CN106937521B - A kind of electromagnetic radiation inhibition structure and its application based on gap waveguide theory - Google Patents
A kind of electromagnetic radiation inhibition structure and its application based on gap waveguide theory Download PDFInfo
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- CN106937521B CN106937521B CN201710080721.1A CN201710080721A CN106937521B CN 106937521 B CN106937521 B CN 106937521B CN 201710080721 A CN201710080721 A CN 201710080721A CN 106937521 B CN106937521 B CN 106937521B
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Abstract
The invention discloses a kind of, and the electromagnetic radiation based on gap waveguide theory inhibits structure and its application.Periodic electro-magnetic bandgap EBG structure is equipped between cooling encapsulation lid or radiator respectively in package substrate, to realize that the boundary condition of PMC carries out electromagnetic radiation inhibition in required frequency range, specially spaced array uniformly distributed pin type two-dimensional metallic EBG structure and mushroom-shaped two-dimensional metallic EBG structure, there is air gap, so that the distance between electromagnetic bandgap structure bottom surface and package substrate are less than a quarter of working frequency range centre frequency corresponding wavelength between electromagnetic bandgap structure and package substrate.The present invention is able to achieve the electromagnetic radiation being effectively reduced in working frequency range, has apparent inhibiting effect particularly with the electromagnetic radiation of high frequency, realizes the miniaturization of design size, can be used in the encapsulation design of chip, printed circuit board etc..
Description
Technical field
The present invention relates to a kind of, and the electromagnetic radiation based on gap waveguide theory inhibits structure and its application, more particularly, to
A kind of electromagnetic radiation based on gap waveguide theory inhibits structure and its application.
Technical background
With the high speed development of electronics and electrical equipment, message transmission rate and clock frequency are quick in high-speed digital system
It improves, electromagnetic interference and heat dissipation problem become the significant challenge that next-generation electronic product is faced.It is asked to solve heat dissipation
Cap and radiator would generally be added in the encapsulation design of printed circuit board and chip in topic.Traditional radiator and encapsulation
Lid is usually made of the metal of high thermal conductivity and high conductivity, with the continuous improvement of integrated circuit operation rate, cap and
Radiator is easy to form resonant cavity between the metal ground of package substrate, and noise current can be coupled to by capacity effect
On cap and radiator, so that radiator and cap is become new radiation source, cause serious EMI problem.
The approach that tradition solves the electromagnetic radiation as caused by cap and radiator mainly has ground connection and coating to inhale wave
Material.But ground connection only can effectively inhibit electromagnetic radiation in low frequency, not have obvious inhibiting effect to the electromagnetic radiation of high frequency,
Even the electromagnetic radiation of high frequency can be made to deteriorate sometimes.Although and Coated With Absorbing Material can effectively press down on cap and radiator
The electromagnetic radiation of different frequency range processed, but absorbing material is expensive and will affect the working performance and heat dissipation of integrated circuit.
Summary of the invention
In view of the foregoing deficiencies of prior art, it is an object of that present invention to provide a kind of based on gap waveguide theory
Electromagnetic radiation inhibits structure and its application, inhibits associated electrical to produce by increasing EBG structure in cap and radiator lower surface
The electromagnetic radiation of product solves the electromagnetic radiation excessive problem as caused by radiator and cap.
It is as follows that the present invention solves technical solution used by Related Technical Issues:
Periodic electro-magnetic bandgap EBG structure is equipped between cooling encapsulation lid or radiator respectively in package substrate,
To realize that the boundary condition of PMC carries out electromagnetic radiation inhibition in required frequency range, to inhibit unwanted electromagnetic wave propagation.
The electromagnetic bandgap structure is fixed on cooling encapsulation lid or radiator lower surface.
In view of processing technology and heat dissipation problem, the periodic electromagnetic bandgap structure is the uniformly distributed pin of spaced array
Type two-dimensional metallic EBG structure and mushroom-shaped two-dimensional metallic EBG structure.
The pin type two-dimensional metallic EBG structure includes metal pin, metal pin upper end be fixed on cooling encapsulation lid or
The lower surface of the top-level metallic plate of person's radiator, package substrate include dielectric layer and underlying metal plate, metal pin lower end and envelope
Filling has air gap between the dielectric layer of substrate.
