CN109391871B

CN109391871B - Bluetooth earphone

Info

Publication number: CN109391871B
Application number: CN201811474064.XA
Authority: CN
Inventors: 周佐航
Original assignee: Anker Innovations Co Ltd
Current assignee: Anker Innovations Co Ltd
Priority date: 2018-12-04
Filing date: 2018-12-04
Publication date: 2021-09-17
Anticipated expiration: 2038-12-04
Also published as: CN109391871A

Abstract

The invention provides a Bluetooth headset. The bluetooth headset includes: a housing having an accommodating space; the main board is positioned in the accommodating space of the shell and is provided with a first surface and a second surface which are oppositely arranged; the receiving and sending module is arranged in the accommodating space on one side of the first surface of the mainboard, is electrically connected to the first surface of the mainboard and is used for receiving and sending data; the microphone is electrically connected to one end of the connecting structure, the other end of the connecting structure is electrically connected to the second surface of the mainboard, and a shielding layer is arranged on the surface of the connecting structure facing the hair receiving module to shield noise signals. According to the Bluetooth headset, the shielding layer facing the transceiver module is arranged on the surface of the connecting structure of the microphone to shield the interference of noise signals to radio frequency signals; and simultaneously, a complete and fixed reference surface can be provided for the radio frequency signal.

Description

Bluetooth earphone

Technical Field

The invention relates to the field of earphones, in particular to a Bluetooth earphone.

Background

The bluetooth audio transmission technology has appeared for many years, and along with the development of mobile intelligent devices, the technology has been more fully applied in the field of mobile communication, and is represented by bluetooth headsets, which are widely used. The Bluetooth headset is connected in a wireless mode through the Bluetooth, a connecting line is omitted, the size is small, carrying and using are convenient, the Bluetooth headset is loved by many people, and further development of the Bluetooth headset in structure and effect is promoted.

With the continuous development of the Wireless audio market, the form of the bluetooth headset is also more diversified, from the traditional Stereo bluetooth headset to the current true Wireless headset (TWS), Active Noise Cancellation (ANC) headset, smart headset and the like.

The TWS headset is classified into an in-ear TWS headset and a rod TWS headset. Compared with an in-ear TWS earphone, the whole product is closer to the face of a user, and the radio frequency of the product is inevitably affected by the face of the user. In addition, the structure (such as a transceiver module) in the earphone also affects the radio frequency of the product, so that the performance of the earphone is reduced.

Therefore, how to eliminate the influence of the face of the user on the radio frequency of the product becomes a problem which needs to be solved urgently at present.

Disclosure of Invention

The invention provides a Bluetooth earphone for solving the problem that the radio frequency of the existing earphone is influenced, which comprises:

a housing having an accommodating space;

the main board is positioned in the accommodating space of the shell and is provided with a first surface and a second surface which are oppositely arranged;

the receiving and sending module is arranged in the accommodating space on one side of the first surface of the mainboard, is electrically connected to the first surface of the mainboard and is used for receiving and sending data;

the microphone is electrically connected to one end of the connecting structure, the other end of the connecting structure is electrically connected to the second surface of the mainboard, and a shielding layer is arranged on the surface of the connecting structure facing the hair receiving module to shield noise signals.

Optionally, the bluetooth headset further includes a touch module disposed in the accommodating space on one side of the first surface of the motherboard, and configured to trigger a control signal;

the distance between the hair receiving module and the touch module is larger than a first distance so as to avoid the interference of the touch module on the hair receiving module.

Optionally, a feeding point is disposed on the first surface of the motherboard, the transceiver module is disposed on the first surface of the motherboard via the feeding point, and a distance between the touch module and the feeding point is greater than the first distance.

Optionally, a pi matching circuit is disposed on the first surface of the main board, and the pi matching circuit is disposed adjacent to the feeding point.

Optionally, the shielding layer is a ground plane, and the connection structure includes a flexible circuit board.

