CN116417782B - Wireless earphone and terminal antenna - Google Patents

Abstract

The embodiment of the application discloses a wireless earphone and a terminal antenna, and relates to the technical field of antennas. The application can solve the problem of poor communication performance of the wireless earphone caused by higher head mode loss. The terminal antenna includes: a first radiator disposed in the ear stem and a first reference ground. The first radiator is provided with a feed source and a grounding point, the first radiator is connected with the first reference ground through the grounding point, the grounding point is arranged on the lower half part of the first radiator, and the lower half part of the first radiator is a part, far away from the ear bag part, of the first radiator. The wireless earphone is provided with the terminal antenna and the metal dust screen component. The metal dust-proof net assembly comprises a metal dust-proof net and a metal dust-proof net gasket which are mutually communicated; through being connected metal dust screen and metal dust screen gasket electricity, metal dust screen gasket passes through electrically conductive shell fragment bullet and connects on the antenna, realizes the static of metal dust screen and returns to the ground, avoids the influence of metal dust screen to the antenna.

Description

Wireless earphone and terminal antenna

Technical Field

The present application relates to the field of antenna technologies, and in particular, to a wireless earphone and a terminal antenna.

Background

In a head-mounted electronic device such as a wireless earphone, a wireless communication function can be realized by an antenna provided therein. Taking a Bluetooth earphone as an example, the Bluetooth earphone can be in wireless connection with electronic equipment (such as a mobile phone) through covering a Bluetooth frequency band by an antenna arranged in the Bluetooth earphone so as to receive an audio signal from the electronic equipment and play audio; or to send audio signals to the electronic device, to make voice inputs, etc.

The effect of the head-mode loss on the antenna performance during wear is significant, thereby affecting the communication quality of the wireless headset.

Disclosure of Invention

The embodiment of the application provides a wireless earphone and a terminal antenna, which can solve the problem of poor communication performance of the wireless earphone caused by higher head mould loss in the working process of the antenna arranged in the current wireless earphone.

In order to achieve the above purpose, the embodiment of the application adopts the following technical scheme:

In a first aspect, a terminal antenna is provided that is disposed in a wireless headset that includes an ear-cup portion and an ear-stem portion. The terminal antenna includes: a first radiator disposed in the ear stem and a first reference ground. The first radiator is provided with a feed source and a grounding point, the first radiator is connected with the first reference ground through the grounding point, the grounding point is arranged on the lower half part of the first radiator, and the lower half part of the first radiator is a part, far away from the ear bag part, of the first radiator.

Based on this scheme, the terminal antenna that sets up in wireless earphone can set up in the otorod portion to wireless earphone wears the in-process, and the antenna can not be along with the embedding of ear package portion people's ear, avoids embedding people's ear from this to the serious influence of antenna performance, reduces the head mould loss promptly. In addition, by arranging the grounding point at the lower half part of the first radiator, the antenna radiator and the reference ground are enabled to be upwards through the opening of the U-shaped structure formed by the grounding point, so that a lower electric field value in the radiator and a surrounding space is obtained, head mode loss is reduced, and communication performance is improved.

In one possible design, the ground point is disposed on an upper half of the first radiator, where the electric field value at the first location on the first radiator is a first electric field value, and the upper half of the first radiator is a portion of the first radiator that is proximate to the ear cup. The grounding point is arranged at the lower half part of the first radiator, and the electric field value of the first position on the first radiator is a second electric field value. The second electric field value is smaller than the first electric field value, and the first position is any position on the first radiator. Based on this scheme, a contrast definition of electric field values for the opening up scheme versus the opening down scheme is provided. The grounding point is arranged on the upper half part of the first radiator and downward corresponds to the opening. The grounding point is arranged on the lower half part of the first radiator and corresponds to the opening upwards. In the case of the aperture-down scheme, the electric field value at the same position on the radiator is lower, and the electric field value at the same position is also lower, in addition to the lower electric field value at the same position on the radiator, which is distributed in the space around the radiator.

In one possible design, the operating frequency band of the terminal antenna includes a first frequency band, and the length of the first radiator is determined according to 1/4 wavelength of the first frequency band. When the terminal antenna works, the first radiator excites a 1/4 wavelength mode to cover the first frequency band. Based on this solution, a definition of the length of the first radiator is provided. In this example, the first radiator may excite a 1/4 wavelength mode to cover the operating band. Thus, the length of the first radiator may correspond to the size of 1/4 wavelength of the operating frequency band. The specific implementation can be adjusted around 1/4 wavelength.

In one possible design, the terminal antenna further comprises a second reference ground disposed at the ear cup portion, the second reference ground being connected to an end of the first reference ground remote from the ground point. Based on this scheme, still another structural scheme is provided. The compliance plate provided in the ear-cup portion may serve as a second reference ground that may be connected to the compliance plate and the stiffening plate in the ear-stem portion.

In one possible design, the operating frequency band of the terminal antenna includes a first frequency band, and the sum of the lengths of the first reference ground and the second reference ground is determined according to 1/2 wavelength of the first frequency band. When the terminal antenna works, the first reference ground and the second reference ground jointly excite a 1/2 wavelength mode, and a frequency band covered by the 1/2 wavelength mode is at least partially overlapped with the first frequency band. Based on the scheme, the first reference ground and the second reference ground (also can be called as a reference ground extension part) can jointly excite a 1/2 wavelength mode, the bandwidth of the 1/4 wavelength mode is extended, and the performance of the working frequency band is improved. In other implementations, the mode in which the first reference ground and the second reference ground are jointly excited may also be other multiples of the 1/4 wavelength mode, such as a 3/4 mode, a 1-multiple mode, etc., for extending the bandwidth of the 1/4 wavelength. Depending on the excited mode, the total length of the first and second reference grounds may be flexibly adjusted to correspond to the excited mode.

In one possible design, the first frequency band includes a bluetooth frequency band. Based on this scheme, a specific usage scenario is provided. For example, the terminal antenna may be used to cover the Bluetooth (2.4 GHz) band.

In one possible design, the first reference ground is realized by a printed circuit board PCB and/or a flexible circuit board FPC. Based on this scheme, a specific implementation of the first reference ground is provided. For example, the bearing function of the flexible printed circuit board (FPC) on other components can be realized by combining a hard board (PCB) and the flexible printed circuit board (FPC).

In one possible design, the first radiator is realized by laser direct structuring LDS and/or FPC. Based on this scheme, a specific implementation of an antenna is provided.

In one possible design, the second reference ground is implemented by an FPC. Based on this scheme, a specific implementation of the second reference ground is provided. For example, the second ground reference is enabled by the FPC to acquire a larger board surface in a more complicated space in the ear cup.

In one possible design, the wireless earphone is further provided with a metal dust screen assembly, the first radiator of the terminal antenna is connected with the metal dust screen assembly, and when the wireless earphone works, static electricity on the metal dust screen assembly returns to the ground through the grounding point of the terminal antenna. Based on this scheme, a relative relation example of the metal dust screen component and the antenna is provided. The metal dust screen can return to the ground through the grounding point of the antenna, so that static electricity is guided. When the antenna radiates, the metal dust screen can be used as a part of the antenna to radiate, so that the radiating area of the antenna is enlarged, the influence of the metal dust screen on the antenna is avoided, and the performance of the antenna is improved.

In a second aspect, there is provided a wireless headset having provided therein a terminal antenna as provided in the first aspect and any one of its possible designs.

Based on this scheme, a definition of product morphology is provided. The wireless earphone can be a pair of earphones symmetrically arranged on the left ear and the right ear. The terminal antenna can be arranged in each earphone, so that better communication quality can be obtained based on the arrangement of the terminal antenna.

In one possible design, the first reference ground of the wireless earphone is provided with a baseband module and a radio frequency module, and the terminal antenna is sequentially connected with the radio frequency module and the baseband module through the feed source. The terminal antenna is connected with a zero potential point of the first reference ground through the grounding point. Based on the scheme, a link setting example for realizing antenna radiation in the wireless earphone is provided.

