementation, circuit main board is arranged in radio-frequency power supply managing chip and sensor power supply management chip
The back side can embody the scientific and technological content of transparent mobile terminal.In addition, radio-frequency power supply managing chip and sensor power supply management core
Piece calorific value is smaller, even if the back side of circuit main board is arranged in, is also able to satisfy radio-frequency power supply managing chip and probe power pipe
Manage demand of the chip to heat dissipation performance.
In a kind of implementation of the disclosure, the surrounding of the power management chip, which is provided with, surrounds the power management
The ground wire of chip.
In the embodiments of the present disclosure, by shielding case both interference of the maskable external signal to power management chip, also can
Interference of the shielded power supply managing chip to radiofrequency signal, realizes shielding macroscopically.In the surrounding of power management chip, packet is set
The ground wire of power management chip is enclosed, realizes the processing of packet ground, by wrapping handles the electricity to the power management chip on circuit main board
Interference between road and other circuits is shielded, and realizes the shielding on microcosmic.
In a kind of implementation of the disclosure, the power management chip includes multiple power capacities, the multiple function
Rate capacitor uses π word-lifting formula.
In this implementation, multiple power capacities use π word-lifting formula, such power capacity from vibration when
Wait, each not in the same direction due to power capacity, will not aggravate seismaesthesia in a certain direction on propagation, but meeting
It cancels out each other, to eliminate the noise that power capacity plate shake phenomenon generates.
In a kind of implementation of the disclosure, the power management chip includes multiple inductance, the multiple inductance quilt
It is configured to be formed for offsetting positive magnetic field, the front magnetic field is that the inductance of the front setting of the circuit main board is formed
Magnetic field, the front of the circuit main board is one side of the circuit main board towards the screen.
In this implementation, when putting multiple inductance at the circuit main board back side, judged according to the flow direction of electric current each
The direction of inductance leakage field is put in the way of then capable of offsetting positive magnetic field by the magnetic field of generation, to make each inductance
The magnetic field that is formed of the inductance that is arranged of leakage field and circuit main board front cancel out each other, to reduce interference.
In a kind of implementation of the disclosure, the surrounding of the clock circuit is provided with the ground for surrounding the clock circuit
Line.
In this implementation, by wrap handle to the interference between the clock circuit and other circuits on circuit main board into
Row shielding.
In a kind of implementation of the disclosure, connector interface is provided on the center, the connector interface
Exit is arranged at intervals with dry foam, and short-circuit protection circuit, the both ends of the dry foam are provided on the circuit main board
It is arranged with two terminal intervals of the short-circuit protection circuit, the outlet of the connector interface is the connector interface direction
Described circuit main board one end.
In this implementation, by connector interface place one piece of dry foam, dry foam both ends with it is short
Two terminal intervals setting of circuit is protected on road, will be expanded after dry foam water suction, by water conduction, to make short-circuit protection
Circuit is connected, and the power supply of transparent mobile terminal is turned off, and realizes protection.In addition, due to the absorbent function of dry foam, additionally it is possible to keep away
Exempt from the inside that water enters transparent mobile terminal from connector interface.
In a kind of implementation of the disclosure, a terminal of the short-circuit protection circuit connects the power management core
Piece, another terminal ground of the short-circuit protection circuit.
In this implementation, another by the way that a terminal of short-circuit protection circuit will be protected to connect power management chip
A terminal ground so that power management chip can perceive whether the circuit is connected, and then carries out short-circuit protection.
In a kind of implementation of the disclosure, the heating column is copper or silvery heating column, the heat-conducting effect of copper or silver
It is good, so being suitable as the material of disclosure heating column.
In a kind of implementation of the disclosure, heat conductive pad is provided between the heating column and the circuit main board.
In this implementation, heat conductive pad is set between heating column and circuit main board, the stress of metal is prevented to be applied to
Lead to circuit main board Physical Damage on circuit main board, plays the effect of protection circuit main board.
In a kind of implementation of the disclosure, the transparent rear shell is led towards being provided on one side for the circuit main board
Heated filament, the heat conductive filament connect the heating column and the center.
In this implementation, increase heat conductive filament between heating column and center, as heating column in transparent rear shell
Extend, so that the heat that circuit main board is transmitted out reaches center.
In a kind of implementation of the disclosure, the transparent rear shell includes the transparent rear shell of internal layer and the transparent rear shell of outer layer,
Vacuum heat-insulation cavity is formed between the transparent rear shell of the internal layer and the transparent rear shell of outer layer.