Optionally, a distance between the shielding layer and the hair extension module in a direction perpendicular to the main board is greater than a second distance, so as to avoid noise from interfering with the hair extension module.

Optionally, the bluetooth headset further includes a speaker, the speaker is disposed on one side of the second surface of the motherboard, the speaker includes a positive electrode and a negative electrode, wherein the positive electrode is connected to the second surface of the motherboard through a positive connecting wire, the negative electrode is connected to the second surface of the motherboard through a negative connecting wire, and the positive connecting wire and the negative connecting wire are wound around the speaker.

Optionally, the bluetooth headset further includes a battery assembly and a filter circuit, wherein the battery assembly and the filter circuit are disposed on one side of the second surface of the motherboard, a positive electrode of the battery assembly is electrically connected to the second surface of the motherboard through an elastic structure, and a negative electrode of the battery assembly is electrically connected to the second surface of the motherboard through a battery connection line; the filter circuit is disposed adjacent to the positive electrode of the battery assembly.

Optionally, the bluetooth headset further includes a bluetooth chip, and the bluetooth chip is electrically connected to the transceiver module and is configured to process data received and transmitted by the transceiver module.

Optionally, the bluetooth headset is a rod-shaped wireless bluetooth headset.

According to the Bluetooth headset provided by the embodiment of the invention, the surface of the connecting structure of the microphone in the Bluetooth headset is provided with the shielding layer facing the transceiver module, and the shielding layer is used for shielding the interference of noise signals to radio frequency signals; meanwhile, a complete and fixed reference surface can be provided for the radio frequency signals, and the influence of environmental factors on the communication distance of the product is reduced.

Drawings

The above and other objects, features and advantages of the present invention will become more apparent by describing in more detail embodiments of the present invention with reference to the attached drawings. The accompanying drawings are included to provide a further understanding of the embodiments of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings, like reference numbers generally represent like parts or steps.

Fig. 1A is an external overall structure diagram of a bluetooth headset according to an embodiment of the present invention;

fig. 1B is a schematic diagram of a disassembled partial structure of a bluetooth headset according to an embodiment of the present invention;

fig. 2 is a schematic diagram of a disassembled partial structure of a bluetooth headset according to another embodiment of the present invention;

fig. 3A is a schematic diagram of an external overall structure of a bluetooth headset according to another embodiment of the present invention;

fig. 3B is a schematic structural view of a cross section taken along a-a in fig. 3A.

Detailed Description

In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. It will be apparent, however, to one skilled in the art, that the present invention may be practiced without one or more of these specific details. In other instances, well-known features have not been described in order to avoid obscuring the invention.

In the following description, for purposes of explanation, specific details are set forth in order to provide a thorough understanding of the present invention. It is apparent that the practice of the invention is not limited to the specific details set forth herein as are known to those of skill in the art. The following detailed description of the preferred embodiments of the invention, however, the invention is capable of other embodiments in addition to the detailed description and should not be construed as limited to the embodiments set forth herein.

It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention, as the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. When the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. The terms "upper", "lower", "front", "rear", "left", "right" and the like as used herein are for purposes of illustration only and are not limiting.

Ordinal words such as "first" and "second" are referred to herein merely as labels, and do not have any other meaning, such as a particular order, etc. Also, for example, the term "first component" does not itself imply the presence of "second component", and the term "second component" does not itself imply the presence of "first component".

Specific embodiments of the present invention will now be described in more detail with reference to the accompanying drawings, which illustrate representative embodiments of the invention and do not limit the invention.

Example one

The invention provides a bluetooth headset, in order to solve the above technical problem, the bluetooth headset includes at least:

a housing having an accommodating space;

microphone and connection structure, wherein, microphone electricity is connected in connection structure's one end, and connection structure's the other end electricity is connected on the second surface of mainboard, and wherein connection structure's the other end with send the module and set up in the relative position of mainboard both sides, wherein, send the module towards in connection structure and be provided with the shielding layer on sending the surface of module, with shielding noise signal.