In one possible design, the first reference ground is provided with a first conductive element and a second conductive element, and the terminal antenna is sequentially connected with the radio frequency module and the baseband module through the feed source, specifically: the terminal antenna is sequentially connected with the radio frequency module and the baseband module through a first conductive piece at a position corresponding to the feed source. The terminal antenna is connected with a zero potential point on the first reference ground through the grounding point, specifically: the terminal antenna is connected with the zero potential point of the first reference ground through a second conductive piece at a position corresponding to the grounding point. Based on this scheme, an example of an electrical connection scheme for implementing the above-described communication link is provided.

In one possible design, the first conductive element and/or the second conductive element is a conductive spring. Based on this scheme, a specific electrical connection scheme implementation is provided.

In one possible design, a first antenna matching circuit is provided between the feed of the terminal antenna and the radio frequency module, the first antenna matching circuit comprising at least one of: capacitance, inductance, resistance, variable capacitance, variable inductance, variable resistance. The first antenna matching circuit is used for adjusting the port impedance of the terminal antenna. Based on this scheme, a scheme is provided for adjusting the antenna port impedance to obtain better radiation performance.

In one possible design, the first reference ground includes a first PCB and a first FPC. The first conductive piece is arranged on the first PCB, the first antenna matching module, the radio frequency module and the baseband module are arranged on the first FPC, and the first conductive piece is connected with the first antenna matching module through a connecting cable. Or the first conductive piece and the first antenna matching module are arranged on the first PCB, the radio frequency module and the baseband module are arranged on the first FPC, and the first antenna matching module is connected with the radio frequency module through a connecting cable. Or the first conductive piece, the first antenna matching module and the radio frequency module are arranged on the first PCB, the baseband module is arranged on the first FPC, and the radio frequency module is connected with the baseband module through a connecting cable. Based on the scheme, the flexible connection cable-based setting is provided, so that each module on the communication link can be arranged on one circuit board at different time, and further flexible setting of components is realized.

In one possible design, a second antenna matching circuit is provided between the ground point of the terminal antenna and the first reference ground, the second antenna matching circuit comprising at least one of: microstrip line, capacitor, inductor, band-pass filter. The response frequency band of the band-pass filter comprises the working frequency band of the terminal antenna. Based on this scheme, several specific implementations of the grounding scheme are provided.

In one possible design, a metal dust screen assembly is provided in the wireless headset for placement near a sound pickup hole provided on the ear stem. The metal dust screen assembly comprises a metal dust screen and a metal dust screen gasket which are mutually communicated, wherein a conductive elastic sheet is arranged on the metal dust screen gasket, and the metal dust screen gasket is electrically connected with a first radiator of the terminal antenna through the conductive elastic sheet. Based on this scheme, through being connected metal dust screen and metal dust screen gasket electricity (e.g. through the conductive adhesive electricity is connected), then with metal dust screen gasket through electrically conductive shell fragment (e.g. metal shell fragment) bullet connect to the antenna radiator on, when having realized the static of metal dust screen and returning to the ground, avoid the influence of metal dust screen to the antenna.

Drawings

FIG. 1 is a schematic diagram of a wireless headset usage scenario;

FIG. 2 is a schematic diagram of a wireless headset;

FIG. 3 is a schematic diagram of an antenna implementation in a wireless headset;

Fig. 4 is a schematic diagram of an antenna arrangement position in a wireless earphone according to an embodiment of the present application;

fig. 5A is a schematic diagram of a wireless earphone according to an embodiment of the present application;

FIG. 5B is a schematic view of a metal dust screen assembly according to an embodiment of the present application;

fig. 6 is a schematic diagram of an antenna stand and an antenna according to an embodiment of the present application;

fig. 7 is a schematic diagram of an antenna scheme according to an embodiment of the present application;

fig. 8 is a schematic diagram of an antenna implementation according to an embodiment of the present application;

fig. 9 is a schematic diagram of an antenna related communication link according to an embodiment of the present application;

fig. 10A is a schematic diagram of a communication link corresponding to an antenna feed point according to an embodiment of the present application;

Fig. 10B is a schematic diagram of a communication link corresponding to an antenna grounding point according to an embodiment of the present application;

Fig. 10C is a schematic diagram of an antenna grounding list and a feed point setting position according to an embodiment of the present application;

FIG. 11 is a graph showing electric field values of different opening directions according to an embodiment of the present application;

FIG. 12 is a schematic diagram showing simulation contrast of S parameters in different opening directions according to an embodiment of the present application;

Fig. 13 is a schematic diagram of yet another antenna scheme according to an embodiment of the present application;

fig. 14 is a schematic diagram of electric field value distribution of an antenna scheme according to an embodiment of the present application;

fig. 15 is a schematic diagram of S-parameter simulation comparison provided in an embodiment of the present application.

Detailed Description

Currently, there is an increasing demand for convenience in use of electronic devices, which makes use of wireless headphones (such as bluetooth headphones) more and more frequent.

Exemplary, in connection with fig. 1, a schematic diagram of a wireless headset usage scenario is shown. When the wireless earphone works, the wireless earphone can be worn on the ear of a person, and is communicated with other electronic equipment through wireless signals, so that the playing of audio is realized. The wireless communication may be Bluetooth (Bluetooth) based communication, among others. Other electronic devices, such as cell phones, may establish a wireless connection (e.g., a bluetooth connection) as an audio input/output device with the wireless headset to communicate with the wireless headset over the wireless connection. For example, audio signals are transmitted to the wireless earphone through a wireless connection, so that music playing is realized. As another example, audio signals from the wireless headset are received, and functions such as voice input are realized. Therefore, the earphone is different from the traditional wired earphone, separation of the earphone and the audio input/output equipment can be realized, and the earphone is more convenient to use.

It should be appreciated that an antenna in the wireless headset that is operable to cover the bluetooth frequency band (e.g., 2.4GHz-2.483 GHz) may be provided for wireless communication with the audio output device.

Exemplary, in connection with fig. 2, a schematic diagram of the composition of a wireless headset is shown. As shown in fig. 2, the wireless earphone may include an ear-pack portion into which a human ear can be put, and an ear stem portion exposed to the outside when worn. Wherein the antenna of the wireless earphone can be arranged in the ear-bag part. Correspondingly, a battery can be arranged in the ear rod part for supplying power to the wireless earphone. It will be appreciated that the placement of the battery in the ear stem portion is also one of the reasons for the placement of the antenna in the ear cup portion due to the effect of the battery on the performance of the antenna.

In order to be able to cover the operating frequency band, the antenna in the wireless headset may have different forms.

By way of example, an exemplary illustration of a common antenna form in a wireless headset is provided in connection with fig. 3. As shown in fig. 3, the antenna commonly used in wireless headphones may be an IFA antenna or a PIFA antenna.

In some embodiments, an IFA antenna is taken as an example. The IFA antenna may comprise a strip-shaped radiator, which may be provided with a feed for feeding the IFA antenna, and which may also be provided with a ground point. In general, the feed may be disposed at one end of the radiator or near the end, and the ground point may be disposed on the radiator near the feed.

In other embodiments, a PIFA antenna is used as an example. Similar to the IFA antenna, the radiator of the PIFA antenna may be provided with a feed and a ground point. Unlike IFA antennas, the radiator of PIFA antennas is generally larger in area, and better radiation performance is obtained by planar radiation. For example, as shown in fig. 3, the radiator of the PIFA antenna may be rectangular. As one example, the length of the IFA antenna and/or PIFA antenna may be determined from 1/4 of the operating wavelength.

In the embodiment of the application, the radiation performance of the antenna can be identified by the efficiency under the free space (such as the free space efficiency) and the efficiency under the head die (such as the head die efficiency). The free space efficiency may be, among other things, the efficiency of the antenna in free space (FREESPACE). The head mold efficiency may be the efficiency of the antenna system (e.g., a wireless headset provided with an antenna as in the example above) when worn on the head mold. The head model efficiency is understood to be the efficiency exhibited by the human head after absorption and reflection of radiation, based on free space radiation. In the present application, the loss of radiation performance of the antenna due to absorption of radiation by the human head or the like may be referred to as head mode loss.

