CN102088837A - Heat sink and portable electronic device with same - Google Patents
Heat sink and portable electronic device with same Download PDFInfo
- Publication number
- CN102088837A CN102088837A CN2009103110820A CN200910311082A CN102088837A CN 102088837 A CN102088837 A CN 102088837A CN 2009103110820 A CN2009103110820 A CN 2009103110820A CN 200910311082 A CN200910311082 A CN 200910311082A CN 102088837 A CN102088837 A CN 102088837A
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- Prior art keywords
- heat sink
- diapire
- lid
- portable electron
- framework
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Abstract
The invention provides a heat sink and a portable electronic device with the same. The heat sink comprises a frame body and a cover body, wherein, the frame body comprises a bottom wall; the middle part of the bottom wall is equipped with an opening; and one side of the cover body is connected with one side of the bottom wall and the joint is bent, and the other three sides of the cover body are separated from the bottom wall. The heat sink further comprises a wave-absorbing plate, and the wave-absorbing plate is fixed on the frame body and is adjacent to the bottom wall so as to close over the opening.
Description
Technical field
The present invention relates to heat abstractor, relate in particular to a kind of heat sink and use the portable electron device of this heat sink.
Background technology
All to be employing be assembled in printed circuit board (PCB) with the electronic building brick of each functional module that (Printed Circuit Board is PCB) on the plate for the present electronic installation that uses, great majority.Generally all can generate heat during these electronic building brick work, if do not carry out radiating treatment, very likely the serviceability to these electronic installations impacts.
For some bigger heat abstractors, present radiating mode often adopts heat pipe to add radiating fin.Accelerate heat radiation as need, then can on fin, add fan.For some less portable electron devices, for example mobile phone, wireless Internet card etc. then can't be put into heat pipe, radiating fin and fan etc.These less portable electron devices generally adopt the mode of nature conduction to conduct heat to the external world.
But for these less portable electron devices, if in running order for a long time, the heat that its internal electrical components is sent in time is not discharged to the external world, and very likely the serviceability to this portable electron device exerts an influence.
Summary of the invention
Given this, be necessary to provide a kind of fin that is applicable to the portable electronic devices heat radiation.
In addition, also be necessary to provide a kind of portable electron device with described heat sink.
A kind of heat sink, comprise a framework and a lid, this framework comprises a diapire, an opening is offered at this diapire middle part, this lid one side is connected with this diapire one side and the junction bending, other three sides are separated with this diapire, and described heat sink comprises that also one inhales wave plate, and this suction wave plate is fixed on this framework adjacent with this diapire to cover this opening.
A kind of portable electron device, comprise a heat sink, a circuit board and be installed in some soft copies on this circuit board, this heat sink comprises a framework and a lid, this framework comprises a diapire, an opening is offered at this diapire middle part, this lid one side is connected with this diapire one side and the junction bending, other three sides are separated with this diapire, described heat sink comprises that also one inhales wave plate, this suction wave plate is fixed on this framework adjacent with this diapire covering this opening, and the heat diffusion that this heat sink will these some electronic building bricks distributes is outside this portable electron device.
Compared to conventional art, the heat transferred that described portable electron device distributes described some electronic building bricks by described conducting piece is to this heat sink, strengthen radiating rate and area of dissipation by this heat sink, thereby prevent the excessive heat radiation of these some electronic building bricks and influence the serviceability of this portable electron device.
Description of drawings
Fig. 1 is the three-dimensional exploded view of the portable electron device of better embodiment of the present invention.
Fig. 2 is the three-dimensional exploded view at another visual angle of portable electron device shown in Figure 1.
Fig. 3 is the three-dimensional assembly diagram of portable electron device shown in Figure 1.
Fig. 4 is the cut-away view of portable electron device shown in Figure 3 along the IV-IV line.
Fig. 5 is the three-dimensional assembly diagram of another state of portable electron device shown in Figure 3.
The main element symbol description
Embodiment
The heat sink that the present invention relates to is used in portable electron devices such as mobile phone, wireless Internet card.In present embodiment, be that example describes to be applied to a wireless Internet card 100.
See also Fig. 1, wireless Internet card 100 comprises a body 10 and a heat sink 30.This heat sink 30 is located in this body 10, and is covered with portions of electronics assembly 113, is used for its electronic building brick that is covered with is dispelled the heat and electromagnetic shielding.
This body 10 comprises a main body 11, a conducting piece 12, a housing 13 and a loam cake 15.This main body 11 is placed in this housing 13, and this loam cake 15 is covered on this housing 13 (as shown in Figure 3).This main body 11 roughly is a cuboid shape, and it comprises a circuit board 111, some electronic building bricks 113 and a lanyard 115.These some electronic building bricks 113 are installed on this circuit board 111.This lanyard 115 is fixed in this main body 11 1 sides.
This conducting piece 12 by heat conductivility preferably material make, in the present embodiment, this conducting piece 12 is made of copper.The roughly rectangular frame shaped of this conducting piece 12, it is surrounded by four conductive sheet 121 that connect successively.These each conductive sheet 121 rectangular sheets.This conducting piece 12 adopts surface mounting technology to be attached on this circuit board 111, and portions of electronics assembly 113 is located in it.