The mushroom-shaped two-dimensional metallic EBG structure includes metal pin and metal patch, and metal pin upper end is fixed on scattered
The lower surface of the top-level metallic plate of capping or radiator is sealed, metal pin lower end is connected to metal patch upper end center, gold
Belonging to has air gap between patch lower end and the dielectric layer of package substrate, package substrate includes dielectric layer and underlying metal plate.
There is air gap, electromagnetic bandgap structure bottom surface and encapsulation base between the electromagnetic bandgap structure and package substrate
The distance between plate (i.e. air gap thickness+thickness of dielectric layers) be less than working frequency range centre frequency corresponding wavelength four/
One, so that gap waveguide is collectively formed by the metal ground of electromagnetic bandgap structure and package substrate, in working frequency range effectively
Inhibit the parallel plate mode and resonance between cap or radiator and package substrate metal ground, so that work be effectively reduced
Electromagnetic radiation in frequency range.In working frequency range, it can effectively inhibit cap or radiator and package substrate metal ground
Between cavity mode and parallel plate mode, so that the electromagnetic radiation in the frequency range be effectively reduced.
Present invention specific implementation changes inhibition electromagnetism spoke by adjusting the distance between electromagnetic bandgap structure and package substrate
The effective frequency range penetrated includes cycle length, the length of metal pin and side also by the geometric dimension for changing periodic unit structure
Length, thickness of dielectric layers, air gap thickness change effective frequency range of electromagnetic radiation processed.
Can have physical connection between the radiator and cap and package substrate, will not influence designed radiator or
Inhibitory effect of the cap to electromagnetic radiation.
The present invention does not introduce dissipating for the working performance and total that will not influence integrated circuit with lossy material
Hot property.
Package substrate material involved in technical solution of the present invention can make corresponding adjustment according to actual package model.
The electromagnetic radiation inhibits application of the structure in chip or printed circuit board encapsulation.
The present invention can be used in the encapsulation design of chip, printed circuit board etc., inhibit the electromagnetic radiation of related electronic products.
The present invention realizes the boundary condition of PMC using EBG structure in certain frequency range.Without electromagnetic wave in special frequency channel
It can be propagated in the gap between metal flat and EBG structure, the height in the gap depends on the related geometric parameters of EBG structure
Number, the generally less than a quarter of active centre frequency corresponding wavelength.When less than quarter-wave, the electromagnetic wave of any direction
It cannot be propagated in the air gap between electro-magnetic bandgap EBG structure floor and two planes of package substrate top surface, electromagnetism
Wave can only be propagated along the transmission line of two interplanars, such as microstrip line, bonding line, and other direction electromagnetic wave propagations will be pressed down
System.
The beneficial effects of the present invention are:
The present invention effectively inhibits related electronic products work under the premise of not influencing cooling integrated and performance
Electromagnetic radiation in frequency range, so that related electronic products be made to meet the standard of electromagnetic interference.
The present invention can be used for chip, printed circuit board etc. encapsulation design in, particularly with high frequency electromagnetic radiation by bright
Aobvious inhibiting effect, and its effective frequency range can be changed by adjusting relevant parameter, expand application range.
The design of the present invention cap and radiator suitable for electronic equipment, the mushroom-shaped two-dimensional metallic especially proposed
The embodiment of EBG structure can effectively reduce the size of similar metal EBG structure, realize the miniaturization of design size, make this hair
The application range and application band of cap and fansink designs scheme in bright are more extensive.
Detailed description of the invention
Fig. 1 is the principle of the present invention schematic diagram.
Fig. 2 is the tomograph of pin type metal surface used cellular construction in the present invention.
Fig. 3 is the tomograph of mushroom-shaped metal surface cellular construction used in the present invention.
Fig. 4 is that the novel sealing capping tomograph of pin type metal surface design is utilized in the present invention.
Fig. 5 is that the novel sealing capping tomograph of mushroom-shaped metal surface design is utilized in the present invention.
Fig. 6 is that the new radiator tomograph of mushroom-shaped metal surface design is utilized in the present invention.
Fig. 7 is to be covered on the front view applied in WB-BGA encapsulation using the novel sealing of pin type metal surface design.
Fig. 8 is to be covered on the front view applied in WB-BGA encapsulation using the novel sealing of mushroom-shaped metal surface design.
Fig. 9 is application (a) front view using the new radiator of mushroom-shaped metal surface design in WB-BGA encapsulation
(b) top view
Figure 10 is the 3m field radiation pattern for being applied to WB-BGA encapsulation using the novel sealing capping of pin type metal surface design.
