CN102088837B - Heat sink and portable electronic device with same - Google Patents
Heat sink and portable electronic device with same Download PDFInfo
- Publication number
- CN102088837B CN102088837B CN200910311082.0A CN200910311082A CN102088837B CN 102088837 B CN102088837 B CN 102088837B CN 200910311082 A CN200910311082 A CN 200910311082A CN 102088837 B CN102088837 B CN 102088837B
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- CN
- China
- Prior art keywords
- heat sink
- lid
- diapire
- portable electron
- electron device
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Abstract
The invention provides a heat sink and a portable electronic device with the same. The heat sink comprises a frame body and a cover body, wherein, the frame body comprises a bottom wall; the middle part of the bottom wall is equipped with an opening; and one side of the cover body is connected with one side of the bottom wall and the joint is bent, and the other three sides of the cover body are separated from the bottom wall. The heat sink further comprises a wave-absorbing plate, and the wave-absorbing plate is fixed on the frame body and is adjacent to the bottom wall so as to close over the opening.
Description
Technical field
The present invention relates to heat abstractor, relate in particular to a kind of heat sink and apply the portable electron device of this heat sink.
Background technology
The electronic installation using at present, great majority are all to adopt the electronic building brick of each functional module to be assembled on printed circuit board (PCB) (Printed Circuit Board, PCB) plate.During these electronic building brick work, generally all can generate heat, if do not carry out radiating treatment, very likely the serviceability of these electronic installations be impacted.
For some larger heat abstractors, current radiating mode often adopts heat pipe to add radiating fin.As need, accelerate heat radiation, can on fin, add fan.For some less portable electron devices, such as mobile phone, wireless Internet card etc., cannot put into heat pipe, radiating fin and fan etc.These less portable electron devices generally adopt the mode of nature conduction to conduct heat to the external world.
But for these less portable electron devices, if in running order for a long time, the heat that its internal electrical components is sent is not discharged to the external world in time, very likely the serviceability of this portable electron device is exerted an influence.
Summary of the invention
Given this, be necessary to provide a kind of fin that is applicable to portable electronic devices heat radiation.
Separately, be also necessary to provide a kind of portable electron device with described heat sink.
A kind of heat sink, comprise a framework and a lid, this framework comprises a diapire, an opening is offered at this diapire middle part, this lid one side is connected with this diapire one side and junction bending, other three sides are separated with this diapire, and described heat sink also comprises a suction wave plate, and this suction wave plate is fixed in this framework adjacent with this diapire to cover this opening.
A kind of portable electron device, comprise a heat sink, a circuit board and be installed in the some soft copies on this circuit board, this heat sink comprises a framework and a lid, this framework comprises a diapire, an opening is offered at this diapire middle part, this lid one side is connected with this diapire one side and junction bending, other three sides are separated with this diapire, described heat sink also comprises a suction wave plate, this suction wave plate is fixed in this framework adjacent with this diapire to cover this opening, and the heat diffusion that this heat sink distributes these some electronic building bricks is outside this portable electron device.
Compared to conventional art, the heat that described portable electron device distributes described some electronic building bricks by described conducting piece is passed to this heat sink, by this heat sink, strengthen radiating rate and area of dissipation, thereby prevent the excessive heat radiation of these some electronic building bricks and affect the serviceability of this portable electron device.
Accompanying drawing explanation
Fig. 1 is the three-dimensional exploded view of the portable electron device of better embodiment of the present invention.
Fig. 2 is the three-dimensional exploded view at another visual angle of portable electron device shown in Fig. 1.
Fig. 3 is the three-dimensional assembly diagram of portable electron device shown in Fig. 1.
Fig. 4 is that portable electron device shown in Fig. 3 is along the cut-away view of IV-IV line.
Fig. 5 is the three-dimensional assembly diagram of another state of portable electron device shown in Fig. 3.
Main element symbol description
Embodiment
The heat sink the present invention relates to is used in the portable electron devices such as mobile phone, wireless Internet card.In present embodiment, take and be applied to a wireless Internet card 100 and describe as example.
Refer to Fig. 1, wireless Internet card 100 comprises a body 10 and a heat sink 30.This heat sink 30 is located in this body 10, and covers and establish portions of electronics assembly 113, for the electronic building brick that its cover is established, dispels the heat and electromagnetic shielding.
This body 10 comprises a main body 11, a conducting piece 12, a housing 13 and a upper cover 15.This main body 11 is placed in this housing 13, and this upper cover 15 is covered on this housing 13 (as shown in Figure 3).This main body 11 is roughly a cuboid shape, and it comprises a circuit board 111, some electronic building bricks 113 and a lanyard 115.These some electronic building bricks 113 are installed on this circuit board 111.This lanyard 115 is fixed on this main body 11 1 sides.
