CN108200752A - Has the radiator of EMI suppression masking structure - Google Patents
Has the radiator of EMI suppression masking structure Download PDFInfo
- Publication number
- CN108200752A CN108200752A CN201810179774.3A CN201810179774A CN108200752A CN 108200752 A CN108200752 A CN 108200752A CN 201810179774 A CN201810179774 A CN 201810179774A CN 108200752 A CN108200752 A CN 108200752A
- Authority
- CN
- China
- Prior art keywords
- heat generating
- generating component
- barricade
- mentioned
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20518—Unevenly distributed heat load, e.g. different sectors at different temperatures, localised cooling, hot spots
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
Abstract
A kind of radiator for having EMI suppression masking structure, including a heat generating component, a temperature-uniforming plate and a shielding framework.Heat generating component includes a circuit board and is electrically coupled to a heat generating component of circuit board.One surface of temperature-uniforming plate is corresponding to amplexiform heat generating component.Shielding framework includes the plural barricade of masking heat generating component surrounding being arranged, and each barricade surrounds corresponding two opening jointly, and temperature-uniforming plate and circuit board correspond to each opening and abut each barricade respectively, to form a shielding space.Thereby, reach reduction height, while reach the radiator of electromagnetic shielding and heat dissipation effect.
Description
Technical field
The present invention relates to a kind of radiator, espespecially a kind of radiator with EMI suppression masking structure for reducing height.
Background technology
Existing electronic equipment is all installed such as mobile phone, tablet computer, laptop or other radiators
There are many electronic building bricks.When electronic equipment operate or operate when, these electronic building bricks will generate a degree of electromagnetic field and
Heat will generate between electromagnetic field caused by such electronic building brick and interfere with each other, obstruct, and then influence electronic equipment just
Often running, this phenomenon are referred to as Electromagnetic Interference (Electro Magnetic Interference；EMI).At present to
The mode of EMI is prevented mostly to shield electromagnetic wave into the electromagnetic shielding cover generating component of a U-shaped metalwork material, and by
It is relatively low and meet current environmental regulation in the method cost of metalwork masking, therefore be most often used.Above-mentioned integrally formed U
Type cover body or cover have a top plate and plural number support (side) plate extended from top plate edge perpendicular.It would generally be applied on top plate
Cloth heat dissipation material is connect again with radiator, to be conducted the waste heat that generating component generates to radiator via cover of meter hood.So
And above-mentioned top plate can increase the whole height of electronic equipment with the heat conduction material being coated with thereon, can not be useful in tends to frivolous and palpus
In the electronic equipment of heat dissipation.In view of this, how effectively to solve the above problems, and take into account the EMI suppression of electronic equipment and heat dissipation effect
Fruit, the real subject for having become related dealer and having desired most ardently solution.
Invention content
Effectively reach reduction height it is an object of the present invention to provide a kind of, imitated simultaneously with electromagnetic shielding and heat dissipation
The radiator of the tool EMI suppression masking structure of fruit.
In order to achieve the above object, the present invention provide it is a kind of have EMI suppression masking structure radiator, including a heat generating component,
One temperature-uniforming plate and a shielding framework.Heat generating component includes a circuit board and is electrically coupled to a heat generating component of circuit board.Samming
One surface of plate is corresponding to amplexiform heat generating component.Shielding framework includes the plural barricade of masking heat generating component surrounding being arranged,
Each barricade surrounds corresponding two opening jointly, and temperature-uniforming plate and circuit board correspond to each opening and abut each barricade respectively, with shape
Into a shielding space.
Preferably, above-mentioned each barricade is respectively provided with the first end for abutting foregoing circuit plate and abuts above-mentioned samming
One the second end of plate.
Preferably, the first end of above-mentioned each barricade or the second end also have spaced plural first clamping
Portion, above-mentioned temperature-uniforming plate correspond to above-mentioned each first clamping portion and are then provided with plural second clamping portion.
Preferably, above-mentioned each first clamping portion and each second clamping portion optionally hole or lug each other, makes each
One clamping portion and the mutual snapping in each second clamping portion or riveted.