Figure 11 is the 3m field radiation pattern for being applied to WB-BGA encapsulation using the novel sealing capping of mushroom-shaped metal surface design.
Figure 12 is the 3m field radiation pattern for being applied to WB-BGA encapsulation using the new radiator of mushroom-shaped metal surface design.
In figure: 1, cooling encapsulation lid or radiator, 2, electromagnetic bandgap structure, 3, air gap, 4, package substrate；5, it pushes up
Layer metal plate, 6, metal pin, 7, air gap, 8, dielectric layer, 9, underlying metal plate；10, top-level metallic plate, 11, metallic pin
Nail, 12, metal patch, 13 air gaps, 14, dielectric layer, 15, underlying metal plate；16, Metal Packaging lid, 17, pin type two dimension
Metal EBG structure, 18, mushroom-shaped two-dimensional metallic EBG structure, 19, radiator, 20, mushroom-shaped two-dimensional metallic EBG structure.
Specific embodiment
The invention will be further described with embodiment with reference to the accompanying drawing.
As shown in Figures 2 and 3, common cap lower surface is a smooth metal flat in conventional package, and logical
The often very little at a distance from package substrate.Since cap range noise source is close, much noise electric current can be coupled on cap,
And it will form resonant cavity between conventional package lid and the metal ground of package substrate, the resonance between two parallel-plates can make whole
The electromagnetic radiation of a structure is greatly enhanced.It is theoretical based on above-mentioned gap waveguide, in the lower surface design of cap EBG of the present invention
Structure is formed together gap waveguide with package substrate metal ground, can inhibit unwanted electromagnetic wave in design frequency range
Propagation to reduce electromagnetic radiation in the frequency range.
Embodiment 1
As shown in figure 4,1 lower surface of cooling encapsulation lid between package substrate 4 and cooling encapsulation lid 1 is equipped with periodically
Electro-magnetic bandgap EBG structure 2, periodic electromagnetic bandgap structure 2 are the uniformly distributed pin type two-dimensional metallic EBG structure of spaced array,
Including metal pin 6,6 upper end of metal pin is fixed on the lower surface of the top-level metallic plate 5 of cooling encapsulation lid or radiator, envelope
Filling substrate 4 includes dielectric layer 8 and underlying metal plate 9, and the underlying metal plate 9 of package substrate 4 is used as metal ground, metal pin
There is air gap 7 between 6 lower ends and the dielectric layer 8 of package substrate 4.It is embodied according to the design needs, adjustment unit structure
Period, the height of the length and width of metal pin and air gap designs effective frequency range, inhibits the electromagnetism in special frequency channel
Radiation.
Embodiment 2
As shown in figure 5,1 lower surface of cooling encapsulation lid between package substrate 4 and cooling encapsulation lid 1 is equipped with periodically
Electro-magnetic bandgap EBG structure 2, periodic electromagnetic bandgap structure 2 are the uniformly distributed mushroom-shaped two-dimensional metallic EBG structure of spaced array,
Including metal pin 11 and metal patch 12,11 upper end of metal pin is fixed on the top-level metallic of cooling encapsulation lid or radiator
The lower surface of plate 10,11 lower end of metal pin are connected to 12 upper end center of metal patch, and metal patch 12 is square, metal patch
There is air gap 13, package substrate 4 includes dielectric layer 14 and bottom gold between 12 lower end of piece and the dielectric layer 14 of package substrate 4
Belong to plate 15, the underlying metal plate 9 of package substrate 4 is used as metal ground.Specific implementation can according to the design needs, adjustment unit
The period of structure, the length and width of metal pin, the side length of metal patch and the height of air gap design effective frequency range, suppression
Electromagnetic radiation in special frequency channel processed.
Pin type metal surface of the present embodiment structure relative to embodiment 1, the geometric dimension in identical effective frequency range
It is smaller, it can be applied to the chip package of small size, application range and frequency range are more extensive.As mushroom-shaped two-dimensional metallic EBG
When the metal surface of structure is less than a quarter of design frequency range centre frequency corresponding wavelength at a distance from metal ground, do not have
Electromagnetic wave can be propagated in the gap gap of two interplanars.But when there are transmission line such as microstrip lines, bonding line in air gap
Whens equal, electromagnetic wave may only be propagated along transmission line, other direction electromagnetic wave propagations will be suppressed.