Furthermore, the efficiency in different scenarios may in turn include the radiation efficiency as well as the system efficiency. The radiation efficiency may identify the highest efficiency that the antenna system can achieve with a complete impedance match in the current environment (e.g., in free space, in head mode, etc.). The system efficiency may identify the efficiency that the antenna system has in the current environment and in the current port matching state. That is, the radiation efficiency may indicate the maximum radiation capacity of the antenna system, and the system efficiency may indicate the actual efficiency of the antenna in the current state. By increasing the radiation efficiency, the system efficiency can generally be increased under the same conditions. Under the condition of unchanged radiation efficiency, the purpose of improving the system efficiency can be achieved by improving port matching.

It will be appreciated that most of its operating scenarios are worn in the human ear for wireless headphones. Therefore, the head mold efficiency is one of important communication indexes of the wireless headset. Therefore, the head mode loss is controlled, so that the head mode efficiency of the antenna in the wireless earphone can be improved. In addition, the wireless earphones designed in pairs are required to communicate with each other, and in the communication process, signals need to bypass the head die, so that the communication quality between the wireless earphones can be improved by reducing the head die loss. In this example, the communication capability between wireless headsets that bypasses the headdie may be identified by the winding head gain of the antenna. The wraparound gain may be an average gain value of the wireless headset near the non-wearer side ear. The higher the winding head gain, the more communication capability between the wireless headsets that bypasses the head mould.

At present, with reference to the foregoing descriptions of fig. 2 and 3, the average value of the free space efficiency of the earphone antenna is generally about-6 dB, the amplitude reduction of the head mode is generally 6dB to 8dB when the earphone antenna is worn, and the average value of the head mode efficiency is-12 dB to-14 dB. In addition, in terms of head winding gain, since the head mode loss is large, the gain is mainly formed by diffraction, and the reference industry is generally from-28 dBi to-32 dBi. That is, the current scheme is not ideal in terms of both the head-up efficiency and the head-winding gain, thereby affecting the communication quality of the wireless headset.

The antenna scheme provided by the embodiment of the application can be applied to portable mobile terminals such as wireless headphones and the like, and can reduce the head die loss, thereby achieving the effects of improving the head die efficiency and winding head gain.

During the operation of the antenna, an electric field is distributed in the surrounding space. Under otherwise identical conditions, the lower the electric field values of the antenna radiator and the surrounding antenna, the smaller the head mode loss. The smaller the effect of the head mould on the antenna radiation, the higher the corresponding head mould efficiency and the winding head gain. The antenna scheme provided by the embodiment of the application can generate smaller electric field values in the working process through the configuration of the antenna structure under the same conditions (such as the same environment, the same input power and the like), thereby achieving the effect of reducing the head model loss and further improving the communication quality of the wireless earphone. In the embodiment of the application, the antenna scheme with smaller electric field value can also be called as a low-field type antenna.

The application scenario of the scheme provided by the embodiment of the application is described below with reference to the accompanying drawings.

The antenna scheme provided by the embodiment of the application can be applied to wireless earphones, is used for supporting wireless connection between the wireless earphones and other terminal equipment, and can also be used for supporting mutual communication between paired wireless earphones. In other implementations of the present application, the low-field antenna may be applied to other electronic devices with similar communication requirements, such as headphones, smart glasses, etc., which are not described herein.

By way of example, a bluetooth headset (hereinafter simply referred to as a headset) is taken as an example. Fig. 4 shows a schematic diagram of the composition of an earphone 400 according to an embodiment of the present application.

In this example, similar to the composition of fig. 2, the headset 400 may also include an ear cup portion 402, and an ear stem portion 401. The ear cup 402 is the portion of the headset 400 that is worn in the human ear. The ear stem 401 may be the portion of the headset 400 that is exposed to the outside of a person's ear when worn. As shown in fig. 4, in this example, the ear stem portion 401 may further include a connection portion and an ear post portion. The ear post portion may be a portion of the ear stem portion 401 disposed along the Y direction. Correspondingly, the connection portion may be a portion of the ear stem 401 connecting the ear cup 402 and the ear post.

As shown in an example of fig. 4, in the earphone 400 provided in this example, an antenna may be provided for supporting a wireless connection function of the earphone 400 with other terminal devices (such as an audio input output device of a mobile phone). In some scenarios, the antenna may also be used to support wireless interconnection between headphones 400 arranged in pairs. In addition, a battery may be further disposed in the earphone 400, for supplying power to and outputting power to the operation of the earphone 400. In some embodiments, the battery may also be provided in a connection in the ear stem 401. Unlike the earphone 400 composition shown in fig. 2, in this example, an antenna may be provided at the ear stem 401. Correspondingly, a battery may be provided in the ear cup 402. Therefore, the antenna radiator can not be wrapped by the human ear when the earphone 400 is worn and works, so that the influence of human bodies (such as human ears, heads and the like) on the antenna work is reduced.

A plurality of hardware components may also be provided in the headset 400 shown in fig. 4 for implementing the functions of the headset. Exemplary, as shown in fig. 5A, a schematic diagram of a composition of another earphone according to an embodiment of the present application is provided. The headset 500 may be a specific composition of the headset 400 as shown in fig. 4. It should be understood that the composition of the headset 500 as shown in fig. 5A is not to be construed as a specific limitation on the headset, but merely as one possible example. In other embodiments, headset 500 may also include more or fewer components. The specific composition of the earphone is not limited in the embodiment of the application.

For example, as shown in fig. 5A, the headset 500 may include a battery 501, a speaker assembly 502, a microphone (not shown in fig. 5A), a first circuit board 504, a second circuit board 505, a main chip 506, a touch assembly 507, a charging module (not shown in fig. 5A), an antenna mount 508, an antenna 509, and the like.

The outer appearance of the ear cup portion 402 of the headset 500 may be an ear cup 515. Inside the ear shell 515, there may be provided a battery 501, a speaker assembly 502, a second circuit board 505, etc. Wherein the speaker assembly 502 and the battery 501 are connected to the second circuit board 505. The second circuit board 505 may be a flexible circuit board that facilitates compact layout routing under irregular space within the ear-cup portion 402. The speaker assembly 502 is used to amplify the audio signal processed by the main chip 506 for delivery to the human ear. The battery 501 provides power to the headset 500 as a whole.

In the example shown in fig. 5A, the outer periphery of the ear stem portion 401 of the headset 500 may include an ear stem outer housing 510 and an ear stem inner housing 511. The ear stem outer case 510 and the ear stem inner case 511 may be used to form an exterior surface of the ear stem portion 401, and other functional components may be provided in the exterior surface. In this example, the functional components included in the ear stem 401 may include a first circuit board 504 and an antenna mount 508. The ear stem 401 may further include a main chip 506 disposed on the first circuit board 504, a touch assembly 507, and an antenna 509 disposed on the antenna support 508. In some implementations, a microphone (not shown in fig. 5A) may also be provided on the first circuit board 504. A microphone, as a sound pickup device, may be used to collect the user's sound signals. The number of microphones may be one or more in different implementations. The microphone may convert the acoustic signals to electrical signals that are transmitted to the main chip 506. The main chip 506 may transmit an electrical signal corresponding to the sound signal to the terminal device through a wireless transmission link between the earphone 500 and the terminal device, so as to achieve a voice function.

Correspondingly, one or more pick-up holes may be provided on the ear stem outer housing 510. Taking two sound pickup holes as an example, the ear stem outer case 510 may be provided with a first sound pickup hole 512 and a second sound pickup hole 513. In order to prevent dust from entering the cavity of the earphone 500, a dust screen assembly may be disposed at a position corresponding to the pick-up hole. For example, a corresponding dust-proof net assembly may be provided at a corresponding position of the first sound pickup hole 512 and/or the second sound pickup hole 513, respectively. In this example, the dust-proof net assembly 514 is disposed at a position corresponding to the first sound collection hole 512. In various implementations, the material comprising the dust screen assembly 514 may be a conductive material or a non-conductive material. In this example, the dust screen assembly 514 is formed of a metallic material. The area of the antenna 509 relief on the antenna backing 508 may be larger than the area of the first sound pickup aperture 512 for coexistence with the structure of the metal dust screen assembly 514.