Fig. 1A is an external overall structural schematic diagram of a bluetooth headset according to an embodiment of the present invention, which is an external schematic diagram after being packaged; fig. 1B is a schematic diagram of a disassembled partial structure of a bluetooth headset according to an embodiment of the present invention; the bluetooth headset includes at least a housing 101 to form a space for accommodating other functional devices.

The basic function of the casing 101 is to realize a carrier of the basic service performance (functions of receiving information, transmitting information, operating and the like) of the bluetooth headset, meet the appearance characteristics (including color, shape, size and the like) of the whole headset, and protect electronic components (a machine core, a display screen and the like) and circuits.

Alternatively, the housing 101 is composed of an upper housing and a lower housing, and the outer shapes of the upper housing and the lower housing may be overlapped, the upper housing and the lower housing form a receiving space thereafter.

Optionally, the upper shell and the lower shell are made of the same material, so that the upper shell and the lower shell have the same shrinkage rate, and the upper shell and the lower shell are prevented from being completely clamped and sealed after being processed.

Alternatively, the plastic material generally selected for the housing 101 is Polycarbonate (PC) and Acrylonitrile Butadiene Styrene (ABS) copolymer and mixture, and it should be noted that the material of the housing 101 is not limited to one, and any housing material commonly used in the art can be applied to the embodiments of the present invention, and is not listed here.

Optionally, the housing 101 needs to have a certain strength to satisfy the ability of various drop, twist, and seat pressure tests without being damaged.

Illustratively, the thickness of the housing 101 is 0.5-4mm, and for the housing of the injection molded plastic part, the wall thickness is related to the size, structure, plastic material, mold gate position, injection molding process and other factors of the part, and the approximate range is 0.5-4 mm; the thin part is poor in strength and difficult to be injection molded; too thick, causes material waste, long forming period, easy shrinkage and poor surface quality.

For bluetooth earphones, in the case of PC material, the front wall thickness of the housing 101 is selected to be in the range of 1.0-1.2mm, the currently commonly used thickness is 1.0mm (if the product is larger, 1.2mm should be selected), and,

in the embodiment of the invention, the Bluetooth headset is a rod-shaped wireless Bluetooth headset. The body of the stick-shaped bluetooth headset has a stick-shaped body extending from the ear of the user, next to the face of the user and towards the mouth of the user, wherein one end of the stick-shaped body is provided with a microphone 105, as shown in fig. 1A, and the other end is an earpiece 102.

The main board is disposed in the housing 101, and the main board 107 has a first surface and a second surface disposed opposite to each other, so as to integrate various functional chips and functional devices on the main board.

The first surface is a surface far away from the earplugs 102 of the bluetooth headset and a surface far away from the face of the user, the first surface and the outermost touch module are located on the same side and are also the front side of the motherboard, and the second surface is a surface close to the earplugs 102 of the bluetooth headset and is a surface close to the face of the user.

Wherein, mainboard 107 encapsulates under to on the casing, for example be provided with post or muscle on the casing down in order to support mainboard 107, fix a position, for example 3 to 4 post or muscle evenly distributed take place the upset deformation under on the casing to prevent to carry out the button to bluetooth headset.

Wherein, it presses the mainboard to be equipped with 3 to 4 posts or muscle on the upper shell, and just distributes evenly. The clearance between the main board and the side wall of the housing 101 is not less than 0.2 mm.

The main Board 107 may be a Printed Circuit Board (PCB) substrate, a ceramic substrate, a Pre-injection molded (Pre-mold) substrate, or the like.

The PCB is manufactured by processing different components and various complex process technologies, and the like, wherein the structure of the PCB circuit board has a single-layer structure, a double-layer structure and a multi-layer structure, and the manufacturing modes of different hierarchical structures are different.

Alternatively, the printed circuit board is primarily comprised of pads, vias, mounting holes, wires, components, connectors, fills, electrical boundaries, and the like.