This conducting piece 12 is made by the good material of heat conductivility, and in the present embodiment, this conducting piece 12 is made of copper.This conducting piece 12 is rectangular frame shaped roughly, and it is surrounded by four conductive sheet 121 that connect successively.The rectangular sheet of this each conductive sheet 121.This conducting piece 12 adopts surface mounting technology to be attached on this circuit board 111, and portions of electronics assembly 113 is enclosed in the inner.
This housing 13 is roughly a cavity type, and it comprises an assembly wall 131, a perisporium 133 and a containing cavity 135.This perisporium 133 is convexly equipped with and forms and surround thus this containing cavity 135 around these assembly wall 131 peripheries.On this assembly wall 131, offer a pilot hole 1311, this pilot hole 1311 is roughly rectangular poroid, and it is corresponding with the position of this conducting piece 12.This pilot hole 1311 is for exposing this heat sink 30.Accommodating this main body 11 of this containing cavity 135 in the inner.This assembly wall 131 connects and offers two hanging support holes 1313 in abutting connection with this perisporium 133, and this two hanging supports hole 1313 is passed to be connected to this upper cover 15 for this lanyard 115.
See also Fig. 2, these upper cover 15 shapes are roughly suitable with described assembly wall 131.This upper cover 15 is covered on this assembly wall 131, for covering electronic building brick 113 and the heat sink 30 being placed in this housing 13.These upper cover 15 1 sides convex with a lug 151, offer a through hole 1511 on this lug 151.This lug 151 is corresponding with this hanging support hole 1313.This lanyard 115 is connected to this through hole 1511 through behind this two hanging supports hole 1313, so that this upper cover 15 is connected in to this housing 13, in case this upper cover 15 is lost.
Described heat sink 30 comprises a framework 31, a lid 32, suction wave plate 33 and a viscosity glue 35.Described framework 31 comprises a diapire 311 and four sidewalls 313 that are convexly equipped with around these diapire 311 surroundings.An opening 315 (as shown in Figure 5) is offered at these diapire 311 middle parts.These lid 32 1 sides are connected with a side of diapire 311, and its other three sides are separated with diapire 311.This lid 32 is one-body molded with framework 31, and it bends with diapire 311 connections, and it is preset as relative diapire 311 perks.When this lid 32 is subject to External Force Acting, its perk end moves to cover this opening 315 to this diapire 311.This lid 32 convexes with some thermal columns 321 towards described opening 315 intervals, for increasing the area of dissipation of this heat sink 30.This each thermal column 321 axially offers a louvre 323, and this louvre 323 runs through this lid 32.
Described suction wave plate 33 is roughly rectangular laminar, and it is made by absorbing material.This suction wave plate 33 can be transformed into heat energy by electromagnetic wave energy and noise, and has heat sinking function concurrently.This suction wave plate 33 is fixed on the diapire 311 of this framework 31 by this viscosity glue 35.
These viscosity glue 35 shapes and size are roughly corresponding with this diapire 311, and it is for adhering to this framework 31 by this suction wave plate 33.This viscosity glue 35 can adopt common cohesive material to make, and also can adopt special-purpose heat-conducting glue material to make, to increase the heat sinking function of this heat sink 30.
See also Fig. 4, described framework 31 and lid 32 adopt the higher materials of the coefficient of heat conduction such as copper, aluminium, iron to make.This heat sink 30 is fixed on this housing 13 by the mode of injection mo(u)lding.When this upper cover 15 is covered on this housing 13, this upper cover 15 is held in this lid 32, so that this lid 32 covers this opening 315, now this framework 31, lid 32 and suction wave plate 33 play electromagnetic shielding action jointly; The heat that described some electronic building bricks 113 distribute is delivered on this sidewall 313 and on this lid 32 by the conducting piece 12 around its setting, and by this heat sink 30, this heat diffusion is arrived outside this wireless Internet card 100.The heat that described some electronic building bricks 113 distribute is also diffused into outside this wireless Internet card 100 by this suction wave plate 33 and this louvre 323 simultaneously.
See also Fig. 5, after this upper cover 15 is opened with respect to this housing 13, relatively and these diapire 311 perks, the heat that these some electronic building bricks 113 distribute can directly be dispersed into the external world by this opening 315 to this lid 32, thereby has strengthened radiating effect.Now by the common electromagnetic shielding action that rise of this framework 31 and suction wave plate 33.
The heat that wireless Internet card 100 of the present invention distributes described some electronic building bricks 113 by described conducting piece 12 is passed to this heat sink 30, by this heat sink 30, strengthen radiating rate and area of dissipations, thereby prevent this excessive heat radiation of some electronic building bricks 113 and affect the serviceability of this wireless Internet card 100.