In general, key components of metal dust screen assembly 514 may include metal dust screen 514A, and metal dust screen spacer 514B. In the assembly process, the metal dust screen 514A may be fixed on the inner surface of the outer shell 510 of the ear rod by using adhesive, and the metal dust screen 514A and the metal dust screen pad 514B may be electrically connected by using a large-area conductive adhesive or spot welding, so that the two metal parts are conducted. A top view of the metal dust screen 514A and metal dust screen spacer 514B included in the metal dust screen assembly 514 is shown as (a) in fig. 5B. Fig. 5B (B) shows an oblique side view of metal dust screen 514A and metal dust screen spacer 514B included in metal dust screen assembly 514. It should be appreciated that the metal dust screen assembly 514 generally requires a grounding process to protect nearby electronics from static electricity on the metal dust screen assembly 514.

In this example, because the metal dust screen assembly 514 is very close to the antenna 509, if the metal dust screen assembly 514 alone achieves electrostatic to ground conduction, it can have a significant impact on the performance of the antenna 509. In this example, metal dust pad 514B may be directly electrically connected to the radiator of antenna 509. For example, the metal dust screen pad 514B is spring-connected to the radiator of the antenna 509 by providing a conductive spring. This allows the metal dust screen assembly 514 to act as part of the radiator of the antenna 509 to assist in radiating during operation of the antenna 509. By increasing the antenna 509 area, antenna 509 performance is improved. In addition, as the antenna 509 is provided with a ground path, electrostatic diversion from the metal dust screen component 514 to the ground is also realized, and the function multiplexing of the same structural component is realized.

In an embodiment of the present application, the first circuit board 504 may be implemented by a printed wiring board (printed circuit board, PCB) and/or a flexible circuit board (Flexible Printed Circuit, FPC). For example, the first circuit board 504 may be implemented in the form of a combination of a PCB and an FPC. As another example, the first circuit board 504 may be implemented by a simple FPC or PCB. In this example, the first circuit board 504 is exemplified as a form of combining with a PCB through an FPC to realize its function. The function of the touch control component 507 can be realized through relevant settings on the FPC. Illustratively, the touch control component 507 may implement the touch control functionality of the headset 500. For example, the headset 500 may receive an indication of a user via the touch component 507. The user's instruction may be inputted through a touch, a slide, or the like operation. To receive user input, a sensing portion may be provided in the touch assembly 507, which may be provided on an inner surface of the ear stem outer housing 510. The control chip of the touch unit may be laid out on the first circuit board 504.

On the first circuit board 504, one or more circuits formed of a plurality of electronic devices may be provided. The circuitry may be used to implement processing of analog and/or digital signals in conjunction with main chip 506. Some of the circuitry on the first circuit board 504 may be connected to the antenna 509 for feeding the antenna 509 in a transmit scenario and/or for receiving signals from the antenna 509 for processing in a receive scenario. In some embodiments, the circuitry coupling the antenna 509 to the main chip 506 may be radio frequency circuitry. The radio frequency circuit may be provided with one or more filtering devices, signal amplifying devices, etc. The radio frequency circuit may be used for performing signal processing in an rf domain, where the rf domain signal may be an analog signal. In some implementations, the various components and circuits provided on the radio frequency circuit may be collectively referred to as a radio frequency module.

An antenna 509 coupled to the radio frequency module may be provided on the antenna mount 508. As shown in fig. 5A, the antenna mount 508 may be located between the ear post outer housing member 510 and the first circuit board 504. The antenna 509 correspondingly disposed on the antenna backing 508 may be any one of the following: ceramic antennas, steel sheet antennas, laser direct structuring (LASER DIRECT structuring, LDS) antennas, or in-mold injection antennas, etc.

As an example, fig. 6 shows a schematic diagram of an antenna mount 508 and a corresponding antenna 509. Fig. 6 (a) is a schematic diagram of the antenna stand 508. The antenna 509 shown in fig. 6 (b) may be mounted or provided on the antenna mount 508. In this example, in combination with the example shown in fig. 5A, the profile of the antenna mount 508 may be matched to the projection of the ear shaft 401 on the XOY plane. This allows the antenna 509 provided on the antenna stand 508 to obtain a maximum area. Because of the arrangement of the first sound pickup hole 512, the second sound pickup hole 513 and the touch control assembly 507, the antenna bracket 508 can perform line avoidance at the corresponding positions of the first sound pickup hole 512, the second sound pickup hole 513 and the touch control assembly 507. In addition, in some embodiments, the antenna support 508 may further include a region partially overlapping the touch component in the Z-direction (e.g., a first trace overlapping region shown in fig. 6 (a)). In the first routing overlapping area, the antenna support 508 can be adjusted through the Z-directional recess, so that under the condition that the integrity of the antenna support 508 is ensured, a height space is reserved for the touch component 507, and coexistence among components is realized. In addition, in order to achieve the function of the touch control component 507, a metal wire or the like needs to be arranged to achieve signal transmission. The metal trace, due to its close distance from the antenna 509, may have an effect on the antenna radiation (e.g., introduce clutter, reduce efficiency, etc.). In some implementations of the application, filtering components may be provided on the metal traces (and/or the trace paths of the corresponding circuit board) to reduce or eliminate the effects of the metal traces on the antenna. For example, taking the working frequency band of the antenna 509 as the bluetooth frequency band, a filter circuit corresponding to the bluetooth frequency band may be disposed on the metal wire to prevent clutter generated by the metal wire (such as wires in the touch component 507) from falling into the bluetooth frequency band, thereby achieving the effect of reducing or eliminating the influence of the touch component 507 on the antenna.

An antenna 509 as shown in fig. 6 (b) may be provided on the antenna stand 508 as shown in fig. 6 (a). In various implementations of the application, antenna 509 may correspond to the maximum radiator area. In some implementations, the area of the antenna radiator may also be smaller than the area shown in (b) of fig. 6.

It should be appreciated that the structural relationship between the antenna radiator and the antenna support 508 may be flexible when the antenna 509 is implemented by different processes. For example, when the antenna radiator is implemented by an FPC, the FPC may be attached to the antenna bracket 508. As another example, where the antenna radiator is implemented by LDS, the antenna radiator may be etched on the surface of the antenna mount 508, etc. by an LDS process.

The antenna 509 scheme provided by the embodiment of the application can be applied to the antenna with the composition shown in fig. 5A or fig. 6. For example, the low electric field antenna 509 provided by the embodiment of the present application may be implemented based on the antenna stand 508 and the antenna 509 as shown in fig. 6.

The antenna scheme provided by the embodiment of the application is exemplified below.

Fig. 7 is a schematic diagram of a low electric field type antenna according to an embodiment of the application. In this example, the antenna may be disposed in the ear stem.

For example, in an embodiment of the present application, a feed (i.e., feed point) and a ground point may be provided on the antenna. For an example, please refer to fig. 7, which illustrates an example of an antenna scheme provided in a wireless headset according to an embodiment of the present application. As shown in fig. 7, the antenna may include a radiator, which may be L-shaped. One end of the radiator may be provided with a ground point G1. The other end of the radiator may be provided with a feed F1. In other embodiments, the location of the ground point may be different from the end of the radiator as shown in fig. 7. For example, the ground point G1 may be provided at an arbitrary position on the lower half of the antenna radiator. In addition, the arrangement of the feed source F1 is only an example in fig. 7, and in other implementations of the embodiment of the present application, the position of the feed source F1 on the radiator may be flexibly adjusted according to the position of the ground point G1. For example, to be able to excite a 1/4 wavelength mode on the radiator, the length of the radiator may be 1/4 wavelength of the operating band (e.g. the bluetooth band). It should be noted that, due to the limitation of the boundary condition, the ground point G1 may be relatively fixedly disposed, and the position of the corresponding feed source F1 may be flexibly selected.

It should be noted that, in the antenna scheme shown in fig. 7, the opening of the U-shaped structure formed by the antenna radiator and the reference ground may be upward. That is, when the antenna is disposed in the wireless headset, the opening of the U-shaped structure may be directed in the direction of the top of the user's head, rather than in the direction of the user's chin, when the wireless headset is worn by the user. From another perspective, the antenna scheme provided by the embodiment of the application can have the ground point arranged on the lower half part of the radiator.