Preferably, what above-mentioned shielding framework was integrally formed is made or is assembled respectively with above-mentioned each barricade, with
Form above-mentioned shielding space.
Preferably, the present invention is also comprising a Heat Conduction Material and the setting being configured between above-mentioned temperature-uniforming plate and heat generating component
Plurality of radiating fins in another surface of the temperature-uniforming plate.
Preferably, above-mentioned temperature-uniforming plate also has towards and abuts a bending part of above-mentioned heat generating component and be set to the folding
A Heat Conduction Material between turn of bilge and the heat generating component.
Preferably, the material of above-mentioned each barricade is aluminium, copper, iron or its alloy.
In order to achieve the above object, the present invention also provides a kind of radiator for having EMI suppression masking structure, including a fever group
Part, a temperature-uniforming plate and a shielding framework.Heat generating component includes a circuit board and plural heat generating component, and each heat generating component is to each other
Every and be electrically coupled to circuit board.One surface of temperature-uniforming plate is corresponding to amplexiform each heat generating component.Shielding framework includes what is be arranged
Four barricades of the plural heat generating component of masking, each barricade surround corresponding two opening jointly.Temperature-uniforming plate and circuit board point
Each opening is not corresponded to and abuts each barricade, wherein being each configured with an intermediate plate, each centre between appointing two adjacent heat generating components
Plate forms plural shielding space with each barricade.
Preferably, two ends of above-mentioned each intermediate plate connect above-mentioned each barricade, and each intermediate plate and each barricade respectively
It is highly identical.
In one embodiment, each barricade is respectively provided with the first end for abutting circuit board and abuts temperature-uniforming plate
A second end, be made or assembled respectively with each barricade wherein shielding framework system is integrally formed, to form screen
Space is covered, that is, shields framework, circuit board and the common shield heating component of temperature-uniforming plate, to effectively prevent electromagnetic interference (EMI).
In one embodiment, the first end of each shielding framework or the second end also have spaced plural number
First clamping portion, temperature-uniforming plate correspond to each first clamping portion and are then provided with plural second clamping portion, so that each barricade can
That leans on and stablize is fastened between temperature-uniforming plate and circuit board.
In one embodiment, a Heat Conduction Material is further provided between heat generating component and temperature-uniforming plate and is set to
The plurality of radiating fins on another surface of the temperature-uniforming plate.Heat Conduction Material generated waste heat when can effectively heat generating component be operated
In quick conduction to temperature-uniforming plate, and the external world is conducted heat to so that radiating efficiency is substantially improved through each radiating fin.In addition, samming
The opening of the directly corresponding masking framework of plate is amplexiformed, and also can effectively reduce the height of radiator entirety, and then dissipate the present invention
Thermal can be applied in light and short electronic product.
Description of the drawings
Fig. 1 is the exploded view for being painted the first preferred embodiment of the invention.
Fig. 2 is the exploded view of the temperature-uniforming plate and each barricade that are painted the first preferred embodiment of the invention.
Fig. 3 is the sectional view for being painted the first preferred embodiment of the invention.
Fig. 4 is another sectional view for being painted the first preferred embodiment of the invention.
Fig. 5 is the sectional view for being painted the second preferred embodiment of the invention.
【Critical piece symbol description】
10 radiator, 1 heat generating component, 11 circuit board, 12 heat generating component, 2 temperature-uniforming plate, 21 surface, 22 second clamping portion, 23 bending part 3
Shield 31 barricade of framework, 311 first end, 312 the second end, 313 first opening 33 shielding space, 34 intermediate plate 4 of clamping portion 32
5 radiating fin of Heat Conduction Material.
Specific embodiment
The detailed description of the related present invention and technology contents, cooperation description of the drawings is as follows, however appended attached drawing only provides ginseng
It examines and illustrates to use, be not used for limiting protection scope of the present invention.