This housing 13 roughly is a cavity type, and it comprises an assembly wall 131, a perisporium 133 and a containing cavity 135.This perisporium 133 is convexly equipped with around these assembly wall 131 peripheries and forms and surround thus this containing cavity 135.Offer a pilot hole 1311 on this assembly wall 131, this pilot hole 1311 is roughly rectangular poroid, and its position with this conducting piece 12 is corresponding.This pilot hole 1311 is used to expose this heat sink 30.These containing cavity 135 ccontaining these main bodys 11 are in it.This assembly wall 131 connects in abutting connection with this perisporium 133 and offers two hanging support holes 1313, and this two hanging supports hole 1313 is passed to be connected to this loam cake 15 for this lanyard 115.
See also Fig. 2, these loam cake 15 shapes are roughly suitable with described assembly wall 131.This loam cake 15 is covered on this assembly wall 131, is used to cover the electronic building brick 113 and the heat sink 30 that are placed in this housing 13.These loam cake 15 1 sides convex with a lug 151, offer a through hole 1511 on this lug 151.This lug 151 is corresponding with this hanging support hole 1313.This lanyard 115 is connected to this through hole 1511 after passing this two hanging supports hole 1313, so that this loam cake 15 is connected in this housing 13, in case this loam cake 15 is lost.
Described heat sink 30 comprises a framework 31, a lid 32, a suction wave plate 33 and a viscous adhesive 35.Described framework 31 comprises a diapire 311 and four sidewalls 313 that are convexly equipped with around this diapire 311 all around.An opening 315 (as shown in Figure 5) is offered at these diapire 311 middle parts.These lid 32 1 sides are connected with a side of diapire 311, and its other three sides are separated with diapire 311.This lid 32 is one-body molded with framework 31, and it bends with diapire 311 connections, and promptly it is preset as relative diapire 311 perks.This lid 32 is subjected to external force to do the time spent, and its perk end moves to cover this opening 315 to this diapire 311.This lid 32 convexes with some thermal columns 321 at interval towards described opening 315, is used to increase the area of dissipation of this heat sink 30.This each thermal column 321 axially offers a louvre 323, and this louvre 323 runs through this lid 32.
Described suction wave plate 33 is roughly rectangular laminar, and it is made by absorbing material.This suction wave plate 33 can be transformed into heat energy with electromagnetic wave energy and noise, and has heat sinking function concurrently.This suction wave plate 33 is fixed on the diapire 311 of this framework 31 by this viscous adhesive 35.
These viscous adhesive 35 shapes and size are roughly corresponding with this diapire 311, and it is used for this suction wave plate 33 is adhered to this framework 31.This viscous adhesive 35 can adopt common cohesive material to make, and also can adopt special-purpose heat-conducting glue material to make, to increase the heat sinking function of this heat sink 30.
See also Fig. 4, described framework 31 and lid 32 adopt the higher materials of the coefficient of heat conduction such as copper, aluminium, iron to make.This heat sink 30 is fixed in this housing 13 by the mode of injection mo(u)lding.When this loam cake 15 was covered on this housing 13, this loam cake 15 was held in this lid 32, so that this lid 32 covers this opening 315, this framework 31, lid 32 and suction wave plate 33 play electromagnetic shielding action jointly at this moment; The heat that described some electronic building bricks 113 distribute is delivered on this sidewall 313 by the conducting piece 12 around its setting and reaches on this lid 32, and by this heat sink 30 this heat diffusion is arrived outside this wireless Internet card 100.The heat that described some electronic building bricks 113 are distributed also is diffused into outside this wireless Internet card 100 by this suction wave plate 33 and this louvre 323 simultaneously.
See also Fig. 5, after this loam cake 15 is opened with respect to this housing 13, these lid 32 relative and these diapire 311 perks, the heat that these some electronic building bricks 113 distribute can directly be dispersed into the external world by this opening 315, thereby has strengthened radiating effect.This moment is by this framework 31 and the suction wave plate 33 common electromagnetic shielding action that rise.
The heat transferred that wireless Internet card 100 of the present invention distributes described some electronic building bricks 113 by described conducting piece 12 is to this heat sink 30, strengthen radiating rate and area of dissipations by this heat sink 30, thereby prevent these some electronic building brick 113 excessive heat radiations and influence the serviceability of this wireless Internet card 100.
In addition, those skilled in the art also can make various modifications, interpolation and the replacement on other forms and the details in claim of the present invention scope of disclosure and spirit.Certainly, these are according to the variations such as various modifications, interpolation and replacement that spirit of the present invention is made, all should be included in the present invention's scope required for protection in.
Claims (10)
1. heat sink, comprise a framework and a lid, this framework comprises a diapire, it is characterized in that: an opening is offered at this diapire middle part, this lid one side is connected with a side of this diapire and the junction bending, and other three sides are separated with this diapire, and this lid can cover this opening, described heat sink comprises that also one inhales wave plate, and this suction wave plate is fixed on this framework and covers this opening.