As one possible implementation, a specific implementation of the antenna scheme as shown in fig. 7 is described in connection with the structural components as shown in fig. 5A and 6. Please refer to fig. 8. In fig. 8, (a) is a hard board portion (e.g., first hard board 801) of the first circuit board 504. For example, the hard board portion may be a portion of the first circuit board 504 that is formed by a PCB. In addition to the hard board portion, the first circuit board 504 may include a portion of a flexible board (e.g., FPC). As shown in fig. 8 (a), the first hard board 801 (or referred to as a first PCB) may be provided with a plurality of components thereon. Wherein a first conductive element 802 and a second conductive element 803 may be included. The first conductive element 802 and the second conductive element 803 may be used to electrically connect an antenna radiator on the antenna support to corresponding circuitry on the first rigid board 801. For example, in various implementations, the first conductive element 802 and/or the second conductive element 803 may perform their functions through electrical connection components such as conductive foam, conductive spring, conductive thimble, and the like. As an example, a conductive spring is provided at the first conductive member 802. When the antenna support on which the antenna is mounted and the first hard board 801 are assembled in the earphone, the elastic sheet at the first conductive piece 802 can realize conduction between the corresponding circuit on the first hard board 801 and the antenna radiator in a spring connection manner. Illustratively, the first conductive element 802 may be connected to a first conductive point 804 on the antenna 509 to thereby achieve a feed point to the antenna. The second conductive element 803 may be connected to a second conductive point 805 on the antenna 509 to thereby achieve the grounding of the antenna. In other implementations, the first conductive element 802 and/or the second conductive element 803 may also perform their electrical connection function through other conductive processes. For example, at the first conductive element 802, a bonding pad corresponding to the first hard board 801 may be soldered (e.g. spot-welded) to an exposed bonding pad corresponding to the antenna radiator, so as to implement the electrical connection function of the first conductive element 802.

Corresponding to the electrical connection parts (e.g., the first conductive part 802 and the second conductive part 803) provided on the first hard plate 801 as shown in fig. 8 (a), as shown in fig. 8 (b), after the antenna 509 is assembled or set with the antenna stand, the connection part of the first conductive point 804 and the first conductive part 802 may correspond to the feed F1 (or the feed point) of the antenna 509. The connection of the second conductive point 806 with the second conductive member 803 may correspond to the ground point of the antenna 509.

It should be appreciated that the arrangement of the first conductive points 804 and the second conductive points 805 on the antenna 509 may correspond to a specific manufacturing method of the antenna 509. Take the antenna implementation by LDS process as an example. In this example, the outer surface of the antenna mount may be coated with an LDS corresponding material that may be converted from a non-conductive body to a conductive body after laser irradiation. Thus, the corresponding antenna radiator can be obtained by carrying out laser along the preset antenna wiring on the surface of the antenna bracket. In other implementations, the antenna is mounted on the antenna mount using an FPC as an example. It should be appreciated that the antenna facing is typically coated with a non-conductive ink for protecting the internal traces. Then, in order to realize the feeding (or feeding and grounding) to the antenna, copper exposure treatment may be performed at a corresponding position on the antenna appearance surface so as to realize the electrical connection with the antenna radiator through the copper exposure point. For example, as shown in (b) of fig. 8, a first conductive point 804 and a second conductive point 805 may be provided on the antenna. When the antenna is in an FPC architecture, the first conductive points 804 and the second conductive points 805 may be exposed copper points on the FPC of the antenna. The first conductive point 804 and the second conductive point 805 may be positioned to correspond to the first conductive member 802 and the second conductive member 803, respectively. That is, the antenna FPC may be attached to the antenna mount, and when the antenna mount is assembled with the first hard board 801 in the earphone, the first conductive point 804 may be electrically connected to the first conductive member 802, and the second conductive point 805 may be electrically connected to the second conductive member 803.

Illustratively, in connection with the antenna scheme illustrated in fig. 7, in this example as in (b) of fig. 8, the second conductive point 805 may be used to ground through the second conductive member 803. The first conductive point 804 may be connected to a radio frequency circuit corresponding to the feed through the first conductive element 802. Thereby achieving the effect of feeding through the first conductive point 804 and grounding through the second conductive point 805. Thus, the U-shaped structure of the antenna and the first hard plate 801 as a reference ground can have a structural feature of opening upward, thereby obtaining an effect of low electric field distribution.

It should be noted that, in some embodiments of the present application, the first conductive point 804 and/or the second conductive point 805 may further provide a matching circuit between the conductive point and the circuit when connected to the circuit on the first hard board 801 through the corresponding conductive member. As shown in fig. 9, the antenna feed F1 may be connected to the radio frequency module through the first matching module, and may be connected to the baseband module through the radio frequency module. The baseband module may perform its functions by a baseband processor, or by other components with digital processing capabilities, such as a Microprocessor (MCU), etc. The antenna ground point G1 may be connected to a reference ground on the first stiffener 801 through a second matching module. In the embodiment of the application, the baseband module may also be called a communication module.

In this example, the matching circuit (e.g., the first matching circuit and/or the second matching circuit) may include at least one of the following: capacitance, inductance, resistance, variable capacitance, variable inductance, variable resistance, and the like. The components in the matching circuit may be in series or parallel. The number of the components can be flexibly adjusted according to actual needs. It should be understood that, taking the first matching circuit between the first conductive point 804 (i.e. the feed source) and the radio frequency circuit as an example, by adjusting the types, the numbers and/or the values of the components on the first matching circuit, the matching of the antenna ports can be achieved, so as to achieve the effect of tuning the corresponding resonance of the antenna to the working frequency band. For example, the 1/4 wavelength resonance of the antenna may be tuned to the bluetooth operating band by port matching. Similarly, in some embodiments, a second matching circuit may be disposed between the second conductive point 805 (i.e., the grounding point) and the reference ground of the first hard board 801, and by adjusting the type, number, and/or value of the components on the second matching circuit, matching of the grounding terminal may be achieved, and an effect of tuning the corresponding resonance of the antenna to the operating frequency band may also be obtained. In various implementations of the application, the function of the first matching circuit and/or the second matching circuit may also be implemented in other forms, such as a band-pass filter, a band-reject filter, etc. The embodiment of the application is not limited to the specific implementation of the first matching circuit and/or the second matching circuit. As an example, the operating frequency band of the antenna includes the bluetooth frequency band. The second matching circuit may be arranged to exhibit a bandpass characteristic over the bluetooth frequency band, thereby enabling current in the bluetooth frequency band to pass back to ground through the second matching circuit. In combination with the foregoing description, in some implementations, the second matching module may also implement a dc ground by way of a microstrip line or the like.

In different circumstances, the 1/4 wavelength mode of excitation of the antenna may partially or fully cover the operating band, or the 1/4 wavelength mode may be outside the operating band, without matching. The first matching circuit and/or the second matching circuit may then be arranged according to the specific circumstances in different implementations of the application. For example, the first matching circuit tuning port is set for matching, and the second matching circuit tuning ground is not set. For another example, the second matching circuit tuning ground is set and the first matching circuit tuning port is not set for matching. For another example, the tuning ports of the first matching circuit are set to match at the same time, and the tuning ground of the second matching circuit is set. For another example, the first matching circuit tuning port matching is not set, nor is the second matching circuit tuning ground set.

In connection with the connection between the modules on the communication link shown in fig. 9, and the functions of the modules described above. It should be appreciated that, in different implementations, the connection relationship between the modules on the communication link may be flexibly set according to the actual situation. The number of the modules can be correspondingly adjusted.

By way of example, fig. 10A illustrates an example of the arrangement of various modules on several possible communication links provided by embodiments of the present application. In this example, the communication link where the first conductive point 804 (i.e., the feed F1) is located is illustrated as an example.

As shown in fig. 10A (a), the antenna may be connected to the first conductive member 802, the first antenna matching module, the radio frequency module, and the communication module in this order through the first conductive point 804. The first antenna matching module may be a device set mainly based on inductance and capacitance to adjust the input impedance of the antenna or limit the boundary condition of the antenna. For example, the first antenna matching module may take the form of a high impedance match (e.g., a series large inductance, a series small capacitance, or a band-stop match). In some implementations, a parallel location may also be provided in the first antenna matching module for providing a parallel inductance and capacitance, if needed, to adjust the resonant location of the antenna.