In addition, those skilled in the art also can make various modifications, interpolation and the replacement in other forms and details in the claims in the present invention scope of disclosure and spirit.Certainly, the variations such as various modifications, interpolation and replacement that these are made according to spirit of the present invention, all should be included in the present invention's scope required for protection in.
Claims (10)
1. a heat sink, comprise a framework and a lid, this framework comprises a diapire, it is characterized in that: an opening is offered at this diapire middle part, this lid one side is connected with a side of this diapire and junction bending, and other three sides are separated with this diapire, and this lid can cover this opening, described heat sink also comprises a suction wave plate, and this suction wave plate is fixed in this framework and covers this opening.
2. heat sink as claimed in claim 1, is characterized in that: described heat sink also comprises a viscosity glue, and this viscosity glue adheres to this suction wave plate in this framework.
3. heat sink as claimed in claim 1, is characterized in that: on described lid, convex with some thermal columns, described each thermal column axially offers a louvre, and this louvre runs through this lid.
4. heat sink as claimed in claim 1, is characterized in that: described lid and this framework are one-body molded.
5. a portable electron device, comprise a heat sink, one circuit board and be installed in the some soft copies on this circuit board, this heat sink comprises a framework and a lid, this framework comprises a diapire, it is characterized in that: an opening is offered at this diapire middle part, this lid one side is connected with this diapire one side and junction bending, other three sides are separated with this diapire, described heat sink also comprises a suction wave plate, this suction wave plate is fixed in this framework adjacent with this diapire to cover this opening, the heat diffusion that this heat sink distributes these some electronic building bricks is outside this portable electron device.
6. portable electron device as claimed in claim 5, it is characterized in that: described portable electron device also comprises a conducting piece, this conducting piece is fixed on this circuit board and in abutting connection with these some electronic building bricks, this conducting piece and this heat sink are in contact with one another, the heat that these some electronic building bricks distribute is passed to this heat sink by this conducting piece, and by this heat sink expand area of dissipation and by this dissipation of heat to this portable electron device.
7. portable electron device as claimed in claim 5, is characterized in that: on described lid, convex with some thermal columns, described each thermal column axially offers a louvre, and this louvre is through to this lid.
8. portable electron device as claimed in claim 5, is characterized in that: described portable electron device also comprises a housing, and this heat sink adopts the mode of injection mo(u)lding to be fixed in this housing.
9. portable electron device as claimed in claim 5, is characterized in that: described heat sink also comprises a suction wave plate and a viscosity glue, and this viscosity glue adheres to this suction wave plate in this framework.
10. portable electron device as claimed in claim 5, it is characterized in that: described portable electron device also comprises a upper cover, a housing and a lanyard, this heat sink is fixed on this housing, this upper cover is covered on this housing and is held in this lid, this lid moves to cover this opening near this diapire, and this lanyard connects this upper cover and this housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910311082.0A CN102088837B (en) | 2009-12-08 | 2009-12-08 | Heat sink and portable electronic device with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910311082.0A CN102088837B (en) | 2009-12-08 | 2009-12-08 | Heat sink and portable electronic device with same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102088837A CN102088837A (en) | 2011-06-08 |
| CN102088837B true CN102088837B (en) | 2014-12-10 |
Family
ID=44100374
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910311082.0A Expired - Fee Related CN102088837B (en) | 2009-12-08 | 2009-12-08 | Heat sink and portable electronic device with same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102088837B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103037666B (en) * | 2011-09-28 | 2015-05-20 | 鸿富锦精密工业（深圳）有限公司 | Heat dissipation structure and electronic device |
| TWI562687B (en) * | 2014-09-24 | 2016-12-11 | Wistron Corp | Circuit board assembly |
| JP7272146B2 (en) * | 2019-07-05 | 2023-05-12 | 株式会社デンソー | radar equipment |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1443035A (en) * | 2002-03-01 | 2003-09-17 | 联想(北京)有限公司 | Heat dissiption structure of printed circuit board of portable mobile communication terminal |
| CN101174168A (en) * | 2006-10-31 | 2008-05-07 | 佛山市顺德区顺达电脑厂有限公司 | Cooling structure of electronic device |
| CN101516174A (en) * | 2008-02-21 | 2009-08-26 | 黄干元 | Radiating shield case |
-
2009
- 2009-12-08 CN CN200910311082.0A patent/CN102088837B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1443035A (en) * | 2002-03-01 | 2003-09-17 | 联想(北京)有限公司 | Heat dissiption structure of printed circuit board of portable mobile communication terminal |
| CN101174168A (en) * | 2006-10-31 | 2008-05-07 | 佛山市顺德区顺达电脑厂有限公司 | Cooling structure of electronic device |
| CN101516174A (en) * | 2008-02-21 | 2009-08-26 | 黄干元 | Radiating shield case |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102088837A (en) | 2011-06-08 |
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| C14 | Grant of patent or utility model | ||
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141210 Termination date: 20161208 |