2. heat sink as claimed in claim 1 is characterized in that: described heat sink also comprises a viscous adhesive, and this viscous adhesive should be inhaled wave plate and be adhered on this framework.
3. heat sink as claimed in claim 1 is characterized in that: convex with some thermal columns on the described lid, described each thermal column axially offers a louvre, and this louvre runs through this lid.
4. heat sink as claimed in claim 1 is characterized in that: described lid and this framework are one-body molded.
5. portable electron device, comprise a heat sink, one circuit board and be installed in some soft copies on this circuit board, this heat sink comprises a framework and a lid, this framework comprises a diapire, it is characterized in that: an opening is offered at this diapire middle part, this lid one side is connected with this diapire one side and the junction bending, other three sides are separated with this diapire, described heat sink comprises that also one inhales wave plate, this suction wave plate is fixed on this framework adjacent with this diapire covering this opening, and the heat diffusion that this heat sink will these some electronic building bricks distributes is outside this portable electron device.
6. portable electron device as claimed in claim 5, it is characterized in that: described portable electron device also comprises a conducting piece, this conducting piece is fixed on this circuit board and these some electronic building bricks of adjacency, this conducting piece and this heat sink are in contact with one another, the heat that these some electronic building bricks distribute is passed to this heat sink by this conducting piece, and enlarges area of dissipation and this heat is distributed to outside this portable electron device by this heat sink.
7. portable electron device as claimed in claim 5 is characterized in that: convex with some thermal columns on the described framework, described each thermal column axially offers a louvre, and this louvre is through to this fin.
8. portable electron device as claimed in claim 5 is characterized in that: described portable electron device also comprises a housing, and this heat sink adopts the mode of injection mo(u)lding to be fixed in this housing.
9. portable electron device as claimed in claim 5 is characterized in that: described heat sink comprises that also one inhales a wave plate and a viscous adhesive, and this viscous adhesive should be inhaled wave plate and be adhered on this framework.
10. portable electron device as claimed in claim 5, it is characterized in that: described portable electron device also comprises a loam cake, a housing and a lanyard, this heat sink is fixed on this housing, this loam cake is covered on this housing and is held in this lid, this lid moves to cover this opening near this diapire, and this lanyard connects this loam cake and this housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910311082.0A CN102088837B (en) | 2009-12-08 | 2009-12-08 | Heat sink and portable electronic device with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910311082.0A CN102088837B (en) | 2009-12-08 | 2009-12-08 | Heat sink and portable electronic device with same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102088837A true CN102088837A (en) | 2011-06-08 |
| CN102088837B CN102088837B (en) | 2014-12-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910311082.0A Expired - Fee Related CN102088837B (en) | 2009-12-08 | 2009-12-08 | Heat sink and portable electronic device with same |
Country Status (1)
| Country | Link |
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| CN (1) | CN102088837B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103037666A (en) * | 2011-09-28 | 2013-04-10 | 鸿富锦精密工业（深圳）有限公司 | Heat dissipation structure and electronic device |
| CN105578706A (en) * | 2014-09-24 | 2016-05-11 | 纬创资通股份有限公司 | circuit board assembly |
| WO2021005950A1 (en) * | 2019-07-05 | 2021-01-14 | 株式会社デンソー | Radar device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1212050C (en) * | 2002-03-01 | 2005-07-20 | 联想(北京)有限公司 | Heat dissiption structure of printed circuit board of portable mobile communication terminal |
| CN101174168A (en) * | 2006-10-31 | 2008-05-07 | 佛山市顺德区顺达电脑厂有限公司 | Cooling structure of electronic device |
| CN101516174A (en) * | 2008-02-21 | 2009-08-26 | 黄干元 | Radiating shield case |
-
2009
- 2009-12-08 CN CN200910311082.0A patent/CN102088837B/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103037666A (en) * | 2011-09-28 | 2013-04-10 | 鸿富锦精密工业（深圳）有限公司 | Heat dissipation structure and electronic device |
| CN103037666B (en) * | 2011-09-28 | 2015-05-20 | 鸿富锦精密工业（深圳）有限公司 | Heat dissipation structure and electronic device |
| CN105578706A (en) * | 2014-09-24 | 2016-05-11 | 纬创资通股份有限公司 | circuit board assembly |
| CN105578706B (en) * | 2014-09-24 | 2018-08-17 | 纬创资通股份有限公司 | circuit board assembly |
| WO2021005950A1 (en) * | 2019-07-05 | 2021-01-14 | 株式会社デンソー | Radar device |
| JP2021012083A (en) * | 2019-07-05 | 2021-02-04 | 株式会社デンソー | Radar device |
| CN114096869A (en) * | 2019-07-05 | 2022-02-25 | 株式会社电装 | Radar apparatus |
| JP7272146B2 (en) | 2019-07-05 | 2023-05-12 | 株式会社デンソー | radar equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102088837B (en) | 2014-12-10 |
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