Shown in please referring to Fig.1 to Fig.3, the present invention provides a kind of radiator 10 for having EMI suppression masking structure, including a hair
Hot component 1, a temperature-uniforming plate 2 and a shielding framework 3.Heat generating component 1 includes a circuit board 11 and is electrically coupled to circuit board 11
One heat generating component 12.Signified circuit board 11 is preferably a printed circuit board herein；Heat generating component 12 is then including but not limited to one
Chip (chip).
In this first specific embodiment, the 21 corresponding heating surface for amplexiforming heat generating component 11 of a surface of temperature-uniforming plate 2 is (not
Mark).The temperature-uniforming plate 2 of the present embodiment is for example by solid copper coin or by hollow copper coin and the aqueous being stored in copper coin institute structure
Into evaporation and condensation through aqueous achieve the effect that quick conductive.To increase heat conducting effect, the present embodiment, which also includes, matches
The Heat Conduction Material 4 that is placed between temperature-uniforming plate 2 and heat generating component 12 and be set to temperature-uniforming plate 2 another surface plural number heat dissipation
Fin 5 (as shown in Figure 4).Heat Conduction Material 4 reduces the impedance that heat is transmitted, and then improve heat dissipation to plug the gap or hole
Property.Signified Heat Conduction Material (Thermal Interface Material herein；TIM) 4 be, for example, heat-conducting glue, heat conduction sealing,
Heat-conducting cream, heat-conducting glue band or other suitable materials etc..
Shielding framework 3 includes the plural barricade 31 of masking 12 surrounding of heat generating component being arranged, and each barricade 31 is common
Corresponding two opening 32 is surrounded, temperature-uniforming plate 21 and circuit board 11 is made to correspond to each opening 32 respectively and abut each barricade 31, to be formed
One shielding space 33.Each barricade 31 is respectively provided with the first end 311 for abutting circuit board 11 and abuts 2 surface of temperature-uniforming plate
21 the second end 312, wherein shielding framework 3 be it is integrally formed be made or assembled respectively with each barricade 31,
To form above-mentioned shielding space 33, that is, 2 common shield heating component 12 of framework 3, circuit board 11 and temperature-uniforming plate is shielded, to have
Effect prevents electromagnetic interference (EMI).
In embodiment as shown in Figure 1 to Figure 3, the shape of shielding space 33 preferably corresponds to the shape of heat generating component 12 and is
One rectangle, and the quantity of each barricade 31 is four.It 33 also can be with however in other different embodiments, between mask frame
Heat generating component 12 of different shapes surrounds such as triangle, circle or other suitable shapes, does not limit.
In embodiment as shown in Figure 1 to Figure 3, the first end 311 or the second end 312 of each barricade 31 also have
There is spaced plural first clamping portion 313, temperature-uniforming plate 2 corresponds to each first clamping portion 313 and is then provided with the second clamping of plural number
Portion 22.Each first clamping portion 313 and each second clamping portion 22 optionally hole or lug each other, make each first clamping portion
313 with each second clamping portion, 22 mutual snapping or riveted.A perforation is preferably in the hole of the present embodiment；However in other differences
Embodiment in, hole also can be a blind hole.In addition, each first clamping portion 313 and each second clamping portion 22 are preferably respectively with riveting
The mode stationary positioned of conjunction.
Also have one to amplexiform piece (figure omits) however in other different embodiments, between each first clamping portion 313, it is each to paste
What contact pin can be bent amplexiforms in the surface of temperature-uniforming plate 2 21.Therefore when each first clamping portion 313 is inserted in respectively second clamping portion
When 22, the surface 21 of piece while the abutting temperature-uniforming plate 2 of bending is respectively amplexiformed, to increase the effect for preventing EMI.
Please also refer to shown in Fig. 4, temperature-uniforming plate 2 also has towards and abuts a bending part 23 of heat generating component 12 and set
The Heat Conduction Material 4 being placed between bending part 23 and heat generating component 12, to be applied to for example reduce height or other different demands
Mechanism design electronic device (figure omit) in.
It should be noted that the opening 32 of the directly corresponding masking framework 3 of temperature-uniforming plate 2 is amplexiformed or grafting, radiated with effective reduce
The whole height of device 10, and then radiator of the present invention is enable to apply in light and short electronic product.