In this implementation, using Double-layered transparent rear shell design, and between internal layer and outer layer be vacuum, realize every
Heat.
It in a kind of implementation of the disclosure, is had the gap on the shell, the gap is sealed by fruit juice gel.
In this implementation, it using fruit juice gel at gap, is used as sealing.Fruit juice gel, which is affected by temperature, compares use
It is small, and leakproofness is relatively good.
It should be understood that above general description and following detailed description be only it is exemplary and explanatory, not
The disclosure can be limited.
Detailed description of the invention
The drawings herein are incorporated into the specification and forms part of this specification, and shows the implementation for meeting the disclosure
Example, and together with specification for explaining the principles of this disclosure.
Fig. 1 is a kind of positive structure schematic of transparent mobile terminal shown according to an exemplary embodiment；
Fig. 2 is the side structure schematic diagram of transparent mobile terminal shown in FIG. 1；
Fig. 3 is the structure schematic diagram of transparent mobile terminal shown in FIG. 1；
Fig. 4 is the partial schematic diagram of transparent mobile terminal shown in FIG. 1；
Fig. 5 is a kind of circuit block diagram of transparent mobile terminal shown according to an exemplary embodiment；
Fig. 6 is the structure schematic diagram of the transparent mobile terminal of another kind shown according to an exemplary embodiment；
Fig. 7 is a kind of open-circuit condition of the short-circuit protection circuit of transparent mobile terminal shown according to an exemplary embodiment
Schematic diagram；
Fig. 8 is a kind of short-circuit condition of the short-circuit protection circuit of transparent mobile terminal shown according to an exemplary embodiment
Schematic diagram.
Specific embodiment
Example embodiments are described in detail here, and the example is illustrated in the accompanying drawings.Following description is related to
When attached drawing, unless otherwise indicated, the same numbers in different drawings indicate the same or similar elements.Following exemplary embodiment
Described in embodiment do not represent all implementations consistent with this disclosure.On the contrary, they be only with it is such as appended
The example of the consistent device and method of some aspects be described in detail in claims, the disclosure.
Fig. 1 is a kind of positive structure schematic of transparent mobile terminal shown according to an exemplary embodiment.Such as Fig. 1 institute
Show, transparent mobile terminal includes shell 100 and the screen 400 that is embedded on shell 100.Fig. 2 is shown in FIG. 1 transparent mobile whole
The side structure schematic diagram at end.Referring to fig. 2, shell 100 includes center 101 and transparent rear shell 102, and the transparent lid of rear shell 102 closes
On center 101, screen 400 is embedded on center 101.Here, transparent rear shell 102, center 100 and 400 thread of screen constitute one
A box-like structure.Screen 400 is embedded to be referred on center 101, and the edge of screen 400 is fixed on center 101.Fig. 3 is Fig. 1 institute
The structure schematic diagram of the transparent mobile terminal shown.As shown in figure 3, transparent mobile terminal further includes being arranged in shell 100
Circuit main board 200, the circuit structure 300 that is arranged on circuit main board 200.
As shown in figure 3, circuit main board 200 has towards the back side (bottom) of transparent rear shell 102, circuit structure 300
At least part is arranged on the back side of circuit main board 200, and the back side of circuit main board 200 is provided with Transparent shielding cover 500, is located at
At least part of the circuit structure 300 at the back side of circuit main board 200 is located in Transparent shielding cover 500.Fig. 4 is shown in FIG. 1
The partial schematic diagram of transparent mobile terminal.Referring to Fig. 3 and Fig. 4, it is arranged between the back side of circuit main board 200 and transparent rear shell 102
There is heating column 600.
Wherein, which can be transparent mobile phone.
The embodiment of the present disclosure, by the way that at least part circuit structure to be arranged in the back side of circuit main board, after transparent
Shell shows the back side and at least part circuit structure of the circuit main board, and then guarantees that the transparent mobile terminal shows really
Internal circuit.Meanwhile being located in Transparent shielding cover positioned at least part of the circuit structure at the back side of circuit main board, thus real
Now to the shielding of the interference signal between circuit structure and outside mobile terminal.The back side of circuit main board and transparent rear shell it
Between be provided with heating column, the heat that the circuit structure on circuit main board generates is transmitted in transparent rear shell, to guarantee entire
The heat dissipation of circuit main board.By above-mentioned shielding and heat dissipation design, guarantee can show real internal circuit by transparent rear shell,
It is not necessary that the circuit pattern of engraving is additionally arranged, the thickness and weight of entire transparent mobile terminal are alleviated.
As shown in figure 3, be located at circuit main board 200 the back side circuit structure 300 include processor 301, processor 301
In in Transparent shielding cover 500.