Further, common board Layer structures of printed circuit boards include three types, namely a Single Layer board (Single Layer PCB), a Double Layer board (Double Layer PCB) and a Multi Layer board (Multi Layer PCB), and the specific structures are as follows:

(1) single-layer board: i.e. a circuit board with only one side copper-clad and the other side not copper-clad. Typically, the components are placed on the side that is not copper-clad, the copper-clad side being used primarily for wiring and soldering.

(2) Double-layer plate: i.e., a circuit board with both sides copper-clad, is commonly referred to as a Top Layer (Top Layer) on one side and a Bottom Layer (Bottom Layer) on the other side. The top layer is generally used as the surface for placing components, and the bottom layer is used as the surface for welding components.

(3) Multilayer board: that is, a circuit board including a plurality of working layers includes a plurality of intermediate layers in addition to a top layer and a bottom layer, and the intermediate layers can be used as a conductive layer, a signal layer, a power layer, a ground layer, etc. The layers are insulated from each other and the connections between the layers are usually made by vias.

The printed circuit board includes many types of working layers, such as a signal layer, a protective layer, a silk-screen layer, an internal layer, and so on, which are not described herein again.

The transceiver module 109 is disposed in the accommodating space on the first surface side of the motherboard and electrically connected to the first surface of the motherboard for receiving and transmitting data.

Among them, the transceiver module 109 is an element for transmitting or receiving electromagnetic waves, such as an antenna, in the transmission and reception system. The transceiver module 109 functions to convert the high-frequency electromagnetic energy in the transmission line into free-space electromagnetic waves, or vice versa.

The Antenna types include Stamping Metal Antenna, Chip Antenna, and Printed Antenna. Wherein, the patch antenna mainly has: ceramic antennas (e.g., B-flipper antennas), integrated antennas, and the like. The stamping antenna mainly comprises: beryllium copper (phosphor bronze) stamped antennas, wire antennas, and the like.

The Type of the antenna in the embodiment of the present invention may be one of a serpentine, an L-shape, a dual panel L-shape, and a Loop-Type antenna (Loop-Type).

In the embodiment of the invention, the antenna is designed to be Loop-Type in a form, so that the anti-interference performance of the product is improved.

Optionally, the width of the antenna should be not less than 0.5mm, and of course, the width of the antenna may be selected according to actual needs, and is not limited herein.

In the embodiment of the invention, in order to reduce the influence of the outside on the radio frequency of the Bluetooth headset, larger metal objects such as a SPEAKER (SPEAKER), a RECEIVER (RECEIVER) and a BATTERY (BATTERY) cannot be arranged within 3mm around the antenna. In addition, when the antenna was apart from low-voltage distribution cabinet when 3mm above to prevent that low-voltage distribution cabinet from causing the interference to the antenna.

The microphone 105 is an element that receives and processes sound during a call. The microphone 105 is connected out of the motherboard via a connection 106. For example, the microphone 105 is electrically connected to one end of the connection structure 106, and the other end of the connection structure 106 is electrically connected to the second surface of the main board 107.

Optionally, the housing 101 is provided with a first opening 103 and a second opening 104, which communicate with the microphone 105 for receiving signals.

Illustratively, the microphone 105 is connected in the following ways:

1. a Flexible Printed Circuit (FPC) type which can be directly connected with a PCB in a soldering connection way; or may be connected through a 4 pin FPC connector. When the FPC is connected, the mutual position of the FPC connecting end and the PCB is required to be noticed, and the FBC cannot be distorted and deformed too much. When the FPC welding mode is adopted, components cannot be arranged within 3mm around a welding point.

2. And the lead type (wire) can be directly welded with the PCB.

3. Pin (Pin) Pin style, through PCB holes, hand soldered.

4. The conductive rubber sleeve type is characterized in that the conductive rubber sleeve is in compression joint with the PCB, the compression amount of the conductive rubber sleeve and the PCB is required to be noticed when the conductive rubber sleeve is connected in a conductive rubber sleeve mode, and the height space is required to be 85% -90% in a natural state.