Please also refer to shown in Fig. 5, to be painted the sectional view of the second preferred embodiment figure of the invention.The present embodiment with
First embodiment major difference is that, heat generating component 1 includes plural heat generating component 12, each heat generating component 12 be spaced and
It is electrically coupled to circuit board 11.Shielding framework 3 includes four barricades 31 of the above-mentioned each heat generating component 12 of masking being arranged,
In appoint and be each configured with an intermediate plate 34 between two adjacent heat generating components 12, each intermediate plate 34 forms plural number with each barricade 31
Shielding space 33.
Each barricade 31 of connection that two ends of each intermediate plate 34 abut respectively, and the knot of each intermediate plate 34 and each barricade 31
Structure, material and height all same, make each heat generating component 12 can effectively by shielding framework 3, intermediate plate 34, temperature-uniforming plate 2 and
Circuit board 11 covers, and prevents electromagnetic interference.Remaining structure and linking relationship of the present embodiment, please join described in previous embodiment,
Details are not described herein.
In conclusion it should be considered as illustrating the present invention rather than to limit this herein in this revealed embodiment
Invention.Protection scope of the present invention should be defined by the right applied for a patent, and cover its legal equivalents, not
It is limited to previous description.
Claims (10)
1. a kind of radiator for having EMI suppression masking structure, it is characterised in that including：
One heat generating component comprising a circuit board and is electrically coupled to a heat generating component of the circuit board；
One temperature-uniforming plate, a surface of the temperature-uniforming plate is corresponding to amplexiform the heat generating component；And
One shielding framework, comprising the plural barricade for covering the heat generating component surrounding being arranged, each barricade surrounds jointly
Corresponding respectively opening abuts the respectively barricade respectively for corresponding two opening, the temperature-uniforming plate and the circuit board, empty to form a shielding
Between.
2. the radiator of tool EMI suppression masking structure as described in claim 1, it is characterised in that above-mentioned each barricade difference
With the first end for abutting foregoing circuit plate and a second end of the above-mentioned temperature-uniforming plate of abutting.
3. the radiator of tool EMI suppression masking structure as claimed in claim 2, it is characterised in that the of above-mentioned each barricade
One end or the second end also have spaced plural first clamping portion, and above-mentioned temperature-uniforming plate corresponds to above-mentioned each first clamping portion
Then it is provided with plural second clamping portion.
4. as claimed in claim 3 tool EMI suppression masking structure radiator, it is characterised in that above-mentioned each first clamping portion and
Each second clamping portion optionally hole or lug each other, make each first clamping portion and the mutual snapping in each second clamping portion or riveting
It closes.
5. the radiator of tool EMI suppression masking structure as described in claim 1, it is characterised in that above-mentioned shielding framework is integrated
It is molding to be made or assembled respectively with above-mentioned each barricade, to form above-mentioned shielding space.
6. the radiator of tool EMI suppression masking structure as described in claim 1, it is characterised in that also above-mentioned equal comprising being configured at
A Heat Conduction Material between warm plate and heat generating component and be set to the temperature-uniforming plate another surface plurality of radiating fins.
7. the radiator of tool EMI suppression masking structure as described in claim 1, it is characterised in that above-mentioned temperature-uniforming plate also has court
To and abut a bending part of above-mentioned heat generating component and the Heat Conduction Material being set between the bending part and the heat generating component.
8. the radiator of tool EMI suppression masking structure as described in claim 1, it is characterised in that the material of above-mentioned each barricade
For aluminium, copper, iron or its alloy.
9. a kind of radiator for having EMI suppression masking structure, it is characterised in that including：
One heat generating component is spaced and is electrically coupled to comprising a circuit board and plural heat generating component, each heat generating component
The circuit board；
One temperature-uniforming plate, a surface of the temperature-uniforming plate is corresponding to amplexiform each heat generating component；And
One shielding framework, comprising four barricades of the plural heat generating component of masking being arranged, each barricade surrounds jointly
Corresponding respectively opening abuts the respectively barricade respectively for corresponding two opening, the temperature-uniforming plate and the circuit board, wherein appointing two adjacent
An intermediate plate is each configured between the heat generating component, respectively the intermediate plate forms plural shielding space with the respectively barricade.