Comparison diagram 4 and Fig. 5 it can be found that mushroom-shaped metal surface EBG structure height be much smaller than pin type metal surface,
It is more suitable for the package application scene of miniaturization, application range and frequency range are also more extensive.
Embodiment 3
As shown in fig. 6,1 lower surface of radiator between package substrate 4 and radiator 1 is equipped with periodic electro-magnetic bandgap
EBG structure 2, periodic electromagnetic bandgap structure 2 are the uniformly distributed mushroom-shaped two-dimensional metallic EBG structure of spaced array.
As shown in fig. 6,19 be that radiator, upper part are the radiation tooth for heat dissipation between common plate in chip package, under
Surface is smooth metal covering, is generally mounted to the cooling encapsulation side of covering, and is connected between cap by one layer very thin of colloid
It connects.In view of practical application scene, retain smooth metal covering in radiator lower surface middle section, as cap and encapsulation
Substrate provides enough spaces, therefore mushroom-shaped two-dimensional metallic EBG structure is arranged in the annular region around cap, the period
The arrangement of structure and quantity can make corresponding adjustment according to practical application scene.
Mushroom-shaped two-dimensional metallic EBG structure includes metal pin 11 and metal patch 12, and 11 upper end of metal pin is fixed on
The lower surface of the top-level metallic plate 10 of cooling encapsulation lid or radiator, 11 lower end of metal pin are connected to 12 upper end of metal patch
Center, metal patch 12 are square, and have air gap between 12 lower end of metal patch and the dielectric layer 14 of package substrate 4
13, package substrate 4 includes dielectric layer 14 and underlying metal plate 15, and the underlying metal plate 9 of package substrate 4 is used as metal ground.
Specific implementation can according to the design needs, the period of adjustment unit structure, the length and width of metal pin, the side of metal patch
Long and air gap height designs effective frequency range, inhibits the electromagnetic radiation in special frequency channel.
Pin type metal surface of the present embodiment structure relative to embodiment 1, the geometric dimension in identical effective frequency range
It is smaller, it can be applied to the chip package of small size, application range and frequency range are more extensive.As mushroom-shaped two-dimensional metallic EBG
When the metal surface of structure is less than a quarter of design frequency range centre frequency corresponding wavelength at a distance from metal ground, do not have
Electromagnetic wave can be propagated in the gap gap of two interplanars.But when there are transmission line such as microstrip lines, bonding line in air gap
Whens equal, electromagnetic wave may only be propagated along transmission line, other direction electromagnetic wave propagations will be suppressed.
Present example is with typical commercial packages model wire bonding-ball grid array (wire-bonded ball grid
Array, WB-BGA) for encapsulation, the implementation and its inhibition to electromagnetic radiation that are specifically described designed screening cover and radiator
Effect.
Fig. 7 and Fig. 8 is that the cap designed using pin type metal surface and mushroom-shaped metal surface is encapsulated in WB-BGA
In application model front view.The geometric dimension for adjusting two kinds of EBG structures makes two kinds of caps inhibit effective frequency of electromagnetic radiation
Duan Junwei 10-17GHz.The related geometric dimension of pin type metal surface is as follows at this time: the period of periodic unit structure is 6mm,
The length and width of metal pin is respectively 5mm and 1mm, and the height of air gap is 0.4mm.The correlation of mushroom-shaped metal surface
Geometric dimension are as follows: the period of periodic unit structure is 4.4mm, and the length and width point of metal pin is 1mm, air gap
Height is 0.4mm.Figure 10 and Figure 11 is respectively the cooling encapsulation for applying pin type metal surface and mushroom-shaped metal surface to design
The field the 3m radiation curve comparison diagram of lid and the entire WB-BGA encapsulation of application conventional package lid.It follows that the benefit in design frequency range
The field the 3m radiation of total can be effectively reduced with novel sealing capping.
Fig. 9 is that application model of the above-mentioned radiator using the design of mushroom-shaped metal surface in commercial WB-BGA encapsulation is shown
It is intended to, (a) is front view, (b) is top view.The related geometric parameters of the periodic unit structure of designed mushroom-shaped metal surface
Number is as follows: period 5mm, and the length of metal pin is 1.5mm, and the width of metal pin is 0.5mm, and the side length of metal patch is
4.6mm, air gap height are 1.5mm, and the corresponding effective frequency range for inhibiting electromagnetic radiation is 8.2~16.2GHz.Figure 12 is to answer
With the field the 3m radiation curve comparison diagram of new radiator and the entire WB-BGA encapsulation of traditional heat sinks.It follows that in design frequency
It is radiated in section using the field 3m that new radiator can effectively reduce total.