In the embodiment of the present invention, the microphone and the main board are electrically connected by a Flexible Printed Circuit (FPC) connection method.

It should be noted that there is no overlapping part with the FPC right above and below the antenna, and the mutual edge distance is more than 3mm, to prevent the radio frequency of the earphone from being affected.

Wherein, the connecting structure 106 is in a strip shape to adapt to the shape of the main body of the rod-shaped bluetooth headset.

Wherein a shielding layer (not shown) is disposed on a surface of the connecting structure 106 facing the transceiver module 109 to shield the noise signal.

Optionally, the shielding layer is disposed between the motherboard and the microphone. According to the Bluetooth headset provided by the embodiment of the invention, the complete ground is added at the upper end of the microphone wiring to serve as a ground reference surface for sending out the radio-frequency signals by the receiving and sending module, so that the interference of MIC signals and human body signals (the shielding layer is easy to be close to the human body at the position of the headset) on the radio-frequency signals is shielded; and secondly, a complete and fixed reference surface is provided for the radio frequency signal, and the influence of environmental factors on the communication distance of the product is reduced.

Wherein, the shielding layer is a ground plane layer. In an embodiment of the present invention, the shielding layer is a metal layer and an insulating layer sequentially disposed on the surface of the connection structure.

The shielding layer may also be made of other shielding materials commonly used in the art, which is not limited herein.

Further, in order to achieve a better shielding effect, a distance D1 between the shielding layer and the hair extension module 109 in a direction perpendicular to the main board is greater than the second distance.

The second distance is determined by the minimum radio frequency interference of the human body signal to the antenna in the radio frequency range of the antenna, and is not limited to a certain value range. In an embodiment of the invention, the second distance is, for example, 3.5mm or more, so as to prevent the influence of the human body signal on the radio frequency.

According to the Bluetooth headset provided by the embodiment of the invention, the surface of the connecting structure of the microphone in the Bluetooth headset is provided with the shielding layer facing the transceiver module, and the shielding layer is used for shielding MIC signals and interference of human body signals on radio frequency signals; meanwhile, a complete and fixed reference surface can be provided for the radio frequency signals, and the influence of environmental factors on the communication distance of the product is reduced.

Example two

The present invention also provides another embodiment of a bluetooth headset, in which the bluetooth headset includes:

a housing having an accommodating space;

The housing, the main board, the transceiver module, the microphone and the connecting structure can all refer to the related descriptions in the first embodiment, except for the above structure, the bluetooth headset in this embodiment further includes other functional elements, and the further included functional elements are further described in detail below.

First, as shown in fig. 2, wherein fig. 2 does not show various functional devices of the bluetooth headset, only the housing and the accommodating space of the bluetooth headset are shown, so as to better show the relative arrangement of the housing and the accommodating space, therefore, how the functional devices in the bluetooth headset are arranged in the housing and the accommodating space will be described in detail below with reference to fig. 1B and fig. 2. Wherein the microphone 105 is arranged on the microphone holder 204 in the microphone groove 205.

Further, the bluetooth headset further comprises a bluetooth chip, and the bluetooth chip is electrically connected with the transceiver module 109 and is used for processing the data received and sent by the transceiver module.

The bluetooth headset further includes an earpiece 102, as shown in fig. 1A, disposed at one end of the rod-shaped bluetooth headset, for example.

The silicone sleeve of the earplug 102 may be made of conventional materials, and is not limited herein. The ear plugs 102 include ear plug shells and ear plug covers, the ear plug shells are assembled with the lower shell through screws or glue, and the ear plug covers are connected with the ear plug shells through buckles or glue.

The earphone receiving cavity is generally composed of an earplug and an earplug cover, and a receiver is arranged in the earphone receiving cavity.

It should be noted that, the bluetooth headset in the embodiment of the present invention includes a left headset and a right headset, where the left headset and the right headset are designed according to a mirror image principle.