Further, in various implementations, one or more devices may be included in the first antenna matching module. The first conductive member 802 is a connection device for connecting the antenna matching module and the antenna conductive point, and may be a conductive device such as a spring sheet, a conductive foam, and the like. Thus, when the antenna is operated, feeding to the antenna can be achieved by the link as shown in (a) of fig. 10A.

In the example of (b) in fig. 10A to (d) in fig. 10A, connection cables may also be provided between the respective modules. By way of example, the connection cable may comprise at least one of the following: coaxial lines, microstrip lines, liquid crystal polymers (Liquid Crystal Polymer, LCP), and the like. The connection cable can be used for transmission of feeding signals between boards. For example, the connection cable may be used for transmission of feed signals between the first circuit board 504 and the second circuit board 505 as shown in fig. 5A. As another example, the connection cable may be used for transmission of feed signals between the first stiffener 801 on the first circuit board 504 and other circuit boards (e.g., flex boards). Therefore, through the arrangement of the connecting cables, different modules can be incompletely arranged on the same circuit board, and the flexibility of module arrangement is improved.

For example, as shown in (b) of fig. 10A, a connection cable may be provided between the first conductive member 802 and the first antenna matching module. The first conductive element 802 may thus be disposed on one circuit board (e.g., the first hard board 801), and the corresponding first antenna matching module, radio frequency module, and communication module may be disposed on another circuit board (e.g., the flex portion of the first circuit board, and/or the second circuit board). Therefore, separation of module arrangement is realized, and design flexibility is improved.

As shown in (c) of fig. 10A, the connection cable may be disposed between the radio frequency module and the first antenna matching module. Thus, the first conductive element 802 and the first antenna matching module may be disposed on one circuit board (e.g., the first hard board 801), and the corresponding radio frequency module and communication module may be disposed on another circuit board (e.g., the flex portion of the first circuit board, and/or the second circuit board). Therefore, separation of module arrangement is realized, and design flexibility is improved.

As shown in (d) of fig. 10A, the connection cable may be disposed between the radio frequency module and the communication module. Thus, the first conductive element 802, the first antenna matching module, and the radio frequency module may be disposed on one circuit board (e.g., the first hard board 801), and the corresponding communication module may be disposed on another circuit board (e.g., the flex portion of the first circuit board, and/or the second circuit board). Therefore, separation of module arrangement is realized, and design flexibility is improved.

It should be appreciated that in other implementations, more connection cables may be provided to achieve a split design of more modules, based on any of the possible implementations shown in fig. 10A. Furthermore, in combination with the foregoing description, in any possible implementation of the foregoing examples, a specific implementation of the first matching module may be flexibly selected according to an actual port matching situation. For example, in some implementations, in the case where the original port matches well, the first matching module may not be set, thereby simplifying the module setting.

Referring to fig. 10B, several possible examples of arrangements of modules on a communication link are provided for embodiments of the present application. In this example, the communication link where the second conductive point 805 (i.e., the ground point G1) is located is illustrated as an example.

As shown in fig. 10B (a), the antenna may be sequentially connected to the second conductive member 803, the second antenna matching module, and a reference ground (e.g., a reference ground provided by the first circuit board) through the second conductive point 805. The second conductive member 803 is a connection device for connecting the antenna matching module and the antenna conductive point, and may be a conductive device such as a spring sheet, a conductive foam, or the like, similar to the first conductive member 802. The second antenna matching module may comprise a small inductance, a large capacitance, or a bandpass match. The large electric field region of the antenna can thereby be adjusted to the +y direction of the ear stem, i.e. at the top of the ear stem, and the large current region is located in the-Y direction of the ear stem, i.e. at the bottom of the ear stem. In addition, the metal dust screen assembly can also play a role in the ground. In some implementations, the first and/or second matching modules may further include a parallel transient voltage suppression diode (TRANSIENT VOLTAGE SUPPRESSION, TVS) to prevent static intrusion into the communication path, allowing static to go down as soon as possible. In other implementations of the application, the TVS may be disposed in the corresponding first antenna matching module of the first conductive element 802 to conduct static electricity to the floor in parallel.

In other embodiments, the antenna may also employ a dc down ground scheme. For example, as shown in fig. 10B (B), the antenna may be sequentially connected to the second conductive member 803 and the reference ground (e.g., the reference ground provided by the first circuit board) through the second conductive point 805. In this scenario, the setting overhead of the second matching module is saved by direct current grounding.

Continuing with the description of the solution shown in fig. 7, it should be understood that the arrangement of the first conductive member 802 and the second conductive member 803 shown in (a) of fig. 8, and the arrangement positions of the first conductive point 804 and the second conductive point 805 shown in (b) of fig. 8 are both examples. In other embodiments of the application, the location of the electrical connection on the antenna and on the first stiffener 801 may also be different from the example shown in fig. 8. Exemplary, referring to fig. 10C, several examples of the placement of the first conductive points 804 and the second conductive points 805 on the antenna are provided for embodiments of the present application. Taking the first conductive point 804 as the feed source F1, the second conductive point 805 as the ground point G1 as an example. The positions of the first conductive points 804 and the second conductive points 805 on the first hard board 801 correspond to each other, and are not described herein. In the example shown in fig. 10C, 10-1 and 10-9, the positions of the first conductive point 804 and the second conductive point 805 may be similar to those shown in (b) of fig. 8.

In the examples of 10-1 to 10-8, the position of the ground point G1 (i.e., the second conductive point 805) may be unchanged, such as being disposed on the lower half of the antenna radiator, and the position of the feed source F1 may be flexibly adjusted. Illustratively, as shown at 10-1, the feed F1 may be disposed on the left radiator on the antenna radiator near the first sound pickup hole (i.e., the upper sound pickup hole). As shown at 10-2, the feed F1 may be disposed on top of the antenna radiator. As shown in fig. 10-3, the feed source F1 may be provided on the right side radiator on the antenna radiator near the first sound pickup hole. As shown in fig. 10-4, the feed F1 may be disposed on the antenna radiator at a right side position near the middle. As shown in fig. 10-5, the feed F1 may be disposed on the antenna radiator at a position near the upper side of the ground point G1. As shown in fig. 10-6, the feed F1 may be disposed at a bottom position of the antenna radiator. As shown in fig. 10-7, the feed F1 may be provided on the left radiator on the antenna radiator near the second sound pickup hole (i.e., the lower sound pickup hole). As shown in fig. 10-8, the feed F1 may be disposed on the antenna radiator at a left side position near the middle.

In the examples 10-9 to 10-13, the position of the ground point G1 may also be flexibly adjusted, for example, arranged on the radiator in the lower part of the antenna. Take the example that the feed source F1 is provided on the left radiator on the antenna radiator near the first sound pickup hole (i.e., the upper sound pickup hole). The ground point G1 may be provided at the bottom of the antenna radiator, as shown at 10-10. As shown in fig. 10-11, the ground point G1 may be provided on the left side radiator on the antenna radiator near the second sound pickup hole (i.e., the lower sound pickup hole). As shown in fig. 10-12, the ground point G1 may be provided on the antenna radiator on the right side radiator near the second sound pickup hole (i.e., the lower sound pickup hole).

It should be understood that the positions of the first conductive point 804 and the second conductive point 805 shown in fig. 10C are only some examples, and in other implementations, the positions of the first conductive point 804 and the second conductive point 805 in the different examples may also be alternating with each other. In a different implementation, by setting the first conductive point 804 and the second conductive point 805, the antenna radiator and the reference ground can be made to have an opening with a U-shaped structure formed by the grounding points upward, so that when the antenna works, the large electric field area is located in the +y direction of the ear pole, that is, at the top of the ear pole. The high current region is located in the-Y direction of the ear stem, i.e., at the bottom of the ear stem. Thereby obtaining lower electric field distribution and reducing head mode loss.

In the foregoing example, it was clarified that in the case where the antenna opening is upward, it is possible to have a lower electric field distribution, whereby the head mode loss can be significantly reduced. The above effect is demonstrated below in combination with a comparison of the open-top and open-bottom schemes.

Illustratively, the description is provided in connection with the scheme comparison shown in FIG. 11.