In this implementation, processor is arranged in the back side of circuit main board, since processor is mobile terminal internal medicine
The highest component of skill content, so designing the technology sense that can be improved transparent mobile terminal in this way.Meanwhile processor being arranged
In Transparent shielding cover, thus the signal interference between shielding processing device and other circuits.
In the embodiments of the present disclosure, processor can be central processing unit (Central Processing Unit, CPU).
Further, heating column 600 is between processor 301 and transparent rear shell 102, and heating column 600 is across transparent
Shielding case 500.Since processor is the maximum component of calorific value in circuit structure, thus by heating column setting in processor and
Between transparent rear shell, heat dissipation can be better achieved.
As shown in figure 3, be additionally provided with camera (Camera) 700 in transparent rear shell 102, the design of camera 700 and often
It is similar to advise mobile terminal, is not described herein.
In the embodiments of the present disclosure, by being divided again the component in the circuit structure 300 on circuit main board 200
Match, component with high content of technology is distributed in the back side of circuit main board 200, consequently facilitating user watches.
In the embodiments of the present disclosure, it is had the gap on shell 100, gap is sealed by fruit juice gel.As shown in figure 3, camera
There is gap 112, which is sealed by fruit juice gel between 700 and transparent rear shell 102.
The main path that dust enters mobile terminal is switch key, universal serial bus (Universal Serial
Bus, USB) gap between components and shell such as interface, earpiece and camera, dust enters mobile terminal in order to prevent, and
Lead to have the phenomenon that dust as viewed from transparent rear shell, specially treated is done to these gaps.Usual mobile terminal wants these gaps
It is not processed or is blocked with rubber mat, but these schemes can not all accomplish to be absolutely sealed.In order to guarantee sealing effect, this Shen
It please be sealed at gap using fruit juice gel, fruit juice gel, which is affected by temperature, to be compared using small, and leakproofness is relatively good, avoids
Dust enters mobile terminal from above-mentioned gap.
Wherein, fruit juice gel is a kind of novel environment-friendly adhesive, and main component is industrial gelatine.
As shown in Figure 3 and Figure 4, Transparent shielding cover 500 includes: the bracket 501 and patch that the back side of circuit main board 200 is arranged in
Close the Transparent shielding film 502 on bracket 501.
In this implementation, Transparent shielding cover is made of bracket and Transparent shielding film two parts, Transparent shielding film
It is fitted on bracket and forms shielding case, realize the function of signal shielding.
When making Transparent shielding cover 500, first by the assembly of heating column 600 between circuit main board 200 and transparent rear shell 102,
Then bracket 501 is set in 200 surrounding of circuit main board.Transparent shielding film 502 is fitted to the side and top of bracket 501 again
On；In the position that heating column 600 passes through, Transparent shielding film 502 fits on heating column 600 simultaneously.In order to guarantee sealing effect
Fruit can also use laser welding in Transparent shielding film 502 and 600 contact position of heating column, in Transparent shielding film 502 and branch
501 contact position of frame uses laser welding.Illustratively, film thawing is made to stick heating column using Laser welding technology of plastics heating
600 and bracket 501.
As shown in Figure 3 and Figure 4, bracket 501 may include the metal column of multiple arrangements that form a circle, consequently facilitating transparent screen
Cover the fitting of film 502.In other implementations, bracket 501 or an integral structure, for example, one netted
Supporting structure.
Further, which can connect with the earthed circuit of circuit main board 200, so that interference signal be imported
Ground.
In the embodiments of the present disclosure, Transparent shielding film 502 is transparent anti-Electro Magnetic Compatibility (Electro Magnetic
Compatibility, EMC) film.Further, Transparent shielding film 502 is carbon nano-fiber thin film.Utilize Nano carbon fibers
Conductive ion in film made of tieing up masks extraneous interference source, and the metal column that interference source directly passes through shielding case is led
Enter to ground, not only can guarantee the transparent effect of shielding case, but also good shielding action can be played.
In the embodiments of the present disclosure, heating column 600 is copper or silvery heating column, the good heat conduction effect of copper or silver, so suitable
Cooperation is the material of disclosure heating column.Copper or silvery heating column 600 and transparent rear shell 102 are inlayed together, after transparent
Shell 102 transfers heat to center 101, plays heat transfer process.
Referring to fig. 4, heat conductive pad 601 is provided between heating column 600 and circuit main board 200.
In this implementation, heat conductive pad is set between heating column and circuit main board, the stress of metal is prevented to be applied to
Lead to circuit main board Physical Damage on circuit main board, plays the effect of protection circuit main board.