In addition, the bluetooth headset further includes a touch module disposed in the accommodating space on the first surface side of the main board, for example, in the touch module area 201 shown in fig. 2, for triggering the control signal.

The touch module is used as an input device of the electronic product and used for sending instructions to the electronic product so as to enable the electronic product to execute corresponding actions.

The touch module may use a touch screen (touchscreen) or a touch pad (touchpad). For example, in one example of the present invention, the touch module is a touch pad, and the touch pad is formed by an array of rows and columns on a printed circuit board; the printing plate and the surface plastic film are bonded by strong double sides, and the induction detection principle is capacitance sensing. A special ic board under the touchpad surface constantly measures and reports this trajectory to ascertain the motion and position of the finger.

For example, when the electronic product to be turned on and turned off is a bluetooth headset, at least one of the following functions may be implemented when the touch module is touched: turning on and off, turning on, turning off, playing, pausing, volume adjusting and the like are not listed.

The distance between the transceiver module 109 (e.g., the transceiver module area 202 shown in fig. 2) and the touch module is greater than the first distance, so as to eliminate the influence of the touch module on the radio frequency of the transceiver module (e.g., the antenna).

Optionally, the first distance is determined by minimizing radio frequency interference of the touch module to the antenna within a radio frequency range of the antenna, and is not limited to a certain range of values, for example, in an embodiment of the present invention, the first distance is greater than 3mm, as shown in fig. 1B, and of course, if the accommodation space of the bluetooth headset allows, the larger the first distance, the better.

Optionally, a feeding point 203 of the transceiver module 109 is disposed on the first surface of the motherboard, the transceiver module 109 is disposed on the first surface of the motherboard via the feeding point, and a distance between the touch module and the feeding point is greater than the first distance.

Furthermore, a pi-shaped matching circuit is arranged on the first surface of the mainboard to adjust the impedance of the antenna and ensure that the impedance of the antenna is matched with that of the chip.

Illustratively, the pi-matching circuit is located adjacent to the feed point, e.g., the pi-matching circuit is reserved near the antenna feed point network.

The bluetooth headset further includes a speaker 302, as shown in fig. 3B, where fig. 3B is a schematic structural diagram of a cross section of fig. 3A along a-a direction in an embodiment of the present invention, the speaker 302 is disposed on one side of the second surface, the speaker includes an anode and a cathode, the anode is connected to the second surface of the motherboard through an anode connection line, the cathode is connected to the second surface of the motherboard through a cathode connection line, and the anode connection line and the cathode connection line are disposed around the speaker body.

Optionally, the initial line length of the speaker 302 is 15-20mm, and cannot be greater than 20mm, and exceeding 20mm has a relatively large influence on the radio frequency of the product. Namely, the length of the positive connecting wire and the negative connecting wire is 15-20 mm.

Optionally, the positive connecting wire and the negative connecting wire encircle the loudspeaker body for 3-5 circles, so that the influence on radio frequency generated by the positive electrode and the negative electrode of the loudspeaker are mutually counteracted to further reduce noise.

Wherein the positive and negative connection lines are placed in the gap between the housing 101 and the speaker 302.

The positive connecting wire and the negative connecting wire can be conventional wires as long as the electric connection function can be achieved.

The speaker adopts foam and is tightly pressed on the casing 101 to realize the sealing of the speaker 302 and the casing 101.

The second surface is also provided with a filter circuit, and the filter circuit is arranged adjacent to the positive electrode of the battery pack. For example, an L-shaped filter circuit is required to be reserved for the battery anode and the loudspeaker network.

Optionally, the bluetooth headset further includes a battery assembly 301, wherein the battery assembly 301 is disposed on one side of the second surface, a positive electrode of the battery assembly 301 is electrically connected to the second surface through the elastic structure, and a negative electrode of the battery assembly 301 is electrically connected to the second surface through the battery connection line.

Illustratively, the length of the battery connecting wire is 10-15 mm.

Alternatively, the battery pack 301 may be adhered to the PCB board by double-sided adhesive with a thickness of 0.1-0.2mm, supported by ribs of the lower case.