As shown in fig. 11, the field value distribution of the two antenna schemes, opening up and opening down, was compared by simulation. In the electric field simulation, the darker the color of the electric field distribution (i.e., the higher the gray value), the larger the corresponding electric field value.

Fig. 11 (a) shows an antenna arrangement scheme with an upward opening and a distribution of a corresponding electric field. For example, in an open-up version, the ground point G1 may be disposed at an end of the radiator remote from the ear cup. In this example, the ground point G1 may realize its grounding function by being grounded to a floor (e.g., a printed circuit board or the like as a reference ground). The feed source F1 may be disposed at an end of the radiator near the ear-bag portion.

Fig. 11 (b) shows the distribution of the corresponding electric field in the antenna arrangement with the opening down. For example, in the case of the downward opening, the ground point G2 may be provided at an end of the radiator close to the ear cup. In this example, the ground point G2 may also perform its ground function by being grounded to the floor. The feed F2 may be disposed at an end of the radiator remote from the ear-bag portion.

Comparing the electric field simulation results of the open-top solution and the open-bottom solution, it can be seen that in the open-top solution, the electric field value is smaller, the distribution area is smaller, and the electric field simulation results are mainly concentrated near the ear drum. Correspondingly, in the scheme with the downward opening, the electric field value is larger, the distribution area is more, and the electric field value is mainly concentrated near the tail end of the ear rod. Thus, under the same input power condition, the electric field value of each part in the space is lower in the scheme (namely the scheme provided by the application) of opening upwards with larger electric field distribution area. As compared with the electric field simulation in fig. 11, the solution provided by the embodiment of the present application (i.e. the solution with the opening up) has a lower spatial electric field value distribution and a lower electric field distribution on the radiator.

Thus, based on the foregoing description, the antenna scheme provided by the embodiment of the application with a lower electric field value distribution has lower corresponding head mode loss. The following describes S-parameter simulation in the head model scenario shown in fig. 12.

As shown in (a) of fig. 12, S11 is compared between the opening up scheme and the opening down scheme. The resonance center of both schemes is around 2.48 GHz. The bandwidth of the opening up scheme is significantly higher than the bandwidth of the opening down scheme. As shown in (b) of fig. 12, the radiation efficiency of the open-up scheme is compared with that of the open-down scheme. In the resonance center position, although the resonance depth of the opening-up scheme is lower than that of the opening-down scheme, the radiation efficiency is higher than that of the opening-down scheme. That is, the deeper S11 in the opening-down scheme is due to the larger loss (such as head-mode loss), and the deeper S11 does not correspond to the better radiation efficiency. As shown in fig. 12 (c), the system efficiency is compared for the open-up scheme with the open-down scheme. It can be seen that the system efficiency peak for the open-up approach is still higher than the system efficiency peak for the open-down approach. Further, the efficiency bandwidth of the open-up scheme is significantly better than that of the open-down scheme, corresponding to the higher bandwidth in S11, in terms of system efficiency.

In this way, it can be demonstrated that the aperture-up scheme has better radiation performance in both antenna schemes as shown in fig. 11. Corresponding to the electric field simulation shown in fig. 11, it can be demonstrated that the low-electric-field antenna with lower electric field value distribution can have better head-mode radiation performance under the same conditions in the previous example.

In the description of the antenna scheme provided in the embodiment of the present application in fig. 7 to 12, the composition of the antenna scheme is described from the perspective of the feed source and the ground point arrangement. The antenna scheme with the feed source and grounding point setting characteristics can be IFA, PIFA, left hand (CRLH), T-shaped antenna and the like. Embodiments of the present application are not limited with respect to the implementation of a low electric field antenna with an upward opening.

In the examples of fig. 7-12 described above, the resonance covering the operating band may be obtained by excitation of the antenna radiator operating at 1/4 wavelength. The embodiment of the application also provides an antenna scheme which can multiplex the reference ground and acquire double resonances near the working frequency band. Therefore, the distribution area of the electric field in the working process of the antenna can be further increased, and the electric field value of each point is reduced. Further, the head mode loss is further reduced, and the wireless earphone obtains better communication quality.

As illustrated by way of example in fig. 13. The portion of the reference ground remote from the ground point may also be connected to the reference ground extension portion. The reference ground extension may also be a zero potential reference similar to the reference ground. As an example, as shown in fig. 14, when the antenna scheme is disposed in the earphone, the reference ground extension portion may be formed by a flexible board portion disposed in a first circuit board of the ear stem portion and a second circuit board (e.g., a flexible board corresponding to the second circuit board) disposed in the ear cup portion.

Thus, during operation of the antenna as shown in fig. 13, the reference ground extension and the reference ground can jointly excite the 1/2 wavelength mode in addition to the 1/4 wavelength mode that can be excited on the antenna radiator, thereby forming a dual resonance effect. It should be appreciated that in other embodiments, the reference ground extension and the reference ground may also jointly excite frequency doubling of 1/2 wavelength modes, such as 1-wavelength mode, 3/2 wavelength mode, etc., for jointly forming a dual-resonant coverage operating band with the 1/4 wavelength mode. In this example, the reference ground extension and the reference ground co-excite the 1/2 wavelength mode are taken as examples.

As a possible implementation, the length of the antenna radiator may be determined from 1/4 wavelength of the operating frequency band, so that the excitation 1/4 wavelength mode covers the operating frequency band. In other implementations, the total length of the reference ground extension and the reference ground may be determined based on 1/2 wavelength of the operating frequency band, thereby exciting a 1/2 wavelength mode to cover the operating frequency band. In the implementation process, the total length of the first circuit board and the second circuit board can be controlled so as to meet the above-mentioned size requirement, and the excitation 1/2 wavelength mode covers the working frequency band. For example, in the case where the first circuit board and the second circuit board constitute the reference ground, the sum of the lengths of the first circuit board and the second circuit board may correspond to 1/2 wavelength. In other embodiments, where the total length of the first and second circuit boards is small, an inductor or the like may be provided at an appropriate position so as to increase the reference ground length. In other embodiments, when the total length of the first circuit board and the second circuit board is smaller, a band-stop network based on the operating frequency band may be set at a suitable position so as to adjust the electrical length of the reference ground to a suitable position.

In this example, due to the upward arrangement of the antenna opening, it is possible to have the effect of low electric field distribution, so that the entire antenna system has low head mode loss. At the same time, the antenna performance is further improved due to the coverage of the double resonance described in the above example.

As an example, as shown in the electric field simulation result in fig. 13, in combination with the electric field simulation effect of the opening-up scheme and the opening-down scheme shown in fig. 11, it can be seen that after the reference ground expanding portion (as in the scheme example shown in fig. 14) is added, the electric field distribution is expanded from the ear stem portion to the ear pocket portion, so that the electric field distribution range is larger and the local electric field value is lower with the same input power. In addition, as can be seen from electric field simulation, at the antenna opening (i.e. the end of the antenna radiator near the ear-bag), the field value on the radiator or in the surrounding space is significantly reduced compared with the scheme that the opening is upward before the reference ground expansion part is added. In combination with the effect explanation of the above-described opening-up scheme, the head mode loss of the scheme provided in this example is smaller, and the antenna performance is better. The following describes the S-parameter simulation results shown in fig. 15.

As shown in fig. 15 (a), a comparison is made between the opening up scheme (abbreviated as single wave) before the additional reference earth expansion portion shown in fig. 7 and the opening up scheme (abbreviated as double wave) after the additional reference earth expansion portion shown in fig. 14 (S11). It can be seen that in a duplex wave scheme, resonance around 2.4GHz may correspond to a 1/4 wavelength mode of the antenna radiator. There is a significant recess around 2.7GHz, which can be understood here as the resonance corresponding to the 1/2 wavelength mode. The resonance, although not fully covering the operating band around 2.48GHz, can also have the effect of significantly expanding bandwidth and optimizing input impedance. Thus, in other embodiments of the present application, the lengths of the antenna radiator and at least portions of the first and second circuit boards (e.g., referred to as the first lengths) may also be different from 1/2 wavelength of the operating frequency band. For example, in the case where the first length is slightly greater than 1/2 wavelength of the operating band, then the excited 1/2 wavelength mode may be located in the low frequency direction of the operating band. Therefore, the method can be used for expanding the low-frequency directional bandwidth of the working frequency band and improving the low-frequency directional performance. Correspondingly, the 1/4 wavelength mode excited on the antenna radiator can shift to the high frequency direction of the working frequency band, so that the high frequency performance of the working frequency band is improved through the 1/4 wavelength mode. For another example, in the case where the first length is slightly less than 1/2 wavelength of the operating band, then the excited 1/2 wavelength mode may be located in the high frequency direction of the operating band. Therefore, the method can be used for expanding the high-frequency directional bandwidth of the working frequency band and improving the high-frequency directional performance. Correspondingly, the 1/4 wavelength mode excited on the antenna radiator can shift to the low frequency direction of the working frequency band, so that the low frequency performance of the working frequency band is improved through the 1/4 wavelength mode.