10. the radiator of tool EMI suppression masking structure as claimed in claim 9, it is characterised in that the two of above-mentioned each intermediate plate
End connects above-mentioned each barricade, and each intermediate plate is identical with the height of each barricade respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810179774.3A CN108200752A (en) | 2018-03-05 | 2018-03-05 | Has the radiator of EMI suppression masking structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810179774.3A CN108200752A (en) | 2018-03-05 | 2018-03-05 | Has the radiator of EMI suppression masking structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108200752A true CN108200752A (en) | 2018-06-22 |
Family
ID=62595052
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810179774.3A Pending CN108200752A (en) | 2018-03-05 | 2018-03-05 | Has the radiator of EMI suppression masking structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108200752A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110366362A (en) * | 2019-08-07 | 2019-10-22 | 李居强 | It is electromagnetically shielded radiator |
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|---|---|---|---|---|
| CN1659942A (en) * | 2002-04-10 | 2005-08-24 | 戈尔企业控股股份有限公司 | Board-level EMI shield with enhanced thermal dissipation |
| CN201733567U (en) * | 2010-06-11 | 2011-02-02 | 鸿富锦精密工业（深圳）有限公司 | Electromagnetic shielding device with heat-dissipating function |
| CN105188329A (en) * | 2015-09-24 | 2015-12-23 | 山东超越数控电子有限公司 | Electromagnetic shielding cover and electronic device |
| CN205389320U (en) * | 2016-03-23 | 2016-07-20 | 乐视控股（北京）有限公司 | Heat dissipation shield assembly |
| CN206181696U (en) * | 2016-10-28 | 2017-05-17 | 中科创达软件科技（深圳）有限公司 | Cell -phone shielding heat radiation structure of low thermal resistance and cell -phone that has this structure |
| US20170290209A1 (en) * | 2016-04-04 | 2017-10-05 | Commscope Technologies Llc | Systems and methods for thermal management for high power density emi shielded electronic devices |
| CN207854398U (en) * | 2018-03-05 | 2018-09-11 | 昇业科技股份有限公司 | Has the radiator of EMI suppression masking structure |
-
2018
- 2018-03-05 CN CN201810179774.3A patent/CN108200752A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1659942A (en) * | 2002-04-10 | 2005-08-24 | 戈尔企业控股股份有限公司 | Board-level EMI shield with enhanced thermal dissipation |
| CN201733567U (en) * | 2010-06-11 | 2011-02-02 | 鸿富锦精密工业（深圳）有限公司 | Electromagnetic shielding device with heat-dissipating function |
| CN105188329A (en) * | 2015-09-24 | 2015-12-23 | 山东超越数控电子有限公司 | Electromagnetic shielding cover and electronic device |
| CN205389320U (en) * | 2016-03-23 | 2016-07-20 | 乐视控股（北京）有限公司 | Heat dissipation shield assembly |
| US20170290209A1 (en) * | 2016-04-04 | 2017-10-05 | Commscope Technologies Llc | Systems and methods for thermal management for high power density emi shielded electronic devices |
| CN206181696U (en) * | 2016-10-28 | 2017-05-17 | 中科创达软件科技（深圳）有限公司 | Cell -phone shielding heat radiation structure of low thermal resistance and cell -phone that has this structure |
| CN207854398U (en) * | 2018-03-05 | 2018-09-11 | 昇业科技股份有限公司 | Has the radiator of EMI suppression masking structure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110366362A (en) * | 2019-08-07 | 2019-10-22 | 李居强 | It is electromagnetically shielded radiator |
| CN110366362B (en) * | 2019-08-07 | 2020-08-07 | 李居强 | Electromagnetic shielding heat radiator |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180622 |
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| WD01 | Invention patent application deemed withdrawn after publication |