Claims (7)
1. a kind of electromagnetic radiation based on gap waveguide theory inhibits structure, it is characterised in that: package substrate (4) respectively with dissipate
It seals and is equipped with periodic electromagnetic bandgap structure (2) between capping or radiator (1), to realize PMC's in required frequency range
Boundary condition carries out electromagnetic radiation inhibition；
There are air gap (3) between the electromagnetic bandgap structure (2) and package substrate (4), electromagnetic bandgap structure (2) bottom surface
The distance between package substrate (4) is less than a quarter electromagnetic bandgap structure of working frequency range centre frequency corresponding wavelength.
2. a kind of electromagnetic radiation based on gap waveguide theory according to claim 1 inhibits structure, it is characterised in that: institute
It states electromagnetic bandgap structure (2) and is fixed on cooling encapsulation lid or radiator lower surface.
3. a kind of electromagnetic radiation based on gap waveguide theory according to claim 1 inhibits structure, it is characterised in that: institute
Stating periodic electromagnetic bandgap structure (2) is the uniformly distributed pin type two-dimensional metallic EBG structure or mushroom-shaped two dimension of spaced array
Metal EBG structure.
4. a kind of electromagnetic radiation based on gap waveguide theory according to claim 3 inhibits structure, it is characterised in that: institute
Stating pin type two-dimensional metallic EBG structure includes metal pin (6), and metal pin (6) upper end is fixed on cooling encapsulation lid or dissipates
The lower surface of the top-level metallic plate (5) of hot device has air gap (7) between metal pin (6) lower end and package substrate (4).
5. a kind of electromagnetic radiation based on gap waveguide theory according to claim 3 inhibits structure, it is characterised in that: institute
Stating mushroom-shaped two-dimensional metallic EBG structure includes metal pin (11) and metal patch (12), and metal pin (11) upper end is fixed on
The lower surface of the top-level metallic plate (10) of cooling encapsulation lid or radiator, metal pin (11) lower end are connected to metal patch
(12) upper end center has air gap (13) between metal patch (12) lower end and package substrate (4).
6. a kind of electromagnetic radiation based on gap waveguide theory according to claim 1 inhibits structure, it is characterised in that: institute
Physical connection can be had by stating between radiator or cap and package substrate.
7. a kind of -6 any electromagnetic radiation based on gap waveguide theory inhibit the application of structure according to claim 1,
It is characterized by: the electromagnetic radiation inhibits application of the structure in chip or printed circuit board encapsulation.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110060981A (en) * | 2019-03-27 | 2019-07-26 | 海宁利伊电子科技有限公司 | Electromagnetic interference (EMI) emissions based on artificial surface plasma inhibit structure |
| CN111244069B (en) * | 2020-01-15 | 2022-03-01 | 中国科学技术大学 | Quantum chip packaging structure, manufacturing method thereof and method for improving resonant frequency |
| CN112187310B (en) * | 2020-09-07 | 2022-03-22 | 南京航空航天大学 | Novel millimeter wave front end module based on EBG encapsulation and LTCC circuit |
| CN112530910B (en) * | 2020-11-18 | 2022-09-02 | 北京理工大学 | Metal waveguide device for three-dimensional packaging of chip and design method thereof |
| CN114865261A (en) * | 2021-02-04 | 2022-08-05 | 广州程星通信科技有限公司 | Space power combiner based on electromagnetic forbidden band structure |
| CN114095098B (en) * | 2022-01-18 | 2022-06-21 | 荣耀终端有限公司 | Electronic equipment and cavity noise suppression method |
| CN114597612A (en) * | 2022-03-10 | 2022-06-07 | 中国电子科技集团公司第四十一研究所 | Flange and terahertz waveguide connecting piece based on electromagnetic band gap structure |
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| CN102084538A (en) * | 2008-07-07 | 2011-06-01 | 希达尔天线顾问股份公司 | Waveguides and transmission lines in gaps between parallel conducting surfaces |
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| CN105007710A (en) * | 2014-04-22 | 2015-10-28 | 英特尔公司 | EBG design for mitigating radio frequency interference |
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| CN102084538A (en) * | 2008-07-07 | 2011-06-01 | 希达尔天线顾问股份公司 | Waveguides and transmission lines in gaps between parallel conducting surfaces |
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