As shown in fig. 15 (b), the radiation efficiency of the single wave scheme and the double wave scheme are compared. It can be seen that the radiation efficiency is significantly improved in the case of covering the operating frequency band by means of double resonance. For example, the radiation efficiency peak is raised by more than 3dB. As shown in fig. 15 (c), there is a comparison of the system efficiency of the single wave scheme and the double wave scheme. It can be seen that the peak system efficiency is raised by more than 4dB with the dual resonance coverage of the operating band, and the bandwidth is also very significantly extended. For example, in a single wave scheme, the-15 dB bandwidth does not exceed 200MHz. In the duplex wave scheme, the system efficiency exceeds-14 dB in the range from 2.4GHz to 3 GHz. For example, in this example, the operating frequency band includes a bluetooth frequency band, in which the system efficiency of the duplex wave scheme is improved to within-10 dB, significantly higher than that of the single wave scheme. Correspondingly, the radiation efficiency is also improved significantly (e.g. within-10 dB).

Therefore, the scheme with the upward opening provided by the embodiment of the application is obviously improved compared with the existing scheme whether single wave or double wave is adopted. Through the arrangement of the low-field antenna, the head mode loss can be reduced, and further, when the low-field antenna is applied to electronic equipment (such as an earphone) in a head mode scene, the communication quality of the electronic equipment can be remarkably improved.

Although the application has been described in connection with specific features and embodiments thereof, it will be apparent that various modifications and combinations can be made without departing from the spirit and scope of the application. Accordingly, the specification and drawings are merely exemplary illustrations of the present application as defined in the appended claims and are considered to cover any and all modifications, variations, combinations, or equivalents that fall within the scope of the application. It will be apparent to those skilled in the art that various modifications and variations can be made to the present application without departing from the spirit or scope of the application. Thus, it is intended that the present application also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.

Claims (17)

1. A terminal antenna, characterized in that the terminal antenna is arranged in a wireless earphone, the wireless earphone comprises an ear-bag part and an ear-rod part; the terminal antenna includes:

a first radiator disposed in the ear stem portion and a first reference ground;

the first radiator is provided with a feed source and a grounding point, the first radiator is connected with the first reference ground through the grounding point, the grounding point is arranged on the lower half part of the first radiator, and the lower half part of the first radiator is a part, far away from the ear bag part, of the first radiator;

the first radiator and the first reference ground form a U-shaped structure through the grounding point, and an opening of the U-shaped structure faces one end of the ear rod part connected with the ear bag part;

The grounding point is arranged on the upper half part of the first radiator, the electric field value of the first position on the first radiator is a first electric field value, and the upper half part of the first radiator is a part, close to the ear bag part, of the first radiator;

The grounding point is arranged on the lower half part of the first radiator, and the electric field value of the first position on the first radiator is a second electric field value;

The second electric field value is smaller than the first electric field value, and the first position is any position on the first radiator.

2. The terminal antenna of claim 1, wherein the operating frequency band of the terminal antenna comprises a first frequency band, the length of the first radiator being determined from 1/4 wavelength of the first frequency band;

When the terminal antenna works, the first radiator excites a 1/4 wavelength mode to cover the first frequency band.

3. A terminal antenna according to claim 1 or 2, further comprising a second reference ground provided at the ear cup, the second reference ground being connected to an end of the first reference ground remote from the ground point.

4. A terminal antenna according to claim 3, wherein the operating frequency band of the terminal antenna comprises a first frequency band, the sum of the lengths of the first reference ground and the second reference ground being determined from 1/2 wavelength of the first frequency band;

When the terminal antenna works, the first reference ground and the second reference ground jointly excite a 1/2 wavelength mode, and a frequency band covered by the 1/2 wavelength mode is at least partially overlapped with the first frequency band.

5. A terminal antenna according to claim 2 or 4, wherein the first frequency band comprises a bluetooth frequency band.

6. A terminal antenna according to claim 1 or2 or 4, characterized in that the first reference ground is realized by means of a printed wiring board PCB and/or a flexible circuit board FPC.

7. A terminal antenna according to claim 1 or2 or 4, characterized in that the first radiator is realized by laser direct structuring LDS and/or FPC.

8. The terminal antenna of claim 4, wherein the second ground reference is implemented through an FPC.

9. A terminal antenna according to claim 1, 2 or 4, wherein a metal dust screen assembly is further provided in the wireless headset, the first radiator of the terminal antenna is connected to the metal dust screen assembly, and when the wireless headset is in operation, static electricity on the metal dust screen assembly returns to ground through a grounding point of the terminal antenna.

10. A wireless headset, characterized in that the wireless headset is provided with a terminal antenna according to any of claims 1-9.

11. The wireless earphone according to claim 10, wherein a baseband module and a radio frequency module are arranged on a first reference ground of the wireless earphone, and the terminal antenna is sequentially connected with the radio frequency module and the baseband module through the feed source; the terminal antenna is connected with a zero potential point on the first reference ground through the grounding point.

12. The wireless headset of claim 11, wherein the first reference ground is provided with a first conductive member and a second conductive member,

The terminal antenna is sequentially connected with the radio frequency module and the baseband module through the feed source, and specifically comprises:

the terminal antenna is sequentially connected with the radio frequency module and the baseband module through a first conductive piece at a position corresponding to the feed source;

The terminal antenna is connected with the zero potential point on the first reference ground through the grounding point, specifically:

and the terminal antenna is connected with the zero potential point on the first reference ground through a second conductive piece at a position corresponding to the grounding point.

13. The wireless headset of claim 12, wherein the first conductive member and/or the second conductive member is a conductive dome.

14. The wireless earphone according to claim 12 or 13, wherein a first antenna matching circuit is provided between the feed of the terminal antenna and the radio frequency module, the first antenna matching circuit comprising at least one of: capacitance, inductance, resistance, variable capacitance, variable inductance, variable resistance;

The first antenna matching circuit is used for adjusting the port impedance of the terminal antenna.

15. The wireless headset of claim 14, wherein the first reference ground comprises a first PCB and a first FPC;

the first conductive piece is arranged on the first PCB, the first antenna matching circuit, the radio frequency module and the baseband module are arranged on the first FPC, and the first conductive piece is connected with the first antenna matching circuit through a connecting cable; or alternatively

The first conductive piece and the first antenna matching circuit are arranged on the first PCB, the radio frequency module and the baseband module are arranged on the first FPC, and the first antenna matching module is connected with the radio frequency module through a connecting cable; or alternatively

The first conductive piece, the first antenna matching circuit and the radio frequency module are arranged on the first PCB, the baseband module is arranged on the first FPC, and the radio frequency module is connected with the baseband module through a connecting cable.

16. The wireless headset of claim 12 or 13, wherein a second antenna matching circuit is provided between the ground point of the terminal antenna and the first reference ground, the second antenna matching circuit comprising at least one of: microstrip line, capacitor, inductor, band-pass filter; the response frequency band of the band-pass filter comprises the working frequency band of the terminal antenna.

17. The wireless headset of any one of claims 10-13 or 15, wherein a metal dust screen assembly is provided in the wireless headset for positioning adjacent a sound pick-up aperture provided on the ear stem portion;

The metal dust screen assembly comprises a metal dust screen and a metal dust screen gasket which are mutually communicated, a conductive elastic sheet is arranged on the metal dust screen gasket, and the metal dust screen gasket is electrically connected with a first radiator of the terminal antenna through the conductive elastic sheet.