Optionally, the battery expands during charging, so that the design needs to pay attention to the expansion space of the battery, a gap needs to be reserved around the expansion space, and the expansion space can be fixed on a single-sided foam surface at the bottom. The expansion space of the cell is about 0.2 mm.

According to the Bluetooth headset provided by the embodiment of the invention, the surface facing the transceiver module is arranged between the microphone and the transceiver module in the Bluetooth headset, and the shielding layer is used for shielding the interference of MIC signals, touch module signals and human body signals to radio frequency signals; meanwhile, a complete and fixed reference surface can be provided for the radio frequency signals, and the influence of environmental factors on the communication distance of the product is reduced. In addition, the distance between the Bluetooth headset receiving and sending module and the touch module is larger than 3mm, so that the influence of the touch module on the radio frequency of the headset is eliminated. The placement of the speaker and battery are further limited to further eliminate the effect of the above elements on the radio frequency of the headset and further reduce noise.

The terms are used in the same sense as those commonly understood by those skilled in the art of the present invention. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Terms such as "part," "member," and the like, when used herein, can refer to either a single part or a combination of parts. Terms such as "mounted," "disposed," and the like, as used herein, may refer to one component as being directly attached to another component or one component as being attached to another component through intervening components. Features described herein in one embodiment may be applied to another embodiment, either alone or in combination with other features, unless the feature is otherwise inapplicable or otherwise stated in the other embodiment.

The present invention has been illustrated by the above embodiments, but it should be understood that the above embodiments are for illustrative and descriptive purposes only and are not intended to limit the invention to the scope of the described embodiments. Furthermore, it will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, and that many variations and modifications may be made in accordance with the teachings of the present invention, which variations and modifications are within the scope of the present invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. A Bluetooth headset, comprising:

a housing having an accommodating space;

the microphone is electrically connected to one end of the connecting structure, and the other end of the connecting structure is electrically connected to the second surface of the mainboard;

the touch control module is arranged in the accommodating space on one side of the first surface of the mainboard and used for triggering a control signal, wherein the distance between the hair receiving module and the touch control module is greater than a first distance so as to avoid the interference of the touch control module on the hair receiving module;

wherein, connection structure orientation send out the module on the surface be provided with the shielding layer to shielding microphone signal and human body signal are to radio frequency signal's interference, at the perpendicular to in the mainboard direction, the shielding layer with send out the distance between the module and be greater than the second distance, the shielding layer is a ground plane, connection structure includes flexible line way board.

2. The bluetooth headset according to claim 1, wherein a feeding point is disposed on the first surface of the main board, the transceiver module is disposed on the first surface of the main board via the feeding point, and a distance between the touch module and the feeding point is greater than the first distance.

3. The bluetooth headset of claim 2, wherein a pi-shaped matching circuit is disposed on the first surface of the main board, the pi-shaped matching circuit being disposed adjacent to the feeding point.

4. The bluetooth headset of claim 1, further comprising a speaker disposed on a side of the second surface of the main board, the speaker comprising a positive electrode and a negative electrode, wherein the positive electrode is connected to the second surface of the main board via a positive connection line, the negative electrode is connected to the second surface of the main board via a negative connection line, and the positive connection line and the negative connection line are wound around the speaker.

5. The bluetooth headset of claim 1, further comprising a battery assembly and a filter circuit, wherein the battery assembly and the filter circuit are disposed on one side of the second surface of the motherboard, a positive electrode of the battery assembly is electrically connected to the second surface of the motherboard via an elastic structure, and a negative electrode of the battery assembly is electrically connected to the second surface of the motherboard via a battery connection line; the filter circuit is disposed adjacent to the positive electrode of the battery assembly.

6. The bluetooth headset of claim 1, further comprising a bluetooth chip electrically connected to the transceiver module for processing data received and transmitted by the transceiver module.

7. The bluetooth headset of claim 1, wherein the bluetooth headset is rod-shaped.