Further, heat conductive pad 601 is arranged between heating column 600 and processor 301, is further able to prevent metal
Stress is applied on processor 301 and leads to 301 Physical Damage of processor, plays the effect of protection processor 301.
In the embodiments of the present disclosure, heat conductive pad 601 can be heat conductive silica gel material or other flexibilities with heating conduction
Material is made.
Referring to fig. 4, transparent rear shell 102 includes the transparent rear shell 121 of internal layer and the transparent rear shell 122 of outer layer, the transparent rear shell of internal layer
Vacuum heat-insulation cavity 123 is formed between 121 and the transparent rear shell 122 of outer layer.Using Double-layered transparent rear shell design, and internal layer with
It is vacuum between outer layer, realizes heat-insulated.
Fig. 5 is a kind of circuit block diagram of transparent mobile terminal shown according to an exemplary embodiment.Referring to Fig. 5, circuit
Structure 300 further includes Common Flash Memory 302, power management chip 303, radio circuit 304 other than including aforementioned processor 301
And clock circuit 305, in Common Flash Memory 302, power management chip 303, radio circuit 304 and clock circuit 305 extremely
Few one is located at the back side of circuit main board 200.
In this implementation, circuit main board the back side setting Common Flash Memory, power management chip, radio circuit and
On the one hand at least one of clock circuit can guarantee the beauty of the transparent side of mobile terminal, on the other hand can guarantee to lead to
Cross scientific and technological content possessed by the part that transparent rear shell is exposed.
In the embodiments of the present disclosure, power management chip 303 is located at the back side of circuit main board 200, the back of circuit main board 200
Face is provided with multiple Transparent shielding covers 500, and power management chip 303 and processor 301 are located at different Transparent shieldings
In cover 500.
In this implementation, power management chip can also generate noise jamming radio frequency electrical due to will receive external interference
Road, so needing to carry out signal shielding using shielding case；Meanwhile in order to avoid the signal between processor and power management chip
Interference, processor and power management chip is arranged in different shielding cases.
In other implementations of the embodiment of the present disclosure, aforementioned heating column 600 can also be located at circuit structure 300 except place
Manage the other component outside device 301 and between transparent rear shell 102, for example, positioned at power management chip 303 and transparent rear shell 102 it
Between.
In the terminal, such as in mobile phone, four power management chips 303 are generally included on circuit main board 200, this four
A power management chip 303 be respectively charging management chip, to processor power main power source managing chip, give radio circuit supply
The radio-frequency power supply managing chip of electricity and the sensor power supply management chip powered to sensor.
Power management chip when in use, can generate heat.Wherein, as long as the booting operation of main power source managing chip will produce
Heat amount, calorific value are maximum.Charging management chip only can just generate heat in charging, and radio-frequency power supply managing chip only exists
Fever when making a phone call, the two belong to triggering fever of having ready conditions.The calorific value of sensor power supply management chip is minimum.Circuit main board
200 front (top) is directed towards screen 400, has metal screen layer, while by heat-conducting glue the gold of chip and the screen back side
Belong to shielded layer to connect together, helps to radiate.Therefore, it generates heat serious power management chip and charging management chip can be set
In the front of circuit main board 200, radio-frequency power supply managing chip and sensor power supply management chip be can be set in circuit main board 200
The back side.
Radio-frequency power supply managing chip and sensor power supply management chip are arranged in the back side of circuit main board 200, Neng Gouti
Reveal the scientific and technological content of transparent mobile terminal.In addition, radio-frequency power supply managing chip and the calorific value of sensor power supply management chip compared with
It is small, even if the back side of circuit main board 200 is arranged in, also it is able to satisfy radio-frequency power supply managing chip and sensor power supply management chip pair
The demand of heat dissipation performance.
In the embodiments of the present disclosure, the surrounding of power management chip 303 is using the processing design of packet ground, i.e. power management chip
303 surrounding is provided with the ground wire for surrounding power management chip 303.
In the embodiments of the present disclosure, by shielding case both interference of the maskable external signal to power management chip, also can
Interference of the shielded power supply managing chip to radiofrequency signal, realizes shielding macroscopically.In the surrounding of power management chip, packet is set
The ground wire of power management chip is enclosed, realizes the processing of packet ground, by wrapping handles the electricity to the power management chip on circuit main board
Interference between road and other circuits is shielded, and realizes the shielding on microcosmic.
Power management chip 303 generallys use Buck conversion circuit (Buck circuit) design, and Buck circuit includes metal
Oxide semiconductor field effect transistor (Metal Oxide Semiconductor, MOS), multiple power capacities and multiple electricity
Sense.Power management chip 303 is stored and is released energy by inductance, has noise (Noise) generation.Can both it be shielded by shielding case
Cover interference of the external signal to power management chip 303, also can interference of the shielded power supply managing chip 303 to radiofrequency signal, it is real
Now shielding macroscopically.By signal wire in the setting ground wire up and down of power management chip 303, power management chip is surrounded
303, realization shields the interference between the circuit and other circuits of power management chip 303, realizes the shielding on microcosmic.
In the embodiments of the present disclosure, multiple power capacities of power management chip 303 use π word-lifting formula.
In this implementation, power capacity is ceramic condenser, and ceramic condenser is arranged on circuit main board, in ripple current
When flowing through, since charge hits meeting so that faint vibration occurs between ceramic condenser and circuit main board, generates plate and shake phenomenon.Multiple function
Rate capacitor uses π word-lifting formula, when such power capacity is from vibration, since power capacity is not each same
On direction, will not aggravate seismaesthesia in a certain direction on propagation, but can cancel out each other, to eliminate power capacity plate shake phenomenon
The noise of generation.
Wherein, three power capacities may make up π word-lifting formula according to the perpendicular design of a cross two.
Certainly, in addition to the back side of circuit main board 200, the positive power capacity of circuit main board 200 is also required to using π font
Design.
In the embodiments of the present disclosure, multiple inductance of power management chip 303 are configured to be formed for offsetting just
Face magnetic field, positive magnetic field are the magnetic field that the inductance of the front setting of circuit main board 200 is formed, and the front of circuit main board 200 is electricity
One side of the road mainboard 200 towards screen 400.
In this implementation, when putting multiple inductance at the circuit main board back side, judged according to the flow direction of electric current each
The direction of inductance leakage field is put in the way of then capable of offsetting positive magnetic field by the magnetic field of generation, to make each inductance
The magnetic field that is formed of the inductance that is arranged of leakage field and circuit main board front cancel out each other, to reduce interference.
As previously mentioned, the back side of circuit main board 200 is also provided with clock circuit 305, clock circuit 305 passes through crystal oscillator
Clock signal is provided for Wireless Fidelity (Wireless Fidelity, WIFI), processor etc., clock signal 305 belongs to high frequency letter
Number, there is interference to radio circuit 304, therefore clock circuit 305 also needs to handle using packet.Namely clock circuit 305
Surrounding be provided with surround clock circuit 305 ground wire, by wrap handle on circuit main board 200 clock circuit 305 and its
Interference between his circuit shields.
Fig. 6 is the structure schematic diagram of the transparent mobile terminal of another kind shown according to an exemplary embodiment.Referring to
The difference of Fig. 6, the transparent mobile terminal and transparent mobile terminal illustrated in fig. 3 is, transparent rear shell 102 is towards circuit main board
200 are provided with heat conductive filament 602 on one side, and heat conductive filament 602 connects heating column 600 and center 101, increase between heating column and center
Add heat conductive filament, as extension of the heating column in transparent rear shell, so that the heat that circuit main board is transmitted out reaches center.
The one side of processor 301 connects touching with circuit main board 200, and heat diffusion is gone out by circuit main board 200.And it handles
The heat on 301 surface of device then reaches center 101 by heating column 600 and heat conductive filament 602, enables the heat of circuit main board 200
It uniformly diffuses on mobile terminal case, guarantees heat dissipation effect.
In the embodiments of the present disclosure, heat conductive filament 602 can using material identical with heating column 600 make, such as copper or
Person's silver.
Heat conductive filament 602 can be made of Shooting Technique, for example, can be formed by the way of die casting in a mold thermally conductive
Silk 602.By designing mold, the heat conductive filament 602 in transparent rear shell 102 can also be molded into certain pattern, play beauty
Effect.Heat conductive filament 602 is fixed in transparent rear shell 102 after completing, for example, will be led by the way that multiple heating columns 600 are arranged
Heated filament 602 is stuck between multiple heating columns 600 and transparent rear shell 102 and is fixed, or by glue that heat conductive filament 602 is fixed
In transparent rear shell 102, or pass through other conventional fixed heat conductive filaments 602 of fixed form.
Further, aforementioned heat conductive filament 602 is arranged in the transparent rear shell 121 of internal layer.The transparent rear shell 121 of internal layer and outer layer are saturating
It is vacuum between bright rear shell 122, so even if transparent some heat of rear shell 121 of internal layer can not quickly pass through heat conductive filament
602 lines are transferred to center 101, will not because of heat aggregation and influence grip feeling because vacuum layer by heat well every
It leaves and.
In the embodiments of the present disclosure, short-circuit protection circuit is additionally provided on circuit main board 200.The short-circuit protection circuit is specific
It can be set in the front of circuit main board 200.
Fig. 7 and Fig. 8 is a kind of short-circuit protection circuit figure of transparent mobile terminal shown according to an exemplary embodiment.?
In the embodiment of the present disclosure, connector interface is provided on center 101, referring to figs. 7 and 8, between the exit of connector interface 111
Every being provided with dry foam 112, the both ends of dry foam 112 and two terminals of short-circuit protection circuit are (between terminal b, terminal c)
Every setting, the outlet of connector interface 111 is connector interface 111 towards 200 one end of circuit main board.
In this implementation, by connector interface place one piece of dry foam, dry foam both ends with it is short
Two terminal intervals setting of circuit is protected on road, will be expanded after dry foam water suction, by water conduction, to make short-circuit protection
Circuit is connected, and the power supply of transparent mobile terminal is turned off, and realizes protection.In addition, due to the absorbent function of dry foam, additionally it is possible to keep away
Exempt from the inside that water enters transparent mobile terminal from connector interface.
As shown in FIG. 7 and 8, a terminal b connection power management chip 303 of short-circuit protection circuit, short-circuit protection circuit
Another terminal c ground connection.In this implementation, by the way that a terminal of short-circuit protection circuit will be protected to connect power management
Chip, another terminal ground so that power management chip can perceive whether the circuit is connected, and then carry out short circuit
Protection.
Further, a terminal b of the short-circuit protection circuit connects bias voltage by resistance R, the bias voltage i.e. by
Power management chip 303 provides, another terminal c ground connection.When short-circuit protection circuit conducting, power management chip 303 is detected
Change to bias voltage a, power management chip 303 can close power supply at this time, to realize circuit protection.As shown in fig. 7, working as
Dry 112 area of foam therefore will not be in floating state, not power consumption with the electrical contact when lesser.As shown in figure 8,
After dry foam 112 is soaked, area increase can touch the circuit, to short-circuit conditions occur, electric current increases, and cause to protect
Shield.
In the embodiments of the present disclosure, connector interface includes but is not limited to USB interface, audio interface, charging interface etc..
Further, which can also include humidity sensor d, humidity sensor d while and power supply
Managing chip 303 is electrically connected, and when bias voltage variation, power management chip 303 is believed according to the humidity that humidity sensor d is generated
Number determine whether to close power supply.If humidity is less than threshold value, power supply is not closed.If humidity is not less than threshold value, electricity is closed
Source.And then avoid in wet environment rather than mistake closes power supply when connector interface is soaked, guarantee that the transparent mobile terminal can
Normal use in wet condition.
Those skilled in the art after considering the specification and implementing the invention disclosed here, will readily occur to its of the disclosure
Its embodiment.This application is intended to cover any variations, uses, or adaptations of the disclosure, these modifications, purposes or
Person's adaptive change follows the general principles of this disclosure and including the undocumented common knowledge in the art of the disclosure
Or conventional techniques.The description and examples are only to be considered as illustrative, and the true scope and spirit of the disclosure are by following
Claim is pointed out.
It should be understood that the present disclosure is not limited to the precise structures that have been described above and shown in the drawings, and
And various modifications and changes may be made without departing from the scope thereof.The scope of the present disclosure is only limited by the accompanying claims.
Claims (19)
1. a kind of transparent mobile terminal, which is characterized in that the transparent mobile terminal includes shell (100), is arranged in the shell
It circuit main board (200) in body (100), the circuit structure (300) being arranged on the circuit main board (200) and is embedded described
Screen (400) on shell (100)；The shell (100) includes center (101) and transparent rear shell (102)；
The circuit main board (200) has towards the back side of the transparent rear shell (102), and the circuit structure (300) is at least
A part is arranged on the back side of the circuit main board (200), and the back side of the circuit main board (200) is provided with Transparent shielding cover
(500), at least part positioned at the circuit structure (300) at the back side of the circuit main board (200) is located at described transparent
In shielding case (500)；
Heating column (600) are provided between the back side and the transparent rear shell (102) of the circuit main board (200).
2. transparent mobile terminal according to claim 1, which is characterized in that the Transparent shielding cover (500) includes: setting
Bracket (501) at the back side of the circuit main board (200) and the Transparent shielding film that is fitted on the bracket (501)
(502)。
3. transparent mobile terminal according to claim 2, which is characterized in that the Transparent shielding film (502) is nanometer
Carbon fiber film.
4. transparent mobile terminal according to claim 1-3, which is characterized in that be located at the circuit main board
(200) circuit structure (300) at the back side includes processor (301), and the processor (301) is located at the Transparent shielding
It covers in (500).
5. transparent mobile terminal according to claim 4, which is characterized in that the heating column (600) is located at the processing
Between device (301) and the transparent rear shell (102), and the heating column (600) passes through the Transparent shielding cover (500).
6. transparent mobile terminal according to claim 4, which is characterized in that the circuit structure (300) further includes general
Flash memory (302), power management chip (303), radio circuit (304) and clock circuit (305), the Common Flash Memory (302),
At least one of power management chip (303), radio circuit (304) and clock circuit (305) are located at the circuit main board
(200) the back side.
7. transparent mobile terminal according to claim 6, which is characterized in that the power management chip (303) is located at institute
The back side of circuit main board (200) is stated, the back side of the circuit main board (200) is provided with multiple Transparent shielding covers (500), and
The power management chip (303) and the processor (301) are located in the different Transparent shielding covers (500).
8. transparent mobile terminal according to claim 7, which is characterized in that the power management chip (303) includes giving
The radio-frequency power supply managing chip of radio circuit (304) power supply and the sensor power supply management chip powered to sensor.
9. transparent mobile terminal according to claim 7, which is characterized in that the surrounding of the power management chip (303)
It is provided with the ground wire for surrounding the power management chip (303).
10. transparent mobile terminal according to claim 7, which is characterized in that the power management chip (303) includes more
A power capacity, the multiple power capacity use π word-lifting formula.
11. transparent mobile terminal according to claim 7, which is characterized in that the power management chip (303) includes more
A inductance, the multiple inductance are configured to be formed for offsetting positive magnetic field, and the front magnetic field is the circuit master
The magnetic field that the inductance of the front setting of plate (200) is formed, the front of the circuit main board (200) are the circuit main board (200)
Towards the one side of the screen (400).
12. transparent mobile terminal according to claim 6, which is characterized in that the surrounding of the clock circuit (305) is arranged
There is the ground wire for surrounding the clock circuit (305).
13. transparent mobile terminal according to claim 6, which is characterized in that be provided with connector on the center (101)
The exit of interface (111), the connector interface (111) is arranged at intervals with dry foam (112), the circuit main board
(200) short-circuit protection circuit, the both ends of the dry foam (112) and two terminals of the short-circuit protection circuit are provided on
Interval setting, the outlet of the connector interface (111) are the connector interface (111) towards the circuit main board (200)
One end.
14. transparent mobile terminal according to claim 13, which is characterized in that a terminal of the short-circuit protection circuit
It connects the power management chip (303), another terminal ground of the short-circuit protection circuit.
15. transparent mobile terminal according to claim 1-3, which is characterized in that the heating column (600) is copper
Or silvery heating column.
16. transparent mobile terminal according to claim 1-3, which is characterized in that the heating column (600) and institute
It states and is provided with heat conductive pad (601) between circuit main board (200).
17. transparent mobile terminal according to claim 1-3, which is characterized in that transparent rear shell (102) court
To being provided on one side heat conductive filament (602) for the circuit main board (200), the heat conductive filament (602) connects the heating column (600)
With the center (101).
18. transparent mobile terminal according to claim 1-3, which is characterized in that transparent rear shell (102) packet
Include the transparent rear shell of internal layer (121) and the transparent rear shell of outer layer (122), the transparent rear shell of internal layer (121) and the transparent rear shell of outer layer
(122) vacuum heat-insulation cavity (123) are formed between.
19. transparent mobile terminal according to claim 1-3, which is characterized in that seamed on the shell (100)
Gap, the gap are sealed by fruit juice gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811142943.2A CN109040379B (en) | 2018-09-28 | 2018-09-28 | Transparent mobile terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811142943.2A CN109040379B (en) | 2018-09-28 | 2018-09-28 | Transparent mobile terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109040379A true CN109040379A (en) | 2018-12-18 |
| CN109040379B CN109040379B (en) | 2021-06-04 |
Family
ID=64614877
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811142943.2A Active CN109040379B (en) | 2018-09-28 | 2018-09-28 | Transparent mobile terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109040379B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112070994A (en) * | 2020-08-07 | 2020-12-11 | 福建联迪商用设备有限公司 | Intelligent POS terminal data protection structure and protection method |
| TWI786975B (en) * | 2021-12-03 | 2022-12-11 | 明泰科技股份有限公司 | Electronic device with aluminum foil heat sink and aluminum foil heat sink |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102014205887B4 (en) * | 2014-03-28 | 2015-10-08 | Ecom Instruments Gmbh | Device arrangement |
| CN205039873U (en) * | 2015-09-22 | 2016-02-17 | 蒲彩贵 | Heat pipe cooling formula mobile phone motherboard heat radiation structure |
| CN105578811A (en) * | 2014-10-17 | 2016-05-11 | 小米科技有限责任公司 | Electronic equipment and using method thereof |
| CN205266130U (en) * | 2016-01-07 | 2016-05-25 | 浪潮电子信息产业股份有限公司 | Prevent store controller electromagnetic interference's shield cover |
| US20160226549A1 (en) * | 2014-02-26 | 2016-08-04 | Kyocera Corporation | Electronic apparatus |
| CN105979749A (en) * | 2015-10-22 | 2016-09-28 | 乐视移动智能信息技术（北京）有限公司 | Mobile terminal heat radiation device and mobile terminal |
| CN206181696U (en) * | 2016-10-28 | 2017-05-17 | 中科创达软件科技（深圳）有限公司 | Cell -phone shielding heat radiation structure of low thermal resistance and cell -phone that has this structure |
| CN106790866A (en) * | 2016-12-22 | 2017-05-31 | 怀宁佳瑞包装有限公司 | It is a kind of to have the mobile phone shell being incubated with heating function |
| CN106790861A (en) * | 2016-12-07 | 2017-05-31 | 上海与德信息技术有限公司 | Mobile terminal and the method for preventing mobile terminal waterlogged damage |
| CN107509383A (en) * | 2017-09-22 | 2017-12-22 | 昆山维开安电子科技有限公司 | A kind of Transparent shielding cover for pcb board |
-
2018
- 2018-09-28 CN CN201811142943.2A patent/CN109040379B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20160226549A1 (en) * | 2014-02-26 | 2016-08-04 | Kyocera Corporation | Electronic apparatus |
| DE102014205887B4 (en) * | 2014-03-28 | 2015-10-08 | Ecom Instruments Gmbh | Device arrangement |
| CN105578811A (en) * | 2014-10-17 | 2016-05-11 | 小米科技有限责任公司 | Electronic equipment and using method thereof |
| CN205039873U (en) * | 2015-09-22 | 2016-02-17 | 蒲彩贵 | Heat pipe cooling formula mobile phone motherboard heat radiation structure |
| CN105979749A (en) * | 2015-10-22 | 2016-09-28 | 乐视移动智能信息技术（北京）有限公司 | Mobile terminal heat radiation device and mobile terminal |
| CN205266130U (en) * | 2016-01-07 | 2016-05-25 | 浪潮电子信息产业股份有限公司 | Prevent store controller electromagnetic interference's shield cover |
| CN206181696U (en) * | 2016-10-28 | 2017-05-17 | 中科创达软件科技（深圳）有限公司 | Cell -phone shielding heat radiation structure of low thermal resistance and cell -phone that has this structure |
| CN106790861A (en) * | 2016-12-07 | 2017-05-31 | 上海与德信息技术有限公司 | Mobile terminal and the method for preventing mobile terminal waterlogged damage |
| CN106790866A (en) * | 2016-12-22 | 2017-05-31 | 怀宁佳瑞包装有限公司 | It is a kind of to have the mobile phone shell being incubated with heating function |
| CN107509383A (en) * | 2017-09-22 | 2017-12-22 | 昆山维开安电子科技有限公司 | A kind of Transparent shielding cover for pcb board |
Non-Patent Citations (1)
| Title |
|---|
| 白猫初号机: "《嗯，自己动手换了个透明后盖，莫名的有种蒸汽朋克风... - 荣耀8玩机技巧 花粉俱乐部》", 9 May 2018 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112070994A (en) * | 2020-08-07 | 2020-12-11 | 福建联迪商用设备有限公司 | Intelligent POS terminal data protection structure and protection method |
| TWI786975B (en) * | 2021-12-03 | 2022-12-11 | 明泰科技股份有限公司 | Electronic device with aluminum foil heat sink and aluminum foil heat sink |
| US11864356B2 (en) | 2021-12-03 | 2024-01-02 | Alpha Networks Inc. | Aluminum or copper foil heat dissipator and electronic device having the same |
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| Publication number | Publication date |
|---|---|
| CN109040379B (en) | 2021-06-04 |
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